Classifications

• • C—CHEMISTRY; METALLURGY
  • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • C02F1/00—Treatment of water, waste water, or sewage
  • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
• • C—CHEMISTRY; METALLURGY
  • C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
  • C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
  • C10M175/00—Working-up used lubricants to recover useful products ; Cleaning
  • C10M175/0058—Working-up used lubricants to recover useful products ; Cleaning by filtration and centrifugation processes; apparatus therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D17/00—Separation of liquids, not provided for elsewhere, e.g. by thermal diffusion
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D35/00—Filtering devices having features not specifically covered by groups B01D24/00 - B01D33/00, or for applications not specifically covered by groups B01D24/00 - B01D33/00; Auxiliary devices for filtration; Filter housing constructions
  • B01D35/12—Devices for taking out of action one or more units of multi- unit filters, e.g. for regeneration
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D37/00—Processes of filtration
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D37/00—Processes of filtration
  • B01D37/04—Controlling the filtration
  • B01D37/041—Controlling the filtration by clearness or turbidity measuring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D37/00—Processes of filtration
  • B01D37/04—Controlling the filtration
  • B01D37/043—Controlling the filtration by flow measuring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D37/00—Processes of filtration
  • B01D37/04—Controlling the filtration
  • B01D37/046—Controlling the filtration by pressure measuring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
  • B01D61/14—Ultrafiltration; Microfiltration
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
  • B01D61/14—Ultrafiltration; Microfiltration
  • B01D61/16—Feed pretreatment
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01D—SEPARATION
  • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
  • B01D61/14—Ultrafiltration; Microfiltration
  • B01D61/22—Controlling or regulating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
  • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
  • B28D1/025—Use, recovery or regeneration of abrasive mediums
• • C—CHEMISTRY; METALLURGY
  • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • C02F1/00—Treatment of water, waste water, or sewage
  • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
  • C02F1/444—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration

Definitions

• the present invention relates to a method and an apparatus for regenerating a processing waste fluid generated by free abrasive grain processing in which processing is performed using a processing liquid in which released abrasive grains are dispersed in a medium liquid.
• an oily or aqueous working liquid in which abrasive grains such as GC and WA are dispersed in a medium liquid such as kerosene or water is generally used.
• abrasive grains such as GC and WA are dispersed in a medium liquid such as kerosene or water
• machining is performed while supplying a machining fluid to the surface of the workpiece, and the supplied machining fluid is recovered and then supplied to the surface of the workpiece again. Used in circulation.
• the working fluid suitably promotes the working by supplying the abrasive grains to the surface of the work, and at the same time, has a function of washing away the chips generated by the working.
• the concentration of chips in the machining fluid is a predetermined value determined by the machining conditions.
• the concentration of chips in the machining fluid is a predetermined value determined by the machining conditions.
• the working fluid exceeding the above-mentioned predetermined concentration must be reused by removing the chips, or replaced with a new working fluid that does not contain the chips.
• the above swarf was extremely small, having an average particle size of about 1/10 or less as compared with abrasive grains, and was difficult to remove. That is, in the case of removal by membrane filtration, the use of a membrane having pores sufficiently smaller than the average grain size of the abrasive grains separates the abrasive grains into a medium liquid containing cutting chips. It is possible.
• the abrasive layer accumulates on the film and a cake layer is formed, the chips do not pass through the film and only the medium liquid permeates, so the filter membrane must be replaced frequently to remove enough chips It was necessary, and it was difficult to re-disperse the cake formed on the surface of the filtration membrane in the medium liquid in order to reuse the abrasive grains.
• chips such as silicon have a smaller specific gravity and a smaller diameter than abrasive grains such as GC, so they can be removed by sedimentation and discarding the supernatant. Even in this case, it was extremely difficult for the settled abrasive grains to be solidified and dispersed again in the working fluid.
• a working fluid having an extremely high abrasive grain concentration is generally used as described above.
• a relatively high viscosity working fluid of about 50 to 100 cp is suitable.
• the present invention has been made in view of the above circumstances, and an object thereof is to enable processing of a processing waste liquid having a relatively high abrasive concentration and high viscosity suitable for improving the processing efficiency of free abrasive processing. Accordingly, it is an object of the present invention to provide a processing waste liquid regenerating method and a processing waste liquid regenerating apparatus having a relatively simple structure. Disclosure of the invention
• the gist of the method for regenerating the processing waste liquid of the first invention for achieving such an object is that cutting in the processing waste liquid from the free abrasive grain processing performed using the processing liquid in which the abrasive grains are dispersed.
• a method for regenerating a processing waste liquid by separating powder comprising: (a) pores sufficiently smaller than the average particle size of the abrasive grains and sufficiently larger than the average particle size of the above-mentioned cutting powder;
• the processing waste liquid is processed by so-called cross-flow filtration using a cross-flow filtration membrane through which abrasive grains cannot pass and chips can pass. Therefore, a part of the processing waste liquid is discharged to the second chamber side of the cross-flow filter together with the swarf in the mouth-and-mouth opening / separation step while being circulated in the circulation path in the circulation step. Therefore, in the processing waste liquid circulated in the circulation path, only the amount of chips is reduced according to the amount of the discharged waste liquid while the amount of abrasive particles is maintained at the initial amount, and the amount of regenerated material is regenerated. It is recovered in a suspended state in the processing fluid recovery process. Therefore, the ratio of the amount of the swarf to the amount of the abrasive grains in the reclaimed processing liquid is reduced, and the regenerated processing liquid can be used again as the processing liquid.
• the processing waste liquid is circulated along the surface of the cross-flow filtration membrane, the abrasive grains are maintained in a suspended state without accumulating on the surface of the cross-flow filtration membrane.
• the processing can be performed even if the circulating processing waste liquid has a high concentration or high viscosity, and the concentration and viscosity are not restricted as in the regenerating apparatus using the above-mentioned hydrocyclone, and a high polishing rate suitable for improving the processing efficiency. Processing waste liquid having a high particle density and high viscosity can be treated.
• the above-mentioned regeneration method can be constituted only by the cross-flow filter, the circulation path and the recovery device, it can be carried out with a relatively simple device constitution.
• cross-flow filtration is generally performed for the purpose of recovering a filtrate from which suspended particles have been removed from a suspension. It contains large-diameter abrasive grains and small chips of about 1/10 or less of the abrasive grains, and the small-diameter chips are uniformly dispersed in the processing waste fluid. Therefore, if cross-flow filtration is performed using a filtration membrane as described above, the circulating processing waste liquid and the discharged processing waste liquid have the same chip concentration, and the circulating processing waste liquid is The amount of abrasive grains does not change, and only the amount of chips is reduced by the ratio of the amount of discharged waste liquid to the amount of processed waste liquid introduced into the circulation path. For example, 3/4 of the processing waste If it is discharged to the second chamber side of the mouth filter, the amount of the cut in the circulated processing waste liquid is reduced to 1/4.
• the present invention has been made by paying attention to this point.
• the concentration ratio between the abrasive grains and the cutting chips in the processing waste liquid reaches a predetermined value
• the filtration is terminated and the liquid is circulated.
• the processing waste liquid By collecting the processing waste liquid as a recycled processing liquid, only the amount of chips can be reduced in a state where abrasive grains are dispersed in the processing waste liquid. Since the processing waste liquid having a constant chip concentration is discharged to regenerate the processing waste liquid as described above, the classification performance (that is, the abrasive grain recovery rate and the chip removal Rate) is not affected by the abrasive concentration.
• the average particle size of the swarf is about 1/5 to 1/20 of the average particle size of the abrasive grains in loose abrasive processing.
• the average particle diameter is about 1/5 to 3/4, more preferably about 1/2, the abrasive grains do not pass through and only the chips are reliably removed.
• the size of the pores is made relatively large, abrasive grains which have been reduced by crushing or abrasion during the processing will be removed at the same time, and a more suitable regenerating processing liquid will be obtained.
• the above-mentioned regenerated processing liquid is concentrated by the discharge of the processing waste liquid to the second chamber side of the cross-flow filter to increase the abrasive grain concentration.
• the processing waste liquid regenerating method according to the first aspect of the present invention is characterized in that, before or while the processing waste liquid is circulated in the circulation path, abrasive grains and chips are added to the processing waste liquid.
• the method further includes the step of adding an amount of a medium liquid not containing the same to the amount discharged to the second chamber side in the cross flow separation step.
• the processing waste fluid Since the concentration does not increase, the filtration efficiency increases and circulation is performed. ⁇ The load on the pump and the like is reduced.
• the filtration is terminated when the amount of the added medium liquid and the amount of the discharged processing waste liquid are equal, and the amount of the added medium liquid is reduced by collecting the processing waste liquid in the circulation path.
• the amount of swarf is reduced according to the ratio of the amount of the original processing waste liquid, and the concentration of abrasive grains in the recovered regenerated processing liquid is the same as the initial concentration before the medium liquid was added.
• the reprocessing fluid can be used immediately.
• the gist of the method for regenerating a processing waste liquid according to the second invention for achieving the above object is that a processing liquid in which abrasive grains are dispersed is used to perform processing in a processing waste liquid from free abrasive processing.
• the processing waste liquid is impervious to abrasive grains and swarf. Since it is processed by the so-called cross-flow filtration using a cross-flow filtration membrane, a part of the processing waste liquid is mixed with the chips in the The processing waste liquid that is discharged to the second chamber side of the flow filter is circulated in the circulation path, and the medium liquid that does not contain abrasive grains and chips is discharged in the medium liquid supply step. By supplying the same amount into the circulation path, the medium liquid amount becomes the same as the initial amount, and is recovered in a suspended state in the recovery processing liquid recovery step.
• the processing waste fluid circulating in the circulation path reduces only the amount of chips in accordance with the amount of processing waste fluid discharged while the amount of abrasive grains and the amount of medium liquid are maintained at the initial amounts. And collected. Therefore, the ratio of the amount of swarf to the amount of abrasive grains in the regenerating solution is reduced, and the concentration of the abrasive grains is the same as that at the beginning, so that it can be used again as a working fluid as it is.
• the regeneration method according to the second aspect of the present invention can be implemented with only a cross-flow filter, a circulation path, a medium liquid supply device, and a recovery device, and thus can be implemented with a relatively simple device configuration.
• the second chamber in order to remove clogging of the cross-flow filtration membrane to secure a filtration flux and to improve the permeation of chips, the second chamber is connected to the first chamber.
• at least a part of the medium liquid passes through the second chamber in the medium liquid supply step.
• the above-mentioned back washing is performed by being supplied to the circulation path. That is, as described above, since the medium fluid is permeated together with the chips in the cross-flow separation step, the concentration of abrasive grains in the processing waste fluid in the circulation path increases.
• the abrasive concentration of the regenerated machining fluid can be set to a predetermined value, and at the same time, the cross-floor one-filtration membrane can be backwashed.
• the processing waste liquid circulated in the circulation path is recovered as a regenerated processing liquid, backwashing is performed to circulate the medium liquid containing no abrasive grains and chips. Returning to the channel is not particularly problematic, and frequent backwashing (ie, the medium supply step) can be used to maintain a high filtration flux.
• the entire amount of the medium liquid supplied to the circulation path ie, the amount equal to the amount of liquid permeated to the second chamber side in the crossflow separation step
• the entire amount of the medium liquid supplied to the circulation path is a path from the second chamber to the first chamber. It may be transmitted through.
• the cross-flow filtration membrane of the cross-flow filtration device is a single-layer mesh c
• the filtration membrane is porous Quality ceramics
• chips gradually accumulate inside the cross-flow filtration membrane, so that the chips gradually become difficult to permeate through the cross-flow filter. If the treatment is continued for a long time, only the medium liquid is filtered from the circulating processing waste liquid, and the amount of chips cannot be reduced sufficiently. For this reason, it is necessary to frequently replace the cross-flow filtration membrane.
• the processing waste liquid containing the chips is constantly discharged to the cross-flow opening. Since it passes through one filtration membrane, it is possible to carry out the treatment continuously for a long time.
• the processing waste liquid regenerating method is characterized in that the processing waste liquid containing the chips discharged to the second chamber side of the cross mouth opening filter in the cross flow separation step is converted from the average particle size of the chips.
• the method further includes a medium liquid collecting step of collecting a medium liquid containing no abrasive grains and chips by filtering through a filtration membrane having sufficiently small pores. In this way, the medium liquid discharged together with the chips in the cross-floor one-separation step is collected, so that the waste of the medium liquid is further reduced, and the processing cost is further reduced. The amount of discarded processing waste liquid is further reduced.
• the medium liquid collecting step is provided through a first chamber of a filter having a first chamber and a second chamber separated by the filtration membrane.
• the processing waste liquid is circulated in the circulation path, and the medium liquid is recovered to the second chamber side of the filter, whereby the processing waste liquid is concentrated in the circulation path.
• the medium liquid recovery step is performed by so-called cross-flow filtration, so that clogging of the filtration membrane does not easily occur and high filtration efficiency can be obtained.
• the processing waste liquid that is circulated and concentrated is discharged after the concentration of the chips becomes sufficiently high, the processing waste liquid to be disposed of can be reduced to a small amount.
• the processing waste liquid containing the chips discharged to the second chamber side of the cross mouth opening filter in the cross mouth opening separation step further includes a medium liquid collecting step of collecting a medium liquid containing no abrasive grains and cuttings for use in the addition step by filtering through a filtration membrane having pores sufficiently smaller than the average particle diameter. c In this way, the recovered medium liquid is suitably used, thereby further reducing processing costs and further reducing the amount of processing waste liquid discarded.
• the processing waste liquid containing the swarf discharged to the second chamber side of the crossflow filter in the crossflow separation step is processed using an average particle size of the swarf.
• the method further includes a medium liquid collecting step of collecting a medium liquid containing no abrasive grains and cuttings for use in the medium liquid supply step by filtering through a filtration membrane having pores sufficiently smaller than the diameter. It is a thing. In this way, the recovered medium liquid is suitably used, thereby further reducing processing costs and further reducing the amount of processing waste liquid to be discarded.
• the medium liquid supply step is performed in the circulation path after the second chamber of the cross mouth opening filter is substantially filled with the supplied medium liquid.
• the processing waste liquid is circulated in the circulation path passing through the first chamber until the second chamber is filled with the medium liquid, and pressure is applied to the film surface.
• the permeation of the medium liquid from the second chamber to the first chamber, that is, backwashing does not start, and the backwashing starts after the second chamber is filled with the medium liquid. It will be backwashed. That is, in a normal cross-flow filtration device, when backwashing, the circulation of the processing waste liquid is stopped (generally, the circulation pump is stopped), and then the supply of the medium liquid to the second chamber side is started.
• the cross-flow filtration membrane used in the present invention needs to use a relatively large aperture in order to allow the chips to pass therethrough, if the backwash is performed in the same procedure, the second room
• the medium liquid supplied to the first chamber immediately permeates to the first chamber side, and only the lower part of the cross filter membrane is first backwashed. Therefore, even if the medium liquid is filled up to the upper part, the permeation amount of the medium liquid from the lower part is increased because the permeation resistance of the lower part that has been backwashed earlier is small, and the upper part is sufficiently backwashed. May not be.
• the backwashing does not start until the second chamber is filled with the medium liquid, and the entire surface of the cross-floor single filtration membrane is backwashed in substantially the same manner.
• the gist of the processing waste liquid regenerating apparatus of the third invention for achieving the above object is that the processing waste liquid from the free abrasive processing from the free abrasive processing is performed using the processing liquid in which the abrasive grains are dispersed.
• a processing waste liquid regenerating apparatus for regenerating processing waste liquid by separating chips comprising: (h) a first waste liquid tank for storing the processing waste liquid; and (i) sufficiently smaller than an average particle diameter of the abrasive grains.
• a cross filter with a first chamber and a second chamber separated by a cross filter with pores sufficiently larger than the average particle diameter of the cutting chips; and 1) a first circulation path passing through the first chamber of the waste liquid tank and its cross filter and the first filter, and) by circulating the processing waste liquid in the first circulation path, the processing waste liquid is transferred to the surface of the cross filter and the filtration membrane.
• the processing waste liquid regenerating apparatus is provided with a so-called cross-flow filter in which a first flow path through which the processing waste liquid is circulated is provided with a cross-flow filtration membrane through which abrasive grains cannot pass and chips can pass. Since the processing waste liquid is circulated in the first circulation path by the circulation device, part of the processing waste liquid is discharged together with the chips through the cross-flow filter, while the processing waste liquid is processed in the first circulation path. The waste liquid is recovered in the form of a suspension by a reclaimed processing liquid recovery device.
• the amount of the abrasive particles contained in the recovered regenerating solution does not change, but the amount of the swarf passes through the filter. It is reduced according to the amount of processing waste liquid discharged. Therefore, the ratio of the amount of swarf to the amount of abrasive is reduced in this regenerative processing fluid, and if necessary, a medium solution free of abrasive and swarf is added to release the abrasive again. It can be used for grain processing.
• the reclaimed processing liquid recovery device is provided, for example, by providing a recovery path having an on-off valve in the first circulation path, and the regenerated processing liquid is recovered by opening the on-off valve.
• the gist of the processing waste liquid regenerating apparatus of the fourth invention for achieving the above object is as follows.
• a flow measuring device for measuring the amount of the processing waste liquid discharged to the chamber side and the amount of the medium liquid supplied from the medium liquid tank to the first circulation path, respectively, and the medium in the medium liquid tank
• a medium liquid supply device for supplying a liquid into the first circulation path at least in part by an amount equal to the discharged processing waste liquid amount through a path from the second chamber to the first chamber. It is in.
• the processing waste liquid recycling device does not include abrasive grains and chips.
• the recovered regenerated working fluid has the same amount of medium fluid and abrasive grains, but the amount of cuttings discharged through the filter. It is reduced according to the amount of waste liquid. Therefore, the ratio of the amount of swarf to the amount of abrasive grains in the regenerated machining liquid is reduced, and the concentration of the abrasive grains is the same as the initial one, so that it can be used again for free abrasive grain processing as it is.
• the reclaimed processing liquid recovery device is provided, for example, by providing a recovery path having an on-off valve in the first circulation path, and the regenerated processing liquid is recovered by opening the on-off valve.
• the cross-flow filtration membrane of the cross-flow filtration device is formed of a single-layer mesh.
• the mouthpiece filter is configured such that a lowermost part of the second chamber is stored in a lowermost part of the first chamber and the wastewater tank. Is located at a level higher than the liquid level of the processing waste liquid. In this way, the medium liquid supplied from the medium liquid tank to the first circulation path by the medium liquid supply device through the second chamber of the cross filter and the first filter is all in the first circulation including the first chamber and the waste liquid tank. Returned into the route.
• the processing waste liquid is circulated in the first circulation path again by the circulation device.
• the medium liquid supplied from the medium liquid tank does not remain in the second chamber, and the processing waste liquid containing the chips is processed.
• all of the medium liquid supplied by the medium liquid supply device is taken into the first circulation path, and the amount of the medium liquid in the first circulation path is maintained substantially constant.
• the cross flow filter has an uppermost portion located below a liquid surface of the medium liquid stored in the medium liquid tank.
• the processing waste liquid regenerating apparatus of the third invention is characterized in that the processing waste liquid discharged to the second chamber side of the crossflow filter is reduced to a size sufficiently smaller than the average particle diameter of the chips.
• the apparatus further includes a medium liquid recovery device that recovers a medium liquid that does not contain abrasive grains and chips by filtering through a filtration membrane having holes.
• the processing waste liquid regenerating apparatus of the fourth invention is characterized in that the processing waste liquid discharged to the second chamber side of the crossflow filter is reduced to a size sufficiently smaller than the average particle diameter of the chips.
• the apparatus further includes a medium liquid recovery device that recovers a medium liquid containing no abrasive grains and chips by filtering through a filtration membrane having holes, and supplies the medium liquid to the medium liquid tank.
• the medium liquid contained in the processing waste liquid discharged to the second chamber side of the crossflow filter is used as the medium liquid supplied into the circulation path by the medium liquid supply device. Therefore, the amount of the medium liquid to be discarded is reduced to reduce the cost such as free abrasive processing, and the amount of the waste liquid is reduced to reduce the effect on the environment.
• the medium liquid recovery device includes: a second waste liquid tank that stores a processing waste liquid discharged to the second chamber side of the cross flow filter; and a first waste liquid tank separated by the filtration membrane.
• a filter having a first chamber and a second chamber; a second circulation path passing through the second waste liquid tank and the first chamber of the filter; and processing the processing waste liquid by circulating the processing waste liquid in the second circulation path.
• a circulating device for allowing waste liquid to flow along the surface of the filtration membrane and performing a cross-flow filtration for removing a medium liquid containing no chips through the filtration membrane to the second chamber side of the filtration device;
• a concentrated waste liquid discharging device for discharging, as a concentrated waste liquid, a processing waste liquid having a high chip concentration while being circulated in the second circulation path.
• the concentrated waste liquid discharge device is provided, for example, by providing a discharge path having an on-off valve in a second circulation path for the second waste liquid, etc., and opening and closing the on-off valve. Is discharged.
• the processing waste liquid regenerating apparatus includes a medium liquid tank for storing the medium liquid taken out to the second chamber side of the filter, a supply amount control valve, and a liquid sending unit.
• the medium liquid recovered by the medium liquid recovery device is Since the processing waste liquid in the first circulation path is supplied into the first waste liquid ink in accordance with a change in the abrasive concentration, the abrasive concentration is maintained within a predetermined range. For this reason, even if the processing waste liquid is discharged to the second chamber side of the first filter and the abrasive concentration of the processing waste liquid in the first circulation path becomes high, the concentration is within a predetermined range.
• FIG. 1 is a function block diagram showing the principle of a processing waste liquid regenerating apparatus and a regenerating method according to the present invention.
• FIG. 2 is a diagram showing a configuration of a processing waste liquid regenerating apparatus according to one embodiment of the present invention.
• FIG. 3 is a diagram showing a primary filter used in the processing waste liquid regenerating apparatus of FIG.
• FIG. 4 is a diagram illustrating a filtration method using the processing waste liquid regenerating apparatus of FIG.
• FIG. 5 is a functional block diagram showing the principle of a processing waste liquid regenerating apparatus and a regenerating method according to another embodiment of the present invention.
• FIG. 6 is a view showing a configuration of a processing waste liquid regenerating apparatus according to another embodiment of the present invention.
• FIG. 7 is a diagram showing a primary filter used in the processing waste liquid recycling apparatus of FIG.
• FIG. 8 is a time chart illustrating a filtration method using the processing waste liquid regenerating apparatus of FIG.
• FIG. 9 is a diagram for explaining a change over time of the concentration of abrasive grains and the concentration of cutting chips when processing the processing waste liquid according to the time chart of FIG.
• FIG. 10 is a view for explaining still another embodiment of the present invention, and corresponds to a part of FIG.
• FIG. 11 is a view for explaining still another embodiment of the present invention, and corresponds to a part of FIG.
• FIG. 12 is a diagram illustrating another embodiment of the primary filter used in the processing waste liquid regenerating apparatus of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
• FIG. 1 is a functional block diagram showing the principle of the processing waste liquid regeneration method of the first invention and the principle of the processing waste liquid regeneration device of the third invention.
• the waste liquid in which the abrasive grains and chips are dispersed is separated into a regenerated processing liquid in which the concentration of chips is reduced in the primary filtration device and a processing waste liquid containing no abrasive grains.
• This regenerated processing liquid is used again for free abrasive processing such as lapping after adjusting the concentration by adding a medium liquid containing no abrasive grains as needed.
• the processing waste liquid containing no abrasive grains is separated into a concentrated waste liquid having a high concentration of chips in the secondary filtration device and a medium liquid containing no abrasive grains and chips.
• the concentrated waste liquid is discarded.
• the recovered medium liquid is used for adjusting the concentration of the processing waste liquid circulated in the primary filtration device, or for adjusting the concentration of the regenerated processing liquid.
• FIG. 2 is a diagram showing a configuration of an example of the processing waste liquid regenerating apparatus 10.
• This waste liquid reclaiming device consists of a primary filtration device 12 that recovers regenerated machining fluid containing abrasive grains by separating chips from the processing waste fluid, and a processing device that does not contain abrasive particles discharged from the primary filtration device 12. Concentrate waste liquid and collect medium liquid. And a secondary filtration device 14 as a liquid recovery device.
• the upper side corresponds to the vertical upper side of the actual device, and the lower side corresponds to the vertical lower side.
• the primary filtration device 12 includes, for example, a first waste liquid tank 16 for storing processing waste liquid generated in a lapping device (not shown), and a first chamber 20 and a second chamber 22 separated by a filtration membrane 18.
• a primary filter 24 having a circulating pump 26, a pressure gauge 28, and an on-off valve 30 to connect the first waste liquid tank 16 to the inlet of the first chamber 20 of the primary filter 24.
• 1 Supply path 3 2 1st return path 3 equipped with pressure gauge 3 4 and on-off valve 36 to connect 1st waste tank 16 with outlet of 1st chamber 20 of primary filter 24 8, a waste liquid path 40 connected to the second chamber 22 of the primary filter 24 and having an on-off valve 39, and a first supply path 32 between the circulation pump 26 and the on-off valve 30.
• a recovery path 44 having an on-off valve 42 connected thereto is provided.
• the primary filter 24 is used for the cross-flow filter
• the filtration membrane 18 is used for the cross-flow filter
• the circulation pump 26 is used for the circulation device
• the first supply path 32 and the first return path is provided.
• Reference numeral 38 denotes a first circulation path or a circulation path
• the on-off valve 42 and the recovery path 44 correspond to a regenerated processing liquid recovery device.
• the secondary filtration device 14 is provided with a second waste liquid tank 46 for storing the processing waste liquid containing no abrasive particles supplied from the waste liquid passage 40, and a first chamber 5 separated by a filtration membrane 48.
• a secondary filter 54 having a 0 and a second chamber 52, a circulating pump 56, a pressure gauge 58, and on-off valves 60, 62 are provided with a second waste ink 46 and a secondary filter 54.
• a second supply line 64 connecting the inlet of the first chamber 50 of the second, a pressure gauge 66 and on-off valves 68, 69 are provided.
• a second return path 70 connecting the outlet of the chamber 50, a discharge path 74 having an on-off valve 72 and connected to the second waste liquid tank 46, and on-off valves 76 and 78 are provided.
• a filtrate tank 82 for storing a filtrate supplied from the filtrate path 80, that is, a medium liquid containing no abrasive grains and chips.
• the secondary filter 54 is a filter
• the second supply path 64 and the second return path 70 are a second circulation path
• the on-off valve 72 and the discharge path 74 are concentrated.
• the filtrate waste tank 82 corresponds to the medium fluid tank in the condensate waste liquid discharge device c.
• the filtrate tank 82 of the secondary filtration device 14 above is provided with a liquid feed pump 84 and an on-off valve 86.
• a liquid sending path 88 for sending a medium liquid containing no abrasive grains and chips in the filtrate tank 82 to the first waste liquid tank 16 is connected, and the filtrate path 80 is provided with an on-off valve 76, 7 8
• a backwash path 92 having an on-off valve 90 is connected to a position between the liquid feed pump 84 and the on-off valve 86 in the liquid feed path 88.
• the liquid sending pump 84 corresponds to the liquid sending device
• the on-off valve 86 corresponds to the supply amount control valve
• the liquid sending path 88 corresponds to the medium liquid supply path.
• the primary filter 24 is, for example, a pair of stainless steel punching metal 9 having filtration membranes 18, 18 made of, for example, a single-layer stainless steel mesh on opposing surfaces.
• a corner provided with the first chamber 20 having a rectangular cross section formed by connecting two stainless plates 96 and 96 with each other at a side end thereof at an interval of about 10 mm. It comprises a cylindrical body and a case 98 which forms the second chamber 22 by covering the outer peripheral surface of the rectangular cylindrical body.
• the mesh size of the stainless steel mesh forming the filtration membrane 18 is appropriately set in accordance with the average grain size of the abrasive grains contained in the processing waste fluid to be regenerated. Is set to be sufficiently small and sufficiently larger than the size of the chips.
• the 1st room 20 and the 2nd room 22 of the next filter 24 are filtration membranes 18, 1
• the first supply path 32 is connected to the opening 102 of the first chamber 20, and the first return path 38 is provided on the opposite side of the opening 102. (Not shown).
• the case 98 is provided with a connection hole 104 to which the waste liquid path 40 is connected.
• the secondary filter 54 is, for example, a ceramic provided with a large number of through-holes provided with the filtration membrane 48 on the inner wall surface thereof along the axial direction of a cylindrical base made of, for example, porous alumina ceramics.
• the filter is configured such that one end of the through hole is connected to the second supply path 64 and the other end is connected to the second return path 70.
• the size of the pores of the filtration membrane 48 is appropriately set according to the average particle size of the chips, which fluctuates depending on the processing conditions, so as to be sufficiently smaller than the average particle size of the chips. You.
• the first waste liquid tank 16 is provided with a liquid meter 106 for detecting the amount of the processing waste liquid stored therein and a hydrometer 108 for detecting the concentration.
• the second waste liquid tank 46 is provided with a hydrometer 110 for detecting the concentration of the processing waste liquid stored therein.
• the liquid meter 106 and the specific gravity meters 108 and 110 are connected to the control device 112.
• on-off valve 86 of the liquid supply path 88 for example, an electrically controllable on-off valve such as a solenoid valve is used. These on-off valves 30, 42, 62, 72, 86 are used. Is also connected to the control device 112.
• control device 112 controls the liquid amount, concentration, and the second waste liquid tank 46 in the first waste liquid tank 16 detected by the liquid level meter 106, the specific gravity meters 108, 110.
• the on / off valve 30 and the like are opened and closed based on the concentration in the chamber to adjust the concentration of the processing waste liquid in the first circulation path, collect the regenerated processing liquid, and discharge the concentrated processing waste liquid.
• reference numeral 114 denotes the inside of the first waste liquid tank 16. It is a stirrer for stirring the processing waste liquid.
• the processing waste liquid used in the present embodiment is, for example, a kerosene-based lapping liquid (hereinafter referred to as a medium liquid) containing # 1000 (average particle size of about 10 zra) GC or other abrasive particles of 1.6 kg / £.
• the working fluid dispersed so as to have a concentration is used for free abrasive grain processing such as lapping of silicon wafers.
• the above processing waste liquid contains, for example, silicon chips having an average particle diameter of about l.Om at a concentration that degrades processing quality and processing efficiency, for example, a concentration of about 0.5 kg / £.
• the filtration membrane 18 is made of a so-called twilled-woven stainless mesh having pores with a nominal filtration accuracy of about 5 / m (that is, with openings of about 5 m). For 8, a material having pores of about 0.2 zm is used.
• the aperture of the filtration membrane 18 was selected to be about 1/2 of the average diameter of the abrasive grains, which is about 10 m.
• the size of the pores was chosen to be sufficiently smaller, since the average particle size of the chips is about l / zm.
• the on-off valve 42 of the recovery path 44 remains closed.
• the processing waste liquid stored in the first waste liquid tank 16 is circulated in the circulation path (first circulation path) passing through the first supply path 32, the primary filter 24, and the first return path 38. And is passed along the surface of the filtration membrane 18 of the primary filter 24.
• the opening amount of the on-off valves 30 and 36 depends on, for example, the filtration pressure (that is, the average value of the processing waste liquid pressure in the first supply path 32 and the first return path 38) depending on the concentration of the processing waste liquid.
• Appropriate value to be determined generally around 0.5 to 2.0 kg / cm 2 (for example, 1.0 kg / cm 2 ), circulation path Flow rate of the inner is 1. 0 ⁇ 3.
• 0m / s (e.g. 2. 0m / s) c still be set so that the extent, said on-off valve 3 6, 3 9 also close control by the control device 1 1 2 May be done. Further, by controlling the discharge pressure and discharge amount of the circulation pump 26 by inverting, the filtration pressure and the flow velocity in the circulation path may be controlled.
• the processing waste fluid discharged into the waste fluid passage 40 contains abrasive grains because the openings of the filtration membrane 18 are about 5111, which are sufficiently smaller than the abrasive grains and sufficiently larger than the cutting chips. Contains only swarf. That is, the processing waste liquid is transmitted through the waste liquid path 40 in a state where the chips are dispersed, and the concentration of the permeated processing waste liquid is always equal to the concentration of the chips of the circulated processing waste liquid. Will be equal.
• the processing waste fluid circulated through the first supply passage 32 has a constant chip concentration, and the concentration of the cutting particles does not change, but the concentration of the abrasive grains is reduced. Increasingly higher, in other words, the amount of abrasive remains unchanged and only the amount of swarf is reduced.
• the step of circulating the processing waste liquid with the above-mentioned on-off valve 42 closed is equivalent to the circulation step, and the step of discharging the processing waste liquid from the waste liquid passage 40 in this circulation step is a step. ⁇ Corresponds to the flow separation process.
• the opening / closing valve 30 of the first supply path 32 is closed and the opening / closing valve 42 of the recovery path 44 is opened, and the regenerated processing fluid having a sufficiently low chip concentration is discharged. Collected. Since the concentration of the abrasive particles in the recovered regenerated solution is increased by discharging the medium liquid in the processing waste fluid together with the chips through the filter 24, the recycle solution is processed before, during, and during the circulation of the processing waste fluid.
• a predetermined value for example, about 30% of the initial value
• a medium liquid containing no abrasive grains and chips is added and used at a concentration suitable for processing (for example, the initial 1.6 kg / ⁇ ).
• concentration suitable for processing for example, the initial 1.6 kg / ⁇ .
• the method of adding the medium liquid will be described later.
• the step of opening the on-off valve 42 and collecting the regenerated working fluid corresponds to a regenerated working fluid collecting step.
• the processing waste liquid discharged from the waste liquid passage 40 is stored in the second waste liquid tank 46 of the secondary filtration device 14.
• the on-off valves 60, 62, 68, 69, 76, 78 are opened by the operation and manual operation of the control device 112, and the on-off valves 72, 90 are opened. Is closed, the processing waste fluid is circulated by the circulation pump 56 in the second circulation path passing through the second supply path 64, the secondary filter 54, and the second return path 70, and the secondary filter The filter is passed along the surface of the filtration membrane.
• processing waste liquid While the processing waste liquid is circulated in the second circulation path, only the medium liquid containing no abrasive grains and chips is passed through the filtration membrane 48 of the secondary filter 54 and passed through the filtration path 80.
• the processing waste liquid collected in the filtrate tank 82 and circulated in the second circulation path has a gradually increased chip concentration.
• the concentration of chips in the processing waste fluid is a predetermined value (generally, a value at which the filtration efficiency is lower than the predetermined value.
• a predetermined value generally, a value at which the filtration efficiency is lower than the predetermined value.
• the control device 112 activates the on-off valve 62 and closes the on-off valve. 7 2 is opened, and the concentrated waste liquid is discharged from the discharge path 74.
• the step of circulating the processing waste liquid in the secondary filtration device 14 with the on-off valves 72, 90 closed is equivalent to the medium liquid recovery step.
• the above-mentioned detection of the chip concentration is performed by, for example, providing a liquid meter similar to the liquid meter 106 in the second waste liquid tank 46 instead of the measurement using the hydrometer 110, and circulating the same.
• the amount of processing waste The measurement may be performed indirectly, for example, by measuring the amount of the medium liquid taken out to the filtrate passage 80. Further, the concentrated waste liquid may be discharged after a predetermined time elapses.
• the amount of chips in the processing waste fluid is reduced and the abrasive particles are recovered in a suspension state by the primary filtration device 12 having a relatively simple configuration as described above.
• a regenerated machining liquid is obtained, so that usable abrasive grains are effectively used without being discarded. Therefore, there is no waste of abrasive grains in the free abrasive grain processing, and the processing cost is reduced.
• the openings of the filtration membrane 18 are sufficiently smaller than the average particle size of the abrasive grains, and the processing waste liquid is filtered by a so-called cross-flow filtration method. Since the abrasive particles are circulated along the surface of No. 8, the abrasive particles are circulated in the circulation path without being deposited on the surface of the filtration membrane 18, and only the chips are discharged together with the processing waste liquid.
• the concentration and viscosity of the processing waste liquid can be filtered as long as they can be circulated in the circulation path (first circulation path), thereby improving the processing efficiency of the free abrasive processing. Therefore, it is possible to treat the waste liquid having a suitable concentration and viscosity, that is, a relatively high concentration and high viscosity as in the above-described example of the regeneration treatment.
• a suitable concentration and viscosity that is, a relatively high concentration and high viscosity
• a relatively high concentration and high viscosity as in the above-described example of the regeneration treatment.
• a regenerator using a hydrocyclone as conventionally proposed, only a relatively low-concentration and low-viscosity processing waste liquid capable of obtaining a classifying action by centrifugal force can be treated.
• the aperture of the filtration membrane 18 is about 1/2 of the abrasive grain size, the abrasive grains that have become small due to crushing or abrasion in the loose abrasive processing are discharged together with the cutting chips. Thus, a regenerated working fluid more suitable for free abrasive grain processing is recovered.
• the processing waste liquid containing no abrasive particles discharged from the primary filtration device 12 is Since most of the medium liquid is recovered in the secondary filtration device, the amount of the medium liquid that is discarded together with the chips is reduced, so that the treatment is facilitated and the processing cost is further reduced.
• the filtration membrane 18 of the primary filter 24 used in the primary filtration device 12 is made of a single-layer stainless steel mesh, chips that pass through the filtration membrane 18 together with the processing waste liquid are filtered. Does not accumulate in membrane 18. Therefore, the filtration membrane 18 is hardly clogged, and even if the filtration membrane 18 is not replaced, the processing waste liquid having the same chip concentration as the processing waste liquid circulated in the circulation path for a long period of time in the waste liquid path 40. Will be discharged.
• a membrane having a relatively large thickness in the filtration membrane 18 for example, a ceramic filter such as the filtration membrane 48 used in the secondary filter 54, or a laminated sintered wire mesh filter
• a ceramic filter such as the filtration membrane 48 used in the secondary filter 54
• a laminated sintered wire mesh filter When evening is used, chips are accumulated inside the membrane and the chips gradually pass through, so the chip concentration cannot be reduced sufficiently unless the filtration membrane 18 is replaced frequently.
• the secondary filtration device 14 is also a cross-flow filtration performed by a filtration membrane 48 having pores sufficiently smaller than the average particle size of the chip, a ceramic filter or the like is provided on the filtration membrane 48. Even in the case of being used, clogging of the filtration membrane 48 by cutting chips is unlikely to occur, and efficient filtration is performed for a long time without replacing the filtration membrane 48.
• the regenerated processing liquid or the circulating waste fluid contains a medium that does not contain abrasive grains and chips. Liquid needs to be added.
• an example of the addition method will be described.
• Figure 4 shows the time variation of the concentration in the processing waste fluid when the filtration is performed by adding a medium solution that does not contain abrasive grains and chips to the circulating processing waste fluid, using three different addition methods.
• Fig. 4 (a) is a diagram showing each case. The abrasive grain concentration is shown, and FIG. 40 shows the chip concentration.
• Pattern a shown by the solid line is an example in which a large amount of medium liquid was added to the processing waste liquid first.
• This addition amount is determined by the amount of processing waste liquid and the amount of cutting chips to be removed.
• the abrasive concentration of processing waste liquid is 1.6 kI and the concentration of cutting chips is 0.5 kg / ⁇ as described above
• the chip concentration is 0.15 kg / ⁇ (that is, the chip concentration is about 30% of the initial value)
• 2.3 times the amount of the medium liquid in the processing waste liquid is added ( That is, for example, when the processing waste liquid is liquid 200 ⁇ , abrasive grains 320 kg, and chips 100 kg, a medium liquid of 460 ⁇ is added to reduce the chips to 30 kg.)
• the initial concentration of abrasive grains in the circulated processing waste liquid is 0.48 kg / and the chip concentration is 0.15 kg / ⁇ . That is, in this example, the chip concentration is first reduced to the target concentration and then filtered, and the abrasive concentration is gradually increased from 0.48 kg / ⁇ after the waste liquid is discharged together with the chip, and the initial concentration 1.
• the pressure reaches 6 kg / _g, the filtration is terminated, and the circulated processing waste liquid is collected.
• the chip concentration is always constant.
• the first waste liquid tank 16 needs to use a relatively large capacity (660 ⁇ or 3.3 times the processing waste liquid 200 ⁇ in the above example). Since the concentration of the processing waste liquid is relatively low, the filtration speed is high, and the discharge pressure of the circulation pump 26 is not required to be so high. In this example, it is necessary to add a large amount of the medium liquid. However, most of the medium liquid can be repeatedly used as the medium liquid recovered in the filtrate tank 82 by the secondary filtration device 14, so that the medium liquid is added. Is little wasted.
• the processing waste liquid is concentrated until the chip concentration becomes, for example, about 1.1 kg /, so that the waste liquid is discarded.
• the medium liquid is only about 13% of the added liquid amount (about 60 in the above example). It is.
• the amount of processing waste liquid in the circulation path is initially determined by the liquid amount meter 106 provided in the first waste liquid tank 16. (That is, 200 ⁇ in the above example), the control device 1 1 2 operates to close the open / close valve 30 of the first supply path 32 and open / close the recovery path 4 4. The valve 42 is opened, and the processing waste liquid is collected, whereby a regenerated processing liquid is obtained. Therefore, in the case of this pattern a, it is not necessary to detect the concentration of the processing waste liquid, and the hydrometer 108 may not be provided.
• the processing waste liquid is configured to detect the chip concentration by measuring the specific gravity of the processing waste liquid using a specific gravity meter 108, and to collect the processing waste liquid when the chip concentration reaches a predetermined value.
• a flow meter (not shown) provided in the waste liquid passage 40 or the like, and when the amount becomes equal to the amount of the added medium liquid, The processing waste liquid may be collected at a later time. In these cases, the liquid meter 106 may not be provided. That is, in the case of the battery a, it is only necessary to directly or indirectly detect that the amount of the processing waste liquid discharged from the waste liquid passage 40 becomes equal to the amount of the added medium liquid.
• the pattern b indicated by the broken line indicates that the medium liquid is not added at the beginning when the processing waste liquid is circulated, and the amount of the medium liquid according to the amount of the processing waste liquid discharged through the filtration membrane 18 is supplied to the first waste liquid tank It is always replenished to 16. Therefore, as shown in (a), the concentration of the abrasive grains is always constant, while the concentration of the swarf is a medium that does not contain abrasive grains and swarf instead of the processing waste fluid containing the swarf being discharged. As the liquid is added, it is gradually lowered.
• the opening / closing valve 86 is closed by 1 1 2 to stop the supply of the medium liquid. This operation is repeated while filtration is performed by the primary filtration device 12, so that the amount of processing waste fluid in the circulation path (first circulation path) is kept substantially constant, and the abrasive particle concentration is kept substantially constant. It is said that. Then, when it is detected by the hydrometer 108 or the like that the chip concentration has reached the predetermined concentration, the on / off valve 30 is closed and the on / off valve 4 2 Is opened, and the processing waste liquid is recovered from the recovery path 44 to obtain a recycled processing liquid.
• the capacity of the first waste liquid tank 16 is sufficient only by the amount of the processing waste liquid to be processed, and there is an advantage that a large tank capacity is not required.
• the load of the circulation pump 26 is kept substantially constant, and a particularly high discharge pressure is not required.
• the abrasive concentration during filtration is always higher than the above pattern a, but the final abrasive concentration in pattern a is the same as in pattern b, and a circulating pump 24 with the same discharge pressure is used after all. It is good.
• the chip concentration may be directly detected by the specific gravity measured by the specific gravity meter 108 in the first waste liquid tank 16 as described above.
• a gauge may be provided to detect indirectly based on test data by measuring the amount of processing waste liquid discharged.
• the pattern c indicated by the dashed line is the same as the above pattern b, after the concentration of the abrasive particles has become relatively high, the opening and closing valve 86 is opened in the same manner as in the above case, and the medium liquid is discharged into the first waste liquid tank.
• This is an example in which the filtration is performed by supplying the mixture to 16. Even if the concentration of abrasive grains is relatively high in this way, there is no particular problem as long as it does not reach the flow limit in the circulation path.
• the regenerated machining liquid is collected when the predetermined chip concentration is reached.
• the filtration rate (that is, the discharge rate of the processing waste liquid to the waste liquid path 40) is checked in advance, and the on-off valve 86 is operated at regular time intervals. It may be constituted, and there is no problem even if the medium liquid is excessively added so that the abrasive particle concentration is temporarily lowered from the initial value. However, in the case of the pattern c, since the filtration speed decreases as the abrasive particle concentration increases, it is preferable that the concentration is kept relatively low.
• the liquid meter 106 or a flow meter (not shown) provided in the waste liquid passage 40 indirectly by the liquid meter 106 or a flow meter (not shown) provided in the waste liquid passage 40, and directly by the specific gravity meter 108.
• the concentration of abrasive grains in the circulation path (first circulation path) is detected in each case.
• the fluid meter 106 and the specific gravity meter 108 correspond to an abrasive concentration detection device, and the control device 112 controls the abrasive particles. It corresponds to a density control device.
• the control device 112 controls the abrasive particles. It corresponds to a density control device.
• FIG. 5 shows a processing waste liquid regenerating method according to the second invention and a processing waste liquid regenerating device according to the fourth invention.
• FIG. 3 is a function block diagram showing the principle of the installation.
• the waste liquid in which the abrasive grains and chips are dispersed is separated into a regenerated processing liquid in which the concentration of chips is reduced in the primary filtration device and a processing waste liquid containing no abrasive grains.
• This regenerated processing liquid is used again for loose abrasive processing such as lapping.
• the processing waste liquid containing no abrasive grains is separated into a concentrated waste liquid having a high concentration of chips in the secondary filtration device and a medium liquid containing no abrasive grains and chips.
• the concentrated waste liquid is discarded, and the collected medium liquid is stored in a medium liquid tank and then supplied to a primary filtration device, where the filtration membrane is backwashed and the concentration of the processing waste liquid in the circulation path is adjusted.
• the supply amount of the medium liquid from the medium liquid tank to the primary filtration device is determined by measuring the amount of processing waste liquid discharged from the primary filtration device and the amount of the medium liquid supplied from the medium liquid tank by a flow rate measuring device. , And is equal to the amount of processing waste liquid discharged. Since the amount of the medium liquid in the processing waste liquid regeneration device is reduced by the amount contained in the concentrated waste liquid, a new medium liquid is supplied to the medium liquid tank as appropriate to compensate for the reduced amount.
• a processing waste liquid regenerating apparatus including the above-described primary filtration device and secondary filtration device will be described in detail.
• FIG. 6 is a diagram showing a configuration of an example of the processing waste liquid regenerating apparatus 130.
• the processing waste liquid regenerating device 130 is composed of a primary filtration device 13 2 for recovering a regenerated processing liquid containing abrasive grains by separating chips from the processing waste liquid, and abrasive particles discharged from the primary filtration device 13 2
• a secondary filtration device 134 as a medium liquid recovery device that concentrates the processing waste liquid that does not contain water and collects the medium liquid, stores the medium liquid collected by the secondary filtration device 134 and performs primary filtration
• a medium liquid supply device 136 for supplying a medium liquid containing no abrasive grains and chips to the device 132.
• the upper side corresponds to the vertical upper part of the actual device, and the lower side corresponds to the vertical lower part.
• the primary filtration device 132 is substantially the same as the primary filtration device 132 shown in FIG. Although it has a similar configuration, the waste fluid path 40 connected to the bottom of the primary filter 24 has an integrated flow meter 1 3 8 at the position between the on-off valve 39 and the second waste tank 46. And a bypass path 142 connecting the uppermost part of the second chamber 22 to the first waste liquid tank 16 with an on-off valve 140 is provided. 1 The first supply path 32 is connected between the waste liquid tank 16 and the circulation pump 26.
• the secondary filtration device 134 has substantially the same configuration as the secondary filtration device 14 shown in FIG. 2, but has a liquid sending pump 84 and an on-off valve 144, and has a filtrate. It has a filtrate supply path 1 48 connecting the tank 8 2 and the medium liquid tank 1 4 6, and an on-off valve 90, and is connected to the filtrate path 80 between the secondary filter 5 and the on-off valve 78. On the other hand, a backwash path 92 connected to the filtrate supply path 148 between the liquid sending pump 84 and the on-off valve 144 is provided.
• the medium liquid supply device 1336 includes the backwash liquid tank 1446, an integrated flow meter 150 and an on-off valve 152, and includes a primary filter 24 and an on-off valve 39. And a backwashing path 154 for connecting the backwashing liquid tank 146 to the waste liquid path 40 at a position between.
• the backwashing liquid tank 146 corresponds to the medium liquid tank
• the backwashing path 154 corresponds to the medium liquid supply path
• the integrating flowmeters 138 and 150 correspond to the flow rate measuring device.
• the backwashing liquid tank 1 46, the opening / closing valve 15 2, the backwashing path 15 4, and the integrating flow meters 1 38, 150 constitute a medium liquid supply device.
• the primary filter 24 has substantially the same structure as the primary filter 24 shown in FIG. 3, but the case 98 has the waste liquid path 40 and the reverse A connection hole 156 to which the washing path 154 is connected is provided at the end on the opening 102 side, and a connection hole 158 to be connected to the bypass path 154 is a connection hole 156. Provided at the end opposite to the end.
• the primary filter 24 is connected to the connection hole 1 With the end on the side of 56 on the lower side and the end on the side of the connection hole 158 on the upper side, the circulation path is erected vertically upward.
• the filtration membrane 18 is erected vertically, and the lowermost portions of the first chamber 20 and the second chamber 22 are located at the same height. Also, as shown in the figure, the lowermost part of the primary filter 24 is located at least at a height H, above the liquid level of the processing waste liquid in the first waste liquid tank 16, and the uppermost part is The liquid is positioned at least below the liquid level of the medium liquid in the backwash liquid tank 1 46 by the height H 2 c .
• the second chamber 22 located on the upper side in FIG. Also, connection holes similar to the connection holes 156 and 158 are provided at both ends, and are connected to the waste liquid passage 40, the no-pass passage 144, and the like.
• the same filter as that in the embodiment shown in FIG. 2 is used.
• Each of the on-off valves 39, 140, and 152 is a motor-driven valve, and the operation thereof is controlled by the control device 112 together with the circulation pump 26.
• the integrated flow meters 1 3 8 and 1 5 0 are also connected to the control unit 1 1 2 and send a flow signal to the control unit 1 1 2 while the integrated flow is reset by a signal from the control unit 1 1 2 Is done.
• the regeneration of the processing waste liquid by the processing waste liquid regeneration device 130 configured as described above will be described based on the operation of the control device 112 with reference to a time chart shown in FIG.
• the processing waste liquid used was the same as that used in the embodiment shown in FIGS. 2 to 4 described above, and the filtration pressure and the flow rate of the processing waste liquid in the circulation path in the following operation were the same. did.
• the above processing waste liquid is charged into the first waste liquid tank 16, and a medium liquid containing no abrasive grains and chips is sufficiently charged into the backwash liquid tank 146 c and time t.
• the on-off valves 30 and 36 are opened and the circulation pump 26 is operated, the on-off valve 39 is opened by the operation of the control device 112.
• the on-off valves 15 2 of the backwash path 15 4 are closed, and both of the integrated flow meters 18 and 150 are reset.
• the processing waste liquid stored in the first waste liquid tank 16 is circulated in the circulation path passing through the first supply path 32, the primary filter 24, and the first return path 38, and the primary filter 24 Is passed along the surface of the filtration membrane 18.
• the on-off valve 42 of the recovery path 44 and the on-off valve 140 of the bypass path 142 are closed.
• the above-mentioned on-off valves 30, 36, and 42 may also be controlled to open and close by the control device 112. Further, the filtration pressure and the flow velocity in the circulation path may be controlled by controlling the discharge pressure and the discharge amount of the circulating pump 26 in an invar overnight.
• a part of the processing waste liquid is discharged to the waste liquid passage 40 through the filtration membrane 18 of the primary filter 24 while being circulated, and then discharged to the secondary filtration device 1 34 by the integrating flow meter 1 38.
• the liquid volume is measured.
• the processing waste liquid discharged into the waste liquid path 40 does not contain abrasive particles because the aperture of the filtration membrane 18 is about 5 zm, which is sufficiently smaller than abrasive particles and sufficiently larger than cutting chips. Contains only swarf. That is, the processing waste liquid is transmitted through the waste liquid passage 40 in a state in which the cutting chips are dispersed, and the concentration of the permeated processing waste liquid is always equal to the concentration of the chips in the circulated processing waste liquid. It will be.
• the processing waste liquid circulated through the first supply passage 32 is, as shown in FIG.
• the processing waste fluid with a constant chip concentration is discharged, so that the chip concentration does not change but the concentration of the abrasive gradually increases, in other words, the amount of the abrasive remains unchanged. Only the amount has been reduced.
• the process in which the processing waste liquid is circulated in a state where the on-off valves 42 and 152 are closed corresponds to a circulation step, and the processing waste liquid is discharged from the waste liquid passage 40 in this circulation step. This step corresponds to the cross-flow separation step.
• a part of the circulated processing waste liquid is discharged to the waste liquid passage 40, and the integrated flow rate measured by the integrated flow meter 1338 is set to a predetermined value (for example, When the amount of processing waste liquid input into the waste liquid tank 16 reaches 3 to 20 vo ⁇ %, a signal S cul indicating the power-up of the integrating flow meter 1338 is sent to the control device 112 at the time.
• controller 1 1 2 receives the signal S cul drives the opening and closing valve 3 9 is a motor-driven valve in the closing direction, opening and closing valve 3 9 at time t 2 when it detects that a closed state,
• the open / close valves 14 0 and 15 2 are driven in the valve opening direction, whereby the backwash path 15 4 replaces the waste liquid path 40 and is substantially connected to the second chamber 22 of the primary filter 24.
• Opening the on-off valve 15 2 after the on-off valve 39 closes is because the medium in the backwash tank 1 4 6 This is to suppress a decrease in filtration efficiency caused by flowing into the waste liquid passage 40.
• the above connection is switched so that the second chamber 2 of the primary filter 2 4
• the medium liquid in the backwash liquid tank 146 is supplied to 2 through the backwash path 154.
• the circulation pump 26 has not been stopped yet, and since the first chamber 20 is filled with the processing waste liquid, the medium liquid supplied to the second chamber 22 is stored therein. .
• the integrated flow rate of the medium liquid amount that has passed through the backwash path 154 is measured by the integrated flow meter 150.
• the control device 1 1 2 and more timer or the like provided in the inside when it is detected that the predetermined delay time has elapsed, the circulating pump 2 6 at time t 3 in accordance with the control of the control device 1 1 2 Is stopped, the inside of the first chamber 20 is emptied, and so-called backwashing in which the medium liquid permeates from the second chamber 22 to the first chamber 20 is started.
• the predetermined delay time (t 3 ⁇ t 2 ) is set to be long enough to completely fill the second chamber 22 with the medium liquid. Therefore, until time t 3, the first from the backwashing liquid tank 1 4 6
• the medium liquid supplied to the second chamber 22 is discharged to the bypass passage 142 through the connection hole 158 provided in the second chamber 22, and is sent to the first waste liquid tank 16.
• the flow path diameter of Gyakuarairo 1 5 4 since the supply rate of the liquid medium into the second chamber 2 2 is set to be sufficiently larger than the permeation rate of the membrane 1 8, t 3 or later Even during the backwash, the amount of the medium liquid supplied from the backwash liquid tank 146 becomes excessive compared to the permeation speed of the filtration membrane 18, and the second chamber 22 is always filled with the medium liquid, and Excess medium liquid is supplied into the circulation path through the bypass path 142.
• the connection hole 158 and the bypass passage 144 also have an air vent function to facilitate supply of the medium liquid when the medium liquid is supplied to the second chamber 22. It's done.
• the integrated flow rate measured by the accumulated flow meter 1 5 0 reaches a set value to the same value as the accumulated flow meter 1 3 8, the force Untoappu signal S cu 2 the control unit 1 is sent to the 1 2, by a control device 1 1 2, the on-off valve 1 4 0, 1 5 2 is operated in the closing direction, is not completely closed by have you the time t 5.
• the controller 1 12 detects that a predetermined time has elapsed from the time t 4 , at time t e , the integrating flow meters 13 8 and 15 0 are reset, and the circulation pump 26 is turned on. thereby opening the on-off valve 3 9 simultaneously with the operation again, the time t 7 after the time t. ⁇ t filtration is repeated actuation similar to the operation of e is performed.
• the predetermined time period is set to a length in which the on-off valve 152 completes the valve closing operation and the medium liquid filled in the second chamber 22 completely permeates to the first chamber 20 side.
• closed-off valve 3 9 the step of stopping the circulation pump 2 6 was state of opening the opening and closing valve 1 5 2 (time t 3 ⁇ t 5) is equivalent to the medium liquid supplying step I do.
• FIG. 9 shows the change in the concentration of abrasive grains and chips when the processing waste liquid is regenerated by repeating the above operation.
• the ⁇ t 7 By supplying the medium liquid in the medium liquid supply step, the abrasive concentration is returned to the initial value, and the chip concentration is reduced in accordance with the amount of the discharged machining waste liquid. Then, by opening the on-off valve 42, the processing waste liquid having a reduced chip concentration, that is, the regenerated processing liquid is recovered from the recovery path 44.
• the above-mentioned predetermined time is set to a time during which the concentration of chips in the waste fluid in the circulation path decreases to a desired predetermined value by repeating the above operation.
• the step of opening the on-off valve 42 and collecting the regenerated working fluid corresponds to a regenerated working fluid collecting step.
• the processing waste liquid discharged from the waste liquid passage 40 is stored in the second waste liquid tank 46 of the secondary filtration device 13 4. Filtration is performed in the same manner as in the above-described embodiment, so that only the medium liquid (medium liquid containing no abrasive grains and chips) in the processing waste liquid is recovered from the filtrate path 80 and the filtrate tank 82
• the processing waste liquid stored in the tank and having a high chip concentration is discharged from the discharge path 74.
• the medium liquid containing no abrasive grains and chips stored in the filtrate tank 82 is supplied to the filtrate supply path 14 by operating the liquid supply pump 84 with the open / close valve 144 open. It is sent through 8 to the backwash tank 1 4 6. For this reason, the medium liquid supplied to the second chamber 22 through the reverse washing path 154 includes the medium liquid separated from the processing waste liquid discharged through the waste liquid path 40. Become.
• the processing waste liquid regenerating apparatus 130 is connected to the first supply path 3 2, a primary filter 24 having a filtration membrane 18 that cannot pass abrasive grains and a swarf, and a cross-floor single-filtration device equipped with a first return path 38 While the waste liquid is circulated by the circulation pump 26, a part of the waste liquid is discharged through the primary filter 24 together with chips.
• the processing waste liquid recycling device 130 has a backwashing liquid tank 146 for storing a medium liquid containing no abrasive grains and chips, and an integrated flowmeter 150 for backwashing.
• a backwash path 1 54 connecting the liquid tank 1 4 6 to the second chamber 2 2 of the primary filter 24 is provided, and the medium in the back wash liquid tank 1 4 6 is used to reverse the filtration membrane 18. While washing is performed, the waste liquid path 40 is provided with an integrating flow meter 1338 so that the amount of processing waste liquid discharged from the primary filtration device 1332 and the amount of supplied medium liquid become equal. As a result, the processing waste liquid in the circulation path of the primary filtration device 132 is recovered from the recovery path 44 as a regenerated processing liquid while the amount of the medium liquid is maintained substantially constant.
• the amount of the medium fluid and abrasive grains contained in the recovered regenerated machining fluid does not change, but the amount of chips is reduced according to the amount of machining waste fluid discharged through the primary filter 24. . Therefore, in this regenerating processing liquid, the ratio of the amount of the chips to the amount of the abrasive particles is reduced, and the concentration of the abrasive particles is the same as that at the beginning, so that it can be used again for free abrasive processing as it is.
• the amount of swarf is reduced by the primary filtration device 13 2 and the medium liquid supply device 1 36, which have relatively simple configurations, while maintaining the abrasive concentration in the processing waste fluid.
• the abrasive grains are recovered in the form of a suspension and a regenerated machining liquid is obtained, so that usable abrasive grains are effectively used without being discarded, and the obtained regenerated machining liquid is used as it is. Can be done. Therefore, there is no waste of abrasive grains in the free abrasive grain processing, and the processing cost is reduced.
• the clogging of the filtration membrane 18 is performed.
• the medium liquid containing no abrasive grains and chips is transmitted from the second chamber 22 side to the first chamber 20 side.
• the backwash is performed by supplying the medium liquid in the backwash tank 146 to the second chamber 22 in the medium liquid supply step. Done.
• the medium liquid is permeated together with the swarf, so that the abrasive concentration of the processing waste liquid in the circulation path becomes high. It is necessary to add a medium liquid containing abrasive grains and cuttings so as to obtain a predetermined abrasive particle concentration, but the medium liquid is supplied through the second chamber 22 in the medium liquid supply step as described above.
• the concentration of the abrasive grains in the reclaimed working fluid can be set to a predetermined value, and at the same time, the filter membrane 18 can be backwashed.
• the backwashing is performed to remove the abrasive particles. It is not particularly problematic to return the medium liquid containing no chips and chips to the circulation path. Frequent backwashing (that is, the medium liquid supply step) can be performed to maintain a high filtration flux. is there
• the bypass path 144 since the bypass path 144 is provided, during the backwashing as described above, the supply from the backwash liquid tank 1446 becomes excessive due to the difference between the permeation speed and the supply speed.
• the medium liquid to be supplied is supplied into the circulation path through the bypass path 142.
• the amount of the medium liquid necessary for backwashing the filtration membrane 18 is only about l to 10 cm 3 / cm 2 , while the medium is supplied into the circulation path.
• the volume of the medium liquid to be determined is determined by the volume discharged in the cross-floor one-step separation process. If it is necessary to supply more medium liquid than is necessary for backwashing, supply the entire amount through filtration membrane 18.
• the secondary filtration device having the filtration membrane 48 having pores sufficiently smaller than the average particle size of the cuttings, wherein the processing waste liquid containing no abrasive particles discharged into the waste liquid passage 40 is used.
• Most of the medium liquid containing no abrasive grains and chips is recovered from the processing waste liquid by filtration through 134, and sent to the backwash liquid tank 146 to be used in the medium liquid supply process.
• the medium liquid discharged together with the swarf in the separation process at the mouth of the cloth is collected and used, so that the waste of the medium liquid is further reduced, the processing cost is further reduced, and the amount of processing waste liquid discarded. Is further reduced, and processing becomes easier.
• the processing effluent has a swarf concentration of, for example, about l.lkg / ⁇ . Since it is concentrated to a certain extent, only a small amount of medium is discarded. In addition, the medium liquid that becomes insufficient due to this waste treatment is separately supplied to the backwash tank 146.
• the circulation pump 26 is stopped after the second chamber 22 of the primary filter 24 is filled with the medium liquid supplied from the backwash liquid tank 146. Since the circulation of the processing waste liquid in the passage is stopped, the processing waste liquid is circulated in the circulation path passing through the first chamber 20 until the second chamber 22 is filled with the medium liquid, and the processing waste liquid is circulated on the membrane surface. Pressure is applied. Therefore, in this state, the permeation of the medium liquid from the second chamber 22 to the first chamber 20, that is, backwashing does not start, and the circulation pump 26 is filled after the second chamber 22 is filled with the medium liquid. Is stopped, backwashing starts. This ensures that the entire surface of the filtration membrane 18 is backwashed.
• the backwashing is not started until the second chamber 22 is filled with the medium liquid, and the entire surface of the filtration membrane 18 is backwashed in substantially the same manner.
• the primary filter 24 is erected so that the circulation path is directed upward in the vertical direction, and the lowermost portion thereof is used for processing waste liquid stored in the first waste liquid tank 16. It is located above the liquid level only by the height H ,. That is, the lowermost part of the second chamber 22 is located at a level higher than the lowermost part of the first chamber 20 and the liquid level of the processing waste liquid in the first waste liquid tank 16.
• the first chamber 20 and the second chamber 22 of the primary filter 24 are All of the medium liquid is returned to the first waste liquid tank 16 and the circulation path, and thereafter, the processing waste liquid is again circulated through the circulation path ⁇ ⁇ ⁇ by the circulation pump 26, and a part of the processing liquid together with the chips is supplied to the second chamber 2
• the medium liquid supplied from the backwash liquid tank 146 does not remain in the second chamber 22 and is discharged to the waste liquid path 40 together with the processing waste liquid including cutting chips. is not c
• the liquid medium supplied by the liquid medium supply device is incorporated in all the circulation path, and the liquid medium volume within the circulation path is maintained substantially constant Become.
• the water head difference H 2 is supplied to the top of the primary filter 2 4. Therefore, when performing backwashing of the filtration membrane 18, there is no need to provide any liquid supply device such as a pump in the backwashing channel 154, and the entire surface of the filtration membrane 18 can be easily backwashed with a simple device configuration. be able to.
• the water head difference H 2 required for backwashing will vary with the viscosity of the supplied liquid medium is generally sufficient tens cm approximately. For example, under the conditions of the embodiment, it may be about 25 cm.
• the filtration membrane 18 of the primary filter 24 used in the primary filtration device 13 2 is composed of a single-layer stainless steel mesh, as shown in the above-described embodiment, the grinding membrane in the processing waste liquid is used. Chips that pass through the filtration membrane 18 together with the granulation processing waste liquid are unlikely to accumulate in the filtration membrane 18, but in this embodiment, the medium to which the medium liquid is further supplied from the backwash liquid tank 1 46 is used. Abrasives and chips accumulated by backwashing in the liquid supply step are easily removed. Therefore, the filtration membrane 18 is not easily clogged, and even if the filtration membrane 18 is not replaced, the waste liquid path 40 has the same chip concentration as the processing waste liquid circulated in the circulation path for a longer period of time. Processing waste liquid will be discharged.
• FIG. 10 is a diagram showing a main part in a case where the connection method of the bypass paths 142 is different in the embodiment shown in FIG.
• the bypass line 144 instead of being connected to the second chamber 22 of the primary filter 24, the bypass line 144 is directly connected to the waste liquid line 40 (or the backwash line 154). You. Even in this case, the excess amount of the medium liquid supplied from the backwash liquid tank 1 46 to the second chamber 22 passes through the bypass passage 142 to the first waste liquid tank 16. Since it will be sent, backwashing will be performed as in the previous embodiment. At the same time, the excess supply of the medium liquid is supplied to the E-contact circulation path without passing through the filtration membrane 18, and the time required for the medium liquid supply step is relatively shortened. That is, the supply of the medium liquid from the backwashing liquid tank 146 to the circulation path does not necessarily have to be performed through the path through the second chamber 22. Only the part needs to be supplied via the route through the second chamber 22.
• FIG. 11 is similar to the embodiment shown in FIG. 6 in that independent integrating flow meters 13 8 and 15 0 are provided in the waste liquid path 40 and the backwash path 154.
• a common supply / discharge channel 162 having one flowmeter 160 is provided.
• the flow meter 160 is, for example, one that adds or subtracts according to the direction of flow of the liquid, and the processing waste liquid is discharged from the second chamber 22 to the waste liquid passage 40 in the cross-flow separation step.
• the supply liquid amount is subtracted and measured. I do.
• the waste liquid path 40 and the backwash path 154 are alternatively connected to the supply / discharge path 162 by a three-way valve 164.
• the discharged liquid amount integrated by the flow meter 160 is set to a predetermined value (for example, the same value as in the above-described embodiment).
• the power-up signal S cul is sent to the controller 1 12, and the three-way valve 16 4 is switched to the backwash path 15 4 4 side, and then the medium liquid supplied to the second chamber 22
• the reset signal S R is sent to the controller 1 12 by resetting the integrated flow of the flow meter 16 0 to be reset (to 0)
• the three-way valve 16 4 The operation of switching to the waste liquid path 40 again is performed.
• the flow meter 160 automatically resets by integrating and subtracting. Therefore, there is no need to reset by the controller 1 12, and the supply / drain path 16 2 is alternatively switched to the waste liquid path 40 and the reverse washing path 154. Therefore, it is not necessary to control the timing of opening and closing the two on-off valves as in the case of using the on-off valves 39, 152.
• FIG. 12 is a diagram showing another embodiment of the primary filter 24 used in the embodiment shown in FIG.
• the primary filter 24 is erected so that the circulation path is vertical, but the circulation path is horizontal as shown in FIG. 6, 158 may be provided at the uppermost and lowermost parts when the circulation path is horizontal.
• the filtration membrane 18 is erected and the lowermost part of the second chamber 22 is located at the same height as the lowermost part of the first chamber 20, the head difference shown in FIG.
• the lowermost portion of the second chamber 22 is positioned above the liquid level of the processing waste liquid in the first waste liquid tank 16, All the medium liquid supplied in the medium liquid supply step is returned to the circulation path in the same manner as in the above-described embodiment. That is, regardless of the direction of the circulation path in the primary filter 24, the lowermost part of the second chamber 22 must have a height higher than the liquid level in the first chamber 24 and the first waste liquid tank 16. If so, a similar effect can be obtained.
• a single-layer stainless steel mesh was used as the filtration membrane 18 of the primary filter 24.
• a filtration sheet 18 having pores formed by etching a thin metal plate may be used.
• a ceramic filter or the like used for the secondary filter 54 may be used.
• Stainless steel mesh is most preferred.
• the processing waste liquid regenerating devices 10 and 13 were provided with the secondary filtration devices 14 and 13 34, but the secondary filtration devices 14 and 13 4 are not necessarily required. It does not have to be provided.
• a new medium liquid or a medium liquid obtained by filtering the processing waste liquid discharged from the waste liquid passage 40 by another filtration device is used. Must be added to the backwashing tank 146 as appropriate.
• the secondary filtration devices 14 and 14 are provided.
• the size of the openings are appropriately set according to the average particle size of the abrasive grains in the processing waste liquid.
• a filtration membrane 18 having pores of about 20 m may be used.
• a so-called plain-woven stainless steel mesh is preferably used.
• the size of the pores does not necessarily have to be about 1/2 of the average particle diameter of the abrasive grains, and is appropriately set in terms of the filtration rate and the collection efficiency of the abrasive grains, for example, 1/5 to 3 / It may be about 4.
• the size of the swarf is about 1/5 to 1/20 of the size of the abrasive, and 1/2 to 1/20 to ensure the removal of swarf and the collection of usable abrasive as much as possible. It is preferably about 1/5, and in order to increase the filtration efficiency as much as possible, it is preferable to make it relatively large, about 3/4 to 1/2. Therefore, about 1/2 shown in the embodiment is most preferable.
• the primary filter 24 and the secondary filter 54 are both provided with a single filter, but a plurality of filters are provided. May be provided in parallel or in series with the circulation path. In this case, in the embodiment shown in FIGS. 6 to 9, all of the plurality of primary filters 24 are connected to the reverse washing path 154 and the like.
• the chip concentration when the chip concentration becomes 0.5 kg / ⁇ in the machining fluid having an abrasive concentration of 1.6 kg / ⁇ , the chip concentration is reduced to about 0.15 kg / ⁇ .
• these concentrations are appropriately changed according to the processing conditions of the free abrasive grain processing. Further, for example, the amount of the working fluid added in the filtration method of the pattern a shown in FIG. 4 is appropriately changed according to the amount of the processing waste fluid and the amount of reduction of the chip concentration.
• the primary filtration device 12 was provided with a tank for storing a new working fluid containing no abrasive grains and chips, and was provided in the tank.
• the control device 112 By controlling the opening / closing valve by the control device 112, when the working fluid amount stored in the filtrate tank 82 becomes insufficient when the working fluid is to be supplied to the first waste liquid tank 16, It may be configured so that a new processing liquid is supplied to the first waste liquid tank 16 as appropriate.
• the primary filtration device 1 2 the primary filter 24 of the 13 2 has a filtration membrane 1 having pores large enough to separate abrasive particles and chips according to the size of the abrasive particles. If 8 is used, regenerate processing waste fluid containing abrasive grains of various sizes.
• the material of the abrasive grains to be separated is not limited to GC, but is applicable to various kinds of abrasive grains used for machining free abrasive grains such as WA.
• the on-off valves 30, 42, 62, 72, 86 of the embodiments shown in FIGS. 2 to 4 and the on-off valves 39, 15 2 of the embodiments shown in FIGS. , 140, and the circulation pump 26 were both opened and closed or operated by the control device 112, but these may be operated manually, and the control device 112 is not necessarily provided. Good. Conversely, all open / close valves and the like may be controlled by the control device 112.
• the on-off valve 30 or the like when the on-off valve 30 or the like is manually operated to regenerate the processing waste liquid according to the pattern a in FIG. 4, the processing in the first waste liquid tank 16 is performed. It is also possible to visually check the amount of the waste liquid and close the on-off valve 30 and open the on-off valve 42 when the amount of the waste liquid reaches the initial amount.
• at least the on-off valve 86 is constituted by an electromagnetic valve or the like. It is preferable that the opening and closing be controlled by the control device 1 12.
• an electromagnetic valve is used for the on-off valve 30 and the like
• the motor-driven valve is used for the on-off valve 39 and the like. Were used, but these may be used in reverse.
• the on-off valve 39 is closed as shown in the embodiment. Wait for a signal and open on-off valve 1 5 2 It is not necessary to control the opening timing, and the on-off valve 15 can be opened at the same time as the on-off valve 39 is closed.
• the secondary filtration devices 14 and 1334 are provided with another second waste liquid tank similar to the second waste liquid tank 46 in parallel with the second waste liquid tank 46, respectively, via the same on-off valves as the on-off valves 39 and the like. It may be connected to the waste liquid path 40, the second supply path 64, the second return path 70, and the discharge path 74. In this way, the operation of the on-off valve 39 and the like causes the substantial connection between the waste liquid path 40 and the second circulation path to be established between the second waste liquid tank 46 and the other second waste liquid tank. It is possible to switch alternatively.
• the second waste liquid tank 46 when the second waste liquid tank 46 is substantially connected to the waste liquid path 40 and the second circulation path, the other second waste liquid tanks are not substantially connected to these, and the on-off valve By opening the on-off valve similar to 72, the concentrated waste liquid is discharged from the discharge path 74.
• the processing waste liquid inside the second waste liquid tank 46 and the like is circulated in the second circulation path. It is preferable that the wastewater is discharged in a state in which it is not discharged. If the processing wastewater is continuously sent from the primary filtration devices 12 and 1332, two second wastewater tanks 46 are provided as described above. By switching, the concentrated waste liquid may be discharged from the side not substantially connected to the waste liquid path 40 and the second circulation path.
• the processing waste liquid regenerating apparatuses 10 and 130 may be incorporated in a free abrasive processing apparatus such as a lap processing apparatus.
• the working fluid is sent from the tank for storing the recycled working fluid recovered from the recovery path 4 4 to the free abrasive processing apparatus, and the working fluid discharged from the free abrasive processing apparatus is discharged to the first waste liquid tank 1. It may be configured so that it can be stored in 6.
• the liquid level of the liquid medium is configured to be positioned above the upper end of the primary filter 2 to 4, the water head difference H 2 were subjected to the supply of backwash and liquid medium, the medium to backwash path 1 5 4
• the backwash liquid tank 146 may be provided at a lower position, for example, at a position lower than the primary filter 24. For example, if there is no backwash liquid tank 1 4 6
• the filtrate tank 82 corresponds to the medium liquid ink.
• the end of the regeneration of the processing waste liquid is determined when the preset processing time has been reached, but, for example, in the first waste liquid tank 16.
• the chip concentration may be detected to determine the end of regeneration.

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• 1995
  • 1995-06-20 KR KR1019960700871A patent/KR100229989B1/ko not_active Expired - Fee Related
  • 1995-06-20 WO PCT/JP1995/001239 patent/WO1995035261A1/ja active Application Filing
  • 1995-06-20 DE DE19580845T patent/DE19580845T1/de not_active Ceased
  • 1995-06-20 US US08/600,954 patent/US5772900A/en not_active Expired - Fee Related
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