Classifications

• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
  • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
  • B28B1/00—Producing shaped prefabricated articles from the material
  • B28B1/002—Producing shaped prefabricated articles from the material assembled from preformed elements
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B38/00—Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
  • C04B38/008—Bodies obtained by assembling separate elements having such a configuration that the final product is porous or by spirally winding one or more corrugated sheets
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
  • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
• • C—CHEMISTRY; METALLURGY
  • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
  • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
  • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
  • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
  • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G4/00—Fixed capacitors; Processes of their manufacture
  • H01G4/30—Stacked capacitors
  • H01G4/304—Stacked capacitors obtained from a another capacitor
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/09—Forming piezoelectric or electrostrictive materials
  • H10N30/093—Forming inorganic materials
  • H10N30/097—Forming inorganic materials by sintering
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W99/00—Subject matter not provided for in other groups of this subclass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0011—Working of insulating substrates or insulating layers
  • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching

Definitions

• the present invention relates to a method for producing a structured ceramic film. Furthermore, the invention relates to the production of a ceramic body consisting of deri-like ceramic films.
• the structuring of such a ceramic film consists of depressions or cutouts, which can also be holes passing through the film.
• the depressions, recesses or holes are produced by processing the film in the state of a green film.
• a green film is to be understood as the intermediate stage occurring in the production process of a ceramic film, in which the slip material subsequently to be sintered into a ceramic with the binder or binder system contained therein is brought into the form of the film which has not yet been sintered.
• a known method of this type is to provide the green film obtained by drawing the slip out of the slip material and the binder system with holes by 5 punching and finally to sinter this structured green film.
• substrate plates in particular made of aluminum oxide, are used in particular in electronic circuit technology for the construction of hybrid circuits.
• Bts 1 Kow / 27.4.1987 Bts 1 Kow / 19.4.1988 DE-OS 14 39 702 describes a manufacturing process in which voids are present in the ceramic body before the sintering of the ceramic body provided for a capacitor.
• Piezoelectric ceramics in the sintered state monolithic bodies with inner cavities that are not filled, are used as ultrasound transducers for medical diagnosis in particular.
• the voids which are so numerous and so small in the piezoceramic material that they act like pores, reduce the acoustic impedance of this material and thus improve the acoustic adaptation of the material of the ultrasound transducer to the body tissue. It has also already been proposed to form elongated cavities in the interior of the ceramic body of an ultrasound transducer. These cavities are designed and arranged in such a way that they prevent or at least reduce the formation of disturbing modes of transverse vibrations.
• Ceramic bodies in question have been produced in such a way that individual green foils have first been provided with a structured photoresist layer or with structures consisting of photoresist in a photolithographic way, and these foils have then been pressed and sintered into a stack are.
• the sintered stack forms a monolithic ceramic body, in the interior of which there are cavities which correspond to the photolithographic structures on the original green foils.
• the photoresist burns out and leaves corresponding cavities in the film stack.
• Such cavities can be placed precisely in a ceramic body (and, for example, filled with metal serve as electrodes).
• Distributed, generally smaller cavities in such a ceramic body sintered together from green foils lead to a specifically dimensioned porosity in the ceramic body.
• the object of the present invention is to provide a technologically particularly simple method, with the aid of which ceramic foils structured (at first still unsintered) with recesses, recesses or holes can be produced.
• a further development of the task consists in using this method in such a way that ceramic bodies provided with defined cavities can be produced in a simple manner.
• photoresist for example made of the material Kalle, Ozatec R225
• photoresist for example made of the material Kalle, Ozatec R225
• this photosensitive layer is structured into a mask layer which has holes, recesses and the like extending down to the surface of the green film at those points where the green film and the ceramic film produced later have holes or Should have cavities.
• a correspondingly fine liquid jet can be used.
• a typical diameter for such a beam is 0.6 mm.
• the beam intended, i.e. the solvent contained therein is one which is effective in causing the binder system or a component of the binder system to swell in such a way that the subsequent erosive removal of material from the green film is made possible.
• This erosive removal is carried out with high jet pressure. It is also possible to work with a comparatively large jet or with several or many jets at the same time.
• the depressions in the green film actually only occur at the locations that are not covered by the photoresist.
• the beam used here and the green sheet are advantageously moved towards one another, so that the erosive removal of material from the green sheet at all points with holes, cutouts and the like in the photoresist is carried out.
• the depressions can be made to such an extent that holes also arise in the green sheet, ie the green sheet has been drilled through.
• the solvent is selected such that the binder of the ceramic film, but not the photo lacquer material itself, is attacked.
• the above-mentioned photo lacquer material Ozatec R225 and a binder system provided for the green film on the basis of the acrylic acid ester are an advantageous combination, to which toluene or a mixture of toluene and decahydronaphthalene, e.g. in a ratio of 3: 2 can be used very advantageously.
• a material is used as the photoresist, in which, for example, additional chemical resistance can be achieved by post-exposure or tempering at high temperature.
• additional metal film can also be used, which allows greater resistance to be achieved.
• the photoresist still present on the green film is removed.
• the photoresist For example, in the case of positive photoresist, exposing and developing the photoresist now over the entire surface is suitable. The remaining photoresist material is thus made soluble and can be easily removed.
• Green foils provided with depressions or holes according to the preceding method steps are stacked after the photoresist material has been removed and are subjected to a pressing pressure at elevated temperature.
• the stack of films consisting of the original green films sinters together to form a monolithic ceramic block which, however, contains the previously produced depressions and holes in the individual green films.
• Such a monolithic ceramic body with cavities produced according to the method and distributed in a predetermined manner is subjected to further processing steps, for example, a Metallization for the production of electrodes, the necessary polarization with which the piezoelectric properties become effective.
• Material namely its binder that swelling and thus a corresponding reduction in the strength of the material of the green sheet occurs.
• the material treated in this way which in this way has obtained a property different from the original material of the green sheet, is then separated off by the liquid jet treatment and washed away.
• the processing method used according to the invention does not generate any heating in the processed material.
• the liquid jet on the other hand, can even cool. Large areas can be structured in a short time, in particular over the whole area.
• the aforementioned lack of warming precludes any warping of the desired shapes.
• the organic binder is not decomposed in gaseous form, but is washed out in liquid form. This excludes the possibility of precipitation occurring otherwise due to condensation of the decomposition products on cooler parts (of the apparatus). Detached material is removed by washing and can be easily separated. Dusts cannot occur, so that it is easy to master the relevant work regulations.
• the measures used in the invention are just for large quantities can be removed, they are also advantageous for the finest structures.
• the depth of the structuring can be adjusted reliably (for example easier than with laser radiation) with these measures.
• FIG. 1 shows a monolithic, sintered ceramic body 1 produced according to the invention, which has channel-like cavities designated by 2, which are designed and positioned in design and position as shown in FIG.
• such a monolithic ceramic body 1 is produced in such a way that a large number of green foils are produced, as the example in FIG. 2 shows.
• the green sheets can be composed of compositions for sintered piezoceramic, substrate ceramic and the like e.g. consist of lead zirconate titanate, aluminum oxide etc.
• the green film 11 is already coated over the entire surface in FIG. 2 with a layer 12 of photoresist material.
• this photoresist layer 12 is combined with the structure 112 shown in FIG. see.
• the material of the photoresist layer 12 has been removed in individual strips 13 to such an extent that the original surface 14 of the green film 11 is exposed.
• the structures 112 have dimensions down to, for example, 50 ⁇ m, corresponding to the substantially equal dimensions of the depressions, cavities, holes and the like to be produced in the green film or the finished body.
• FIG. 4 shows the application of a liquid jet 21 to the green film 11, specifically from the side provided with the photoresist layer 12.
• FIG. 5 shows an exploded view of two green foils 111 which have been processed using the method according to the invention and two unchanged green foils 11. In the manner shown in this figure, e.g. such

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Ceramic Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Materials Engineering (AREA)
• Organic Chemistry (AREA)
• Power Engineering (AREA)
• Structural Engineering (AREA)
• General Physics & Mathematics (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Inorganic Chemistry (AREA)
• Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
• Ceramic Capacitors (AREA)
• Compositions Of Oxide Ceramics (AREA)
• Micromachines (AREA)
• Laminated Bodies (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Cited By (9)

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Citations (3)

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• 1987
  • 1987-04-27 DE DE19873713987 patent/DE3713987A1/de not_active Withdrawn
• 1988
  • 1988-04-27 US US07/432,724 patent/US5045437A/en not_active Expired - Lifetime
  • 1988-04-27 EP EP88903191A patent/EP0362213B1/de not_active Expired - Lifetime
  • 1988-04-27 JP JP63503471A patent/JPH02500427A/ja active Granted
  • 1988-04-27 WO PCT/DE1988/000250 patent/WO1988008360A1/de not_active Ceased
  • 1988-04-27 DE DE8888903191T patent/DE3864264D1/de not_active Expired - Lifetime

Patent Citations (3)

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