USD777124S1 - Power semiconductor device - Google Patents

Power semiconductor device Download PDF

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Publication number
USD777124S1
USD777124S1 US29/568,598 US201629568598F USD777124S US D777124 S1 USD777124 S1 US D777124S1 US 201629568598 F US201629568598 F US 201629568598F US D777124 S USD777124 S US D777124S
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United States
Prior art keywords
semiconductor device
power semiconductor
view
ornamental design
power
Prior art date
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Active
Application number
US29/568,598
Inventor
Maki Hasegawa
Masahiro Kato
Shinya Nakagawa
Hisashi Kawafuji
Toru Iwagami
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/568,598 priority Critical patent/USD777124S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASEGAWA, MAKI HASEGAWA, IWAGAMI, TORU, KATO, MASAHIRO, KAWAFUJI, HISASHI, NAKAGAWA, SHINYA
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST INVENTORS NAME PREVIOUSLY RECORDED ON REEL 038958 FRAME 0402. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Assignors: HASEGAWA, MAKI, IWAGAMI, TORU, KATO, MASAHIRO, KAWAFUJI, HISASHI, NAKAGAWA, SHINYA
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Description

FIG. 1 is a front, right side, bottom perspective view of a power semiconductor device showing our new design;
FIG. 2 is a rear, left side, top perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines shown represent unclaimed subject matter of a power semiconductor device and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a power semiconductor device, as shown and described.
US29/568,598 2014-04-02 2016-06-20 Power semiconductor device Active USD777124S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/568,598 USD777124S1 (en) 2014-04-02 2016-06-20 Power semiconductor device

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2014007263 2014-04-02
JP2014007264 2014-04-02
JP2014-007266 2014-04-02
JP2014-007265 2014-04-02
JP2014007265 2014-04-02
JP2014-007263 2014-04-02
JP2014-007264 2014-04-02
JP2014007266 2014-04-02
US29/503,649 USD772182S1 (en) 2014-04-02 2014-09-29 Power semiconductor device
US29/568,598 USD777124S1 (en) 2014-04-02 2016-06-20 Power semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/503,649 Division USD772182S1 (en) 2014-04-02 2014-09-29 Power semiconductor device

Publications (1)

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USD777124S1 true USD777124S1 (en) 2017-01-24

Family

ID=57210354

Family Applications (4)

Application Number Title Priority Date Filing Date
US29/503,649 Active USD772182S1 (en) 2014-04-02 2014-09-29 Power semiconductor device
US29/568,598 Active USD777124S1 (en) 2014-04-02 2016-06-20 Power semiconductor device
US29/568,592 Active USD770994S1 (en) 2014-04-02 2016-06-20 Power semiconductor device
US29/568,584 Active USD783550S1 (en) 2014-04-02 2016-06-20 Power semiconductor device

Family Applications Before (1)

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US29/503,649 Active USD772182S1 (en) 2014-04-02 2014-09-29 Power semiconductor device

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/568,592 Active USD770994S1 (en) 2014-04-02 2016-06-20 Power semiconductor device
US29/568,584 Active USD783550S1 (en) 2014-04-02 2016-06-20 Power semiconductor device

Country Status (1)

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US (4) USD772182S1 (en)

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USD805240S1 (en) * 2013-12-09 2017-12-12 Kenall Manufacturing Company Driver housing
USD848960S1 (en) * 2017-11-10 2019-05-21 Auras Technology Co., Ltd. Water cooling radiator
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
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USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD754084S1 (en) 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD836073S1 (en) * 2017-01-25 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
JP1603911S (en) * 2017-09-27 2018-05-14
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JP1603359S (en) * 2017-10-19 2018-05-07
JP1603358S (en) * 2017-10-19 2018-05-07
USD859334S1 (en) 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) * 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
JP1641098S (en) 2018-06-26 2019-09-09
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD954666S1 (en) * 2019-05-03 2022-06-14 Lumileds Holding B.V. Flexible circuit board
JP1646470S (en) * 2019-05-14 2019-11-25
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
JP1711706S (en) * 2021-07-29 2022-04-04
USD1033355S1 (en) * 2021-07-29 2024-07-02 Rohm Co., Ltd. Semiconductor module
JP1711705S (en) * 2021-07-29 2022-04-04

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USD721340S1 (en) * 2012-12-21 2015-01-20 Fuji Electric Co., Ltd. Semiconductor module
USD712853S1 (en) * 2012-12-21 2014-09-09 Fuji Electric Co., Ltd. Semiconductor module
USD721048S1 (en) * 2013-06-17 2015-01-13 Fuji Electric Co., Ltd. Semiconductor module
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device

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Publication number Priority date Publication date Assignee Title
USD805680S1 (en) * 2013-12-09 2017-12-19 Kenall Manufacturing Company Driver housing
USD844216S1 (en) 2013-12-09 2019-03-26 Kenall Manufacturing Company Driver housing
USD805240S1 (en) * 2013-12-09 2017-12-12 Kenall Manufacturing Company Driver housing
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD848960S1 (en) * 2017-11-10 2019-05-21 Auras Technology Co., Ltd. Water cooling radiator
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device

Also Published As

Publication number Publication date
USD770994S1 (en) 2016-11-08
USD783550S1 (en) 2017-04-11
USD772182S1 (en) 2016-11-22

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