USD832227S1 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- USD832227S1 USD832227S1 US29/602,605 US201729602605F USD832227S US D832227 S1 USD832227 S1 US D832227S1 US 201729602605 F US201729602605 F US 201729602605F US D832227 S USD832227 S US D832227S
- Authority
- US
- United States
- Prior art keywords
- semiconductor module
- view
- semiconductor
- module
- ornamental design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a semiconductor module, as shown and described.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2016-24833F JP1580899S (en) | 2016-11-15 | 2016-11-15 | |
JP2016-024833 | 2016-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
USD832227S1 true USD832227S1 (en) | 2018-10-30 |
Family
ID=59270492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/602,605 Active USD832227S1 (en) | 2016-11-15 | 2017-05-02 | Semiconductor module |
Country Status (2)
Country | Link |
---|---|
US (1) | USD832227S1 (en) |
JP (1) | JP1580899S (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD904325S1 (en) | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD980810S1 (en) * | 2020-02-27 | 2023-03-14 | Kioxia Corporation | Integrated circuit card |
USD994624S1 (en) * | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1695980S (en) | 2021-03-09 | 2021-09-27 |
Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) * | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) * | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US5105257A (en) * | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD397092S (en) * | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US6238953B1 (en) * | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
US6521983B1 (en) * | 2000-08-29 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for electric power |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD509810S1 (en) * | 2003-07-30 | 2005-09-20 | Delta Electronics Inc. | Molding structure of electric element |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
-
2016
- 2016-11-15 JP JPD2016-24833F patent/JP1580899S/ja active Active
-
2017
- 2017-05-02 US US29/602,605 patent/USD832227S1/en active Active
Patent Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD259559S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259560S (en) * | 1978-07-28 | 1981-06-16 | Hitachi, Ltd. | Semiconductor |
USD259782S (en) * | 1978-07-28 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD259783S (en) * | 1978-08-25 | 1981-07-07 | Hitachi, Ltd. | Semiconductor |
USD260091S (en) * | 1978-08-25 | 1981-08-04 | Hitachi, Ltd. | Semiconductor |
USD260986S (en) * | 1978-08-25 | 1981-09-29 | Hitachi, Ltd. | Semiconductor |
US4663833A (en) * | 1984-05-14 | 1987-05-12 | Oki Electric Industry Co. Ltd. | Method for manufacturing IC plastic package with window |
US5105257A (en) * | 1990-08-08 | 1992-04-14 | Mitsubishi Denki Kabushiki Kaisha | Packaged semiconductor device and semiconductor device packaging element |
US5347160A (en) * | 1992-09-28 | 1994-09-13 | Sundstrand Corporation | Power semiconductor integrated circuit package |
US5798570A (en) * | 1996-06-28 | 1998-08-25 | Kabushiki Kaisha Gotoh Seisakusho | Plastic molded semiconductor package with thermal dissipation means |
USD396847S (en) * | 1996-10-17 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
USD397092S (en) * | 1997-01-03 | 1998-08-18 | Fujitsu Limited | Integrated circuit package |
USD396846S (en) * | 1997-04-16 | 1998-08-11 | Matsushita Electronics Corporation | Semiconductor device |
US6093957A (en) * | 1997-04-18 | 2000-07-25 | Lg Semicon Co., Ltd. | Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof |
US20010038143A1 (en) * | 1997-06-12 | 2001-11-08 | Yukio Sonobe | Power semiconductor module |
US6330165B1 (en) * | 1998-07-06 | 2001-12-11 | Hitachi, Ltd. | Semiconductor device |
USD416236S (en) * | 1998-09-02 | 1999-11-09 | Citizen Electronics Co., Ltd. | Integrated circuit package |
US6238953B1 (en) * | 1999-01-12 | 2001-05-29 | Sony Corporation | Lead frame, resin-encapsulated semiconductor device and fabrication process for the device |
US6555899B1 (en) * | 1999-10-15 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package leadframe assembly and method of manufacture |
USD444132S1 (en) * | 2000-08-23 | 2001-06-26 | Kabushiki Kaisha Toshiba | Semiconductor element |
US6521983B1 (en) * | 2000-08-29 | 2003-02-18 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device for electric power |
USD466485S1 (en) * | 2001-05-23 | 2002-12-03 | Shindengen Electric Manufactuturing Co., Ltd. | Semiconductor package |
USD466873S1 (en) * | 2001-10-31 | 2002-12-10 | Siliconix Incorporated | Semiconductor chip package |
USD472528S1 (en) * | 2001-10-31 | 2003-04-01 | Siliconix Incorporated | Semiconductor chip package |
USD480371S1 (en) * | 2001-11-30 | 2003-10-07 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475982S1 (en) * | 2002-03-11 | 2003-06-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475355S1 (en) * | 2002-03-11 | 2003-06-03 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD475028S1 (en) * | 2002-03-11 | 2003-05-27 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD476962S1 (en) * | 2002-03-29 | 2003-07-08 | Kabushiki Kaisha Toshiba | Semiconductor device |
USD489338S1 (en) * | 2003-07-28 | 2004-05-04 | Semiconductor Components Industries, L.L.C. | Packaged semiconductor device |
USD509810S1 (en) * | 2003-07-30 | 2005-09-20 | Delta Electronics Inc. | Molding structure of electric element |
US6992386B2 (en) * | 2003-07-31 | 2006-01-31 | Renesas Technology Corp. | Semiconductor device and a method of manufacturing the same |
USD504874S1 (en) * | 2004-08-11 | 2005-05-10 | Semiconductor Components Industries, Llc | Semiconductor device package |
USD510728S1 (en) * | 2004-08-11 | 2005-10-18 | Semiconductor Components Industries Llc | Semiconductor device package |
USD587662S1 (en) * | 2007-12-20 | 2009-03-03 | Fuji Electric Device Technology Co., Ltd. | Semiconductor device |
USD648290S1 (en) * | 2010-06-08 | 2011-11-08 | Miyoshi Electronics Corporation | Semiconductor device |
USD762597S1 (en) * | 2014-08-07 | 2016-08-02 | Infineon Technologies Ag | Power semiconductor module |
USD796459S1 (en) * | 2016-04-11 | 2017-09-05 | Rohm Co., Ltd. | Packaged semiconductor circuit module |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD845921S1 (en) * | 2017-05-02 | 2019-04-16 | Rohm Co., Ltd. | Semiconductor device |
USD852765S1 (en) * | 2017-10-19 | 2019-07-02 | Rohm Co., Ltd. | Semiconductor device |
USD853343S1 (en) * | 2017-10-19 | 2019-07-09 | Rohm Co., Ltd. | Semiconductor device |
USD904325S1 (en) | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD945384S1 (en) * | 2019-09-26 | 2022-03-08 | Lapis Semiconductor Co., Ltd. | Semiconductor module |
USD980810S1 (en) * | 2020-02-27 | 2023-03-14 | Kioxia Corporation | Integrated circuit card |
USD969762S1 (en) | 2020-04-06 | 2022-11-15 | Wolfspeed, Inc. | Power semiconductor package |
USD937231S1 (en) * | 2020-04-06 | 2021-11-30 | Wolfspeed, Inc. | Power semiconductor package |
USD994624S1 (en) * | 2021-03-23 | 2023-08-08 | Rohm Co., Ltd. | Power semiconductor module |
USD1021831S1 (en) * | 2021-03-23 | 2024-04-09 | Rohm Co., Ltd. | Power semiconductor module |
USD1030686S1 (en) * | 2021-03-23 | 2024-06-11 | Rohm Co., Ltd. | Power semiconductor module |
USD1043595S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
USD1043594S1 (en) * | 2022-11-01 | 2024-09-24 | Rohm Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP1580899S (en) | 2017-07-10 |
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