WO1998001892A1 - Procedes et dispositif de nettoyage, rinçage et sechage de tranches - Google Patents

Procedes et dispositif de nettoyage, rinçage et sechage de tranches Download PDF

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Publication number
WO1998001892A1
WO1998001892A1 PCT/US1997/011830 US9711830W WO9801892A1 WO 1998001892 A1 WO1998001892 A1 WO 1998001892A1 US 9711830 W US9711830 W US 9711830W WO 9801892 A1 WO9801892 A1 WO 9801892A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
station
rinse
spin
cleaning
Prior art date
Application number
PCT/US1997/011830
Other languages
English (en)
Inventor
Glenn E. Peterson
Eric Shurtliff
Chad Goudie
John Natalicio
Greg Olsen
Original Assignee
Speedfam Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/676,546 external-priority patent/US5950327A/en
Application filed by Speedfam Corporation filed Critical Speedfam Corporation
Priority to GB9900410A priority Critical patent/GB2334145B/en
Priority to DE19781822A priority patent/DE19781822B4/de
Priority to JP50531798A priority patent/JP2002509643A/ja
Priority to DE19781822T priority patent/DE19781822T1/de
Publication of WO1998001892A1 publication Critical patent/WO1998001892A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

  • the present invention relates, generally, to a self-contained machine for cleaning, rinsing, and spin-drying semiconductor wafer workpieces and, more particularly, to an improved system having a dual input, single water track input mechanism and improved rinse and spin-dry assemblies.
  • CMP chemical mechanical planarization
  • a wafer cleaning machine which overcomes many of the shortcomings of the prior art.
  • a single water track is employed to serially introduce wafers into the wafer cleaning station of the present invention.
  • two or more wafer input stations are configured to supply wafers to the single water track. In this way, as one cassette of wafers is being discharged from a first cassette load station into the water track for further processing, the operator may load a full cassette of wafers into a second cassette load station.
  • a cassette-present sensor in the second load station senses the presence of the second fully loaded cassette, and begins feeding wafers from the second load station into the water track in a substantially uninterrupted sequence. While the second wafer cassette load station is supplying wafers to the water track, the operator may load a new cassette full of wafers to be cleaned into the first cassette load station; alternatively, the loading of full cassettes into the respective load stations may be performed in an automated fashion without the need for a human operator.
  • the single water track feeds the wafers into a single cleaning station wherein both surfaces of each wafer are washed and cleaned.
  • the wafer cleaning station comprises a plurality of pairs of rollers; the rollers pull the wafers through the cleaning station and thereby clean the top and bottom flat surfaces of the wafers. More particularly, various of the rollers within the roller box operate at different rotational speeds. In this way, certain of the rollers may function as drive rollers to move the wafer through the cleaning station, while other rollers may operate at different rotational speeds to thereby clean the surfaces of the wafers as they are driven through the cleaning station.
  • the various rollers in the cleaning station are all contained in an enclosed box which may be easily removed from the machine to facilitate the convenient changing of the rollers as the roller surfaces become worn through extended use.
  • a plurality of channels are configured in an upper inside surface of the roller box to permit the distribution of a plurality of different chemicals ⁇ e.g., water, cleaning solution, surfactants, friction reducing agents, and agents to control the pH of the various solutions) into discrete regions of the roller box.
  • a workpiece passing through a first set of rollers may be exposed to a first chemical solution, whereupon the same wafer may be subsequently exposed to a second chemical solution in a latter stage of the roller box.
  • the roller box is configured to output disks into a rinse station.
  • Workpieces are rinsed in a serial manner within the rinse station, which is configured to tilt downward during the rinsing procedure. The downward tilt facilitates effective drainage and removal of any debris or chemicals.
  • a number of water jets urge each workpiece into the rinse station, maintain the position of the workpiece during rinsing, and perform the rinsing of the upper and lower surfaces of the workpiece.
  • the water jets also support the workpiece within the rinse station such that mechanical contact with the workpiece is minimized.
  • the rinse station suitably includes two substantially identical rinse rings each connected to a shuttle arm configured to shuttle back and forth to thereby facilitate higher workpiece throughput.
  • the two rinse rings are alternately cycled from a left position to a right position during operation.
  • a first rinse ring is configured to receive a workpiece from the roller box
  • the second rinse ring is configured to tilt downwardly from the horizontal plane so that the top, bottom, and edge surfaces of the workpiece may be simultaneously rinsed.
  • the second rinse ring tilts back to the horizontal position whereupon the rinsed workpiece is retrieved by a robotic arm from the second rinse ring.
  • the rinse ring assembly then shuttles to the right position, whereupon the empty second rinse ring receives another workpiece from the roller box.
  • the first rinse ring is tilted downwardly, whereupon the workpiece is rinsed.
  • the first rinse ring then returns to the horizontal position, whereupon a robotic arm retrieves the rinsed workpiece and transfers it to the spin-dry station.
  • the workpieces upon being retrieved from the rinse station are transferred to a dual spin-dry station.
  • a manipulator assembly lifts the rinsed workpieces from the rinse station and transfers the workpieces to one of the spin-dry stations.
  • the timing of the manipulator is controlled to optimize throughput; the manipulator may transport one rinsed workpiece while another workpiece is being rinsed.
  • the use of the manipulator reduces the amount of moving parts within the machine, and simplifies the control and timing processes.
  • An alternate spin-dry station cooperates with the dual rinse ring embodiment such that a first spin-dry station sequentially retrieves rinsed workpieces from the first rinse ring and a second spin-dry station sequentially retrieves workpieces from the second rinse ring.
  • each spin-dry station is equipped with a spin motor which is tuned to the particular type of workpieces being spun. More particularly, a spin-dry station may be tuned by placing a dummy workpiece on the spinner, and allowing the spinner motor to self-tune to the operating environment, including spin speeds in the range of 4,000 rpm, to thereby substantially eliminate harmonics, vibrations, and the like due to the spinner motor through the use of self-adjustment programs resident in the motor. By eliminating harmonics, vibrations, and the like imparted to the system by the motor, very high spin speeds may be employed while minimizing workpiece breakage.
  • Each spin-dry station may include a shield that rises to guard against water and debris that may be shed during the spin-dry process.
  • the use of an articulating shield enables the machine to operate in a relatively "open” manner without having to employ complex enclosures, sealing doors, and additional moving parts.
  • each spin-dry station may employ a number of clamps configured to maintain the workpiece upon the platform during the spin-dry process. The position and configuration of the clamps may be compatible with a number of differently shaped workpieces.
  • a pair of unload cassettes are employed, each being configured to receive workpieces from both spin-dry stations.
  • the machine may be configured to begin filling a second unload cassette with clean, dry workpieces.
  • the first unload cassette may be removed (manually or automatically) from the machine to thereby permit substantially continuous, uninterrupted operation of the subject wafer cleaning machine.
  • the flow of fluids to the wafer load station, water track, cleaning station, and rinse stations are suitably controlled through the use of a fluid flow regulator system, which monitors the flow of fluid, as opposed to prior art systems which typically measure fluid pressure.
  • a fluid flow regulator system which monitors the flow of fluid, as opposed to prior art systems which typically measure fluid pressure.
  • the system is less susceptible to variations in inlet fluid pressure. Fluid flows within the system may thus be much more accurately controlled than is possible with prior art systems.
  • an operator interface suitably comprises a flat panel touch screen.
  • the touch screen is advantageously configured to present the operator with a three-dimensional graphical image of virtually every relevant aspect of the system to facilitate operation, maintenance, trouble-shooting, and the like.
  • Fig. 1A is a detailed front view of a preferred exemplary embodiment of an integrated machine for washing, rinsing, spin-drying, and unloading workpieces;
  • Fig. IB is a perspective schematic view of an alternate embodiment of an enclosed, self- contained machine comprising a dual input, single track machine for washing, rinsing, spin-drying, and unloading in a continuous manner wafer disk workpieces in accordance with the present invention
  • Fig. 2A is a top schematic plan view of the machine shown in Fig. 1A
  • Fig.2B is a top schematic plan view of an exemplary embodiment of the machine shown in Fig. IB
  • Fig.3 is a schematic perspective view of an exemplary discharge mechanism for urging workpieces from load cassettes;
  • Fig. 4 is a top plan view of a workpiece load station, showing the path traveled by workpieces being discharged from one of the cassettes into the water track;
  • Fig. 5 is a detailed top plan view of an exemplary input manifold for receiving workpieces from two inputs and urging the workpieces along the water track;
  • Fig. 6 is a perspective schematic view of the input module shown in Fig. 5 in accordance with a preferred exemplary embodiment of the present invention
  • Fig. 7A is a perspective schematic view of an exemplary scrubber box having a plurality of respective pairs of rollers
  • Fig. 7B is a schematic front elevation view of the scrubber box shown in Fig. 7A;
  • Fig. 7C is a top view of the scrubber box of Fig. 7A;
  • Fig. 7D is a perspective view of the bottom panel of the scrubber box shown in Fig. 7A
  • Fig. 7E is a perspective view of the front panel of the scrubber box shown in Fig. 7A
  • Fig.8A is a top plan schematic view of the top panel of the roller box shown in Fig. 7A
  • Fig. 8B is a cross sectional top view of the top panel shown in Fig. 8A as viewed along line 8B-8B;
  • Fig. 9 is a perspective view of the top panel shown in Fig. 8A;
  • Fig. 10A is a top plan view of an exemplary roller bar useful in the context of the roller box shown in Figs. 7A and 7B;
  • Fig. 10B is a cross-section view of the shaft portion of the roller bar shown in Fig. 10A;
  • Fig. 11 is a side view of an exemplary rinse station employed by the present invention;
  • Fig. 12 is a top view of the rinse station shown in Fig. 11;
  • Fig. 13 is a front plan view of the rinse station shown in Fig. 11;
  • Fig. 14 is a cross sectional depiction of the rinse station viewed from line 14-14 in Fig.
  • Fig. 15 is a cross sectional depiction of a manipulator utilized by the present invention, as viewed from line 15-15 in Fig. 16;
  • Fig. 16 is a top view of the manipulator utilized by the present invention
  • Fig. 17A is a schematic top plan view of an alternate rinse station that may be employed by the embodiment shown in Fig. IB;
  • Fig. 17B is a schematic front elevation view of the rinse station shown in Fig. 17A;
  • Fig. 18 is a detailed view of the rinse ring shuttle assembly of Fig. 17 A, shown in the shifted right position;
  • Fig. 19A is a detailed side view of the rinse station shown in Fig. 17B, shown with one of the rinse rings in the tilted position;
  • Fig. 19B is a closeup view of the rinse ring station of Fig. 19A, illustrating the rinse fluid flow ports;
  • Fig. 20 is a perspective schematic detailed view of an exemplary rinse ring body in accordance with the rinse station shown in Figs. 17A and 17B;
  • Fig. 21 is a top view of an exemplary spin support platform
  • Fig. 22 is a side sectional view of an exemplary spin platform, with a bob shown attached to the distal end of each arm of the spin platform;
  • Fig. 23 is a perspective close-up view of an exemplary spinner bob in accordance with a preferred embodiment of the present invention.
  • Fig. 24 is a cross sectional depiction of a spin-dry assembly that incorporates the spin platform shown in Figs. 21 and 22;
  • Fig.25 is a block diagram of an exemplary fluid flow control system used in accordance with the present invention
  • Fig. 26 is a front view of the machine shown in Fig. 1A;
  • Fig. 27 is a perspective, schematic, partially exploded view of the machine shown in Fig. IB, illustrating various functionally-related compartments.
  • an exemplary embodiment of a wafer cleaning machine 100 suitably includes a wafer load station 102, a water track transport assembly 1 16, a cleaning station 104, a rinse station 106, a manipulator 108 (not shown in Fig. 1A), a spin-dry station 1 10. and a wafer unload station 1 14.
  • An alternate embodiment depicted in Figs. IB and 2B may also include a first transfer station 107.
  • Each of the foregoing stations are structurally and functionally described in greater detail below.
  • wafer load station 102 is suitably configured to accommodate at least two wafer cassettes to permit the substantially continuous operation of machine 100. That is, a first wafer load assembly 1 18 (see Figs. 2A and 2B) is configured to receive a cassette full of wafers to be cleaned.
  • a first wafer load assembly 1 18 is configured to receive a cassette full of wafers to be cleaned.
  • the present invention is described in the context of exemplary workpieces such as semiconductor wafers, virtually any substantially flat, substantially circular workpieces may suitably be employed in the context of the present invention.
  • first load assembly 1 18 the operator may install a second cassette filled (partially or fully) with workpieces to be cleaned in a second wafer load assembly 120.
  • second cassette filled partially or fully
  • the wafers resident in second load assembly 120 may immediately thereafter begin being output into water track 1 16.
  • the operator may install a new cassette of wafers to be cleaned within first load assembly 118. Accordingly, substantially continuous, uninterrupted input of wafers into machine 100 may be achieved, facilitating substantially higher workpiece throughput than previously achievable with presently known wafer cleaning machines.
  • first and second load assemblies 118, 120 are shown in a substantially "T-shaped" configuration, it will be understood that any suitable configuration may be employed to conveniently discharge workpieces from the cassettes into water track 116.
  • a "Y" configuration, or a modified "T" configuration in which the workpieces are not directed toward the opposing cassette assembly may be employed in the context of the present invention, as described in greater detail below.
  • each load assembly 118, 120 may include a platform 124 which supports a cassette 126 filled with workpieces.
  • each load assembly 1 18, 120 further comprises a tank or chamber 132 which may be suitably filled with a desired fluid, for example, deionized water, which may include surfactants, cleaning agents, pH controlling agents, and the like.
  • Elevator assembly 128 is suitably configured to extend into tank 132 to thereby control the vertical position of cassette 126 within tank 132.
  • a wafer discharge assembly 134 suitably comprises soak tank 132 configured to maintain cassette 126 immersed in fluid.
  • Workpiece discharge assembly 134 further comprises a nozzle 136 configured to forcibly discharge a fluid stream toward the edge of the top workpiece within a cassette to discharge the workpiece from the cassette.
  • fluid refers to a liquid in the preferred embodiment
  • fluid may also refer to a gas for those applications of machine 100 in which a gas is used to eject the wafers, for example when it is not necessary to maintain the workpieces in the wetted condition.
  • workpiece discharge assembly 134 is suitably configured to facilitate virtually any desired orientation of nozzle ! 36 with respect to the workpiece to be discharged. More particularly, discharge assembly 134 further comprises a back plate 138, respective side plates 140, 142, a bottom plate 143, and a front plate 144. As best seen in Fig. 3, back plate 138 is suitably configured to slide up and down (along the Z axis) through a slotted engagement mechanism 146 with side plate 140.
  • a Z axis control assembly 148 suitably secures the vertical position of back plate 138 with respect to discharge assembly 134. In this way, the vertical position of nozzle 136 with respect to the uppermost workpiece in the cassette may be adjusted and maintained.
  • Z axis control assembly 148 suitably comprises a screw 149 to secure the Z position of nozzle 136.
  • the X axis position of nozzle 136 may be adjusted and maintained by sliding a nozzle support block 150 along the X axis within a rectangular relief 1 2 formed in rear plate 138.
  • the X position of block 150 (and hence the X position of nozzle 136) may be maintained by securing a pair of screws (not shown) within respective oval adjustment recesses 154 of block 150.
  • the position of nozzle 136 with respect to the workpiece to be discharged may be further adjusted by tilting the Z axis by manipulating respective tilt screws 156. In this way, back plate 138, corresponding to the Z-X plane, may be tilted about the X axis, as desired.
  • a radial adjustment mechanism 158 may be manipulated to effectively rotate nozzle 136 about the Z axis.
  • Front plate 144 of discharge assembly 134 suitably comprises a wafer discharge outlet 160 through which workpieces are discharged from discharge assembly 134 and into water track 116, as described in greater detail below.
  • front panel 144 is suitably secured to water track assembly 1 16 through respective water track mounts 162.
  • elevator assembly 128 is suitably configured to raise platform 124 (and hence cassette 126) upwardly along the Z axis in step-wise fashion within tank 132 to thereby properly position the uppermost wafer proximate cassette 126 adjacent nozzle 136 so that the fluid discharged from nozzle 136 sequentially urges the then uppermost workpiece through wafer outlet passage 160 and into water track 116. as described in greater detail below.
  • nozzle 136 is preferably configured to increase the force of the discharged water such that an adequate and reliable discharging force is applied to the workpieces.
  • nozzle 136 exhibits a reduction in cross sectional area in a longitudinal manner from its inlet to its outlet.
  • nozzle 136 is preferably narrower at the discharge end proximate the workpiece. Accordingly, water gains speed as it passes through nozzle 136, which may be desirable for relatively low pressure applications.
  • water track 1 16 suitably comprises an input module 400 configured to receive workpieces 122 discharged from respective loading assemblies 118 and 120, and to guide the workpieces 122 in a non-contacting fashion down water track 1 16 (e.g. , to the right in Fig. 4).
  • input module 400 configured to receive workpieces 122 discharged from respective loading assemblies 118 and 120, and to guide the workpieces 122 in a non-contacting fashion down water track 1 16 (e.g. , to the right in Fig. 4).
  • workpiece load station 102 suitably comprises a modified "T" configuration, wherein each of respective load assemblies 118, 120 are substantially orthogonal to the path of water track 1 16, yet offset from one another by a sufficient amount to ensure that a wafer discharged from one of the cassettes will not inadvertently contact the oppositely disposed cassette, for example if the discharge force is mistakenly set too high.
  • a dual or plural cassette input configuration may be employed, for example a "Y" configuration, as desired.
  • input module 400 is suitably configured to receive workpieces discharged from load assembly 120 along arrow 408, and to receive workpieces discharged from load assembly 1 18 along arrow 410.
  • the workpieces Upon being received by input module 400, the workpieces are supported by fluid which is projected upwardly from the plane of the track through a plurality of fluid jets, as described in greater detail below, such that mechanical contact between the workpieces and input module 400 is substantially eliminated.
  • Input module 400 suitably comprises a plurality of pull jets 416 (see Fig.5) configured to urge workpieces out of load assembly 120 along the direction of arrow 408.
  • pull jets 416 are suitably oriented to discharge fluid upwardly at an angle with respect to the horizontal plane on the order of 20°-70°, and most preferably about 45°, with the horizontal flow vector oriented along the direction of arrow 408. In this way, workpieces received from load assembly 120 are drawn into the fluid manifold comprising the interior portion of input module 400.
  • Input module 400 further comprises a plurality of pull jets 414, similar to pull jets 416, configured to draw workpieces discharged from load assembly 1 18 into water track 116 along the direction of arrow 410. After being received by input module 400, the workpieces discharged from loading station 102 are carried along water track 116 along the direction of arrow 412 to cleaning station 104. More particularly, input module 400 further comprises a plurality of rows 418, each comprising a number (e.g., 10-20 and most particularly about 17) of fluid jets configured to urge the workpieces along the direction of arrow 412.
  • the fluid jets comprising rows 418 are also configured to discharge fluid upwardly from water track 1 16, and are suitably inclined with respect to the horizontal plane at an angle in the range of 20°-70°, and most preferably about 45°. In this way, workpieces received from load station 102 are urged along water track 116 substantially devoid of any mechanical contact.
  • a first workpiece detection sensor 402 is suitably disposed proximate discharge outlet 160 of load assembly 120; a similar workpiece detection sensor 404 is suitably disposed proximate discharge outlet 160 associated with load assembly 1 18.
  • a workpiece sensor 406 is also suitably disposed within input module 400 proximate the input to cleaning station 104. It should be appreciated that water track 116 may employ any number of sensors in addition to sensors 402, 404, and 406. For example, an exemplary embodiment of machine 100 utilizes a fourth sensor 407 positioned to monitor the progress or presence of workpieces 122 upon water track 1 16.
  • Respective workpiece sensors 402, 404, 406, and 407 monitor the steady state operation of machine 100, and may be configured to generate an alarm, or to stop the operation of machine 100 in the event the workpiece is detected as being "hung up” or otherwise lodged in the vicinity of the sensor.
  • the sensors may be employed to count workpieces as they pass by the sensor (or to confirm that no workpieces are present) to thereby confirm that all of the workpieces have been discharged from a cassette.
  • Workpiece sensors 402, 404, 406, and 407 may comprise any suitable mechanism for detecting the presence and/or absence of a workpiece, for example including optical sensors. Referring now to Figs.
  • an exemplary cleaning station 104 in accordance with a preferred embodiment of the present invention suitably comprises an enclosure, e.g., a scrubber box, enclosing a plurality of pairs of rollers. More particularly, cleaning station 104 suitably comprises a bottom panel 740, a top panel 742, a rear panel 744, and a front panel 738. In accordance with a particularly preferred embodiment, these panels comprise a self-contained box, which can be quickly and easily removed and replaced when it is desired to replace one or more of the rollers. The ability to quickly and conveniently remove and replace rollers and roller boxes in the context of the present invention further facilitates the substantially continuous operation of machine 100.
  • Cleaning station 104 suitably comprises a plurality of roller pairs configured to drive each workpiece through the roller box and to simultaneously clean the top and bottom flat surfaces of each workpiece passing therethrough.
  • cleaning station 104 preferably includes a workpiece input 700 configured to suitably receive workpieces into the enclosure.
  • the first pair of drive rollers (described below) "grabs" the workpiece and feeds it to the next pair of rollers.
  • cleaning station 104 suitably comprises on the order of 5-15 pairs of rollers, and most preferably about 9 pairs of rollers.
  • the scrubber box includes a first roller pair comprising respective rollers 702 and 704; a second roller pair comprising upper roller 706 and lower roller 708; a third roller pair comprising upper roller 710 and lower roller 712; a fourth pair comprising upper roller 714 and lower roller 716; a fifth pair comprising upper roller 718 and lower roller 720; a sixth pair comprising upper roller 722 and lower roller 724; a seventh pair comprising upper roller 726 and lower roller 728; an eighth pair comprising upper roller 730 and lower roller 732; and a ninth, terminal roller pair comprising upper roller 734 and lower roller 736.
  • Machine 100 is suitably configured such that workpieces enter cleaning station 104 from the far left and are sequentially urged through the roller box, being discharged from the roller box at the far right position (proximate rollers 734 and 7
  • each of the odd pairs of rollers function as drive rollers, with each drive roller pair operating at a drive speed S 1.
  • rollers 702, 704, 710, 712, 718, 720, 726, 728, 734, and 736 operate at drive speed SI .
  • each of the bottom rollers i.e., rollers 704, 708, 712, 716, 720, 724, 728, 732, and 736) rotate clockwise as shown in Fig. 7B.
  • each even roller pair i.e., rollers 706, 714, 722, and 730
  • the top roller in each odd roller pair i.e., rollers 702, 710, 718, 726, and 734
  • every even bottom roller i.e., rollers 708, 716, 724 and 732
  • every even top roller i.e., rollers 706, 714, 722 and 730
  • the tension between the two rollers comprising each respective roller pair is suitably approximately uniform throughout the roller box.
  • each odd roller pair is suitably driven by a first drive motor so that each odd roller pair (the "drive rollers") drive the workpieces through the cleaning station at an essentially uniform rate.
  • every even top roller is suitably driven by a second motor at process speed S3; every even bottom roller are suitably driven by the second motor at second drive speed S2 at a predetermined gear ratio below process speed S3.
  • the operator may control the drive speed S 1 by setting a first control associated with the first motor; the operator may also independently control drive speed S3 by manipulating a second control associated with the second motor.
  • the operator also indirectly controls drive speed S2, as drive speed S2 suitably follows drive speed S3 in accordance with the predetermined gear ratio discussed above.
  • drive speed S2 suitably follows drive speed S3 in accordance with the predetermined gear ratio discussed above.
  • substantial processing flexibility is achieved in cleaning station 104.
  • the even roller pairs effectively simultaneously clean the top and bottom surfaces of the workpieces as the workpieces are moved through the scrubber box at drive speed SI by the drive rollers (e.g., the odd roller pairs).
  • cleaning assembly 104 is advantageously configured for easy installation into and removal from machine 100. More particularly, bottom panel 740 suitably comprises one or more grooves (e.g., dovetail grooves) 750 to permit sliding engagement of cleaning assembly 104 to machine 100.
  • bottom panel 740 suitably comprises one or more grooves (e.g., dovetail grooves) 750 to permit sliding engagement of cleaning assembly 104 to machine 100.
  • machine 100 may advantageously comprise a frame portion having corresponding ridges (not shown) configured to be received within grooves 750 for convenient sliding engagement and alignment of cleaning assembly 104 with respect to machine 100.
  • Bottom panel 740 further comprises a fluid outlet 748 through which cleaning fluid may flow out of cleaning station 104, as described in greater detail below. If desired, the fluid retrieved from fluid outlet 748 may be recycled.
  • each of respective drive rollers 702-736 comprise a gear end 760 and a follower end 762.
  • each of the respective gear ends 760 are configured to extend through rear panel 744.
  • Each respective follower end 762 is advantageously configured for rotating receipt within respective follower junctions 764 configured in front panel 738.
  • front panel 738 further comprises a fastener assembly 746 for securing cleaning assembly 104 to the frame (not shown) of machine 100.
  • fastener assembly 746 may comprise a screw, bolt, quick release, or any other suitable fastening mechanism for securably but releasably engaging cleaning assembly 104 to the frame of machine 100.
  • Cleaning assembly 104 may be conveniently removed and replaced as follows.
  • Machine 100 may be placed in the off or hold mode of operation to permit the removal and replacement of cleaning assembly 104.
  • fastener assembly 746 is disengaged, for example by unscrewing a screw associated with fastener 746.
  • Cleaning station 104 may then be manually removed by the operator by pulling the box, for example along arrow 766 in Fig. 7A.
  • Gear ends 760 of the rollers are suitably passively disengaged from the drive mechanism (not shown) associated with machine 100 as cleaning station 104 is slid along arrow 766, guided by grooves 750.
  • cleaning statio 104 may be removed, a replacement box prepared by the operator in advance may be inserted in place of the removed box; alternatively, cleaning station 104 may be opened and the rollers quickly replaced so that the refurbished cleaning station may be quickly placed back onto machine 100.
  • cleaning station 104 may be reassembled with machine 100 by aligning grooves 750 with corresponding ridges associated with the machine, and sliding the box back into the original operating position. Grooves 750 facilitate the alignment of gear ends 760 into the mating drive mechanism (not shown for clarity) associated with machine 100.
  • fastener 746 may be reengaged by the operator to secure cleaning station 104 in place.
  • any fluid inlet, fluid discharge, or workpiece sensing hardware associated with cleaning station 104 may also have to be attended to during removal and reinstallation.
  • top panel 742 further comprises one or more fluid inlet ports configured to distribute fluid to a discrete portion of or to the entirety of the inside of cleaning assembly 104.
  • Fig.8A depicts a horizontal cross section of an exemplary top panel 742 configured as a fluid manifold system and
  • Fig.8B depicts a vertical cross section of top panel 742.
  • Top panel 742 preferably includes a number of manifolds arranged to deliver fluid to specific locations within the scrubber box. More particularly, top panel 742 suitably comprises a first fluid inlet port 802 that communicates with a first manifold 803 configured to distribute a first fluid proximate a number of rollers within the roller box.
  • First manifold 803 is preferably disposed to advantageously release fluid substantially evenly along the length of (or in the vicinity of) one or more of the top rollers.
  • Top panel 742 further comprises a similarly configured second fluid inlet port 804 in communication with a second manifold 805 for distributing a second fluid throughout a different portion of the roller box, for example in the region occupied by the first several roller pairs.
  • Top panel 742 may also include a third fluid inlet port 806 in communication with a third manifold 807 configured to distribute a third fluid throughout a third region of the roller box, for example a region proximate the last several roller pairs.
  • top panel 742 may include a fourth fluid inlet port 808 that communicates with a fourth manifold 809.
  • each individual manifold is suitably configured such that it is fluidly distinct from each of the remaining manifolds. However, one or more of the fluid inlet ports may be coupled together such that a single fluid may be applied to more than one manifold.
  • the manifolds are configured to distribute cleaning fluid to locations between adjacent rollers (the rollers are depicted in phantom lines in Fig. 8A). This arrangement is desirable to allow the cleaning fluid to reach the workpiece as it passes through the scrubber box.
  • each individual manifold includes a plurality of extending channels 812.
  • channels 812 associated with opposing manifolds may be arranged in an alternating configuration.
  • any number of fluid inlet ports and/or fluid manifolds may be employed in conjunction with cleaning station 104, and that the manifolds may communicate with any desired portion of cleaning station 104 with or without overlap, as desired to optimize particular processing applications.
  • top panel 742 is manufactured as a one-piece, substantially seamless assembly. The seamless construction enables manifolds 803, 805, 807, and 809 to be pressurized without leaking cleaning fluid, water, or chemicals to the external portion of cleaning station 104.
  • manifolds 803, 805, 807, and 809 are formed by drilling or boring into a solid piece of plexiglass or other rigid material.
  • Channels 812 (oriented vertically in Fig. 8A) are formed such that adjacent channels originate at opposite sides of top panel 742. Thereafter, several channels that originate from a common side are "connected" together by an intersecting channel 814 (oriented horizontally in Fig.8A). Plugs may be employed to seal the entry holes formed during the boring or drilling process.
  • Each of the manifolds described above preferably dispenses a respective fluid into cleaning assembly 104 through a number of orifices 810. Orifices 810 are formed within top panel 742 such that they communicate with the manifolds.
  • Orifices 810 may be formed using conventional drilling or other techniques. Although alternate manifolds may utilize a discrete nozzle element to eject fluid into the scrubber box, orifices 810 may be desirable to increase the sealing integrity of top panel 742. In addition, the cost to manufacture and maintain top panel 742 can be reduced by eliminating distinct nozzle elements.
  • each of the rollers within cleaning station assembly 104 suitably comprises a roller carrier 780, comprising gear end 760, follower end 762, and an elongated shaft 782.
  • shaft 782 suitably comprises peripheral structures 784 suitable for engaging a soft, spongy elongated annular ring (not shown) about shaft 782.
  • surface structures 784 are illustrated as elongated, parallel geared teeth, virtually any mechanism may be employed which facilitates a strong frictional fit between shaft 782 and the spongy roller material.
  • suitable roller material may comprise PVA rollers available from the Meracel Company of New Jersey.
  • rinsing station 106 preferred exemplary embodiments of the construction and operation of rinsing station 106 will now be described.
  • the air gap between cleaning station 104 and rinse station 106 is relatively small, e.g., approximately 3/16 inch, to ensure that the wafer workpiece does not appreciably dry between the cleaning and rinsing processes.
  • rinse station 106 is configured to receive workpieces in a serial manner, thoroughly rinse each workpiece with one or more rinsing solutions such as deionized water, and hold each rinsed workpiece for manipulator 108, which thereafter transports the rinsed workpiece to spin-dry station 110 (see Fig. 1A). More particularly, a preferred exemplary embodiment of rinse station 106 includes an upper portion 1002, a lower portion 1004 coupled to upper portion 1002, and a support stand 1006 configured to couple lower portion 1004 to machine 100. Upper portion 1002 is held above lower portion 1004 by upstanding brackets 1008 and
  • Entry passage 1012 is suitably located proximate the input side edges of upper and lower portions 1002 and 1004. Workpieces pass through entry passage 1012 as they transfer from cleaning station 104 to rinse station 106.
  • a number of initial rinsing jets are suitably positioned at upper portion 1002 and/or lower portion 1004 proximate entry passage 1012 to immediately begin rinsing the workpiece and to prevent drying of the workpiece.
  • the initial fluid jets are located within upper portion 1002 at or near the column identified by reference number 1013 in Fig. 12.
  • initial rinsing jets may be configured to direct the rinsing fluid at any suitable angle relative to the upper surface 1014 of lower portion 1004.
  • the initial rinsing jets direct the fluid approximately perpendicular to upper surface 1014 or at a forward angle relative to the entry path of the workpiece.
  • a forward directed angle is identified in Fig. 11 as arrow 1016.
  • plane 123 is slightly above (e.g., 5-20mm and preferably about 10mm) upper surface 1014 of lower portion 1004.
  • the fluid (not shown) ejected from a plurality of lower jets 1018 supports workpiece 122 as it is transferred from the cleaning station 104 to the rinse station 106.
  • the fluid from lower jets 1018 also rinses the under surface of workpiece 122 during transport and rinsing.
  • At least one fluid supply port 1020 of suitable configuration may be employed to provide fluid from an external source to lower portion 1004.
  • fluid supply port 1020 communicates with a distribution manifold (not shown) formed within lower portion 1004; the distribution manifold fluidly couples the lower jets 1018 together.
  • Upper portion 1002 may include a plurality of upper jets (hidden from view in the figures) configured to direct rinsing fluid to the upper surface of the workpiece 122 during transfer from cleaning station 104 and during the rinsing process.
  • the upper jets are aligned substantially along arrow 1016 to urge the workpiece completely forward into rinse station 106.
  • the upper jets direct fluid at an angle of approximately 10 to 60 degrees relative to upper portion 1002.
  • lower portion 1004 may include any number of wafer guides 1022.
  • wafer guides 1022 are formed as integral walls proximate the outer opposing edges of lower portion 1004.
  • Wafer guides 1022 are preferably configured and sized such that plane 123 resides beneath the upper height of wafer guides 1022.
  • Lower portion 1004 preferably contains at least one centering pin 1024 configured to maintain the workpiece 122 within a rinse area of rinse station 106.
  • the rinse area may be defined as the forward-most position that workpiece 122 may obtain within rinse station 106.
  • workpiece 122 contacts centering pin 1024 when it has traveled forward a predetermined distance.
  • a workpiece is substantially centered within the rinse station 106 and supported by the supporting fluid ejected from lower jets 1018 (see Fig. 14), the workpiece is said to be completely transferred from cleaning station 104 and residing within the rinse area.
  • rinse station 106 is caused to tilt downwardly, deviating from the horizontal plane by an angle in the range of 10°-50°, and most preferably about 30°.
  • a tilt control mechanism 1026 e.g. , a solenoid-actuated extension arm, is activated to urge rinse station 106 into the tilted position.
  • rinsing fluid is supplied to both the upper surface and bottom surface of the workpiece.
  • Upper jets and lower jets 1018 are preferably pressurized to deliver a suitable stream of fluid, such as deionized water, to the workpiece. It should be appreciated that workpiece throughput may be increased by simultaneously rinsing both the upper and lower surfaces of each workpiece.
  • rinse station 106 employs approximately 256 individual fluid jets that support, transport, and rinse the workpieces.
  • the multiple jets facilitate uniform rinsing and enhanced surface coverage of the workpiece.
  • rinse fluid is applied to the top surface at a rate in the range of 0.1-20 liters/minute, and most preferably about 4-5 liters/minute; similarly, rinse fluid is advantageously applied to the bottom surface at a rate in the range of 0.1-10 liters/minute, and most preferably about 1.5 liters/minute.
  • the individual jets are preferably sized and configured to provide substantially uniform fluid pressure during the rinsing process.
  • Machine 100 controls the supply of rinse fluid such that fluid is conserved when the rinsing cycle is completed.
  • manipulator 108 retrieves the rinsed workpiece and transfers the workpiece to spin-dry station 1 10. It should be appreciated that manipulator 108 and rinse station 106 may be alternatively configured such that the workpiece is removed from rinse station 106 while rinse station 106 is in the tilted position.
  • lower portion 1004 of rinse station 106 may include an arcuate recess 1028 formed therein.
  • Recess 1028 is configured to receive a portion of manipulator 108 when rinse station 106 is in the horizontal position. When the workpiece is positioned fully forward within rinse station 106, recess 1028 is located beneath the workpiece.
  • manipulator 108 suitably includes an arcuate-shaped arm 1500 configured to retrieve a rinsed workpiece from rinse station 106 and to transfer the workpiece to spin-dry station 110.
  • spin-dry station 110 includes at least two spin-dry assemblies 111 and 113. The use of rinse station 106, manipulator 108, and dual spin-dry station 1 10 in accordance with the present invention further facilitates increased workpiece throughput through machine 100.
  • Manipulator 108 preferably includes a base 1512 coupled to machine 100.
  • a swing arm 1506 is preferably coupled to base 1512 such that it is capable of rotation about a substantially vertical axis of rotation.
  • first and second transport sections 1502 and 1504 are located at the free end of swing arm 1506.
  • Base 1512 may include any number of conventional electromechanical components for rotating and lifting swing arm 1506 in accordance with operating protocols employed by manipulator 108.
  • Arm 1500 preferably includes first workpiece transport section 1502 and second workpiece transport section 1504 generally located on opposite sides of arm 1500.
  • First and second transport sections 1502 and 1504 are sized to fit within recess 1028 (see Fig. 14) and beneath the workpiece residing within rinse station 106.
  • first and second transport sections 1 02 and 1504 are configured to be received within recess 1028, swing arm 1506 (coupled to arcuate arm 1500) may not pass under the workpiece if it is in a lowered position. For example, while in a lowered position, manipulator 108 causes swing arm 1506 to rotate about a vertical rotational axis
  • first transport section 1502 resides within recess 1028 and underneath the workpiece.
  • manipulator 108 causes swing arm 1506 to lift upward along the direction defined by axis 1508.
  • a first suction pad 1510 associated with first transport section 1502 may be activated to gently secure the workpiece to first transport section 1502 during the transfer from rinse station 106 to spin-dry station 110.
  • a typical position for a workpiece 122 positioned upon first transport section 1502 is illustrated in phantom lines in Fig. 16.
  • Swing ami 1506 is suitably raised to a height sufficient to enable swing arm 1506 and workpiece 122 to pass between upper portion 1002 and lower portion 1004 of rinse station 106.
  • swing arm 1506 rotates to deposit the workpiece onto, e.g., first spin-dry assembly 11 1.
  • Swing arm 1506 may suitably lower arcuate arm 1500 onto first spin-dry assembly 1 1 1 and rotate to a predetermined wait position between spin-dry station 110 and rinse station 106.
  • manipulator 108 may pause until the next workpiece is fully rinsed by rinse station 106. When the next workpiece is ready for spin-drying, manipulator 108 causes second transport section 1504 to move beneath the workpiece, and the procedure described above in connection with the previous workpiece is repeated until the workpiece is deposited onto second spin-dry assembly 113.
  • the use of two transport sections enables manipulator 108 to be of a relatively simple design having only one axis of rotation and having a limited range of rotation.
  • manipulator 108 may be realized by a "dumb" robot having no interactive sensors or complex control protocols. Consequently, manipulator 108 may be reliably and robustly operated to process a large quantity of workpieces without maintenance or supervision.
  • manipulator 108 any suitable actuating mechanism, control system, motor, and the like, may be utilized in a practical realization of manipulator 108. Accordingly, the specific operating elements of manipulator 108 need not be described in detail herein.
  • rinse station 106 suitably includes a first rinse ring 1102 and a second rinse ring 1104 each mounted to a shuttle arm 1 106.
  • shuttle arm 1106 alternately shifts back and forth from a left position (as shown in Fig. 2B) to a right position (as shown in Fig. 18).
  • a workpiece carried by rinse ring 1 102 may assume position A (when shuttle assembly 1106 is in the left position shown in Fig. 2B) or position B (when shuttle assembly 1 106 is in the right position shown in Fig. 18); analogously, the workpiece carried by rinse ring 1 104 may assume position B (when shuttle assembly 1106 is in the left position shown in Fig.2B) or position C (when shuttle assembly 1106 is in the right position shown in Fig. 18).
  • each respective rinse ring assembly 1 102, 1104 suitably comprises a ring body 1 108 mounted to shuttle arm 1106.
  • Ring body 1108 suitably comprises a fluid manifold 1110 communicating with respective fluid supply ports 1 112A, 1 112B, and 1 1 12C.
  • Manifold 1 1 10 is advantageously configured with a plurality of jets 1 114 disposed about a substantially horizontal surface 11 16 of ring body 1108.
  • Fluid supply ports 1112 supply fluid to the internal region of manifold 1110. such that fluid is ejected from respective jets 1 1 14 at a substantially uniform pressure and flow about the arc defined by surface 1116.
  • plane 123 is slightly above (e.g., 5-20mm and preferably about 10mm) the horizontal surface defined by surface 1 1 16 of ring body 1 108.
  • the fluid (not shown) ejected from jets 11 14 supports workpiece 122 as the workpiece is transferred from the scrubber box to the rinse ring.
  • the workpiece is substantially centered about manifold 1 1 10 through the interaction of respective wafer guides 1 122, 1 124 and respective centering pins 1 118, 1120 as each workpiece is transferred from cleaning station 104 to the respective rinse ring along arrow 1126.
  • the perimeter edge of each workpiece may gently contact wafer guides 1122, 1 124 and/or one or both centering pins 1 118, 1 120, the mechanical contact between the flat workpiece surfaces and rinse ring body 1 108 is substantially avoided.
  • a first fluid nozzle 1202 is suitably configured to discharge rinse fluid at the upper surface of the workpiece, substantially along arrow 1204.
  • a second rinse nozzle 1206 is suitably configured to discharge rinse fluid at the bottom surface of the workpiece, substantially along arrow 1208.
  • rinse station 106 throughput may be increased by simultaneously rinsing both the upper and lower surfaces of each workpiece. Moreover, by orienting first rinse nozzle 1202 with respect to the upper surface of the workpiece as shown in Fig. 19B, the perimeter edge of the workpiece may also be effectively rinsed.
  • rinse fluid is applied to the top surface at a rate in the range of 0.1-20 liters/minute, and most preferably about 4-5 liters/minute; similarly, rinse fluid is advantageously applied to the bottom surface at a rate in the range of 0.1 - 10 liters/minute, and most preferably about 1.5 liters/minute.
  • first transfer station 107 retrieves the rinsed workpiece and transfers the workpiece to spin-dry station 1 10; alternatively, first transfer station 107 may suitably retrieve the rinsed workpiece from the rinse ring while the rinse ring is in the tilted position.
  • first transfer station 107 suitably comprises a robotic arm 109 configured to retrieve a rinsed workpiece from rinse ring 1104 and transfer the workpiece to a spin-dry assembly 1 11.
  • a similar robotic assembly (not shown) is disposed within transfer station 107, and configured to retrieve a rinsed workpiece from rinse ring 1102 (when rinse ring 1102 is in position A as shown in Fig.2B) and transfer the workpiece to spin-dry assembly 113.
  • the use of dual rinse rings, transfer assemblies, and spin-dry stations in accordance with the present invention further facilitates increased workpiece throughput through machine 100.
  • Each spin-dry assembly 11 1, 113 in accordance with the present invention suitably comprises a spin platform 1600 configured to hold the workpiece as it is spin dried.
  • platform 1600 suitably comprises a flat upper surface 1602 having a plurality (e.g., 3 or 5) of slots 1610 which extend through disk shaped platform 1600.
  • the under surface of platform 1600 suitably comprises a hub 1606 having a cylindrical cavity 1604 for receiving a drive shaft (not shown); the drive shaft is suitably connected to a spinner motor, discussed below, for rotating support platform 1600.
  • a bob 1800 is suitably disposed within each slot 1610 and configured to clamp a workpiece during the rotation of spin platform 1600, as described in greater detail below.
  • five bobs 1800 are employed such that spin-dry assemblies 1 11 and 1 13 can be used with conventional round wafer workpieces or substantially round wafer workpieces having a straight-edged portion.
  • Each bob 1800 suitably comprises an upper body portion 1802, a lower body portion
  • Each bob 1800 is suitably pivotably secured within each respective slot 1610 through any convenient mechanism, for example by extending pivot bar 1810 through corresponding pivot supports (not shown) in platform 1600.
  • a suitable spring 1608 is configured to bias bob 1800 such that wafer clamp 1806 is urged upwardly; in so doing, each wafer clamp is also urged inwardly, securely holding workpiece 122 in place as shown in Fig. 22.
  • a respective button actuator assembly 1704 disposed proximate each of the bobs 1800 is configured to extend upwardly along arrow 1702 and contact the under surface of bob 1800, generally as indicated by arrow 1702.
  • the spring force exerted by spring 1608 is counteracted, such that each wafer clamp 1806 associated with each bob 1800 is urged radially outwardly allowing workpiece 122 to drop downwardly, supported only by respective buttons 1808.
  • each respective button 1808 is suitably made from a soft, resilient material which will not damage the under surface of the workpiece 122.
  • a transfer mechanism 1 12 retrieves the workpiece and transfers it to unload station 1 14. While one workpiece is being dried or transferred from a spin-dry assembly 11 1, 1 13 to unload station 114, a second workpiece may be manipulated by manipulator 108. In the alternate embodiment described above, first transfer station 107 may then retrieve a recently rinsed workpiece from rinse station 106 and transfer the workpiece to spin platform 1600. More particularly, with respective wafer clamps 1806 in their retracted, undamped positions, manipulator (or first transfer station 107) places a workpiece on spin platform 1600 supported only by respective buttons 1808.
  • button actuators 1704 are moved downwardly, such that each respective spring 1608 causes each bob 1800 to pivot about pivot bar 1810, such that the respective wafer clamps 1806 are urged radially inwardly, thereby clamping the workpiece.
  • the respective button actuators 1704 may be urged upwardly and downwardly through any desired mechanism, for example pneumatically.
  • the beveled configuration of respective clamps 1806 permit the clamps to lift the workpiece off of the buttons slightly, suitably to preclude contact between the workpiece and the buttons during the spinning operation.
  • spin platform 1600 In this initially clamped position, spin platform 1600, driven by the drive motor (not shown) discussed below, begins spinning at relatively low rpms (e.g. in the range of 500 rpm). Once a desired secondary clamping spin speed is achieved, centrifugal force causes each bob 1800 to further pivot about pivot bar 1810, such that the respective wafer clamps 1806 more securely hold the workpiece.
  • each spin-dry assembly 111, 1 13 includes a shield assembly 1820 configured to substantially surround the respective platform 1602.
  • shield assembly 1820 is suitably formed from a material substantially impermeable by cleaning and rinsing fluids, compounds, and other chemicals employed by machine 100.
  • Fig. 24 depicts shield assembly 1820 in a lowered position (solid lines) and in a raised position (phantom lines).
  • Shield assembly 1820 preferably includes a perimetrical upper edge 1822 that resides at a suitable height above spin platform 1600 during the spin-drying process. After the spin-drying process is complete, upper edge 1822 is lowered to a height below the upper surface 1602 of spin platform 1600. In the preferred embodiment, the upper edge 1822 raises approximately one inch (I ”) above upper surface 1602 of spin platform 1600. The specific height may vary depending upon the spinning speed, the arrangement of neighboring components of machine 100, or the amount of protection desired.
  • Shield assembly 1820 may be raised and lowered by any number of suitable actuating mechanisms 1823, such as a solenoid or a pneumatic lifter. Actuating mechanisms 1823 may be controlled in accordance with timing protocols associated with the respective spin-dry assembly 111, 113.
  • Shield assembly 1820 is preferably cylindrical in shape; spin platform 1600 is preferably round. As depicted in Fig. 21, shield assembly 1820 and spin platform 1600 may be substantially concentric, which facilitates effective protection for the surrounding workpieces and components of machine 100 and helps to reduce the size of machine 100. With momentary reference to Fig.2B, each of respective spin-dry assemblies 1 11, 113 may alternatively be enclosable within a spin-dry chamber 1840. More particularly, a first door 1842 and a second door 1844 may be suitably configured to open (e.g., by extending vertically upwardly, vertically downwardly, or in any convenient manner) to permit the robotic arm associated with first transfer station 107 to transfer a workpiece from rinse station 106 onto the spin-dry platform.
  • a second door 1844 may be configured to open to permit second transfer station 112 to transfer a dried workpiece, after spin- drying, from the spin-dry platform to unload station 114.
  • respective doors 1842 and 1844 are advantageously closed.
  • respective spin-dry assemblies 1 11 and 1 13 each include a motor (not shown) configured to rotate the spin platform 1600 and the workpiece carried thereby at high speed to thereby remove fluid from the workpiece.
  • a substantially linear ramp is employed as opposed to the stepwise ramp techniques common in the prior art.
  • the entire acceleration ramp is substantially linear from zero to the top operating speed.
  • the spinning assembly is accelerated to in the range of 3,000-5,000 RPM, and most preferably about 4,000 RPM.
  • a substantially linear ramp is employed from approximately the rest position to 4,000 RPM.
  • the spin assembly 111, 113 is ramped from the point at which the workpiece is securely clamped to the spin platform (e.g. , 500 RPM) to approximately 4,000 RPM in a range of 4-30 seconds, and most preferably about 6-8 seconds.
  • the spin platform e.g. , 500 RPM
  • top speed e.g., 4,000 RPM
  • it is maintained for in the range of 4-20 seconds, and most preferably about 10 seconds.
  • a substantially linear ramp is employed to decelerate the spin assembly.
  • deceleration is effected in approximately 4-30 seconds, and most preferably about 6-8 seconds.
  • the spin-dry assembly 1 1 1, 113 is suitably accelerated from the rest position to approximately the secondary clamping speed at a first acceleration, for example in the range of 20-1,000, and most preferably about 250-300 rpms/second/second.
  • this original acceleration up to the secondary clamping speed suitably occurs in the range of 0.5-5 seconds, and most preferably in the range of about 1-2 seconds.
  • clamping speed e.g. 500 rpm
  • top speed e.g. 4,000 rpm
  • substantially linear (but suitably higher) acceleration e.g. 500 rpm
  • the spin assembly may be accelerated from 500-4,000 rpm in the range of 0.5-10 seconds and most preferably in the range of about 1-2 seconds.
  • harmonics and resonant frequencies are substantially isolated from the workpiece to thereby minimize the possibility of workpiece breakage in the following manner.
  • the present inventors have determined that spin assembly performance can be greatly enhanced through the careful selection of an appropriate spinner motor.
  • a model number ASM 121 brushless servo motor available from Berkeley Process Control, Inc. of Richmond, California, or a functionally equivalent motor may suitably be employed as the spinner motor.
  • the spinner motor comprises a self-tuning feature whereby the motor may be configured to automatically tune itself to optimize its performance within the anticipated operating environment within machine 100.
  • each spin-dry assembly 1 1 1 and 113 may be pretuned by placing a sample workpiece in the spin-dry assembly, and placing the motor (not shown) in the auto-tune or self-tuning mode of operation. This is preferably done while machine 100 is fully operational, thereby optimally simulating the operating environment. The spin-dry assembly 1 11, 113 is then ramped-up in accordance with normal operating process parameters, and the motor is allowed to tune itself to the operating environment.
  • self-tuning motors generally define an operational profile within which the motor optimally operates in an intended operating environment by adjusting various parameters including current, frequency, torque, and the like. In so doing, harmonics and resonant frequencies which may otherwise be contributed to the spin-dry system by the motor are substantially eliminated.
  • machine 100 may be configured to automatically cease operation; alternatively, the operator may suitably stop the machine and retune the spinner motor by placing the spinner motor back in its self-tune mode of operation and retuning the motor. In this way, damaged and broken workpieces as a result of the poor performance of the spinner motor may be substantially eliminated.
  • second transfer assembly 112 is suitably configured to alternatively retrieve dried workpieces from respective spin-dry assemblies 1 1 1 and 1 13.
  • second transfer assembly 112 suitably comprises an extendable, rotatable robotic arm 115 configured to grasp workpieces from each spin-dry assembly and load the workpieces into unload station 1 14.
  • unload station 1 14 suitably comprises a first unload cassette assembly 1 17 and a second unload cassette assembly 1 19.
  • transfer assembly 1 12 alternately retrieves dry workpieces from both spin-dry assemblies 1 11 and 113, and sequentially loads the workpieces into the cassette associated with unload assembly 119 until the cassette is filled.
  • a cassette full sensor (not shown) may be disposed within or proximate cassette unload assembly 1 19 to indicate that the cassette associated with assembly 119 is filled with dry workpieces.
  • transfer station 1 12 continues retrieving dry workpieces from respective spin assemblies 1 1 1 and 113, and begins loading them into the cassette associated with unload cassette assembly 117. While cassette assembly 1 17 is being filled with dry wafers, the full cassette from assembly 1 19 may be removed (either manually or automatically) and replaced with an empty cassette. In this way, the unloading of dry cassettes from machine 100 may be accomplished in a substantially continuous, uninterrupted manner as desired.
  • machine 100 In accordance with a further aspect of the present invention, as variously described above, during the operation of the machine 100 various fluids need to be supplied to the rinse rings (to both support the workpiece and rinse the workpiece), the water track, and to the roller box. Moreover, a plurality of different fluids (e.g., 3) may need to be supplied to the scrub box during the cleaning operation.
  • machine 100 is suitably configured such that a desired volume rate of flow is supplied to these various operations, which flow rate is substantially unaffected by changes in fluid supply pressure, as described below.
  • an exemplary fluid site 1408 may comprise rinse station 106, a fluid inlet port in cleaning station 104, or a workpiece rinse supply port, for example.
  • the process controller (or one of several process controllers) 1416 associated with machine 100 the volume rate of fluid flow to fluid site 1408 may be accurately controlled notwithstanding the presence of variations in the fluid supply pressure.
  • An exemplary hydraulic control scheme 1400 suitably comprises a tank 1402 for holding a supply of a desired processing fluid, a flow meter 1406 having a variable orifice size, a plug valve 1404 for controlling the orifice size of flow meter 1406, and an air servo 1410 for providing an analogue air signal to plug valve 1404, and a processor 1416.
  • a suitable air servo may comprise a model number QB2T1300 manufactured by Proportion-Air of McCordsville, Indiana under U.S. Patent No. 4,901,758.
  • servo valve 1410 suitably comprises a single loop model having internal valves, manifold, internal pressure transducer and electronic controls configured to output an air pressure proportional to an input electrical signal.
  • an electrical signal 1412 from processor 1416 suitably controls the output of servo 1410.
  • flow meter 1406 may suitably comprise a rotary wheel flow meter/switch, for example, a model number M-10000T, M 10000TM-200T, or the like available from the Malema Engineering Corporation.
  • a desired flow rate through flow meter 1406 to fluid site 1408 is suitably programmed into processor 1416 prior to (or during) operation of machine 100.
  • flow meter 1406 outputs an electrical signal 1414 indicative of the actual flow rate through flow meter 1406 to site 1408.
  • Processor 1416 receives electrical signal 1414 and, responding thereto, adjusts the orifice size associated with flow meter 1406 as necessary to maintain the actual flow rate within a predetermined range from the desired set point flow rate.
  • processor 1416 outputs an electrical signal 1412 to servo 1410 to thereby change the analogue air pressure signal 1418 output by air servo 1410 and applied to plug valve 1404.
  • plug valve 1404 changes the orifice size associated with flow meter 1406 in an amount necessary to drive the error between the actual flow rate and the desired flow rate through flow meter 1406 to a minimum.
  • a real time, closed loop PID control scheme is employed by processor 1416 to effect this function.
  • air servo 1410 and plug valve 1404 could simply be eliminated, such that a direct actuation device may be employed to vary the orifice size of flow meter 1406.
  • any suitable torque motor, stepper motor, servo motor, or the like could be employed to directly control the orifice site associated with the flow meter.
  • wafer cleaning machine 100 may be advantageously configured in a substantially modular configuration to facilitate the convenient maintenance, repair, troubleshooting, adaptation, and extension of the machine. More particularly and referring to Figs. 26 and 27, in a preferred embodiment machine 100 suitably comprises a first control tier 1902, a second maintenance tier 1904, and a third process plane tier 1906.
  • Top tier 1906 suitably corresponds to the workpiece processes described above, and advantageously comprises the various spin assemblies, rinse assemblies, scrubber box, and the like, as well as the various motors and actuators associated therewith.
  • Maintenance tier 1904 suitably comprises a plurality of access panels (not shown for clarity) to permit convenient access to various daily and weekly maintenance items, including air filters, fluid filters, and the like.
  • Control tier 1902 suitably houses various features relating to control functions, advantageously organized in discreet compartments each comprising functionally related hardware and related fixtures. More particularly, tier 1902 further comprises a number of drawers and/or skin panels which permit the operator to access various control and functional components.
  • a first drawer 1908 may house a fluid compartment comprising fluid control valves and the like.
  • a second drawer 1910 may house a pneumatics compartment, comprising vacuum lines, pneumatic control valves and the like.
  • a third drawer 1912 may contain the control functionality relating to the electronics of the machine, including input-output ports and a distributed processor, for example one available from Berkeley Process Control. The above functional and control elements may alternatively be accessible via one or more skin panels.
  • machine 100 By configuring machine 100 in accordance with the foregoing modular arrangement, maintenance and repair of machine 100 may be greatly simplified. For example, substantially all components which are logically related to one another may be housed in a common compartment, so that for example all fluids may be checked and fluid systems modified in a single location. As a further example, substantially all of the electronic controls and processing systems may be accessed at a single location (i.e., drawer 1912). To further facilitate the convenient maintenance, repair, and extension of machine 100, respective drawers 1908-1912 are suitably slidingly moveable with respect to the frame of machine 100, for example using ball bearing slide mechanisms functionally analogous to those used in file drawers.
  • the various electrical conduits associated with drawer 1912, the pneumatic conduits associated with drawer 1910, and the hydraulic conduits associated with drawer 1908 are suitably encased in respective flexible conduit tracks 1914A-D.
  • an end 1916 of an exemplary flexible conduit 1914A may be suitably attached to the rear portion 1918 of drawer 1912.
  • flexible conduit 1 16 moves along with the drawer.
  • conduit 1914A slides along with drawer 1912 the various electrical conduits within sleeve 1914A remain stationery and protected from damage by conduit 1914A.
  • the modular construction of machine 100 facilitates the extension of the machine to incorporate additional related functionality or even different functionality entirely.
  • the various processing stations e.g., wafer loading station 102 or cleaning station 104
  • the various processing stations may be contained within separate subframe structures which together comprise the frame associated with machine 100.
  • a frame member 2102 associated with load station 102 is shown abutting against a frame member 2104 associated with cleaning station 104.
  • Respective frame members 2102 and 2104 may be secured to one another, for example through bolts or other fasteners, as desired.
  • respective stations 102 and 104 may be separated at the junction 2106 which defines their interface, and an additional functional module inserted therebetween.
  • the newly inserted functional module may also include a first, second, and third tier component which respectively house the processing, maintenance, and control functionality of the additional module, as desired.
  • a touch screen display (not shown) may suitably be employed to allow the operator to monitor, reconfigure, troubleshoot, and otherwise operate machine 100. More particularly, a touch screen display panel may be configured to display, preferably in three dimensions, a graphical representation of the various operational features of machine 100 described above. For example, if the operator desires to load a new cassette into load station 102, the operator may press a graphical icon representative of load station 102 on the touch screen display. The touch screen display may then prompt the operator with questions, or may simply permit the operator to touch the door associated with the cassette loading function to thereby open the door. This model of touch screen interaction may be applied to virtually any aspect of machine 100 described herein.

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Abstract

Le présente invention a trait à une machine destinée au nettoyage de tranches, comportant un poste d'entrée, une voie d'eau, un poste de nettoyage, un poste de rinçage, un poste d'essorage centrifuge, et un poste de chargement. Le poste d'entrée comprend au moins deux zones d'alimentation assurant une alimentation en continu de tranches vers la voie d'eau. Une fois que les tranches sont passées du poste d'entrée à la voie d'eau, celles-ci sont acheminées le long de la voie d'eau au poste de nettoyage. Le poste de nettoyage comprend plusieurs paires de rouleaux entraînant les tranches à travers le poste de nettoyage, permettant ainsi le nettoyage des surfaces planes, supérieure et inférieure, des tranches. Un distributeur de fluide nettoyant, formé dans le panneau supérieur du poste de nettoyage, permet une bonne distribution du fluide nettoyant en direction des rouleaux. Du poste de nettoyage, les tranches sont transportées vers un poste de rinçage. Du poste de rinçage, les pièces à travailler sont déplacées vers un poste double d'essorage centrifuge, où elles sont centrifugées à grande vitesse afin d'en éliminer toute goutte d'eau résiduelle ou autre. Un bras-transfert manipulateur sort les pièces du poste d'essorage centrifuge et les place dans l'une des deux caissettes de déchargement. Ces dernières une fois remplies de tranches, sont enlevées et déplacées pour être traitées ultérieurement.
PCT/US1997/011830 1996-07-08 1997-07-08 Procedes et dispositif de nettoyage, rinçage et sechage de tranches WO1998001892A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9900410A GB2334145B (en) 1996-07-08 1997-07-08 Methods and apparatus for cleaning,rinsing and drying wafers
DE19781822A DE19781822B4 (de) 1996-07-08 1997-07-08 Reinigungsstation zur Verwendung bei einem System zum Reinigen, Spülen und Trocknen von Halbleiterscheiben
JP50531798A JP2002509643A (ja) 1996-07-08 1997-07-08 ウェハー洗浄、リンスおよび乾燥方法および装置
DE19781822T DE19781822T1 (de) 1996-07-08 1997-07-08 Verfahren und Vorrichtung zum Reinigen, Spülen und Trocknen von Wafern

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/676,546 US5950327A (en) 1996-07-08 1996-07-08 Methods and apparatus for cleaning and drying wafers
US08/676,546 1996-07-08
US85520897A 1997-03-13 1997-03-13
US08/855,208 1997-03-13

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WO1998001892A1 true WO1998001892A1 (fr) 1998-01-15

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JP (1) JP2002509643A (fr)
KR (1) KR20000023597A (fr)
DE (2) DE19781822T1 (fr)
GB (1) GB2334145B (fr)
TW (1) TW387093B (fr)
WO (1) WO1998001892A1 (fr)

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WO1999053531A2 (fr) * 1998-04-10 1999-10-21 Speedfam-Ipec Corporation Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique
WO2000046841A1 (fr) * 1999-02-04 2000-08-10 Steag Microtech Gmbh Procede et dispositif pour nettoyer des substrats
WO2000046842A2 (fr) * 1999-02-03 2000-08-10 Speedfam-Ipec Corporation Appareil de nettoyage de pieces, et procedes associes
US6356091B1 (en) 1998-11-19 2002-03-12 Speedfam-Ipec Corporation Automatic wafer mapping in a wet environment on a wafer cleaner
US6573522B2 (en) 2001-06-27 2003-06-03 Applied Matrials, Inc. Locator pin integrated with sensor for detecting semiconductor substrate carrier
CN105665339A (zh) * 2016-02-17 2016-06-15 上海华力微电子有限公司 一种用于槽型湿法设备的干燥装置及干燥方法
WO2023284238A1 (fr) * 2021-07-16 2023-01-19 北京石头世纪科技股份有限公司 Station de base et système de robot de nettoyage

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999040612A1 (fr) * 1998-02-09 1999-08-12 Speedfam-Ipec Corporation Poste de nettoyage au fluorure d'hydrogene apres traitement planar chimique et mecanique
US6125861A (en) * 1998-02-09 2000-10-03 Speedfam-Ipec Corporation Post-CMP wet-HF cleaning station
WO1999053531A2 (fr) * 1998-04-10 1999-10-21 Speedfam-Ipec Corporation Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique
WO1999053531A3 (fr) * 1998-04-10 2000-03-09 Speedfam Ipec Corp Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique
US6356091B1 (en) 1998-11-19 2002-03-12 Speedfam-Ipec Corporation Automatic wafer mapping in a wet environment on a wafer cleaner
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
WO2000046842A2 (fr) * 1999-02-03 2000-08-10 Speedfam-Ipec Corporation Appareil de nettoyage de pieces, et procedes associes
WO2000046842A3 (fr) * 1999-02-03 2000-12-21 Speedfam Ipec Corp Appareil de nettoyage de pieces, et procedes associes
WO2000046841A1 (fr) * 1999-02-04 2000-08-10 Steag Microtech Gmbh Procede et dispositif pour nettoyer des substrats
US6573522B2 (en) 2001-06-27 2003-06-03 Applied Matrials, Inc. Locator pin integrated with sensor for detecting semiconductor substrate carrier
CN105665339A (zh) * 2016-02-17 2016-06-15 上海华力微电子有限公司 一种用于槽型湿法设备的干燥装置及干燥方法
CN105665339B (zh) * 2016-02-17 2018-04-06 上海华力微电子有限公司 一种用于槽型湿法设备的干燥装置及干燥方法
WO2023284238A1 (fr) * 2021-07-16 2023-01-19 北京石头世纪科技股份有限公司 Station de base et système de robot de nettoyage

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TW387093B (en) 2000-04-11
GB2334145A (en) 1999-08-11
JP2002509643A (ja) 2002-03-26
GB9900410D0 (en) 1999-02-24
GB2334145B (en) 2001-08-22
KR20000023597A (ko) 2000-04-25
DE19781822B4 (de) 2004-09-09
DE19781822T1 (de) 1999-06-17

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