DE69426026T2 - Verfahren zur herstellung einer leitenden schaltung auf der oberfläche eines formkörpers - Google Patents
Verfahren zur herstellung einer leitenden schaltung auf der oberfläche eines formkörpersInfo
- Publication number
- DE69426026T2 DE69426026T2 DE69426026T DE69426026T DE69426026T2 DE 69426026 T2 DE69426026 T2 DE 69426026T2 DE 69426026 T DE69426026 T DE 69426026T DE 69426026 T DE69426026 T DE 69426026T DE 69426026 T2 DE69426026 T2 DE 69426026T2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- molded body
- conductive circuit
- conductive
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1994/000799 WO1995031884A1 (fr) | 1992-11-19 | 1994-05-18 | Procede de realisation d'un circuit conducteur sur la surface d'un produit moule et composant comportant un circuit conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69426026D1 DE69426026D1 (de) | 2000-11-02 |
DE69426026T2 true DE69426026T2 (de) | 2001-05-17 |
Family
ID=14098398
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69426026T Expired - Lifetime DE69426026T2 (de) | 1994-05-18 | 1994-05-18 | Verfahren zur herstellung einer leitenden schaltung auf der oberfläche eines formkörpers |
Country Status (2)
Country | Link |
---|---|
US (1) | US5863405A (de) |
DE (1) | DE69426026T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6631558B2 (en) * | 1996-06-05 | 2003-10-14 | Laservia Corporation | Blind via laser drilling system |
US7062845B2 (en) | 1996-06-05 | 2006-06-20 | Laservia Corporation | Conveyorized blind microvia laser drilling system |
CN1104832C (zh) * | 1996-08-09 | 2003-04-02 | 松下电工株式会社 | 独立导体电路电镀的方法 |
US6162365A (en) * | 1998-03-04 | 2000-12-19 | International Business Machines Corporation | Pd etch mask for copper circuitization |
AU2002227426A1 (en) | 2000-08-15 | 2002-06-24 | World Properties Inc. | Multi-layer circuits and methods of manufacture thereof |
US20020064701A1 (en) * | 2000-09-11 | 2002-05-30 | Hand Doris I. | Conductive liquid crystalline polymer film and method of manufacture thereof |
WO2002024791A2 (en) | 2000-09-20 | 2002-03-28 | World Properties, Inc. | Electrostatic deposition of high temperature, high performance thermoplastics |
AU2002227246A1 (en) | 2000-12-14 | 2002-06-24 | World Properties Inc. | Liquid crystalline polymer bond plies and circuits formed therefrom |
US6730857B2 (en) * | 2001-03-13 | 2004-05-04 | International Business Machines Corporation | Structure having laser ablated features and method of fabricating |
US20050208278A1 (en) * | 2001-08-22 | 2005-09-22 | Landi Vincent R | Method for improving bonding of circuit substrates to metal and articles formed thereby |
DE102005006459A1 (de) * | 2005-02-12 | 2006-08-17 | Preh Gmbh | Metallisiertes Kunststoffbauteil mit einem Anzeigebereich und Verfahren zur Herstellung |
JP2006228895A (ja) * | 2005-02-16 | 2006-08-31 | Alps Electric Co Ltd | 立体回路モジュール及びその製造方法 |
US7877866B1 (en) | 2005-10-26 | 2011-02-01 | Second Sight Medical Products, Inc. | Flexible circuit electrode array and method of manufacturing the same |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4200975A (en) * | 1978-05-30 | 1980-05-06 | Western Electric Company, Incorporated | Additive method of forming circuit crossovers |
SE436399B (sv) * | 1983-06-09 | 1984-12-10 | Nitro Nobel Ab | Skarvforband for sammanfogning av tva rorendar |
JPS61262287A (ja) * | 1985-05-16 | 1986-11-20 | 三井造船株式会社 | パイプ保持装置 |
JPS63169791A (ja) * | 1987-01-08 | 1988-07-13 | 三菱電機株式会社 | 配線パタ−ンの形成方法 |
ATE56050T1 (de) * | 1987-04-24 | 1990-09-15 | Siemens Ag | Verfahren zur herstellung von leiterplatten. |
US4898648A (en) * | 1988-11-15 | 1990-02-06 | Pacific Bell | Method for providing a strengthened conductive circuit pattern |
US5109149A (en) * | 1990-03-15 | 1992-04-28 | Albert Leung | Laser, direct-write integrated circuit production system |
JPH0476985A (ja) * | 1990-07-18 | 1992-03-11 | Cmk Corp | プリント配線板の製造法 |
JPH04263490A (ja) * | 1991-02-19 | 1992-09-18 | Matsushita Electric Ind Co Ltd | 薄膜回路の製造方法 |
US5137618A (en) * | 1991-06-07 | 1992-08-11 | Foster Miller, Inc. | Methods for manufacture of multilayer circuit boards |
EP0543045B1 (de) * | 1991-11-21 | 1995-09-20 | Siemens Aktiengesellschaft | Verfahren zur Herstellung von Leiterplatten |
US5390412A (en) * | 1993-04-08 | 1995-02-21 | Gregoire; George D. | Method for making printed circuit boards |
-
1994
- 1994-05-18 DE DE69426026T patent/DE69426026T2/de not_active Expired - Lifetime
- 1994-05-18 US US08/284,546 patent/US5863405A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5863405A (en) | 1999-01-26 |
DE69426026D1 (de) | 2000-11-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: POLYPLASTICS CO. LTD., TOKIO/TOKYO, JP |