WO1999007768A1 - Polysilazane amine et son procede de preparation - Google Patents
Polysilazane amine et son procede de preparation Download PDFInfo
- Publication number
- WO1999007768A1 WO1999007768A1 PCT/JP1998/003549 JP9803549W WO9907768A1 WO 1999007768 A1 WO1999007768 A1 WO 1999007768A1 JP 9803549 W JP9803549 W JP 9803549W WO 9907768 A1 WO9907768 A1 WO 9907768A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- amine residue
- hydrocarbon group
- polysilazane
- divalent
- group
- Prior art date
Links
- 229920001709 polysilazane Polymers 0.000 title claims abstract description 99
- 238000000034 method Methods 0.000 title description 10
- 239000001257 hydrogen Substances 0.000 claims abstract description 21
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 21
- 239000003960 organic solvent Substances 0.000 claims abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 6
- 150000002430 hydrocarbons Chemical group 0.000 claims description 52
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 24
- -1 hydroxyl compound Chemical class 0.000 claims description 23
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000004215 Carbon black (E152) Substances 0.000 claims description 10
- 150000001408 amides Chemical group 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims 14
- 125000004429 atom Chemical group 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 150000001412 amines Chemical group 0.000 abstract description 40
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 20
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 abstract 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 150000002431 hydrogen Chemical class 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 34
- 238000010521 absorption reaction Methods 0.000 description 34
- 239000010408 film Substances 0.000 description 31
- 238000006243 chemical reaction Methods 0.000 description 28
- 239000000377 silicon dioxide Substances 0.000 description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 16
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 14
- 239000008096 xylene Substances 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 6
- 125000001931 aliphatic group Chemical group 0.000 description 6
- 239000012298 atmosphere Substances 0.000 description 6
- 239000007810 chemical reaction solvent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001414 amino alcohols Chemical class 0.000 description 3
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- 241000238558 Eucarida Species 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 125000000392 cycloalkenyl group Chemical group 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- IIEWJVIFRVWJOD-UHFFFAOYSA-N ethylcyclohexane Chemical compound CCC1CCCCC1 IIEWJVIFRVWJOD-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VIDOPANCAUPXNH-UHFFFAOYSA-N 1,2,3-triethylbenzene Chemical compound CCC1=CC=CC(CC)=C1CC VIDOPANCAUPXNH-UHFFFAOYSA-N 0.000 description 1
- XWYROSCENMIBPI-UHFFFAOYSA-N 1-(1,2-dihydroimidazol-3-yl)ethanol Chemical compound CC(O)N1CNC=C1 XWYROSCENMIBPI-UHFFFAOYSA-N 0.000 description 1
- DLLYWUKJZXFACG-UHFFFAOYSA-N 1-(2,3-dihydro-1h-isoindol-1-yl)ethanol Chemical compound C1=CC=C2C(C(O)C)NCC2=C1 DLLYWUKJZXFACG-UHFFFAOYSA-N 0.000 description 1
- SZDLDMOGLKNNFH-UHFFFAOYSA-N 1-(2,3-dihydroindol-1-yl)ethanol Chemical compound C1=CC=C2N(C(O)C)CCC2=C1 SZDLDMOGLKNNFH-UHFFFAOYSA-N 0.000 description 1
- VGYLMOJQAHXYCK-UHFFFAOYSA-N 1-methylimidazolidine Chemical compound CN1CCNC1 VGYLMOJQAHXYCK-UHFFFAOYSA-N 0.000 description 1
- MADORZDTLHDDEN-UHFFFAOYSA-N 1-piperidin-1-ylethanol Chemical compound CC(O)N1CCCCC1 MADORZDTLHDDEN-UHFFFAOYSA-N 0.000 description 1
- XNIOWJUQPMKCIJ-UHFFFAOYSA-N 2-(benzylamino)ethanol Chemical compound OCCNCC1=CC=CC=C1 XNIOWJUQPMKCIJ-UHFFFAOYSA-N 0.000 description 1
- MGUMZJAQENFQKN-UHFFFAOYSA-N 2-(cyclohexylamino)ethanol Chemical compound OCCNC1CCCCC1 MGUMZJAQENFQKN-UHFFFAOYSA-N 0.000 description 1
- KZTWONRVIPPDKH-UHFFFAOYSA-N 2-(piperidin-1-yl)ethanol Chemical compound OCCN1CCCCC1 KZTWONRVIPPDKH-UHFFFAOYSA-N 0.000 description 1
- RELOFIKZGIJATN-UHFFFAOYSA-N 2-imidazolidin-1-ylethanol Chemical compound OCCN1CCNC1 RELOFIKZGIJATN-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- WRYCSMQKUKOKBP-UHFFFAOYSA-N Imidazolidine Chemical compound C1CNCN1 WRYCSMQKUKOKBP-UHFFFAOYSA-N 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004450 alkenylene group Chemical group 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- LPAGFVYQRIESJQ-UHFFFAOYSA-N indoline Chemical compound C1=CC=C2NCCC2=C1 LPAGFVYQRIESJQ-UHFFFAOYSA-N 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- QWTDNUCVQCZILF-UHFFFAOYSA-N iso-pentane Natural products CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical compound C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- VYMDGNCVAMGZFE-UHFFFAOYSA-N phenylbutazonum Chemical compound O=C1C(CCCC)C(=O)N(C=2C=CC=CC=2)N1C1=CC=CC=C1 VYMDGNCVAMGZFE-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/60—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/62—Nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
Definitions
- the present invention relates to an amine residue-containing polysilazane and a method for producing the same.
- polysilazane has a general formula NH n (R OH) 3 — n (R: alkyl group, n: an integer of 0 to 2).
- R alkyl group
- n an integer of 0 to 2.
- the amino alcohol used as a denaturing agent has a strong hydrophilicity
- the amino alcohol when polysilazane is reacted with the amino alcohol, the amino alcohol is dissolved in a methanol solution or It must be used as an ethanol solution for the reaction.
- the present invention provides a method for modifying polysilazane with an amide residue-containing hydroxyl compound without using a lower alcohol such as methanol or ethanol as a reaction solvent, and an amine residue-containing polysilazane obtained by the method. Is the subject.
- the number average molecular weight of a silazane structure represented by the following general formula (I) and / or a silazane structure represented by the following general formula (II) is 100 to 100,
- a polysilazane containing an amine residue of 0.000 is provided:
- Rl and R2 represent hydrogen, a hydrocarbon group or a hydrocarbon group-containing silyl group, A represents a divalent hydrocarbon group, and B represents an N-hydrocarbon group substituted amine residue or cyclic amine.
- P represents 1 or 0 and p represents 1 when B represents an N-hydrocarbon group-substituted amine residue, and p represents 1 or 0 when B represents a cyclic amine residue.
- a and A2 represent a divalent hydrocarbon group
- B2 represents a divalent chain amine residue or a divalent cyclic amine residue
- p and q represent 1 or 0
- Force S p and q indicate 1 when a divalent chain amide residue is indicated, and p and q indicate 1 or 0 when B 2 is a divalent cyclic amine residue.
- Rl and R2 represent hydrogen, a hydrocarbon group or a hydrocarbon group-containing silyl group, A represents a divalent hydrocarbon group, and B represents an N-hydrocarbon group substituted amine residue or cyclic amine residue.
- R1, R2 and R3 represent hydrogen, a hydrocarbon group or a hydrocarbon group-containing silyl group, and at least one of R1 and R3 represents hydrogen.
- a method for producing an amine residue-containing polysilazane characterized by reacting an amine residue-containing monovalent hydroxyl compound represented by the following formula in an inert organic solvent having no active hydrogen atom:
- Rl and R2 represent hydrogen, a hydrocarbon group or a silyl group containing a hydrocarbon group, A and A2 represent a divalent hydrocarbon group, and B2 represents a divalent chain amine residue or a divalent cyclic amine.
- R1, R2 and R3 represent hydrogen, a hydrocarbon group or a hydrocarbon group-containing silyl group, and at least one of R1 and R3 represents hydrogen.
- a method for producing an amine residue-containing polysilazane characterized by reacting an amine residue-containing divalent hydroxyl compound represented by the following formula in an inert organic solvent having no active hydrogen atom.
- the polysilazane used as a reaction raw material in the present invention is a conventionally known polysilazane having a silazane structure represented by the general formula (III) in its molecular chain.
- R 1 to R 3 are hydrogen, a hydrocarbon group or a hydrocarbon group-containing silyl group, and one or both of R 1 and R 3 represent a hydrogen atom.
- the hydrocarbon group includes an aliphatic hydrocarbon group and an aromatic hydrocarbon group
- the aliphatic hydrocarbon group includes a linear group and a cyclic group.
- hydrocarbon group examples include an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an arylanolalkyl group.
- the number of carbon atoms in these hydrocarbon groups is not particularly limited, but is usually 20 or less, preferably 10 or less. In the present invention, it is particularly preferably an alkyl group having 1 to 6, preferably 1 to 2 carbon atoms.
- preferred hydrocarbon groups are alkyl groups having 1 to 10 carbon atoms, preferably 1 to 6 carbon atoms.
- the number of the hydrocarbon groups bonded to Si is 1 to 3.
- the polysilazane used in the present invention can be a polysilazane having a chain, cyclic or crosslinked structure, or a mixture thereof. Furthermore, the polysilazane used in the present invention may be a modified polysilazane modified with a modifier such as an organic acid, an isocyanate, an amine, a palladium compound, or a platinum compound, in addition to a normal terminally modified polysilazane.
- the number average molecular weight of polysilazane is 100 ⁇ : I 0, 0 0, preferably 3 0 to 5 0 0.
- the modifying agent used in the present invention is a hydroxyl group compound containing an amine residue represented by the general formula (IV) or (V).
- A represents a divalent hydrocarbon group and B represents an N-hydrocarbon group-substituted amine residue or cyclic amine residue.
- p represents 1 or 0, and p represents 1 or 0 when B represents a cyclic amine residue.
- the divalent hydrocarbon A group includes a divalent aliphatic hydrocarbon group and a divalent aromatic hydrocarbon group, and the divalent aliphatic hydrocarbon group includes a linear one and a cyclic one. Is done.
- Examples of such a divalent hydrocarbon group include an alkylene group, an alkenylene group, a cycloalkylene group, a cycloalkylene group, an arylene group, and an arylalkylene group.
- the number of carbon atoms in these divalent hydrocarbon groups is not particularly limited, but is usually 20 or less, preferably 10 or less. In the present invention, it is particularly preferably an alkylene group having 2 to 10 carbon atoms, preferably 2 to 8 carbon atoms.
- the N-hydrocarbon group-substituted amine residue B includes a mono-substituted amine residue and a di-substituted amine residue. Further, the N-substituted amine residue can be a chain amine residue or a cyclic amine residue.
- the hydrocarbon group includes an aliphatic hydrocarbon group and an aromatic hydrocarbon group, and the aliphatic hydrocarbon group includes a chain and a cyclic group. .
- Examples of such a hydrocarbon group include an alkyl group, an alkenyl group, a cycloalkyl group, a cycloalkenyl group, an aryl group, and an arylalkyl group.
- the number of carbon atoms in the hydrocarbon group is not particularly limited, it is usually 20 or less, preferably 1 to 10, more preferably 1 to 3.
- the number of carbon atoms contained in the nitrogen-containing alicyclic ring is 3 to 20, preferably 48. Contained in nitrogen-containing alicyclic ring The number of nitrogen atoms contained is 1-3.
- Such cyclic amine residues include those derived from various cyclic amines. Such cyclic amines include, for example, pyrrolidine, imidazolidin, 3-N-methylimidazolidin, imidazoline, pyrazolidin, 2-N-methylbirazolidine, and pyridin. , Piperazine, 4-N-methylbiperazine, indolin, and isoindolin.
- the bond may be a bond from a nitrogen atom (1N) or a bond from a carbon atom (1C).
- the hydroxyl compound in the case where B represents an N-hydrocarbon-substituted amine residue in the monovalent hydroxyl compound represented by the general formula (IV), the hydroxyl compound can be represented by the following formula.
- A has the same meaning as described above, and is an R 4 or R 5 hydrocarbon group or hydrogen, at least one of which is a hydrocarbon group.
- the hydrocarbon group in this case those described above can be shown.
- the monovalent hydroxyl compound represented by the general formula (VI) contains 3 or more, preferably 4 or more, more preferably 6 or more carbon atoms, and its upper limit is about 30.
- Such monovalent hydroxyyl compounds include N-methyl (or N, N-dimethyl) propanolamine, N-methyl (or N, N-dimethyl) hexanolamine, N-methyl (or N, N—dimethyl) octanolamine, N—methyl (or N, N—dimethyl) dodecanolamine, N—methyl (or N, N—dimethyl) octadecanolamine, N—methyl (or N, N —Dimethyl) oleyl alcoholamine, N-methyl (or N, N-dimethyl) cyclohexanolamine, N-methyl (or N, N-dimethinole) benzylanolenoleamine, N-methyl (or N, N-dimethyl) phenolamine, N —Met
- the compound when B represents a cyclic amine residue, the compound may be 2-imidazolidinyl ethanol, 4-imidazolinyl ethanol, 1-birazolidinylethanol, 2-birazolidinylethanol, 1-piperidinylethanol, 2-piperidinylethanol, N-methyl-2-piperidinylethanol, N-methyl-1-4-piperidininoleethanol, 1-Piperazinolenoethanol, 41-N-methyl 1-piperazinylethanol, indolinylethanol, isoindolinidylethanol, N-methylpyrrolidinol, N-methylpyrrolidinol, 2-piberidinol , N, N-dimethyl-2-piperazinol and the like.
- the divalent chain amine residue is represented by the formula NR— (where R represents a hydrogen or a hydrocarbon group). is there.
- the divalent cyclic amine residue include those derived from the various cyclic amines described above.
- the two bonds in the cyclic amine residue may be a bond from a nitrogen atom (—N and one N) or a bond from a carbon atom (one C and —C). Or a bond (1 N and 1 C) from a nitrogen atom and a carbon atom.
- the polysilazane containing an amine residue of the present invention is represented by the formula (IV) or a monovalent hydroxyl compound represented by the general formula (V) in a reaction solvent with respect to the polysilazane.
- a reaction solvent By reacting the divalent hydroxy compound.
- an inert organic solvent having no active hydrogen atom is used as a reaction solvent.
- the inert organic solvent examples include aromatic hydrocarbons such as benzene, toluene, xylene ethenolebenzene, ethinolebenzene, trimethylbenzene and triethylbenzene; cyclohexane, cyclohexene, decahydronaphthalene, Alicyclic hydrocarbons such as ethylcyclohexane, methylcyclohexane, ⁇ -menthane, dipentene (limonene); ⁇ -pentane, i-pentane, ⁇ -hexane, i-hexane, n- And saturated hydrocarbons such as heptane, i-heptane, n-octane, i-octane, n-nonane, i-nonane, n-decane and i-decane.
- aromatic hydrocarbons such as benzene, toluen
- the reaction is carried out at a temperature of 0 to 200 ° C., preferably 0 to 50 ° C. and at a condition of 0 to 10 kg / cm2G, preferably 0 to 2 kg / cm2G. .
- the concentration of polysilazane in the reaction solvent is 0.1 to 50% by weight, preferably 1 to 10% by weight.
- the proportion of the monovalent or divalent hydrid xyl compound used is 0.01 to 50% by weight, preferably 0.1 to 1.0% by weight, based on polysilazane.
- the hydro-xyl compound represented by the general formulas (IV) and (V) used in the present invention has hydrophobicity, is dissolved in the hydrocarbon-based solvent, and reacts smoothly and homogeneously with polysilazane. Can be. Therefore, the polysilazane containing an amide residue of the present invention is different from that obtained by the conventional method using lower alcohol as a reaction solvent, and is different from that obtained by the reaction of the lower alcohol with polysilazane. Since no solution occurs, when the polysilazane film is fired, Provides a high density fired film.
- the silica-based film formed from the polysilazane film of the present invention usually has a density of 1.5 to 2.3 g / cm3, preferably 1.8 to 2.3 g / cm3.
- the polysilazane containing an amine residue of the present invention can be formed into a high-purity silica film by forming the film and firing it in the air.
- the firing temperature can be as low as 50 to 700 ° C., preferably 50 to 100 ° C. Therefore, when the polysilazane of the present invention is used, a dense siliceous thin film can be formed even on materials having low heat resistance such as plastic, wood, and paper.
- the presence of water vapor is required.
- the high-temperature steam described above is not preferable because it has a bad influence on the semiconductor and the liquid crystal.
- the thin film formed from the polysilazane of the present invention can be converted to silica under an extremely low water vapor partial pressure because of a high conversion rate of silica.
- the pre-firing is performed once in an air atmosphere (including water vapor) at a low temperature of 200 ° C or lower, and then the main firing is performed in a dry atmosphere at 200 ° C or higher.
- a high-purity silicon film can be efficiently obtained.
- the polysilazane of the present invention does not involve a modification reaction, particularly a low-molecular-weight reaction, the polysilazane has a low content of a low-molecular-weight polysilazane component and has a high conversion rate to silica.
- a silica thin film is used, the molecular weight of the low molecular weight component is rapidly increased, and sintering, particularly generation of polysilazane vapor does not occur. As a result, the yield of the obtained silica thin film becomes large. Further, since there is no generation of polysilazane vapor, various inconveniences caused by the polysilazane vapor can be avoided.
- a gas inlet tube, a mechanical stirrer, and a Juichi condenser were attached to a 2-L four-necked flask. After the inside of the reactor was replaced with dry nitrogen, 150 ml of dry pyridine was put into a four-necked flask, and this was cooled with ice. Then a white solid Adaku bets (S i H 2 C 1 2 ⁇ 2 C 5 H 5 N) was produced when adding dichlorosilane 1 0 0 g. The reaction mixture was ice-cooled, and 70 g of ammonia was blown in with stirring. Subsequently, dry nitrogen was blown into the liquid layer for 30 minutes to remove excess ammonia.
- the obtained product was filtered under reduced pressure using a Buchner funnel under a dry nitrogen atmosphere to obtain 1200 ml of a filtrate. Pyridine was distilled off using an evaporator to obtain 40 g of perhydropolysilazane.
- a number average molecular weight of the resulting Peruhi mud polysilazane was measured Ri by the GPC (Exhibition Hirakieki ⁇ CDC 1 3), there was 8 0 0 in terms of polystyrene.
- S i —H of 2170 Absorption: Based on S i —N—S i in the range of 10 20 to 8 20, it was confirmed to exhibit absorption.
- the number average molecular weight of the obtained polysilazane is based on polystyrene. It was 100000 as measured by the GPC method. IR
- the number average molecular weight of the obtained polysilazane was measured by a GPC method using polystyrene as a reference, and was found to be 950.
- the IR (infrared absorption) spectrum contains the absorption of polysilazane, (cmI) Absorption based on N—H of 330 and 1180: S i of 2170 and 830—Absorption based on H: S i of 160 to 800 In addition to the absorption based on -N-S i, absorption based on C-H with a wave number (cm-1) of 270 to 310 was observed.
- the number average molecular weight of the obtained polysilazane was measured by a GPC method using polystyrene as a standard, and was found to be 950.
- the IR (infrared absorption) spectrum shows the absorption of polysilazane, that is, the absorption based on the N—H at a wave number (cmI) of 330 and 2180: 2160 and 833 Absorption based on S i — H of 0: 1 0 6 0 to 800 0 S i — N — In addition to absorption based on S i, wave number (cm-1) 2 7 0 0 to 3 1 0 0 Absorption based on C—H was observed.
- the IR (infrared absorption) spectrum shows the absorption of polysilazane, that is, the absorption based on N—H at the wave number (cm-1) 3370 and 1180: 2170 and 830.
- S i — H-based absorption S 0 6 0 to 800 0
- Absorption based on 1H was observed.
- the IR (infrared absorption) spectrum shows the absorption of polysilazane, that is, the absorption based on the wavenumber (cm-1) 3370, and 1 ⁇ -of 9; 830 S i — Absorption based on H: 106 0 to 800 In addition to absorption based on S i -N-S i, wave number (c m-1) 270 0 to 310 An absorption based on C—H of 0 was observed.
- Perhydropolysilazane and amine-containing polysilazane were dissolved in xylene to prepare a 20 wt% solution. This is diameter 4
- the solution was applied on a 0.5-inch thick silicon wafer using a spin coater (100 rpm, 20 seconds). This was converted to siri force under the following three conditions.
- a silicon wafer having a diameter of 4 inches and a thickness of 0.5 mm was weighed with an electronic balance.
- a polysilazane solution or an amine residue-containing polysilazane solution was formed into a film by the above-described Sincoat method, then converted into silica, and the weight of the silicon wafer with the film was measured again with an electronic balance. Film weight was taken as the difference.
- the film thickness was measured using a stylus type film thickness measuring device (Dektak IIA, manufactured by S10an).
- Silica conversion conditions (1) Silica conversion conditions (2) Silica conversion conditions (3) Silica film density Etch rate Silica film density Etch rate Fuming Silica Film density Etch rate
- the polysilazane containing an amide residue according to the present invention does not use a highly reactive lower alcohol such as ethanol as a reaction solvent in the production thereof, and thus is caused by the reaction between the polysilazane and the lower alcohol. The degradation of polysilazane is prevented. Therefore, the siliceous film obtained by firing the polysilazane of the present invention has a high density and does not cause evaporation of low-molecular-weight polysilazane during the firing.
- the polysilazane containing an amine residue of the present invention can be rapidly converted to silica by firing at a low temperature of 400 ° C. or less, particularly 100 ° C. or less.
- the firing atmosphere is not particularly limited, and a low water vapor partial pressure can be employed.
- the polysilazane containing an amide residue according to the present invention can be used for various purposes, preferably as a material for forming an interlayer insulating film of a semiconductor, as well as in the case of conventional polysilazane.
- (insulating flattening film) forming material, c is advantageously used as an insulating film-forming material in electrical and electronic fields of the gas barrier layer-forming material such as a film liquid crystal also poly silazanes of the present invention, metal, glass, plastic, It can be applied to hard coating, heat and acid resistant coating, antifouling coating and water repellent coating on solid surfaces such as wood.
- the present invention can be applied to gas barrier coating of plastic films, ultraviolet cut coating of glass and plastic, and coloring coating.
- the silazane structure of the formula (I) can be obtained.
- An amine residue-containing polysilazane containing both silazane structures of the formula (II) can be obtained.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Silicon Polymers (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69832282T DE69832282T2 (de) | 1997-08-08 | 1998-08-10 | Aminierte polysilazane und verfahren zur deren herstellung |
US09/485,174 US6310168B1 (en) | 1997-08-08 | 1998-08-10 | Aminated polysilazane and process for the preparation thereof |
EP98936716A EP1002824B1 (en) | 1997-08-08 | 1998-08-10 | Aminated polysilazane and process for the preparation thereof |
KR1020007001281A KR100571298B1 (ko) | 1997-08-08 | 1998-08-10 | 아민 잔기 함유 폴리실라잔 및 그 제조방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9/227420 | 1997-08-08 | ||
JP22742097A JP4030625B2 (ja) | 1997-08-08 | 1997-08-08 | アミン残基含有ポリシラザン及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
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WO1999007768A1 true WO1999007768A1 (fr) | 1999-02-18 |
Family
ID=16860573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1998/003549 WO1999007768A1 (fr) | 1997-08-08 | 1998-08-10 | Polysilazane amine et son procede de preparation |
Country Status (7)
Country | Link |
---|---|
US (1) | US6310168B1 (ja) |
EP (1) | EP1002824B1 (ja) |
JP (1) | JP4030625B2 (ja) |
KR (1) | KR100571298B1 (ja) |
DE (1) | DE69832282T2 (ja) |
TW (1) | TW550276B (ja) |
WO (1) | WO1999007768A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10053201B4 (de) * | 2000-05-02 | 2010-03-04 | Samsung Electronics Co., Ltd., Suwon | Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozess unter Verwendung einer Aufschleuder-Glaszusammensetzung |
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JP3904691B2 (ja) * | 1997-10-17 | 2007-04-11 | Azエレクトロニックマテリアルズ株式会社 | ポリシラザン含有組成物及びシリカ質膜の形成方法 |
JP2000012536A (ja) * | 1998-06-24 | 2000-01-14 | Tokyo Ohka Kogyo Co Ltd | シリカ被膜形成方法 |
JP4075308B2 (ja) * | 1999-03-30 | 2008-04-16 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
US7053005B2 (en) | 2000-05-02 | 2006-05-30 | Samsung Electronics Co., Ltd. | Method of forming a silicon oxide layer in a semiconductor manufacturing process |
US6479405B2 (en) | 2000-10-12 | 2002-11-12 | Samsung Electronics Co., Ltd. | Method of forming silicon oxide layer in semiconductor manufacturing process using spin-on glass composition and isolation method using the same method |
TWI259844B (en) * | 2001-04-27 | 2006-08-11 | Clariant Int Ltd | Anti-fouling coating solution containing inorganic polysilazane |
US6756469B2 (en) * | 2001-07-18 | 2004-06-29 | Kion Corporation | Polysilazane-modified polyamine hardeners for epoxy resins |
JP3572300B2 (ja) * | 2001-08-03 | 2004-09-29 | 三菱重工業株式会社 | 硬質膜を有する合成樹脂製航空機窓 |
KR20080017368A (ko) * | 2005-06-15 | 2008-02-26 | 다우 코닝 코포레이션 | 수소 실세스퀴옥산의 경화 방법 및 나노미터 크기의트렌치에서의 치밀화 방법 |
JP2007094368A (ja) * | 2005-09-01 | 2007-04-12 | Seiko Epson Corp | マイクロレンズ基板、マイクロレンズ基板の製造方法、液晶パネルおよび投射型表示装置 |
US20070270625A1 (en) * | 2006-05-18 | 2007-11-22 | Joshua Gurman | Treatment of Polysilazane Waste |
JP5160189B2 (ja) | 2007-10-26 | 2013-03-13 | AzエレクトロニックマテリアルズIp株式会社 | 緻密なシリカ質膜を得ることができるポリシラザン化合物含有組成物 |
US7999355B2 (en) | 2008-07-11 | 2011-08-16 | Air Products And Chemicals, Inc. | Aminosilanes for shallow trench isolation films |
KR100909215B1 (ko) * | 2009-02-16 | 2009-07-24 | (주)스타네크 | 실리콘-수소 결합의 암모니아 치환을 감소시킨 폴리실라잔 및 폴리실라잔 용액의 제조방법 |
KR20120099448A (ko) | 2009-10-28 | 2012-09-10 | 다우 코닝 코포레이션 | 폴리실란-폴리실라잔 코폴리머 및 이들의 제조방법 및 용도 |
WO2011062100A1 (ja) * | 2009-11-19 | 2011-05-26 | コニカミノルタホールディングス株式会社 | ガスバリア性フィルム、その製造方法、それを用いた有機光電変換素子及び有機エレクトロルミネッセンス素子 |
JP2017200861A (ja) | 2016-05-02 | 2017-11-09 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | 緻密なシリカ質膜形成用組成物 |
JP6668288B2 (ja) * | 2017-04-04 | 2020-03-18 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | 膜形成組成物 |
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JPH06128529A (ja) * | 1992-10-20 | 1994-05-10 | Catalysts & Chem Ind Co Ltd | シリカ系被膜形成用塗布液および被膜付基材 |
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US4720531A (en) * | 1982-09-29 | 1988-01-19 | General Electric Company | Novel scavengers for one-component RTV compositions |
US4782008A (en) * | 1985-03-19 | 1988-11-01 | International Business Machines Corporation | Plasma-resistant polymeric material, preparation thereof, and use thereof |
US5032649A (en) * | 1989-11-27 | 1991-07-16 | Hercules Incorporated | Organic amide-modified polysilazane ceramic precursors |
-
1997
- 1997-08-08 JP JP22742097A patent/JP4030625B2/ja not_active Expired - Lifetime
-
1998
- 1998-08-07 TW TW087113142A patent/TW550276B/zh not_active IP Right Cessation
- 1998-08-10 US US09/485,174 patent/US6310168B1/en not_active Expired - Lifetime
- 1998-08-10 EP EP98936716A patent/EP1002824B1/en not_active Expired - Lifetime
- 1998-08-10 KR KR1020007001281A patent/KR100571298B1/ko not_active IP Right Cessation
- 1998-08-10 WO PCT/JP1998/003549 patent/WO1999007768A1/ja active IP Right Grant
- 1998-08-10 DE DE69832282T patent/DE69832282T2/de not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06128529A (ja) * | 1992-10-20 | 1994-05-10 | Catalysts & Chem Ind Co Ltd | シリカ系被膜形成用塗布液および被膜付基材 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10053201B4 (de) * | 2000-05-02 | 2010-03-04 | Samsung Electronics Co., Ltd., Suwon | Herstellung einer Siliziumoxidschicht bei einem Halbleiterherstellungsprozess unter Verwendung einer Aufschleuder-Glaszusammensetzung |
Also Published As
Publication number | Publication date |
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JP4030625B2 (ja) | 2008-01-09 |
DE69832282D1 (de) | 2005-12-15 |
TW550276B (en) | 2003-09-01 |
EP1002824B1 (en) | 2005-11-09 |
DE69832282T2 (de) | 2006-08-10 |
EP1002824A4 (en) | 2000-11-02 |
JPH1160736A (ja) | 1999-03-05 |
KR20010022686A (ko) | 2001-03-26 |
KR100571298B1 (ko) | 2006-04-17 |
EP1002824A1 (en) | 2000-05-24 |
US6310168B1 (en) | 2001-10-30 |
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