WO1996024177A1 - Isolateur et connecteur haute frequence - Google Patents
Isolateur et connecteur haute frequence Download PDFInfo
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- WO1996024177A1 WO1996024177A1 PCT/JP1996/000179 JP9600179W WO9624177A1 WO 1996024177 A1 WO1996024177 A1 WO 1996024177A1 JP 9600179 W JP9600179 W JP 9600179W WO 9624177 A1 WO9624177 A1 WO 9624177A1
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- WMAOTPCQHADLHO-UHFFFAOYSA-N triethyl(triethylsilyloxysilyloxy)silane Chemical compound C(C)[Si](O[SiH2]O[Si](CC)(CC)CC)(CC)CC WMAOTPCQHADLHO-UHFFFAOYSA-N 0.000 description 1
- ISAWZZLQDXAOQF-UHFFFAOYSA-N tripropyl(tripropylsilyloxysilyloxy)silane Chemical compound C(CC)[Si](O[SiH2]O[Si](CCC)(CCC)CCC)(CCC)CCC ISAWZZLQDXAOQF-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/42—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches
- H01R24/44—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2103/00—Two poles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/933—Special insulation
Definitions
- the present invention relates to an insulator for a connector excellent in high-frequency characteristics and a high-frequency connector using the same, and more particularly, to an insulator and a high-frequency connector using the same, which generate less reflected waves at a contact portion.
- the material used is preferably a material having a small dielectric tangent and a small dielectric tangent. If these are large, a part of the energy given as high frequency will cause intramolecular friction inside the material and will be lost as heat.
- resins having a small dielectric constant and a low dielectric loss tangent include polytetrafluoroethylene, polytetrafluoroethylene-perfluoroalkylvinyl ether copolymer resin, and polymethylpentene. In recent years, it has been proposed to use a thermoplastic norbornene-based resin.
- the voltage standing wave ratio is used as an index to indicate the magnitude of the resulting insulator reflection.
- VSWR voltage standing wave ratio
- dB return loss value
- a resin molded from polytetrafluoroethylene / perfluoroalkylvinyl ether copolymer resin or polymethylpentene has been put to practical use. These resins can be injection-molded, and have a small dielectric loss tangent of 0.003 or less in the range of 1 ⁇ to 10 GHz and a small dielectric constant of 2.20 or less. . However, at frequencies above 1 GHz, it is difficult for insulators made of these resins to reduce the value of the voltage standing wave ratio to 1.40 or less.
- the dielectric loss tangent is as small as 0.004 or less in the range of 1 MHz to 10 GHz, and the dielectric constant is also low. 2. It is as small as 10 or less. Further, an insulator having a voltage standing wave ratio of 1.20 or less at this frequency can be obtained from this resin. However, since this resin cannot be injection-molded and is molded by cutting, there is a problem that mass production is difficult.
- the upper limit of the usable frequency differs depending on the structure. Smaller size can be used at higher frequency.
- a gap is provided in the insulator so that air having a dielectric constant of 1 is interposed therebetween, and the gap can be enlarged so that the insulator can be used at a higher frequency.
- a gap is provided in a small one, a problem of strength arises.
- thermoplastic norbornene-based resin can be injection-molded, has a small dielectric loss tangent at 1 MHz to 10 GHz of 0.004 or less, and has a small dielectric constant of 2.25 or less. . It has never been used as an insulator of a connector, and there is no known example of measuring the value of the voltage standing wave ratio at any wavelength. It was impossible to predict at all how high a voltage standing wave ratio could be obtained with a high frequency band insulator.
- An object of the present invention is to easily mold by injection molding or the like.
- the dielectric loss tangent and dielectric constant are small, and the value of the voltage standing wave ratio is 1.20 or less.
- a desired insulator can be obtained by using a thermoplastic norbornene-based resin as a material, thereby completing the present invention.
- a high-frequency connector having an insulator having a voltage standing wave ratio of 1.20 or less in a high-frequency band of 1.4 GHz or more, which is made of a thermoplastic norbornene resin.
- the molding material of the insulator according to the present invention comprises a thermoplastic norbornene resin.
- Specific examples thereof include hydrogenated ring-opening polymers of norbornene monomers, addition polymers of norbornene monomers, and addition polymers of norbornene monomers and olefins. .
- a monomer known in, for example, Japanese Patent Application Laid-Open No. 2-276842 such as norbornene, its alkyl, alkylidene, aromatic-substituted derivatives and halogens, hydroxyl groups, and ester groups of these substituted or unsubstituted olefins.
- Substituents having a substituent containing an element other than carbon and hydrogen such as an alkoxy group, a cyano group, an amide group, an imido group, and a silyl group; for example, 2-norbornene, 5-methyl-12-norbornene , 5, 5-dimethyl-1-norbornene, 5-ethyl-1-norbornene, 5-butyl-2-norbornene, 5-ethylidene-1-norbornene, 5-methoxycarbonyl 1-norbornene, 5-cyano 2-norbornene, 5-methyl-5-methoxycarbonyl-12-norbornene, 5-phenyl-1-norbornene, 5-phenyl-1-5-methyl-1-norbornene, 5- Hexyl-1-norboernene, 5-year-old octyl-12-norbornene, 5-octyldecyl-1-norbornene, etc .;
- the number average molecular weight of the thermoplastic norbornene resin used in the present invention is 100,000 or more, preferably 100,000 or more, in terms of polystyrene measured by a GPC (gel 'permeation' chromatography) method using a toluene solvent. 15 000 or more, more preferably 20 000 or more, 200 000 or less, preferably 100 000 or less, more preferably 50 000 or less Things. If the molecular weight is too small, the mechanical strength is low, and if it is too large, molding becomes difficult.
- the hydrogenation rate of the main chain structure is preferably at least 90%, more preferably at least 95%, particularly preferably at least 99%. If the rate of hydrogen addition is low and there are many unsaturated bonds in the main chain structure, heat resistance and deterioration are poor, and long In some cases, it becomes difficult to use the power supply stably for a long period of time, and there is a problem in that the dielectric constant and the dielectric loss tangent increase in electrical characteristics.
- thermoplastic norbornene resin is preferably such that the proportion of a monomer having a substituent containing elements other than carbon and hydrogen, that is, a polar group, is 70 mol% or less, and 30 mol% or less. Those which are more preferable, and those which are not used at all are particularly preferable. Those having many polar groups tend to polarize and easily absorb water, causing a large change in the dielectric loss tangent and a problem in terms of increasing the dielectric constant. Not suitable for insulating material in.
- the glass transition temperature (hereinafter referred to as Tg) of the thermoplastic norbornene resin is preferably 110 ° C or higher, more preferably 120 ° C or higher, and more preferably 130 ° C or higher. Are particularly preferred. If the Tg is too low, the heat resistance decreases.
- the molding material of the present invention may be a thermoplastic norbornene resin alone, but the slidability can be improved by blending a silicone-modified polyolefin as a slidability improver.
- a molding material containing a silicone-modified polyolefin since the connection and release can be easily performed.
- the silicone-modified polyolefin is not particularly limited as long as it is a polymer composed of a polyolefin block and a polysiloxane block.
- the polyolefin block has a number average molecular weight of usually 10,000 or more, preferably 15,000 or more, more preferably 20,000 or more, usually 20 or more, in terms of polystyrene measured by the GPC method. 0, 000 or less, preferably 100, 000 or less, more preferably 50, 000 or less. If the molecular weight is small, there is a problem in the strength / slidability of the molded article of the present invention. It contains 50% by weight or more, preferably 70% by weight or more, more preferably 90% by weight or more of a repeating structural unit derived from an olefin such as ethylene, propylene, or styrene. May be present, but generally, a linear one is preferred. If the resin has a branched structure or too few repeating structural units derived from the olefins, the thermoplastic In some cases, it cannot be uniformly dispersed in the linen resin.
- the polysiloxane block bonded to the polyolefin block at a rate of not less than 1/3 usually has a number average molecular weight of at least 3,000, preferably at least 5,000 in terms of polystyrene as measured by the GPC method. Above, more preferably 7,000 or more, usually 200,000 or less, preferably 100,000 or less, more preferably 50,000 or less. If the molecular weight is too small, there is a problem in the slidability of the molded article of the present invention, and if it is too large, it is difficult to uniformly disperse it in the thermoplastic norbornene resin.
- Examples of the monomer used for the polymerization include octamethyltetrasiloxane, octaethyltetrasiloxane, octapropyltetrasiloxane, hexamethyltrisiloxane, hexaethyltrisiloxane, and hexapropyltrisiloxane.
- the polysiloxane block is 1 part by weight or more, preferably 5 parts by weight or more, more preferably 10 parts by weight or more, and 200 parts by weight or less, preferably 100 parts by weight of the polyolefin block. Those bonded at a ratio of 180 parts by weight or less, more preferably 160 parts by weight or less are exemplified. Two or more polysiloxane blocks may be bonded to one polyolefin block. If the amount of the polysiloxane is too small, the slidability of the molded article is poor. If the amount is too large, the production of the insulator becomes difficult and the productivity decreases.
- the silicone-modified polyolefin used in the present invention has a number average molecular weight of preferably at least 20,000, more preferably at least 30,000, particularly preferably at least 40,000 in terms of polystyrene measured by the GPC method. It is at least 000, preferably at most 400, 000, more preferably at most 200, 000, particularly preferably at most 100, 000. If the molecular weight is too small, there is a problem in the slidability of the molded article of the present invention, and if it is too large, it is difficult to uniformly disperse in the thermoplastic norbornene resin.
- Silicone-modified polyolefins can be prepared either by preparing a polyolefin in advance and grafting a polysiloxane block that has been prepared separately, or by graft-polymerizing a siloxane monomer in the presence of the polyolefin. Good. Further, a polymer obtained by polymerizing a polyolefin using polysiloxane xanprox having a structure capable of copolymerizing with olefins at the terminal as a polymer comonomer may be used. In the former case, poly The portion that binds to the silicone block of the olefin must have a structure that can bind to the silicone block, and generally a polar group is introduced.
- the method of introduction is not particularly limited, and may be a method such as modification such as terminal modification or use of a comonomer having a polar group.
- a siloxane monomer may be polymerized by a living anion polymerization method, silyl bromide or the like may be bonded to a terminal to form a high-molecular comonomer, and copolymerized with polyolefin.
- silicone-modified polyolefin commercially available silicone-modified polyolefins, for example, Sumikasen SP300 and Sumikacene SP310 (both of which are manufactured by Sumitomo Chemical Co., Ltd.) can be suitably used.
- the amount of the silicone-modified polyolefin is 0.5 parts by weight or more, preferably 1 part by weight or more, more preferably 5 parts by weight or more and 50 parts by weight or less based on 100 parts by weight of the thermoplastic norbornene resin. It is preferably 30 parts by weight or less, more preferably 20 parts by weight or less. If the amount is too small, the slidability is inferior, and if the amount is too large, the electrical characteristics deteriorate.
- the molding material of the present invention can improve the impact resistance by containing a soft polymer. Particularly, when the connection and disconnection of the connector are repeated, the insulation is hardly affected by the impact, and the crack is cracked. It is preferable because it is difficult to be used.
- the soft polymer used in the present invention is not particularly limited, and a polymer having a Tg of 40 ° C. or less is preferable because of its excellent impact resistance.
- Some block copolymers have a Tg of two or more points, but if one of them has a Tg of 40 ° C. or less, it is preferable as a soft polymer used in the present invention.
- the molecular weight of such a copolymer is preferably at least 10,000, more preferably at least 20,000, particularly preferably at least 30,000, and preferably at least 400,000. 0 or less, more preferably 300,000 or less, particularly preferably 200,000 or less. If the molecular weight is too small, the mechanical properties are inferior, and if it is too high, production is difficult.
- a non-polar resin that is, a resin composed of only carbon and hydrogen is preferable.
- the polymer used in the present invention includes styrene-butadiene-block copolymer.
- a copolymer of an aromatic vinyl 'monomer and a conjugated diene monomer is preferred in terms of easily reducing the amount of metal elements, a block copolymer is particularly preferred, and a hydrogenated product thereof is preferred in view of excellent weather resistance.
- the amount of the soft polymer is 1 part by weight or more, preferably 5 parts by weight or more, more preferably 10 parts by weight or more, and 40 parts by weight or less, based on 100 parts by weight of the thermoplastic norbornene resin. Is 30 parts by weight or less, more preferably 20 parts by weight or less. If the amount is too small, the impact resistance is poor. If the amount is too large, excellent properties of the thermoplastic norbornene resin such as heat resistance and chemical resistance are lost.
- the molding material used in the present invention may contain various additives as needed, as long as the effects of the present invention are not lost.
- additives for example, phenol-based or phosphorus-based antioxidants; phenol-based thermal deterioration inhibitors; benzophenone-based ultraviolet stabilizers; amine-based antistatic agents; aliphatic alcohol partial esters and Partial lubricants such as ethers; Resins such as ethylene polymers; Slidability-imparting agents such as graphite and fluororesin powder; Fillers with low dielectric constant and low dielectric loss tangent such as glass fiber: Is exemplified.
- the molding material used in the present invention has a metal element content of 5 ppm or less, preferably 4 ppm or less, more preferably 3 ppm or less. If the amount of the metal element is too large, the electrical properties of the molding material, such as the dielectric constant and dielectric contact, deteriorate.
- a molding material In order to obtain such a molding material, it is necessary to (1) mix a silicone-modified polyolefin, a low molecular weight polymer, etc., with a small amount of a metal element with a thermoplastic norbornene resin having a small amount of a metal element, if necessary. (2) Prepare a molding material solution using a good solvent that dissolves all the components of the molding material, treat this with an adsorbent to remove metal elements, and remove all the components of the molding material. There is a method of dissolving the molding material in a poor solvent without dissolving it, and (3) repeating an operation of dissolving the molding material ⁇ in a good solvent and depositing it in a poor solvent.
- thermoplastic norbornene-based resin, silicone-modified polyolefin, or a polymer is treated in a solution or treated with an adsorbent in a hydrogenation step to remove metal elements. Reduce the amount of metal elements by repeating dissolution in a good solvent and precipitation in a poor solvent.
- the adsorption material is not particularly limited, synthetic Zeorai DOO, natural Zeorai DOO, active alumina, S i 0 2, A 1 2 0 3 or their crystalline, such as activated clay, non A crystalline mixed composition is preferable, and the specific surface area is preferably 5 Om 2 or more, more preferably 10 Om 2 / g or more, particularly preferably 20 Om 2 or more, and preferably 100 Om 2 or more. 0 m 2 Zg or less, pore volume is preferably 0.5 cm 3 / g or more, more preferably 0.6 cm 3 Zg or more, particularly preferably 0.7 cm 3 / g or more, preferably 1.5 cm 3 Zg or less. If the specific surface area or the pore volume is too small, the adsorption capacity is poor, and if it is too large, the production becomes difficult.
- the method of mixing is not particularly limited, and a method of mixing and precipitating in a solution state, a twin-screw extruder is used. And a method of kneading.
- the molding material is molded all at once for the connector, but the molding method is not particularly limited, and a method suitable for the shape of the insulator may be used.
- the molding material used in the present invention can be melt-molded, Extrusion molding, pressure molding, hot press molding, etc. are used. Above all, injection molding is easy, and it has the feature that molded products with excellent dimensional accuracy can be obtained.
- the shape of the connector insulator of the present invention is selected depending on the shape, purpose, and performance of the connector.
- the following describes mainly the coaxial cable connector, which is the most common connector shape.
- the coaxial cable connector is an insulator that is connected to or connected to the center conductor and the outer conductor of the coaxial cable, and that fixes the center conductor and insulates the center conductor from the outer conductor. It is common to use a gasket that further insulates the whole. Insulators for coaxial cable connectors usually have the shape of a cylinder or a combination of cylinders with different diameters aligned with the center axis, and a through-hole for fixing the center conductor is opened at the center.
- the outer circumference of the insulator of the coaxial cable connector preferably has a diameter of 2 mm or more, more preferably 3 mm or more, particularly preferably 5 mm or more, and 40 mm or less, preferably 30 mm or less, more preferably 25 mm or less.
- the insulator may be provided with a gap other than the above-mentioned through hole for fixing the center conductor.
- the void is generally a through hole parallel to the central through hole, and preferably has a circular cross section. However, it is preferable to leave an interval of preferably 1 mm or more, more preferably 2 mm or more, between the outer peripheries of the through holes and between the through hole and the outer perimeter of the insulator.
- the gap is too large, the strength of the insulator will decrease, and the insulator will be easily damaged when connecting cables. Therefore, it is necessary to provide a sufficiently thick wall between the gap and the gap, between the gap and the outer periphery, and between the gap and the through hole for fixing the center conductor.
- the insulator according to the present invention has a voltage standing wave ratio of 1.20 or less in the range of 2-3 GHz.
- the dynamic friction coefficient of 0.3 or less, preferably 0.27 or less, friction ⁇ product is 0. 009 cm 3 or less, preferably 0. 008 cm 3 superior below and slidability, Young's modulus 1 5000 kg fZcm 2 or more, preferably l tOOO kg fZ cm 2 or less, a tensile strength of 500 kgf / cm 2 or more, preferably 5 50 kg ⁇ Z cm 2 or more, particularly preferably 600 kgf Roh cm 2 or more, usually, 7 50 kgf / cm 2 or less, preferably 700 kgf Roh cm 2 or less, particularly preferably superior 650 kgf / cm 2 or less and the mechanical strength, In addition, bleeding and the like do not easily occur on the molded product surface, and the appearance is good.
- the I ZOD impact value is 4.0 kg ⁇ cmZcm or more, preferably 4.5 kg ⁇ cmZcm or more, more preferably 5.0 kg / cmZcm or more.
- the dielectric constant is preferably 2.60 or less, more preferably 2.55 or less, particularly preferably 2.50 or less, and the dielectric loss tangent is 0.0015 or less, preferably 1 kg to 20 kHz or more at 1 kHz to 20 kHz. Is 0.001 or less, preferably 0.001 or less.
- the center conductor on the female side usually protrudes from the insulator, the center conductor on the female side is located at the back of the through hole in the center of the insulator, and the female side through hole has the center on the female side.
- the center conductors come into contact with each other, and the oscillating center conductor is fixed by the through-hole of the female-side insulator, thereby fixing the oscillating and scalpel.
- the outer conductors also come into contact You.
- the contact between the outer conductors is usually made so that the outer conductor of the outer conductor that covers the outside of the female insulator is covered by the male outer conductor that protrudes from the insulator. Make it fixed.
- coaxial cable connectors include those described in JISC 514, C 541, C 514 and the like.For example, CO 1 type connector, C 0 2 type Connectors.
- the material of the center conductor and the outer conductor is not particularly limited as long as it has conductivity.Examples include those described in J1S above, for example, silver-plated brass, nickel Examples include plated brass, silver plated phosphor bronze, silver plated beryllium copper, and gold plated beryllium copper.
- coaxial cable connectors such as RC232C connectors for personal computers for connecting a large number of conductors at once, and S used for inputting and outputting image information.
- Various shapes, such as terminal connectors are used depending on the application.
- Typical examples of the coaxial cable connector have different shapes and sizes of the outer conductor and the outer conductor of the coaxial cable connector, and usually have a plurality of conductor terminals corresponding to the center conductor of one coaxial cable connector. is there.
- the connector is fixed to each other when the corresponding two types of connecting positions of female and female are matched, and the corresponding conductors are in contact with each other so that electricity can be supplied.
- the conductor is connected to the conductor by means of a hang or the like, and another connector, an electric circuit, an antenna, etc. are connected to the end of the conductor.
- the center conductor and outer conductor of the connector are not always connected to the conductor. It is used only to secure the connection between connectors and is not connected anywhere, or it is directly connected to the circuit of the wiring board and the connector itself is fixed on the board In some cases. In some cases, two female connection parts are integrated so that non-connectable females, female females, or different connectors can be connected indirectly. Two connection sites—Body or two different types of connectors are integrated into one set and may not be connected to the conductor.
- the coefficient of kinetic friction is in accordance with ASTM D1894, and the wear volume is
- Young's modulus, tensile strength at break, tensile elongation at break comply with JISK7113, I ZOD impact value according to JISK711, dielectric constant and dielectric loss tangent at 1 MHz according to JISK6911
- the voltage standing wave ratio was measured in accordance with JISC 5402 5.6.
- the amount of metallic elements was measured by inductively coupled plasma emission spectroscopy after wet ashing of the sample.
- the coefficient of kinetic friction was 17.5 mm from the lateral edge of each of five plate-like test specimens of 55 mm x 90 mm.27.
- the coefficient of kinetic friction was expressed as an average value measured on a 70 mm straight line excluding 10 mm from the edge in the longitudinal direction at the positions of 5 mm and 37.5 mm.
- thermoplastic norbornene resin (ZEONEX 280, manufactured by Zeon Corporation, hydrogenated norbornene-based ring-opening polymer, gel permeation) Approximately 140 ° C, hydrogenation rate of 99.7% or more), and injection-molded under the following conditions to obtain the No.1 test piece of JISK 7113 (for measuring Young's modulus, tensile strength at break, tensile elongation at break) , JISK 7110 No.
- test piece for measuring I ZOD impact value
- 5mm x 90mm test piece with 1mm thickness for measuring dielectric constant, dielectric loss tangent, dynamic friction coefficient, wear volume
- Molding machine Toshiba Machine Co., Ltd., I S—350 FB-19 A Mold clamping pressure: 80 t
- Mold temperature 100 ° C for both fixed and movable sides
- This connector can be used well in the high frequency band. Was easy.
- Thermoplastic norbornene resin (ZEONEX 280) 100 parts by weight of silicone-modified polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen SP 310, low density polyethylene with polysiloxane grafted, low Density polyethylene 40% by weight, polysiloxane 60% by weight) 5 parts by weight or 10 parts by weight was added, and the mixture was mixed with a kneading extruder (TEM-35B, manufactured by Toshiba Machine Co., Ltd.). Melt extrusion was performed at 40 ° C to obtain pellets.
- silicone-modified polyethylene Silicone., Ltd., Sumikasen SP 310, low density polyethylene with polysiloxane grafted, low Density polyethylene 40% by weight, polysiloxane 60% by weight
- TEM-35B manufactured by Toshiba Machine Co., Ltd.
- Example 1 The same as in Example 1 except that the amounts of metal elements of these pellets were measured, and the thickness of a 55 mm x 90 mm 1 mm thick test piece was changed to 3 mm using these pellets.
- the test piece was molded to measure the dynamic coefficient of friction, wear volume, Young's modulus, tensile rupture strength, tensile rupture elongation, I ZOD impact value, dielectric constant, and dielectric loss tangent, and an insulator was used as in Example 1.
- the connector was manufactured by molding, and the voltage standing wave ratio was measured using the connector thus manufactured. Table 1 shows the measurement results.
- a pellet was obtained in the same manner as in Example 2 except that a fluororesin powder (polytetrafluoroethylene, Lubron L-5, manufactured by Daikin Industries, particle size 0.5 to 5 zm) was used instead of the silicone-modified polyethylene.
- a fluororesin powder polytetrafluoroethylene, Lubron L-5, manufactured by Daikin Industries, particle size 0.5 to 5 zm
- a connector was manufactured by molding the same, and the voltage standing wave ratio was measured using the connector thus manufactured. Table 1 shows the measurement results.
- thermoplastic norbornene resin ZEONEX 280
- Septon 2023 manufactured by Kuraray Co., Ltd., number average molecular weight 60,000, Tg has at least one point at 40 ° C or less, metal element amount about 15 ppm
- Ethylene-propylene-diene trimer rubber (Mitsui EPT 103, manufactured by Mitsui Petrochemical Co., Ltd., number average molecular weight 300,000, Tg is at least 40 ° C or less — 20 parts by weight of 100 parts by weight of toluene were dissolved in 100 parts by weight of toluene, and the mixture was stirred well and poured into 500 parts by weight of isopropyl alcohol. The precipitated ethylene propylene trimer rubber was recovered by filtration, left at 50 to 10 torr or less for 24 hours, and dried to recover the ethylene propylene trimer rubber. The amount of the metal element in the recovered rubber was about 45 ppm.
- a pellet was obtained in the same manner as in Example 4, except that 10 parts by weight of the ethylene / propylene trimer rubber recovered in Reference Example 1 was used instead of the hydrogenated styrene-ethylene-propylene-styrene 'block copolymer.
- Table 1 shows the results of molding, measurement of test pieces, molding of insulators, manufacture of connectors, and measurement.
- ethylene-propylene trimer rubber obtained in Reference Example 1 a commercially available ethylene-propylene mono-gen trimer rubber (Mitsui EPT1035) was used in an amount of 5 parts by weight, ⁇ 0 parts by weight, or 15 parts by weight.
- a pellet was obtained in the same manner as in Example 5 except for the use, and the amounts of metal elements were measured, a test piece was formed and measured, an insulator was formed, and a connector was manufactured and measured. Table 1 shows the results.
- the number average molecular weight (Mn) of the polymer in the polymerization reaction solution measured by high performance liquid chromatography (polystyrene conversion) using toluene as a solvent was 17,700, and the weight average molecular weight (Mw) was 35.40. 0, molecular weight distribution (Mw / Mn) was 2.00.
- an alumina-supported nickel catalyst (0.7 parts by weight of nickel, 0.2 parts by weight of nickel oxide, 1 part by weight of nickel oxide, pore volume of alumina 0.8 cm 3 Zg, specific surface area) (3.0 cm 2 / g) 6 parts by weight and isopropyl alcohol 5 parts by weight were added, and the mixture was reacted in an autoclave at 230 ° C. and 45 kgf Zcm : for 5 hours.
- the hydrogenation reaction solution from which the hydrogenation catalyst had been removed by filtration was poured into a mixed solution of 250 parts by weight of acetone and 250 parts by weight of isopropanol with stirring to precipitate the resin, which was collected by filtration. After further washing with 200 parts by weight of acetone, it was dried at 100 ° C. for 24 hours in a vacuum dryer at a reduced pressure of 1 mmHg or less. Yield 99% or more, 1 H- hydrogenation ratio of the double bonds of the polymer backbone by NMR 9 9.9% or more on the degree of hydrogenation of the aromatic ring structure was approximately 9 9.8% .
- the number average molecular weight (Mn) of the obtained hydrogen additive was 22,600 and the weight average molecular weight (Mw) was 42,5 by high performance liquid chromatography (in terms of polyisoprene) using cyclohexane as a solvent.
- the molecular weight distribution (Mw / Mn) was 1.88, and the T g was 136 ° C.
- Example 8 A pellet was obtained in the same manner as in Example 4 except that the resin obtained in Reference Example 2 was used as the thermoplastic norbornene-based resin, the amount of metal elements was measured, test piece molding, measurement, molding of an insulator, connector Table 1 shows the results of the production and measurement.
- a pellet was obtained in the same manner as in Example 5 except that the resin obtained in Reference Example 2 was used as the thermoplastic norbornene-based resin, the amount of metal elements was measured, the test piece was formed, the measurement was performed, the insulator was formed, the connector was formed. Table 1 shows the results of the manufacture and measurement.
- ZEONEX 480 as a thermoplastic norbornene-based resin (Nippon Zeon Co., Ltd., hydrogenated norbornene-based ring-opening polymer, gel 'permeation' chromatographic polystyrene equivalent number average molecular weight of about 28,000
- a pellet having a glass transition temperature of about 140 ° C and a hydrogenation rate of 99.7% or more was used, the amount of metal elements was measured, and a test piece was formed and measured.
- Table 1 shows the results of molding, manufacturing of connectors, and measurements.
- Example 1 Except for using a polyacetal resin (Zyuracon, manufactured by Polyplastics Co., Ltd.) in place of the thermoplastic norbornene resin, the same procedure as in Example 1 was used to form a test piece, an insulator, a connector, a dynamic friction coefficient and a Young's modulus. Table 1 shows the results of measuring the tensile breaking strength, tensile elongation at break, IZOD impact value, dielectric constant, dielectric loss tangent, and voltage standing wave ratio.
- a polyacetal resin Zyuracon, manufactured by Polyplastics Co., Ltd.
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Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP96901490A EP0807998B1 (en) | 1995-01-31 | 1996-01-31 | Insulator and high-frequency connector |
DE69616028T DE69616028T2 (de) | 1995-01-31 | 1996-01-31 | Isolator und hochfrequenzsteckverbinder |
US08/860,705 US6030255A (en) | 1995-01-31 | 1996-01-31 | Insulator and high frequency connector |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7/35968 | 1995-01-31 | ||
JP7035968A JP3072308B2 (ja) | 1995-01-31 | 1995-01-31 | 高周波コネクター |
JP07098074A JP3085138B2 (ja) | 1995-03-30 | 1995-03-30 | 摺動性組成物、成形品、及びコネクター用インシュレーター |
JP7/98074 | 1995-03-30 | ||
JP7/157073 | 1995-05-31 | ||
JP07157073A JP3114574B2 (ja) | 1995-05-31 | 1995-05-31 | 熱可塑性ノルボルネン系樹脂成形材料及びそれを用いる成形品 |
Publications (1)
Publication Number | Publication Date |
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WO1996024177A1 true WO1996024177A1 (fr) | 1996-08-08 |
Family
ID=27288935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1996/000179 WO1996024177A1 (fr) | 1995-01-31 | 1996-01-31 | Isolateur et connecteur haute frequence |
Country Status (4)
Country | Link |
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US (1) | US6030255A (ja) |
EP (1) | EP0807998B1 (ja) |
DE (1) | DE69616028T2 (ja) |
WO (1) | WO1996024177A1 (ja) |
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US6630234B1 (en) * | 1997-06-20 | 2003-10-07 | Nippo Zeon Co., Ltd. | Polymeric film and film capacitor |
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- 1996-01-31 EP EP96901490A patent/EP0807998B1/en not_active Expired - Lifetime
- 1996-01-31 DE DE69616028T patent/DE69616028T2/de not_active Expired - Fee Related
- 1996-01-31 WO PCT/JP1996/000179 patent/WO1996024177A1/ja active IP Right Grant
- 1996-01-31 US US08/860,705 patent/US6030255A/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
EP0807998A4 (en) | 1998-08-12 |
DE69616028T2 (de) | 2002-06-20 |
US6030255A (en) | 2000-02-29 |
EP0807998B1 (en) | 2001-10-17 |
EP0807998A1 (en) | 1997-11-19 |
DE69616028D1 (de) | 2001-11-22 |
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