Classifications

• • H10W70/453—
• • H10W42/60—
• • H10W44/401—
• • H10W70/688—
• • H10W72/701—
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
  • G02F1/1333—Constructional arrangements; Manufacturing methods
  • G02F1/1345—Conductors connecting electrodes to cell terminals
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
  • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
  • G02F1/1362—Active matrix addressed cells
  • G02F1/136204—Arrangements to prevent high voltage or static electricity failures
• • H10W72/07251—
• • H10W72/20—
• • H10W74/00—

Definitions

• the present invention relates to an arrangement (layout) of electrodes of a semiconductor device connected to an external circuit, and more particularly to a tape carrier package (TCP) in which a semiconductor chip is mounted on a tape carrier using TAB (Tape Automated Bonding) technology.
• TCP tape carrier package
• the present invention relates to a display panel module in which a driving semiconductor chip is mounted on a flat display panel such as a liquid crystal display or a plasma display.
• TCP TAB-type tape carrier packages
• electrodes are arranged along four or two sides of a semiconductor chip, as described in, for example, Japanese Patent Application Laid-Open Nos. 412,146 and 5-326,622. Have been. Further, the mounting structure of TCP disclosed in Japanese Patent Application Laid-Open No. 63-84039 discloses that a tape carrier connected to this is formed by forming a bump near the center of a semiconductor element surface.
• the TCP mounted with the above-described elongated rectangular semiconductor chip has a dimension in the longitudinal direction, i.e., the longitudinal force, which is determined by the number of electrodes and the electrode pitch of the semiconductor chip.
• the width is mainly 1) the length of the input and output side outer leads, 2) the length of the input and output side inner leads, and 3) the inner and outer leads.
• FIG. 10 and FIG. 11 show typical examples of such a conventional TCP.
• the TCP 1 is disposed in a device hole 4 opened almost in the center of the tape carrier 3 and a semiconductor chip 2 serving as an LCD driving driver.
• a number of output-side electrodes 5 and human-powered electrodes 6 are arranged in a row along respective long sides facing each other, and the inner leads 7 and 8 project into the device hole 4. Each is connected.
• the inner leads are connected to the corresponding outer leads 11 and 12 by leading wirings 9 and 10 formed on the surface of the tape carrier 3, respectively.
• the length of the outer leads 11 and 12 depends on the connection conditions with the liquid crystal panel on which the TCP is mounted and the external circuit on the input side, and the length of the inner leads 7 and 8 is a semiconductor. It is determined to some extent by the size, pitch, etc. of the electrodes of the chip 2.
• the short side length of the semiconductor chip 2 can be shortened by increasing the degree of integration of the chip and miniaturizing it.
• in order to increase the degree of integration of the chip an expensive manufacturing apparatus is required, and the cost of the manufacturing process is increased, so that there is a problem that the price of the chip is increased.
• the TCP in order to reduce the size of the TCP, it is effective to reduce the area of the wiring 10 on the output side, which has a large number of electrodes, to reduce the mounting area of the semiconductor chip 2.
• the fine pitch of the outer leads In some cases, it may be desirable to increase the pitch of the portal 12 depending on the external connection conditions. In such a case, since the wiring 10 is bent and routed on the film carrier 3, it becomes longer, and the width of the TCP 1 becomes larger.
• the electrode pitch of the semiconductor chip is made equal to the pitch of the outer lead, and the output side lead is reduced.
• the conventional bent wiring is eliminated, and the dimensions of the CP are reduced.
• the electrode pitch which determines the dimensions of the semiconductor chip, is determined by the pitch of the atalyte, it is difficult to reduce the size of the chip, which increases the manufacturing cost of the chip, and depends on the number of electrodes and the electrode pitch of the semiconductor chip. There is a problem that the degree of freedom of TCP design is limited.
• the semiconductor device of the present invention has been made in view of the above-mentioned conventional problems, and its purpose is to provide a driver for driving a flat display panel such as a liquid crystal display. It is an object of the present invention to provide a semiconductor device capable of reducing the mounting area of a semiconductor chip having a large number of electrodes while optimally balancing the degree of integration and the chip size with the manufacturing cost.
• Another object of the present invention is to provide a tape carrier package on which a semiconductor chip having a large number of electrodes as described above is mounted.
• An object of the present invention is to reduce the size and cost while suppressing the manufacturing cost of the device.
• Still another object of the present invention is to provide a flat display capable of reducing the size of the frame for mounting the driving semiconductor chip, thereby reducing the overall size of the device and substantially expanding the display area. It is to provide a panel module. Disclosure of the invention
• the semiconductor device of the present invention is intended to achieve the above-mentioned object, and forms an electrode for electrically connecting to the outside along one long side of a rectangular semiconductor chip;
• the circuit cell is provided inside the electrode.
• this semiconductor device is mounted on an external circuit such as a substrate or a tape carrier, for example, a wiring drawn from an electrode binary lead of the external circuit is routed in the direction of the longer side inside the electrode of the semiconductor device and on the opposite side.
• the area of the lead wiring overlaps with the plane of the semiconductor device, so that the mounting area of the substrate and the like can be significantly reduced. Accordingly, the cost of the semiconductor chip can be reduced to an optimum price in relation to the degree of integration and dimensions, while the mounting area can be greatly reduced and the mounting density can be increased. Implementation can be achieved.
• the electrodes of the semiconductor device include an input terminal, an output terminal, and a power supply terminal
• the number of output terminals is larger than the number of input terminals and power supply terminals
• the area of the wiring on the output side is larger than that on the input side, so that the mounting area can be more effectively reduced.
• the output terminal can be divided into a plurality of blocks, and the blocks can be separated from each other by a greater distance than the pitch of the output terminal in each of the blocks. This allows the routing on the output side Since lines can be designed more freely, the degree of freedom in designing semiconductor chips can be increased.
• a gap is formed between the blocks of the output terminal row, so that molding resin is applied between the semiconductor chip and the tape carrier through this gap. Can be evenly injected into a wide area inside the output terminal row.
• the mounting area can be reduced. In this case, the width, that is, the vertical dimension of the semiconductor device can be reduced, and in this case, the output terminal is divided into a plurality of blocks, and the input terminal is arranged between each block, and the power supply terminal is connected.
• the degree of freedom in designing the wiring on the output side can be increased as well, and at the same time, when mounted on a tape carrier, the output terminals It can be uniformly injected molding resin from a gap formed between the.
• the input protection resistor and the ESD protection diode of the input terminal are located outside the output terminal, they will be separated from the output system of the semiconductor chip by at least the width of the output terminal, and surge from the input side will be output. This is advantageous because the effects on the system can be eliminated.
• a semiconductor chip is a driver for driving a flat display panel, an output terminal is a terminal for outputting a drive signal to the display panel, and an input terminal is a serial terminal.
• an output terminal is a terminal for outputting a drive signal to the display panel
• an input terminal is a serial terminal.
• the tape carrier comprises: a semiconductor chip having an electrode connected to an inner end of the tape carrier; A tape carrier package is provided, wherein the tape carrier package is arranged along one long side of the rectangular semiconductor chip and a circuit cell is provided inside the electrode.
• the wiring drawn from the inner lead on the tape carrier can be routed inside the electrode of the semiconductor chip in the direction of the long side on the opposite side, whereby the region of the wiring is formed on the semiconductor chip. Since it overlaps with a flat surface, the vertical dimension of the tape carrier, that is, the TCP, can be reduced and the manufacturing cost can be reduced.c Also, the degree of freedom in designing the TCP wiring and outer leads can be increased. However, the size of TCP can be reduced while keeping the cost of semiconductor chips low.
• the TCP according to the present invention is designed such that, especially when the electrodes of the semiconductor chip are composed of an input terminal, an output terminal, and a power supply terminal, the inner lead connected to the output terminal is in the direction of the long side opposite to the inside of the semiconductor chip.
• the area of the wiring on the output side is larger than the input side, so that the vertical dimension of the tape carrier can be reduced more effectively, which is convenient.
• the semiconductor chip is a driver for driving the flat display panel
• the output terminal is a terminal for outputting a drive signal to the display panel
• the input terminal is a terminal for inputting serial data.
• the area of the wiring becomes large, so that the vertical dimension of the TCP is reduced. Effect can be further enhanced.
• a flat display panel and a plurality of tape carrier packages connected along the periphery and mounted with a semiconductor chip for driving the display panel.
• the electrodes of the semiconductor chip connected to the binary of the semiconductor are rectangular.
• a display panel module is provided, wherein the display panel module is arranged along one long side of the semiconductor chip and a circuit cell is provided inside the electrode.
• FIG. 1 is a plan view showing a first embodiment of a semiconductor device according to the present invention.
• FIG. 2 is a plan view showing a TCP mounting the semiconductor device of FIG.
• FIG. 3 is an enlarged cross-sectional view taken along the line III-III in FIG.
• FIG. 4 is a plan view showing a second embodiment of the semiconductor device according to the present invention.
• FIG. 5 is a plan view showing a tent CP on which the semiconductor device of FIG. 4 is mounted.
• FIG. 6 is an enlarged cross-sectional view taken along the line VI-VI of FIG.
• FIG. 7 is a plan view showing a modification of the semiconductor device according to the present invention.
• FIG. 8 is a plan view showing a liquid crystal module according to the present invention.
• FIG. 9 is an enlarged cross-sectional view taken along line IX-IX of FIG.
• FIG. 10 is a plan view showing a conventional TCP.
• FIG. 11 is an enlarged cross-sectional view taken along line XI-XI of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
• FIG. 1 shows a first embodiment of a semiconductor device according to the present invention.
• the semiconductor chip 20 is a driver for driving a liquid crystal having a rectangular shape that is elongated left and right.
• On the surface a large number of electrodes are formed in two rows along one long side and the upper side in the attached drawing.
• the electrodes are composed of 240 output terminals 21 arranged in a row at a substantially constant pitch of about 60 m, and 13 input terminals 22 arranged in a row outside the output terminals. And 14 power supply terminals 23.
• seven blocks each including a circuit cell are provided in a region between the electrode and the long side on the opposite side.
• a mouth area 24 having data control and a clock buffer etc.
• driver output unit, the driver control unit, and the latch unit are juxtaposed with a width of about 50 m along the longitudinal direction so as to make the semiconductor chip 20 slender.
• the output terminal row, the input terminal and the power supply terminal row are connected to each other by about 1 degree so that the semiconductor chip 20 is not short-circuited when the semiconductor chip 20 is mounted on the tape carrier as described later. They are separated by 50 m.
• the distance between the two terminal rows can be reduced to about 20 m.
• the output terminals 21 are divided into two sets on the left and right by a gap of about 500 m wider than the pitch provided at the center of the terminal row, and the output terminals of each set correspond to the corresponding left and right.
• Connected to the driver output section 25 of Input terminals 22 are eight serial data input terminals, one clock terminal for latching data, one latch terminal for temporarily holding all data, and serial data
• One terminal to control which of the left and right driver output sections outputs the drive output corresponding to the signal one signal terminal to drive the LCD with AC drive, and drive output regardless of the data and AC signal Force And one signal terminal that is fixed at a low level.
• the power terminals 23 are composed of two logic power terminals and two sets of two driver power terminals.
• the driver power supply terminals of each set are arranged at the left and right ends of the input terminal row, respectively, and are connected to corresponding ends of the driver output unit 25 and the driver control unit 26.
• the input terminals 22 are arranged at substantially constant intervals between the left and right power supply terminals 23, and the wiring drawn therefrom passes through the center gap of the output terminal row and is connected to the logic area 24. Have been. With this configuration, it is possible to reduce the area for drawing out the wiring from the human-powered terminal to half as compared with the case where the logic area 24 is arranged at the left end or the right end of the semiconductor chip 20.
• the static electricity protection resistor and the diode 28 connected to the input terminal 22 are arranged between the input terminal 22 and the output terminal 21.
• the ESD protection resistor and diode on the input side are located far away from the driver output, so surges from the input side affect the driver system and cause problems such as latch-up. No need to consider.
• the output terminal 21 is connected to the output terminal 21 by disposing the electrostatic protection resistor and the diode 28 on the input side as described above. It can be separated from a driver system including an electrostatic protection resistor and a diode by at least the size of the output terminal.
• FIG. 2 shows a TCP 30 in which the semiconductor chip 20 of FIG. 1 is mounted on a tape carrier 29 made of an insulating film having a thickness of about 25 m made of a normal material.
• the tape carrier 29 is etched by copper foil with a thickness of about 20 m adhered to its surface, and is patterned to form a matrix 31, 32, an inner 33, 3. 4, and routing wires 35, 36 connecting them are formed.
• the output side leads 31 are arranged at a constant pitch of 70 m along one long side of the rectangular tape carrier.
• the input-side lead 32 is disposed along the long side on the opposite side, and is exposed on the back surface of the tape carrier 29 by a slit 37 formed in the tape carrier 29.
• the device hole 38 is opened at a position closer to the input side of the tape carrier 32 than the center of the tape carrier 29, and the inner side of the output side and the input side 33 from both side edges in the opening. , 34 protrude in opposite directions. Since all the electrodes of the semiconductor chip 20 are arranged along the one long side, the dimensions of the device hole 38 are smaller than the external shape of the semiconductor chip 20 and the size of the device hole 38 is within the opening. (4) It may be formed to the extent that it can be sufficiently accommodated. Therefore, the length of the inner leads 33, 34 protruding into the device hole 38 should be shorter than in the case of the conventional TC ⁇ , which is larger than the dimensions of the device hole or the outer shape of the semiconductor chip. Can be.
• each electrode of the semiconductor device has bumps 39, 40 formed thereon by, for example, gold plating, and is formed by a bonding tool using a conventional internal bonding technique. It is connected to each of the inner leads 33, 34 by heating and pressurizing with the use of. The surface of each of the inner leads is pre-tinned in order to improve the bonding property with the gold bumps 39 and 40.
• the joint between the inner lead and the bump and the gap between the tape carrier 29 and the semiconductor chip 20 are: It is sealed by injecting mold resin 41. Although the mold resin also spreads into narrow gaps due to capillary action, the center of the output terminal row 21 is expanded as described above with reference to FIG. It is easy to flow.
• a dummy bump 42 is provided inside the output terminal 21 on the surface of the semiconductor chip 20 on which the electrode is formed, a sufficient gap is provided between the tape carrier and the surface of the semiconductor chip as a spacer. It can be secured or can prevent the flow of mold resin. Further, the dummy bumps 42 can be provided at appropriate positions other than the positions shown in FIG. 2, for example, along the long side opposite to the electrodes.
• the output terminal row 21 is further divided at a position other than the center with a gap of about 500 m wider than a predetermined pitch to improve the flow of the molded resin, and The degree of freedom in designing the routing wiring 35 can be increased.
• dummy bumps are provided on the input side terminal rows 22 and 23, or a dummy inner lead (not shown) is formed on the tape carrier 29 and the dummy bumps are formed on the dummy bumps.
• the length L ol 1.9 mm of the output side capacitor 31
• the length L r 2.1 country of the molding resin 41
• the output side lead length L ol is determined by the dimensions of a tool used when mounting the TCP 30 externally, for example, when connecting to the electrodes of the liquid crystal panel as described later.
• the side ground length L o2 is determined by the dimensions of the tool used when soldering to external input and power supply circuits.
• the area of the output-side wiring 35 substantially overlaps the plane of the semiconductor chip 20, so that the vertical length of the TCP 30 is reduced. It can be as short as necessary.
• the area of the routing wiring 35 also increases, but in the case of the present invention, the wiring can be designed with a relatively large margin. Even if the output terminal pitch is increased by about several meters, it can be handled without changing the dimensions of TCP.
• FIG. 4 shows a semiconductor device according to a second embodiment of the present invention.
• the semiconductor chip 20 according to the present embodiment is different from the first embodiment in that all the electrodes including the output terminal 21, the input terminal 22, and the power supply terminal 23 are arranged in one row along one long side thereof. This is different from the semiconductor device of the embodiment. Therefore, the length of the semiconductor chip 20 is longer than that of the first embodiment, but the width, that is, the vertical dimension can be made smaller than that of the first embodiment.
• a central logic area 24, and a driver output section 25 and a driver control section 26 on the left and right sides thereof, respectively.
• a latch section 27 for holding serial data.
• the output terminals 21 are arranged at a constant pitch of about 60 m, and are divided into two sets on the left and right by a wide gap provided in the center of the terminal row.
• C The output terminals of each set connected to the driver output section 25 are further divided into three blocks at intervals of about 100 m, and the input terminal 22 is provided between the blocks. They are almost evenly distributed.
• the input terminal 22 is connected to the logic area 24 through a gap at the center of the terminal row.
• the two logic power supply terminals 23 are arranged in a gap at the center of the terminal row, and are connected to a logic area 24.
• the driver system power supply terminals 23 are arranged in two sets on both left and right ends of the terminal row, and are connected to corresponding ends of the driver output section and the driver control section, respectively.
• the dimensions of the input terminal and the power supply terminal are 80 ⁇ 60 m, whereas the dimensions of the output terminal are as small as 80 ⁇ 40 m. This prevents the input-side inner leads and output-side inner leads that are connected in opposite directions from coming into contact with each other and short-circuiting when mounted on the tape carrier, as described later. This is for providing a gap larger than the output terminal pitch between the blocks of the output terminal divided by the terminal 22.
• the electrostatic protection resistor and the diode 28 connected to the input terminal 22 are arranged outside a terminal row including the output terminal and the like.
• the electrostatic protection resistance on the input side and the diode 28 are at least larger than the dimensions of the output terminal from the driver system. Since it can be separated, it is possible to effectively prevent the surge from the input side from affecting the driver system.
• FIG. 5 shows a TCP 44 in which the semiconductor chip 20 of FIG. 4 is mounted on a tape carrier 43 made of a polyimide film having a thickness of about 2 ⁇ m, as in the embodiment of FIG. ing.
• the tape carrier 43 is made by etching copper foil about 20 ⁇ m thick to make the leads 45, 46, the inner leads 47, 48, and connect them.
• the routing wires 49 and 50 are formed.
• the output side leads 45 are arranged at a constant pitch of 70 m along one long side of the tape carrier, and the human side leads 46 are arranged along the long side on the opposite side. And is exposed on the rear surface by a slit 51 drilled in the tape carrier 43.
• the device hole 52 is located at a position closer to the input side of the tape carrier 43 than the center of the tape carrier 43.
• the device hole 52 since all the electrodes of the semiconductor chip 20 are arranged in a line along one long side, the device hole 52 must be formed smaller than in the case of the first embodiment of FIG. Can be done. Therefore, the width, that is, the vertical dimension of the TCP 44 can be made smaller than that of the first embodiment shown in FIG.
• the output-side and input-side inner leads 47, 48 project into the opening of the device hole 52 from both side edges in directions facing each other and so as to overlap in the horizontal direction on the terminal row. Its length can be shorter than that of TCP, which has device holes larger than those of conventional semiconductor chips.
• TCP 44 heats the bumps 53 and 54 formed on the electrodes of the semiconductor chip 20 by using a normal bonding tool.
• the inner leads 47 and 48 are connected by the pressurization process.
• the joint between the inner lead and the bump and the gap between the tape carrier 43 and the semiconductor chip 20 are formed by molding resin 55. Sealed.
• the mold resin 5 injected from the opening of the device hole 52 by the gap provided at the center of the output terminal row 21 and the gap between the blocks that further divide the sets. 5 easily flows evenly inside the electrodes of the semiconductor chip.
• the output terminal 21 of the semiconductor chip 20 is divided into six blocks by the input terminal 22.
• the arrangement of the input terminals is changed to increase the number of blocks. It can be divided into blocks.
• a dummy bump 42 may be provided on the electrode forming surface of the semiconductor chip 20 as a spacer between the tape carrier and the inside of the terminal row as a stopper for molding resin.
• a dummy bump is provided on the terminal row of the semiconductor chip 20 and the tape carrier 43 is connected to each other by adding a dummy inner lead. The mechanical joining strength between the two can be improved.
• the output side leader length Lol and the input side leader length are each determined by the dimensions of a tool used when connecting the TCP 44 to an external circuit. As can be clearly seen from FIGS.
• the area of the wiring 49 on the output side substantially overlaps with the plane of the semiconductor chip 20. Therefore, as compared with the conventional TCP illustrated in FIG. Significantly shorter vertical length of CP 44 Can be done. Therefore, it is possible to reduce the size of the TCP and reduce the manufacturing cost while keeping the cost of the semiconductor chip 20 low. Also, in the case of the present embodiment, the width of the semiconductor chip 20 can be made somewhat smaller by arranging the electrodes in a row, so that the semiconductor chip 20 can be routed with more margin than in the case of the first embodiment. Wiring and outer leads can be designed.
• FIG. 7 shows a modification of the semiconductor device according to the first embodiment.
• a large number of electrodes of the semiconductor chip 20 are formed in two rows along one long side of an elongated rectangle.
• the terminal row including the input terminal and the power supply terminal 56 is disposed outside, and the terminal row including the output terminal 57 is disposed inside.
• a plurality of blocks 58 constituting each circuit cell are arranged at intervals along the longitudinal direction.
• the output terminal 57 is divided for each block 58 of the corresponding circuit cell and connected to the block.
• the input terminal and the power supply terminal are connected to a predetermined block 58 through a region between the blocks.
• the lead wiring of the output terminal 57 can be provided in a region overlapping the plane of the semiconductor device. Can be done.
• FIGS. 8 and 9 show an embodiment of a liquid crystal display module to which the present invention is applied.
• the liquid crystal display module 59 is a color VGA-compatible type with a pixel count of 1920 x 480 and consists of a liquid crystal panel 60 with electrodes with an XY matrix structure, equipped with a liquid crystal drive semiconductor chip.
• eight TCPs are connected along the upper side and the lower side of one glass substrate 61 of the liquid crystal panel, and two are connected along the left side of the other glass substrate 62.
• the input terminals of TCP 30 on the upper side and lower side have a band-like circuit in the X direction.
• the circuit boards 63 and 64 are connected to each other, and a belt-like circuit board 65 in the Y direction is connected to the TCP 30 on the left side.
• the output terminal 31 of each TCP 30 is electrically and electrically connected to the IT 0 electrode 67 on the surface of the glass substrate 61 using a known anisotropic conductive film 66. Mechanically connected.
• the TCP 30 is connected to the I-shaped electrode of the glass substrate 62 using an anisotropic conductive film.c
• the output terminal and the ITO electrode are not anisotropic conductive film but are bonded. It can also be connected directly using an agent.
• the input terminal 32 of each TCP 30 is connected to the output terminal 68 of the circuit board 63 by soldering.
• a resin mold 69 is provided to protect a connection portion between each terminal of the TCP 30 and each of the glass substrates and each of the circuit boards.
• the frame portion of the liquid crystal display module 59 can be made smaller than the conventional. This makes it possible to reduce the overall size of the liquid crystal display module 59 and, conversely, to substantially enlarge the display screen with respect to the overall size of the device, thereby providing a more easily viewable liquid crystal display device.
• the TCP of the second embodiment shown in FIG. 5 can be used for the liquid crystal display module 59 of the present invention.
• a TCP having a conventional structure can be used on the left side of the glass substrate 62 instead of the TCP 30 of the present invention. In this case, the length of the liquid crystal display module 59 in the horizontal direction cannot be reduced, but in general, the dimensions of the liquid crystal display device often have a margin in the horizontal direction.
• the present invention can be applied not only to a liquid crystal display but also to other flat panel display modules such as a plasma display having a driving semiconductor chip mounted on a peripheral portion.
• each terminal row is formed in a straight line, but it should be arranged in a zigzag pattern that alternates zigzag, or partially zigzag at an appropriate position.
• the layout of the circuit cells formed on the semiconductor chip can be variously changed according to its purpose and specifications.
• the arrangement of the input terminals of the power supply is not limited to the above embodiment, and can be freely designed in accordance with the layout of the circuit cells, the configuration of the external circuit to be mounted, and the like.

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• Devices For Indicating Variable Information By Combining Individual Elements (AREA)
• Wire Bonding (AREA)
• Semiconductor Integrated Circuits (AREA)
• Liquid Crystal (AREA)

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Citations (4)

• 1996
  • 1996-01-12 US US08/704,513 patent/US6037654A/en not_active Expired - Lifetime
  • 1996-01-12 WO PCT/JP1996/000040 patent/WO1996021948A1/ja not_active Ceased
  • 1996-01-12 KR KR1019960705108A patent/KR100209863B1/ko not_active Expired - Fee Related
  • 1996-02-12 TW TW085101740A patent/TW309650B/zh not_active IP Right Cessation

Patent Citations (4)

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