USD945384S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD945384S1 USD945384S1 US29/729,269 US202029729269F USD945384S US D945384 S1 USD945384 S1 US D945384S1 US 202029729269 F US202029729269 F US 202029729269F US D945384 S USD945384 S US D945384S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2019-21603F JP1660133S (en) | 2019-09-26 | 2019-09-26 | |
JP2019-21603 | 2019-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD945384S1 true USD945384S1 (en) | 2022-03-08 |
Family
ID=70775936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/729,269 Active USD945384S1 (en) | 2019-09-26 | 2020-03-25 | Semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD945384S1 (en) |
JP (1) | JP1660133S (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210307220A1 (en) * | 2020-03-27 | 2021-09-30 | Lapis Semiconductor Co., Ltd. | Shield case |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
Citations (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) * | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) * | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
USD396696S (en) * | 1997-01-30 | 1998-08-04 | Sony Corporation | Semiconductor package |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
USD458234S1 (en) * | 2001-02-15 | 2002-06-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD459316S1 (en) * | 2001-02-15 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD459317S1 (en) * | 2001-02-15 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD460744S1 (en) * | 2001-02-15 | 2002-07-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD460951S1 (en) * | 2001-02-15 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD461171S1 (en) * | 2001-02-15 | 2002-08-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD465773S1 (en) * | 2001-08-31 | 2002-11-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6713868B2 (en) * | 2001-11-30 | 2004-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having leadless package structure |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
US20060186520A1 (en) * | 2005-02-03 | 2006-08-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device and manufacturing method thereof |
USD633879S1 (en) * | 2010-03-26 | 2011-03-08 | Advanced Micro Devices, Inc. | Socket cap |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD834544S1 (en) * | 2015-04-01 | 2018-11-27 | Infineon Technologies Ag | Semiconductor module |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
-
2019
- 2019-09-26 JP JPD2019-21603F patent/JP1660133S/ja active Active
-
2020
- 2020-03-25 US US29/729,269 patent/USD945384S1/en active Active
Patent Citations (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD259560S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) * | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) * | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
USD345731S (en) * | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
USD396696S (en) * | 1997-01-30 | 1998-08-04 | Sony Corporation | Semiconductor package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
USD459316S1 (en) * | 2001-02-15 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD459317S1 (en) * | 2001-02-15 | 2002-06-25 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD460744S1 (en) * | 2001-02-15 | 2002-07-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD460951S1 (en) * | 2001-02-15 | 2002-07-30 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD461171S1 (en) * | 2001-02-15 | 2002-08-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD458234S1 (en) * | 2001-02-15 | 2002-06-04 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD465773S1 (en) * | 2001-08-31 | 2002-11-19 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US6713868B2 (en) * | 2001-11-30 | 2004-03-30 | Kabushiki Kaisha Toshiba | Semiconductor device having leadless package structure |
USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US20060186520A1 (en) * | 2005-02-03 | 2006-08-24 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device and manufacturing method thereof |
USD633879S1 (en) * | 2010-03-26 | 2011-03-08 | Advanced Micro Devices, Inc. | Socket cap |
USD853341S1 (en) * | 2015-04-01 | 2019-07-09 | Infineon Technologies Ag | Semiconductor module |
USD834544S1 (en) * | 2015-04-01 | 2018-11-27 | Infineon Technologies Ag | Semiconductor module |
USD834545S1 (en) * | 2015-04-01 | 2018-11-27 | Infineon Technologies Ag | Semiconductor module |
USD851611S1 (en) * | 2015-04-01 | 2019-06-18 | Infineon Technologies Ag | Semiconductor module |
US10510626B2 (en) * | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
USD832227S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
USD832228S1 (en) * | 2016-11-15 | 2018-10-30 | Rohm Co., Ltd. | Semiconductor module |
US10600744B2 (en) * | 2016-11-15 | 2020-03-24 | Rohm Co., Ltd. | Semiconductor device |
USD859334S1 (en) * | 2017-10-26 | 2019-09-10 | Mitsubishi Electric Corporation | Semiconductor device |
USD864135S1 (en) * | 2017-10-26 | 2019-10-22 | Mitsubishi Electric Corporation | Semiconductor device |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD904325S1 (en) * | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210307220A1 (en) * | 2020-03-27 | 2021-09-30 | Lapis Semiconductor Co., Ltd. | Shield case |
US11510348B2 (en) * | 2020-03-27 | 2022-11-22 | Lapis Semiconductor Co., Ltd. | Shield case |
USD974311S1 (en) * | 2020-07-31 | 2023-01-03 | Rohm Co., Ltd. | Semiconductor module |
USD975666S1 (en) * | 2020-07-31 | 2023-01-17 | Rohm Co., Ltd. | Semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
JP1660133S (en) | 2020-05-25 |
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Legal Events
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |