USD945384S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD945384S1
USD945384S1 US29/729,269 US202029729269F USD945384S US D945384 S1 USD945384 S1 US D945384S1 US 202029729269 F US202029729269 F US 202029729269F US D945384 S USD945384 S US D945384S
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US
United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/729,269
Inventor
Shigeki Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lapis Semiconductor Co Ltd
Original Assignee
Lapis Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lapis Semiconductor Co Ltd filed Critical Lapis Semiconductor Co Ltd
Assigned to Lapis Semiconductor Co., Ltd. reassignment Lapis Semiconductor Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: YAMAUCHI, SHIGEKI
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FIG. 1 is a perspective view of semiconductor module showing my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a right-side view thereof; and,
FIG. 7 is a left-side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor module, as shown and described.
US29/729,269 2019-09-26 2020-03-25 Semiconductor module Active USD945384S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2019-21603F JP1660133S (en) 2019-09-26 2019-09-26
JP2019-21603 2019-09-26

Publications (1)

Publication Number Publication Date
USD945384S1 true USD945384S1 (en) 2022-03-08

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ID=70775936

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/729,269 Active USD945384S1 (en) 2019-09-26 2020-03-25 Semiconductor module

Country Status (2)

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US (1) USD945384S1 (en)
JP (1) JP1660133S (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210307220A1 (en) * 2020-03-27 2021-09-30 Lapis Semiconductor Co., Ltd. Shield case
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
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USD458234S1 (en) * 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459316S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) * 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) * 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) * 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) * 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
US20060186520A1 (en) * 2005-02-03 2006-08-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device and manufacturing method thereof
USD633879S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD834544S1 (en) * 2015-04-01 2018-11-27 Infineon Technologies Ag Semiconductor module
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module

Patent Citations (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
USD345731S (en) * 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US5994772A (en) * 1996-12-19 1999-11-30 Lg Semicon Co., Ltd. Semiconductor package
USD396696S (en) * 1997-01-30 1998-08-04 Sony Corporation Semiconductor package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
USD459316S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD459317S1 (en) * 2001-02-15 2002-06-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460744S1 (en) * 2001-02-15 2002-07-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD460951S1 (en) * 2001-02-15 2002-07-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD461171S1 (en) * 2001-02-15 2002-08-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD458234S1 (en) * 2001-02-15 2002-06-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD465773S1 (en) * 2001-08-31 2002-11-19 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US6713868B2 (en) * 2001-11-30 2004-03-30 Kabushiki Kaisha Toshiba Semiconductor device having leadless package structure
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US20060186520A1 (en) * 2005-02-03 2006-08-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device and manufacturing method thereof
USD633879S1 (en) * 2010-03-26 2011-03-08 Advanced Micro Devices, Inc. Socket cap
USD853341S1 (en) * 2015-04-01 2019-07-09 Infineon Technologies Ag Semiconductor module
USD834544S1 (en) * 2015-04-01 2018-11-27 Infineon Technologies Ag Semiconductor module
USD834545S1 (en) * 2015-04-01 2018-11-27 Infineon Technologies Ag Semiconductor module
USD851611S1 (en) * 2015-04-01 2019-06-18 Infineon Technologies Ag Semiconductor module
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210307220A1 (en) * 2020-03-27 2021-09-30 Lapis Semiconductor Co., Ltd. Shield case
US11510348B2 (en) * 2020-03-27 2022-11-22 Lapis Semiconductor Co., Ltd. Shield case
USD974311S1 (en) * 2020-07-31 2023-01-03 Rohm Co., Ltd. Semiconductor module
USD975666S1 (en) * 2020-07-31 2023-01-17 Rohm Co., Ltd. Semiconductor module

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