WO1995031884A1 - Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur - Google Patents

Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur Download PDF

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Publication number
WO1995031884A1
WO1995031884A1 PCT/JP1994/000799 JP9400799W WO9531884A1 WO 1995031884 A1 WO1995031884 A1 WO 1995031884A1 JP 9400799 W JP9400799 W JP 9400799W WO 9531884 A1 WO9531884 A1 WO 9531884A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
thin film
molded product
forming
conductive circuit
Prior art date
Application number
PCT/JP1994/000799
Other languages
English (en)
Japanese (ja)
Inventor
Takayuki Miyashita
Original Assignee
Polyplastics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP4310023A priority Critical patent/JP2965803B2/ja
Application filed by Polyplastics Co., Ltd. filed Critical Polyplastics Co., Ltd.
Priority to DE69426026T priority patent/DE69426026T2/de
Priority to US08/284,546 priority patent/US5863405A/en
Priority to PCT/JP1994/000799 priority patent/WO1995031884A1/fr
Priority to EP94915265A priority patent/EP0711102B1/fr
Publication of WO1995031884A1 publication Critical patent/WO1995031884A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Definitions

  • the present invention relates to a method for forming a conductive circuit on a surface of a molded article and a conductive circuit forming part.
  • the present invention relates to a method for forming a conductive circuit on the surface of a synthetic resin molded article, and relates to a molded article having an accurate conductive circuit on the surface, which is used as a circuit component in the field of electric and electronic equipment. It relates to a method for efficient production.
  • a method of forming a circuit on the surface of a synthetic resin molded product for example, two types of materials having different plating properties are used to form a circuit, and the circuit forming portion and the other portion are formed by double molding.
  • the SKW method or the PCK method is used to form a metal circuit by selectively plating a circuit part using the difference in characteristics.However, these methods require two molding steps. Not only is it complicated and uneconomical, but also it is difficult to improve the adhesion between the two types of resin interfaces, and for example, problems such as penetration of the plating liquid and residue may occur.
  • a circuit forming method using a laser beam has been developed.
  • a metal film having a sufficient thickness is formed in advance as a conductive circuit on the surface of a molded product, and a metal film in a portion other than the conductive circuit is formed.
  • a method of forming a conductive circuit as it is by scattering and removing it with a laser beam is considered. This method does not require double molding and use of a resist, and is extremely simple.However, in this method, the thickness of the conductive metal layer is reduced. It is necessary to use a relatively thick layer (for example, lO ⁇ ri or more) with sufficient conductivity as a circuit, and increase the output of laser light when removing unnecessary parts of the metal layer with one laser beam. Because of the necessity, there is a problem that the base synthetic resin molded product is damaged and its external appearance is significantly impaired, and the synthetic resin is carbonized to cause a problem in insulation.
  • the present inventors have solved the problems of the conventional methods, and formed a complicated shape by a simple method.
  • a metal layer was previously applied to the surface of a synthetic resin molded product.
  • the output of the laser light is reduced, the unnecessary metal layer is selectively removed, and a circuit pattern can be formed without damaging the underlying resin.
  • a desired conductive circuit can be formed relatively easily without impairing the appearance, shape, insulation, etc.
  • the present invention when a conductive circuit is formed on the surface of a synthetic resin molded product, the surface of the synthetic resin molded product that can be coated with metal is previously subjected to chemical plating, sputtering, vacuum deposition, ion plating.
  • a metal coating is applied by a transfer method or a conductive agent coating method to form a metal thin film having a thickness of 0.2 to 2 / m, and then a part of the thin film surface is irradiated with laser light.
  • a circuit pattern of the metal thin film is formed by removing the metal thin film in a portion other than the conductive circuit portion, leaving a portion of the metal thin film which will become a conductive circuit portion, and further forming an electrical circuit on the metal thin film of the circuit pattern.
  • the material of the substrate molded article used in the present invention may be either a thermoplastic resin or a thermosetting resin as long as it is a synthetic resin material to which a metal thin film can be firmly adhered. Taking into account severe processing such as slicing, it is desirable to use a resin having high heat resistance and excellent mechanical strength, and a thermoplastic resin that can be injection-molded is preferable in terms of mass production. Examples include aromatic polyesters, polyamides, polyacetals, polyphenylene sulfides, polysulfones, polyphenylene oxides, and polyolefins. Examples include mid, polyetherketone, polyacrylate, and compositions thereof.
  • Liquid crystalline polymers are particularly preferable in terms of high melting point, high strength, high rigidity, and moldability.
  • Polyester, polyesteramide) and polyethylene sulfide are particularly suitable, but are not limited to these.
  • C in order to enhance the adhesion of the metal thin film, the material may be changed as necessary. Contains the appropriate substances You may.
  • FIG. 1 is a cross-sectional view of a substrate molded product that is a three-dimensional circuit molded component as an example of the present invention.
  • FIG. 2 is a cross-sectional view showing a state in which a chemical copper plating is applied to the surface of the substrate molded article shown in FIG. 1 and a copper thin film is applied.
  • Fig. 3 is a cross-sectional view showing the state in which the chemical copper thin film other than the circuit forming part of the molded product subjected to the chemical copper plating shown in Fig. 2 is removed with a YAG laser to form a circuit pattern. is there.
  • FIG. 4 is a cross-sectional view showing a state where a circuit formed of a metal layer having a required thickness is formed by applying an electrolytic copper plating to a molded product on which the circuit pattern shown in FIG. 3 is formed.
  • 1 is a molded substrate
  • 2 is a copper thin film formed by chemical copper plating
  • 3 is a circuit pattern formed by laser light
  • 4 is a conductive circuit formed by electrolytic copper plating
  • 5 is a conductive circuit.
  • Each shows a laser beam.
  • the substrate molded product (Fig. 1) is molded by injection molding or the like, and in order to improve the adhesion of the metal thin film on its surface, it is further subjected to chemical etching with acid, aluminum, etc., or corona discharge or plasma treatment. And other physical surface treatments.
  • the surface of the molded product is subjected to metal coating to form a metal thin film (FIG. 2).
  • the thickness of the metal thin film applied here is particularly important. If it is too thick, a laser beam with a strong output is required to form a circuit pattern using a laser beam in the next process. Not preferred as it will cause damage to the product. On the other hand, if the thickness is too thin, the workability of the electrical plating is not favorable when a metal layer having a sufficient thickness is formed as a conductive circuit by the electrical plating in the final step. From such a viewpoint, the thickness of the metal thin film provided on the surface of the base molded product is 0.2 to 2 m, preferably 0.3 to 1 ra.
  • the circuit pattern formation by the laser beam can be performed accurately with a relatively weak output without damaging the molded substrate, and is necessary for electrical plating for final circuit formation. This is preferable because a certain degree of conductivity is maintained.
  • any conventionally known method such as chemical plating, sputtering, vacuum deposition, ion plating, transfer method, and coating of a conductive agent may be used. Chemical techniques are needed to form (Electroless plating), sputtering, ion plating, and vacuum deposition are suitable.
  • the molded product with the metal thin film formed on its surface (Fig. 2) is irradiated with laser light whose output is adjusted appropriately to the part other than the circuit formation part, so that the metal thin film in this part is scattered selectively. It is removed to form a metal thin film circuit pattern (Fig. 3).
  • the irradiating laser beam has a wavelength in the infrared region, such as a YAG laser or a carbon dioxide laser, and has a preset circuit pattern and an XY scanning mechanism controlled by a computer. Irradiate selectively with laser and marker.
  • one laser beam is guided in a three-dimensional direction by an optical fiber, a prism, or the like, and a predetermined area is three-dimensionally controlled by a computer. Irradiation can be performed accurately. Also, according to this method, there is an advantage that pattern creation and modification can be easily performed only by changing the drawing program in the laser irradiation area. Thus, a molded article having a circuit pattern formed of a metal thin film may be used as it is as a circuit part if possible according to the purpose of use.
  • an electric circuit is further provided on the circuit pattern, and a metal layer is added to a desired thickness (for example, 10 to 100 ⁇ m) to obtain a final circuit (FIG. 4).
  • a metal layer is added to a desired thickness (for example, 10 to 100 ⁇ m) to obtain a final circuit (FIG. 4).
  • a general electric plating method can be applied since the already formed circuit pattern has a sufficient degree of conductivity for electric plating.
  • the present invention there is no need for complicated composite molding as in the SKW method or the PC method, and there are no complicated steps in a dark room such as circuit pattern exposure and development as in the case of using a photo resist. It is not necessary, and the appearance, shape, and insulation of the base molded product due to damage when using the laser beam can be prevented, and the desired thickness can be accurately determined by a simple method. Thus, it is possible to obtain a molded part having an excellent conductive circuit, which is economically advantageous.
  • a molded product having a 5 nm copper thin film was formed in the same manner as in Example 1 except that the thickness of the chemical copper plating on the surface of the molded product was changed to 5.
  • the laser beam output for the thickness of the thin film was too weak to form the pattern. It was difficult.
  • the output of one laser beam was sequentially increased, it was possible to form a circuit pattern, but an accurate pattern could not be obtained, and damage to the resin background was observed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un procédé permettant d'obtenir facilement un composant moulé comportant un circuit conducteur dont l'épaisseur correspond exactement à l'épaisseur souhaitée. Ce procédé consiste à former, par dépôt chimique ou similaire, un mince film métallique de 0,2 à 2 νm d'épaisseur sur la surface d'un produit moulé en résine synthétique. Ensuite, une partie de la surface de ce mince film est exposée à un rayon laser afin de retirer une partie de ce mince film métallique, correspondant à la zone non conductrice. Après formation du motif du circuit, un circuit conducteur d'épaisseur désirée est produit par électrodéposition.
PCT/JP1994/000799 1992-11-19 1994-05-18 Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur WO1995031884A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP4310023A JP2965803B2 (ja) 1992-11-19 1992-11-19 成形品の表面に導電性回路を形成する方法及び導電回路形成部品
DE69426026T DE69426026T2 (de) 1994-05-18 1994-05-18 Verfahren zur herstellung einer leitenden schaltung auf der oberfläche eines formkörpers
US08/284,546 US5863405A (en) 1994-05-18 1994-05-18 Process for forming conductive circuit on the surface of molded article
PCT/JP1994/000799 WO1995031884A1 (fr) 1992-11-19 1994-05-18 Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur
EP94915265A EP0711102B1 (fr) 1992-11-19 1994-05-18 Procede de realisation d'un circuit conducteur sur la surface d'un produit moule

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4310023A JP2965803B2 (ja) 1992-11-19 1992-11-19 成形品の表面に導電性回路を形成する方法及び導電回路形成部品
PCT/JP1994/000799 WO1995031884A1 (fr) 1992-11-19 1994-05-18 Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur

Publications (1)

Publication Number Publication Date
WO1995031884A1 true WO1995031884A1 (fr) 1995-11-23

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ID=26435285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1994/000799 WO1995031884A1 (fr) 1992-11-19 1994-05-18 Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur

Country Status (2)

Country Link
JP (1) JP2965803B2 (fr)
WO (1) WO1995031884A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101012138B1 (ko) * 2010-11-09 2011-02-07 김미선 레이저를 이용한 입체적인 도체 패턴의 제조 방법 및 이를 위한 장치
KR101160120B1 (ko) * 2011-04-01 2012-06-26 한밭대학교 산학협력단 유리기판의 금속 배선 방법 및 이를 이용한 유리기판
CN103025060B (zh) * 2011-09-27 2015-11-25 比亚迪股份有限公司 一种三维连接器件的制备方法
JP5753521B2 (ja) * 2012-08-24 2015-07-22 日本特殊陶業株式会社 配線基板の製造方法
KR101434423B1 (ko) * 2013-04-02 2014-08-26 전자부품연구원 도전성 패턴을 위한 소재 및 이를 이용한 도전성 패턴 형성방법
JP6338547B2 (ja) 2015-03-31 2018-06-06 オリンパス株式会社 成形回路部品、成形回路部品の製造方法および回路モジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608592B2 (ja) * 1977-11-07 1985-03-04 旭化成株式会社 コネクターの製造法
JPS6126287A (ja) * 1984-07-13 1986-02-05 関西日本電気株式会社 配線基板の製造方法
JPS63169791A (ja) * 1987-01-08 1988-07-13 三菱電機株式会社 配線パタ−ンの形成方法
JPS63283185A (ja) * 1987-04-24 1988-11-21 シーメンス、アクチエンゲゼルシヤフト 印刷回路基板の製造方法
JPH04263490A (ja) * 1991-02-19 1992-09-18 Matsushita Electric Ind Co Ltd 薄膜回路の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS608592B2 (ja) * 1977-11-07 1985-03-04 旭化成株式会社 コネクターの製造法
JPS6126287A (ja) * 1984-07-13 1986-02-05 関西日本電気株式会社 配線基板の製造方法
JPS63169791A (ja) * 1987-01-08 1988-07-13 三菱電機株式会社 配線パタ−ンの形成方法
JPS63283185A (ja) * 1987-04-24 1988-11-21 シーメンス、アクチエンゲゼルシヤフト 印刷回路基板の製造方法
JPH04263490A (ja) * 1991-02-19 1992-09-18 Matsushita Electric Ind Co Ltd 薄膜回路の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP0711102A4 *

Also Published As

Publication number Publication date
JPH06164105A (ja) 1994-06-10
JP2965803B2 (ja) 1999-10-18

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