WO1998030480A1 - Transporteur d'articles - Google Patents

Transporteur d'articles Download PDF

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Publication number
WO1998030480A1
WO1998030480A1 PCT/JP1998/000066 JP9800066W WO9830480A1 WO 1998030480 A1 WO1998030480 A1 WO 1998030480A1 JP 9800066 W JP9800066 W JP 9800066W WO 9830480 A1 WO9830480 A1 WO 9830480A1
Authority
WO
WIPO (PCT)
Prior art keywords
article
transport
conveying
path
air injection
Prior art date
Application number
PCT/JP1998/000066
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Tsuji
Takao Ohnishi
Original Assignee
Ngk Insulators, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators, Ltd. filed Critical Ngk Insulators, Ltd.
Priority to US09/142,329 priority Critical patent/US6224298B1/en
Priority to DE69813433T priority patent/DE69813433T2/de
Priority to EP98900208A priority patent/EP0905064B1/fr
Publication of WO1998030480A1 publication Critical patent/WO1998030480A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/027—Fluid transport of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/10—Associated with forming or dispersing groups of intersupporting articles, e.g. stacking patterns
    • Y10S414/101—Associated with forming or dispersing groups of intersupporting articles, e.g. stacking patterns with article-supporting fluid cushion

Definitions

  • the present invention relates to an article transport apparatus for transporting an article (various electronic components such as semiconductor chips) in a manufacturing process to the next manufacturing step, or for transporting a completed article to the next assembling step.
  • an article transport apparatus for transporting an article (various electronic components such as semiconductor chips) in a manufacturing process to the next manufacturing step, or for transporting a completed article to the next assembling step.
  • a container composed of a box with an upper opening is used to transport many electronic components to the next processing step or storage room. Is often used.
  • workpieces When a large number of electronic components and the like (hereinafter, simply referred to as “workpieces”) are transported using the containers in the manufacturing line, a large number of workpieces are randomly inserted into the containers, and a belt conveyor or a transfer arm is used. In such a way, it is automatically transported to the next processing step or storage room.
  • the article to be transported is a small one such as a semiconductor chip
  • a method of providing a large number of holes in the transport path and blowing the air through the multiple holes to transport the article is used.
  • An article conveying device is an article conveying device provided with at least one row of grooves constituting an article conveying path, wherein the article conveying direction moving mechanism, a floating mechanism, and a conveying direction end portion. And a levitation promoting mechanism.
  • the transport direction moving mechanism may include means for inclining the transport path downward by a predetermined angle toward the transport direction, and a plurality of air drilled to inject in the transport direction onto the transport surface of the transport path. It is preferable that one or a combination of these pressing means provided in the conveying direction at the start end of the conveying path in the conveying direction be appropriately selected and used.
  • the means for inclining the transport path downward by a predetermined angle toward the transport direction By using the means for inclining the transport path downward by a predetermined angle toward the transport direction, the large number of articles are transported downstream in the transport direction by their own weight.
  • the inclination angle should be set to 2 ° or less, because if it is too large, the overlap of the articles at the end in the transport direction will increase, and if it is too small, the transport capacity of the articles will decrease. Suitable, but not limiting.
  • the air injection holes refer to a large number of through holes mechanically drilled / a large number of holes in a porous material such as a sintered metal.
  • By also functioning as an article levitation mechanism it is possible to reduce costs by simplifying the equipment, simplify equipment handling, and improve the reliability of the equipment.
  • the pressing means a method by air blowing or a mechanical pressing method such as a piston can be appropriately selected and used.
  • the transfer capacity can be controlled independently, the applicable range of operating conditions such as the shape of the article and the transfer speed can be expanded, and the article floats particularly at the beginning of the transfer path into which the article is input. The trouble of sinking without any trouble can be solved.
  • the levitation mechanism has a large number of air injection holes formed in the article transport surface of the transport path.
  • air injection holes By injecting air from the air injection holes directly above the conveyance surface, it is possible to satisfactorily float all of the articles placed on the conveyance path and prevent stagnation of articles on the conveyance path. be able to. That is, a large number of articles can be efficiently transported in the transport direction.
  • the levitation promoting mechanism may be configured such that the planar shape of the transport path is a shape in which the floating amount of the article is maximized at a terminal end in the transport direction, or a number of air injection holes are formed in the article transport surface of the transport path.
  • One or a combination of these can be used as appropriate.
  • the article reaching the terminal end in the transport direction of the transport path is located at the highest position above other articles. It is in a floating state and is positioned with high accuracy.
  • a similar effect can be obtained by increasing the air injection amount of the air injection holes provided at the end portion in the transport direction to be larger than the air injection amount of the air injection holes provided at portions other than the end portion in the transport direction.
  • the number of air injection holes may be increased as compared with a portion other than the end in the transport direction.
  • the air injection amount per air injection hole may be increased.
  • the grooves constituting the article transport path may be provided in parallel by the number corresponding to the quality level of the articles.
  • the articles will be loaded into each groove according to the quality level that has been certified for each article in the previous process (for example, the inspection process). From this, it becomes possible to arrange articles of almost the same quality level in each transport path, and in the subsequent assembly process, for example, one apparatus using articles of almost the same quality transported in one transport path. Can be assembled, and the quality of equipment can be improved.
  • three or more air injection holes may be provided with respect to the projected area of the article.
  • the gap area a plane in which the gap area is gradually reduced in the transport direction. You may make it shape.
  • the larger the area of the gap the more easily the air ejected from the air injection holes leaks from the gap, so that the floating amount of the article becomes smaller.
  • the smaller the area of the gap the more the air ejected from the air injection holes Since it is difficult to leak from the gap, the floating amount of the article is large.
  • the gap area is reduced stepwise in the transport direction, the floating amount of the article increases as it goes downstream in the transport direction, and when the article reaches the end in the transport direction. With this, the floating amount of the article is maximized.
  • a slit may be provided in a transport direction end wall of the transport path.
  • a part of the air from the air injection hole at the end in the transport direction leaks out of the transport path in the transport direction and the upward direction through the slit, and the floating amount of the article can be adjusted.
  • a plurality of articles having different ⁇ ⁇ quality levels are transported using a plurality of grooves as a transport path,
  • a protrusion may be provided on a transport direction end wall of the transport path.
  • the end of the transport path is formed by a side wall, the article that has reached the end in the transport direction comes into surface contact with the end wall. Therefore, in order to reduce the inclination of the article located at the end in the transport direction and cause the article to float, the air jet force on the article must be equal to or greater than the contact friction force of surface contact. Considering the balance with the amount, it may be difficult to adjust the air injection amount. In this case, there is a possibility that a problem that a foreign substance adheres to the above-mentioned article may occur.
  • the protrusion is provided on the end wall in the transfer direction, the article that has reached the end portion in the transfer direction comes into contact with the protrusion by point contact or line contact. Therefore, it is possible to reduce the jetting force of the air to the article, and it becomes easy to adjust the air jetting amount. In addition, foreign substances do not adhere to the product.
  • a protrusion may be provided at a rear end portion of the article in the transport direction.
  • the article arriving at the end in the transport direction comes into contact with the protrusion on the end wall in the transport direction at a point contact or a line contact with the article connected to the rear, so that the air jet force on the article is reduced. It is possible to realize simplification of the structure of the air injection mechanism and the control system.
  • the article may be an electronic component.
  • the present invention when a large number of articles are transported in the same direction, only the article located at the end in the transport direction floats above the other articles, so that it is very easy to take out a single article. As a result, even when the article is an electronic component, it can be applied sufficiently, and the semiconductor manufacturing process can be simplified and fully automated.
  • the length of the article along the transport direction may be continuously reduced upward.
  • the article and the end wall, and the article and the subsequent article come into line contact with each other.
  • the rear end of the article concerned is the taper surface at the front end of the next successive article.
  • FIG. 1 is a plan view showing a configuration of an embodiment (hereinafter simply referred to as a transport device according to an embodiment) in which an article transport device according to the present invention is applied to, for example, a transport device that transports a large number of semiconductor chips. is there.
  • FIG. 2 is a cross-sectional view taken along line AA in FIG.
  • FIG. 3 is a plan view of a transfer path of the transfer device according to the present embodiment.
  • FIG. 4 is a characteristic diagram showing a difference in a floating amount of each chip with respect to an opening area of a transport path in the transport device according to the present embodiment.
  • FIG. 5A is an explanatory diagram showing the flying height of the semiconductor chip depending on the gap interval at a point near the starting end.
  • FIG. 5B is an explanatory diagram showing the flying height of the semiconductor chip depending on the gap interval at a point near the end.
  • FIG. 6 is an explanatory diagram showing a floating state of a semiconductor chip transported on a transport path in the transport device according to the present embodiment.
  • FIG. 7 is a schematic perspective view of a transport device according to a first modification.
  • FIG. 8 is an explanatory view showing an example of an ejection direction of an air injection hole provided on a transport surface in a transport device according to a second modification, with the transport device partially cut away.
  • FIG. 9A is a cross-sectional view showing a floating state of a semiconductor chip transferred on a transfer path in a transfer device according to a third modification.
  • FIG. 9B is a plan view showing a floating state of a semiconductor chip transported on a transport path in a transport device according to a third modification.
  • FIG. 10A is a cross-sectional view showing a floating state of a semiconductor chip transported on a transport path in a transport device according to a fourth modification.
  • FIG. 10B is a plan view showing a floating state of a semiconductor chip transported on a transport path in a transport device according to a fourth modification.
  • ⁇ 11 is a semiconductor device transported on the transport path in the transport device according to the fifth modified example. It is an explanatory view showing a floating state of a tip.
  • FIG. 12 is a configuration diagram showing another example of a mechanism for tilting the apparatus main body, for example, with respect to the transport direction in the transport apparatus according to the present embodiment.
  • the transfer device 10 has a plurality of grooves forming a transfer path 12 for transferring a large number of semiconductor chips formed in parallel.
  • the same prismatic end provided commonly to the prismatic start end wall 18 provided in common to the end side openings 12 b of the plurality of transport paths 12 in the apparatus body 14. It has a wall 20.
  • a metal such as aluminum
  • a resin substrate such as glass epoxy
  • a ceramic such as ceramic partially stabilized zirconia or silicon nitride, a glass, or the like
  • the material has little flatness or warpage, and that the material has a large Young's modulus.
  • plastic working, laser machining, electric discharge machining, punching by punching, drilling, or the like can be used as appropriate.
  • the start end wall 18 and the end wall 20 are fixed to the base 16 by, for example, a plurality of screws 22 screwed from the bottom side of the base 16 as shown in FIG.
  • the mounting surface of the apparatus body 14 is defined by the surfaces of the base 18 and the end wall 20 facing each other and the upper surface of the base 16.
  • the device body 14 is mounted on the mounting surface defined on the upper surface of the base 16, and is fixed to the base 16 by screwing screws 24 from the bottom side of the base 16. .
  • the apparatus main body 14 is supported at an inclination angle of, for example, ⁇ ⁇ ⁇ ⁇ with respect to the mounting surface (transfer surface) of the base 16.
  • the opening 12 a of the starting end of the transport path 12 (hereinafter simply referred to as the starting end Pa) is a base 16.
  • end Pb the end opening 12 b of the transport path 12 comes into contact with the mounting surface of the base 16.
  • each transport path 12 is formed so that the shape of the groove width changes stepwise from the start end Pa to the end Pb.
  • Section (area) corresponding to 1.5 times the length Lc of one chip toward Pa Section (area) where the width dl at K1 is constant and set to the minimum, and corresponds to the next approximately 20 mm (area)
  • the width dx at K2 is set so as to continuously and gradually increase toward the starting end Pa, and is set to be wider by a predetermined length t (about 0.4 mm) on both sides over the section K2. Have been.
  • the semiconductor chip 28 When the preceding semiconductor chip 28 is taken out in the section K1, there is a possibility that the following semiconductor chip 28 becomes unstable, the meandering or the like, or the semiconductor chip 28 is conveyed in an overlapping state.
  • the semiconductor chip 28 may meander, etc. Obstacles such as catching on the end wall are eliminated, and the length of the section K1 is set to 1.5 times the length Lc of one chip, and a section K2 where the width dX gradually increases is provided. Thereby, the semiconductor chips 28 can be gradually floated one by one to prevent the semiconductor chips 28 from overlapping.
  • the transport path 12 is set so that the width dy is continuously increased in a section K3 from a point toward the terminal end Pb by a predetermined distance from the start end Pa to the start end Pa.
  • the increase rate of the width dy in the section K3 is set to be larger than the increase rate in the section K2, so that the semiconductor chip 28 can be easily received. Therefore, when the semiconductor chip 28 is loaded into each transport path 12, it is not necessary to perform high-precision positioning control for the transport arm for loading the semiconductor chip 28 into the transport device 10, and a simple mechanism and circuit Configuration is enough.
  • the range from the end Pb to one chip length Lc In other words, the opening area of the first chip from the end Pb is about 1.38 mm 2 or more, and the opening area (the opening area of the second chip) of the next one chip length Lc is about 2.740 mm 2 and above. Mouth area, respectively 6. 7 5 mm 2 or more and 1 0. A is 7 5 mm 2 or more, the opening area of the 4 inch-up onwards, there is a nearly identical to the beginning of the section 3.
  • the gap of the transfer path 12 is defined as the area obtained by subtracting the projection area of the semiconductor chip 28 from the opening area of the groove bottom with respect to the chip length Lc, the gap is stepwise in the transfer direction.
  • the gap space AW e (see FIG. 5B) near the end P b, for example, at the point e in FIG. 3 is the gap space ⁇ at the point n, for example, near the start end P a in FIG. ⁇ ⁇ (see Figure 5 5).
  • the air injection holes 26 are provided at three or more points with respect to the projection area of the semiconductor chip 28, and five points in the present embodiment. Specifically, as shown in Fig. 3, when the projected shape of one chip (indicated by broken line c) is, for example, a rectangular shape, the air injection holes are respectively formed in the portion corresponding to the four corners and the portion corresponding to the center. 26 are provided. In the present embodiment, the diameter of the air injection hole 26 is 0.2 mm.
  • the groove width of the transport path 12 has a planar shape that changes stepwise from the start end Pa to the end Pb, and the opening area (or Gap area) is small.
  • FIG. 6 shows the semiconductor chip 28 transported on the transport path 12.
  • the flying height increases toward the downstream side in the feed direction, and the flying height of the semiconductor chip 28e reaching the terminal end Pb becomes maximum.
  • FIG. 4 shows the difference between the respective flying heights of the semiconductor chips 28 arranged on the transport path 12.
  • the horizontal axis indicates the serial number from the terminal end Pb of the semiconductor chip 28 to be conveyed
  • “mouth” indicates the flying height
  • image indicates the opening area, respectively.
  • the difference between the flying heights described above is that the larger the opening area (or gap area), the larger the air leakage, and the smaller the flying height of the semiconductor chip 28 becomes.
  • the semiconductor chip 28 e located at the end P b in the conveyance direction can be automatically transferred without manual operation. It is possible to easily take out the semiconductor chip 28 that has been transported in large numbers by itself. This leads to the full automation of the entire semiconductor chip 28 transfer system.
  • a plurality of transfer paths 12 provided in the semiconductor chip 28 are allocated according to the quality level of the semiconductor chip 28.
  • the first transport path (upper transport path in Fig. 1) 12 A is assigned to transport the highest quality semiconductor chip 28, and the second transport path for the highest quality semiconductor chip 28 In the same manner, the third, fourth,..., And the third, fourth,. Assign n transfer paths 12C, 12D, 12N.
  • a large number of semiconductor chips 28 are put into the corresponding transport paths 12 according to the quality level certified for each chip in the previous process, for example, the inspection process.
  • a transfer robot having a sorting mechanism can be used for this insertion.
  • a large number of semiconductor chips 28 distributed to the respective transport paths 12 which are distributed according to the quality level and floated in each transport path 12 due to air injection and the inclination of the apparatus body 14 in each transport path 12. Each is transported toward the terminal end Pb while maintaining the state.
  • the semiconductor chip 28 that has reached the terminal end Pb will rise to the uppermost position due to the relationship of the opening area (or gap area).
  • the semiconductor chips 28 e floating most in each transport path 12 are taken out by a plurality of transport arms installed for each quality level, and the electronic devices installed for each quality level are assembled. Put on the line.
  • the transfer arm 12 sequentially starts from the transfer path 12 in which the number of semiconductor chips 28 becomes a predetermined number. The semiconductor chip 28 is taken out and put into the assembly line of one electronic device.
  • the semiconductor chips 28 of almost the same quality level in each of the transport paths 12, and in the subsequent assembly process, for example, the semiconductor chips 2 of almost the same quality transported by one transport path. 8 can be used to assemble one device, and the quality of the device can be improved.
  • the grooves in the transfer path 12 are more fully implemented so that the automatic removal of the semiconductor chip 28 and the entire transfer system of the semiconductor chip 28 can be realized.
  • the air injection holes 26 provided on the bottom surface are provided at five points with respect to the projected area of the semiconductor chip 28, so that a large number of semiconductor chips 28 placed on the transport path 12 are evenly levitated. And the stagnation of the semiconductor chip 28 in the transport path 12 can be prevented. That is, in each transfer path 12, all of the semiconductor chips 28 can be efficiently transferred in the transfer direction.
  • FIGS. 7 to 12 The same components as those in FIGS. 1 to 6 are denoted by the same reference numerals.
  • the transport device 10 according to the first modification has almost the same configuration as the transport device 10 according to the present embodiment, but the transport direction ( The point where the air blow pipe 27 is provided at the start end Pa in the direction of the arrow (in the direction of the arrow in FIG. 7), the width of the transfer surface opening at the end Pb in the transfer direction is particularly narrower than the other parts. There is no point, a point where the number of air injection holes 26 provided on the transport surface of the terminal end Pb is larger than that of other parts, and a plurality of slits 29 are provided in the vertical direction in the transport direction end wall 20a. Is different.
  • the air blow pipe 27 is connected to an air supply system including an air pump and a solenoid valve (not shown), and air (air pressure of about 0.1 to 0.1 mm) is supplied from the nozzle 31 at the tip of the air blow pipe 27. 5 kgf / cm 2 ) is injected toward the semiconductor chip 28. Since the opening of the transfer surface at the starting end Pa is wider than the other portions, the floating state of the semiconductor chip 28 due to fluctuations in the air pressure from the air injection holes 26 provided on the transfer surface, etc. Although the phenomenon that is not stable or does not float occurs, the above-mentioned structure eliminates this phenomenon, and the semiconductor chip 28 can be transported smoothly.
  • the air injection holes 26 are provided more on the transport surface at the end Pb than at other parts, the width of the opening on the transport surface at the end Pb should be particularly narrower than the other parts. Therefore, the semiconductor chip 28 can be raised to the uppermost position.
  • the specific number of air injection holes 26 is individually determined in consideration of the conditions of the semiconductor chip 28 such as the shape and weight, and the conditions of the transfer device 10 such as the opening area of the transfer surface of the transfer path 12. Can be determined.
  • FIG. 7 schematically shows only one groove as the transport path 12, but according to the present embodiment, a plurality of grooves as the transport path 12 are provided according to the quality of the semiconductor chip 28.
  • the transfer device 10 by changing and adjusting the forming conditions of the slit 29 for each transfer path 12, the transfer conditions for each transfer path 12 can be adjusted.
  • the transfer device 10 according to the second modified example shown in FIG. 8 has almost the same configuration as the transfer device 10 according to the present embodiment, but the injection direction of the air injection holes 26 provided on the transfer surface is different. The difference is that it is installed not in the upward direction but in the transport direction (the direction of the arrow in FIG. 8).
  • the air injected from the air injection holes 26 gives the semiconductor chip 28 a force (propulsion force) that moves in the transport direction together with the floating force.
  • the transfer device 10 can have a simple structure, and equipment costs can be reduced.
  • the operation is simplified and the structure is simpler, so that a highly reliable transfer operation can be performed.
  • the transfer device 10 according to the third modified example shown in FIG. 9 has substantially the same configuration as the transfer device 10 according to the present embodiment, except that a protrusion 30 is provided at the end Pb of the transfer path 12. Is different. Specifically, two protrusions 30 are provided side by side on the surface of the terminal wall 20 that closes the terminal opening 12b of each transport path 12 opposite to the terminal opening 12b. I have to.
  • the semiconductor chip 28 e that has reached the terminal end Pb comes into surface contact with the terminal end wall 20. Therefore, in order to lift the semiconductor chip 28 located at the terminal end Pb, the air jetting force on the semiconductor chip 28 must be equal to or more than the surface contact frictional force. When considering the balance with the flying height of 8, it is difficult to adjust the air injection amount. In addition, as described above, a problem that foreign matter adheres to the chip 28 e may also occur.
  • the projection 30 is provided at the terminal Pb, so that the semiconductor chip 28 e reaching the terminal Pb is It comes into contact by contact or line contact. Therefore, it is possible to reduce the jetting force of the air to the semiconductor chip 28e, and to easily adjust the air jetting amount, and to prevent the foreign matter from adhering to the semiconductor chip 28e.
  • a transport device 10 according to a fourth modification shown in FIG. 10 has substantially the same configuration as the transport device 10 according to the first variation, but has a protrusion 3 at the end Pb of the transport path 12. 0 is provided, and a protrusion 32 is provided at the end of the semiconductor chip 28.
  • the semiconductor chip 28 that has reached the terminal end Pb comes into contact with the protrusion 32 at the rear end in the transport direction and the semiconductor chip 28 connected to the protrusion 32 by line contact (or point contact).
  • line contact or point contact
  • the transfer device 10 according to the fifth modification shown in FIG. 11 has almost the same configuration as the transfer device 10 according to the present embodiment, but the semiconductor chip 28 to be inserted has a substantially trapezoidal side surface shape. Is different.
  • the semiconductor chip 28 e located at the terminal Pb is upwardly blown by air.
  • the rear end of the semiconductor chip 28 e moves along a tapered surface (a surface inclined upward in a direction away from the terminal end P) at the front end of the next semiconductor chip 28. Therefore, as the semiconductor chip 28 e located at the terminal end Pb floats upward, the next semiconductor chip 28 moves while entering below the semiconductor chip 28 e at the terminal end Pb.
  • the semiconductor chip 28 e at the terminal Pb easily floats above the other semiconductor chips 28.
  • a base 1 is used as a method of inclining the device main body 14 with respect to the transfer direction, for example.
  • the screw 24 screwed into the device body 14 from the bottom side of 6 was adjusted by appropriately adjusting the screwing amount.
  • the vertical rotation mechanism 4 OA and 40 B may be used.
  • the up-and-down rotation mechanism 4OA and 40B include, for example, a port member 44 screwed in a vertical direction with respect to a stage 42 installed on a part manufacturing line, and the port member.
  • a support member 46 mounted on the head 44 a of the member 44, a mounting plate 48 fixed to the bottom surface of the base 16, and the support member 46 with respect to the mounting plate 48 It has a support shaft 50 for rotatably mounting it.
  • the bolt member 44 of the vertical / rotation mechanism 4 OA on the starting end side opening 12 a side of the transport path 12 is rotated to reduce the amount of screwing of the port member 44 into the stage 42, or the transport path 1 2 End side opening 1 2 Up and down on b side Rotating the port member 44 in the rotating mechanism 40 B to increase the amount of screwing of the bolt member 44 into the stage 42, thereby increasing the device body 1.
  • 4 can be easily supported at an inclination angle of, for example, ⁇ ⁇ ⁇ ⁇ with respect to the transport direction.
  • the transfer device 10 according to the present embodiment and the transfer device 10 according to each modification an example in which the transfer device 10 for transferring a large number of semiconductor chips 28 in one direction is shown. However, it can also be applied to the transport of various small articles.
  • the transport path includes an article transport direction moving mechanism, an article floating mechanism, And a mechanism for promoting the floating of the article at the end of the transport path in the transport direction.

Abstract

Cette invention concerne un transporteur d'articles comprenant des gorges qui se trouvent en juxtaposition avec un numéro correspondant au niveau de qualité de puces à semi-conducteur (28), et qui forment une voie de transport (12) pour ces puces (28). Ce transporteur comprend également une conduite de soufflage d'air (27) qui est disposée au bord de départ (Pa) de la voie de transport (12), qui orientée dans une direction de transport indiquée par la flèche dans la Fig. 7, et qui va générer une poussée permettant de transporter les puces à semi-conducteur (28) dans la direction de transport. Un grand nombre d'orifices pour jets d'air (26) sont pratiqués dans la surface de transport de manière à faire flotter les puces à semiconducteur (28). Ces orifices (26) sont plus nombreux dans la partie extrémité de fuite que dans toute autre partie dans le sens du transport, ceci de manière à maximiser le niveau de flottaison des puces à semi-conducteur (28) à cet endroit. Plusieurs fentes (29) verticales sont formées dans la paroi (20a) de l'extrémité de fuite et dans le sens du déplacement. Il est ainsi possible d'automatiser un système de transport qui permet de transporter des articles dans une seule direction en les faisant flotter sur de l'air, et qui permet notamment de retirer des articles un par un.
PCT/JP1998/000066 1997-01-10 1998-01-09 Transporteur d'articles WO1998030480A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US09/142,329 US6224298B1 (en) 1997-01-10 1998-01-09 Object transport apparatus having a floating conveying means
DE69813433T DE69813433T2 (de) 1997-01-10 1998-01-09 Förderer für gegenstände
EP98900208A EP0905064B1 (fr) 1997-01-10 1998-01-09 Transporteur d'articles

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP9/3187 1997-01-10
JP318797 1997-01-10
JP34684097A JP3581000B2 (ja) 1997-01-10 1997-12-16 物品搬送装置
JP9/346840 1997-12-16

Publications (1)

Publication Number Publication Date
WO1998030480A1 true WO1998030480A1 (fr) 1998-07-16

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Application Number Title Priority Date Filing Date
PCT/JP1998/000066 WO1998030480A1 (fr) 1997-01-10 1998-01-09 Transporteur d'articles

Country Status (5)

Country Link
US (1) US6224298B1 (fr)
EP (1) EP0905064B1 (fr)
JP (1) JP3581000B2 (fr)
DE (1) DE69813433T2 (fr)
WO (1) WO1998030480A1 (fr)

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WO2006064562A1 (fr) * 2004-12-16 2006-06-22 Ueno Seiki Co., Ltd. Distributeur de pieces
JP2007238193A (ja) * 2006-03-06 2007-09-20 Kanto Auto Works Ltd 物品の搬送装置
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JP3581000B2 (ja) 2004-10-27
EP0905064A4 (fr) 2000-04-05
EP0905064A1 (fr) 1999-03-31
JPH10250841A (ja) 1998-09-22
EP0905064B1 (fr) 2003-04-16
US6224298B1 (en) 2001-05-01
DE69813433T2 (de) 2004-03-04

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