US9821787B2 - Circuit board and vehicle brake hydraulic pressure control unit - Google Patents

Circuit board and vehicle brake hydraulic pressure control unit Download PDF

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Publication number
US9821787B2
US9821787B2 US14/632,574 US201514632574A US9821787B2 US 9821787 B2 US9821787 B2 US 9821787B2 US 201514632574 A US201514632574 A US 201514632574A US 9821787 B2 US9821787 B2 US 9821787B2
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Prior art keywords
pad
circuit board
land
solder layer
electrode portion
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US14/632,574
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US20150245483A1 (en
Inventor
Sakae MIYASAKA
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Autoliv Nissin Brake Systems Japan Co Ltd
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Autoliv Nissin Brake Systems Japan Co Ltd
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Assigned to NISSIN KOGYO CO., LTD. reassignment NISSIN KOGYO CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MIYASAKA, SAKAE
Publication of US20150245483A1 publication Critical patent/US20150245483A1/en
Assigned to AUTOLIV NISSIN BRAKE SYSTEMS JAPAN CO., LTD. reassignment AUTOLIV NISSIN BRAKE SYSTEMS JAPAN CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NISSIN KOGYO CO., LTD.
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T15/00—Construction arrangement, or operation of valves incorporated in power brake systems and not covered by groups B60T11/00 or B60T13/00
    • B60T15/02—Application and release valves
    • B60T15/025—Electrically controlled valves
    • B60T15/028—Electrically controlled valves in hydraulic systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Definitions

  • An embodiment described herein generally relates to a circuit board with an electronic circuit and a vehicle brake hydraulic pressure control unit.
  • Plate-shaped electrode portions to which terminals of electric components such as sensors and the like are connected are provided on a circuit board which is used in a control unit of a vehicle brake hydraulic pressure control unit. Then, the electric components can be electrically connected to the electronic circuit by the terminals of the electric components being pressed against the electrode portions.
  • the electrode portion of the circuit board may include a pad which is soldered to a land provided on a front surface of a substrate.
  • a reflow system In soldering the pad to the land, a reflow system is used in which a paste solder is applied to the front surface of the land, and the pad is superposed on the solder layer, thereafter the substrate is heated.
  • JP-4618298-B describes a self-alignment effect working in the soldering step of soldering the pad to the land in which the surface tension of the molten solder in the solder layer acts on the pad to move the pad directly above the land.
  • One object of the invention is to provide a circuit board which enables a pad to be superposed accurately on a land to be joined together by solving the problem described above and a vehicle brake hydraulic pressure control unit which includes the circuit board.
  • An aspect of the invention provides
  • a circuit board ( 10 ) having a substrate ( 11 ) and an electrode portion ( 20 ) which is provided on the substrate ( 11 ), the electrode portion ( 20 ) including:
  • a quadrangular land ( 21 ) which is provided on a front surface ( 11 a ) of the substrate ( 11 );
  • solder layer ( 22 ) which is laminated on the whole of a front surface of the land ( 21 );
  • exposed portions ( 24 , 26 , 28 ) where the solder layer ( 22 ) is exposed are formed individually at four corners or four sides of a front surface of the electrode portion ( 20 ), and
  • the exposed portions ( 24 ) are formed individually at four corners of the front surface of the electrode portion ( 20 ).
  • the pad in the fabrication step of the circuit board, when the substrate is heated in such a state that the land, the solder layer and the pad are superposed one on another, the pad is disposed directly above the land by the self-alignment effect of the solder layer which is melted, whereby the four sides of the pad are superposed on the four sides of the land.
  • This forms the exposed portions of the same shape individually at the four corners of the front surface of the electrode portion.
  • the solder layer which is melted flows outwards of the corner portions of the pad at the exposed portions.
  • the pad Since the pressing forces or the pulling forces act equally on the corner portions of the pad from the solder layer in such a state that the pad is disposed directly on the land and the solder layer is melted, even in the event that an impact or vibration is applied to the substrate, the pad can be prevented from being moved in relation to the land.
  • the exposed portions of the same shape can be formed individually at the four corners of the electrode portion by chamfering equally the four corner portions. Then, the corner portions of the pad can be chambered in a straight line or C chamfered or chamfered round or R chamfered, thereby to enhancing the degree of freedom in designing the electrode portion.
  • the pad ( 25 ) has a circular or ellipsoidal shape
  • the exposed portions ( 26 ) are formed individually at four corners of the front surface of the electrode portion ( 20 ).
  • the exposed portions of the same shape are formed individually at the four corners of the front surface of the electrode portions, and the solder layer which is melted flows outwards of the pad at the exposed portions.
  • the pressing forces or pulling forces act equally on the pad in the four directions from the solder layer in such a state that the pad is disposed directly above the land and the solder layer is melted. Because of this, even in the event that an impact or vibration is applied to the substrate, the pad can be prevented from being moved in relation to the land.
  • the exposed portions ( 28 ) are formed individually on the four sides of the front surface of the electrode portion ( 20 ), the exposed portions ( 28 ) being formed at middle portions of the four sides.
  • the exposed portions of the same shape are formed individually on the four sides of the front surface of the electrode portion, and the solder layer which is melted flows outwards of the pad at the exposed portions.
  • the Pressing forces or pulling forces act equally on the middle portions of the four sides of the pad from the solder layer in such a state that the pad is disposed directly above the land and the solder layer is melted. Because of this, even in the event that an impact or vibration is applied to the substrate, the pad can be prevented from being moved in relation to the land.
  • the circuit board may be applied to the vehicle brake hydraulic pressure control unit.
  • the pad can be prevented from being moved in relation to the land.
  • the pad can be joined to the land accurately.
  • FIG. 1 is an exploded perspective view showing a vehicle brake hydraulic pressure control unit of a first embodiment.
  • FIG. 2A is a plan view showing electrode portions of the first embodiment
  • FIG. 2B is a side view showing a circuit board and a pressure sensor of the first embodiment.
  • FIGS. 3A to 3C show the electrode portion of the first embodiment, in which FIG. 3A is a perspective view, FIG. 3B is a plan view, and FIG. 3C is a sectional view of the electrode portion taken along a line A-A in FIG. 3B .
  • FIG. 4 is a perspective view of the electrode portion of the first embodiment showing a state resulting before a pad is joined to a solder layer.
  • FIG. 5A is a plan view showing another configuration of the electrode portion of the first embodiment
  • FIG. 5B is a plan view showing an electrode portion of a second embodiment.
  • FIGS. 6A and 6B show an electrode portion of a third embodiment, of which FIG. 6A is a perspective view and FIG. 6B is a plan view of the electrode portion.
  • a circuit board is included in an electronic control unit of a vehicle brake hydraulic pressure control unit.
  • a vehicle brake hydraulic control unit U shown in FIG. 1 is preferably used in such vehicles as a motorcycle, a motor tricycle, an all-terrain vehicle (ATV), a motor four-wheeled vehicle and the like.
  • the vehicle brake hydraulic pressure control unit U can execute an anti-lock braking control, a skid control which stabilizes the behaviors of the vehicle, a traction control and the like by controlling the brake hydraulic pressure as required which is given to respective wheels cylinders of wheels of the vehicle.
  • This vehicle brake hydraulic pressure control unit U can be mounted not only on a hybrid vehicle which uses an electric motor as well as an engine (an internal combustion engine) as its drive source but also on an electric vehicle and a fuel cell vehicle which use only an electric motor as its drive source, in addition to a motor vehicle which uses only the engine as its drive source.
  • the vehicle brake hydraulic pressure control unit U has a metallic, substantially rectangular parallelepiped base body 1 .
  • Various components such as a pressure sensor 2 , solenoid valves 3 , reservoirs 5 , a pump 6 , a motor 7 , and the like are assembled to the base body 1 .
  • an electronic control unit 8 is attached to one surface 1 a of the base body 1 .
  • Brake fluid hydraulic lines are formed in an interior of the base body 1 . Additionally, holes are formed in the base body 1 , and the pressure sensor 2 , the solenoid valves 3 , the reservoirs 5 , the pump 6 , the motor 7 and the like are installed in those holes. Further, inlet ports and outlet ports are formed in the base body 1 , and pipings communicating with a master cylinder are connected to the inlet ports, while pipings reaching the wheel cylinders are connected to the outlet ports. The holes in the base body 1 communicate with each other directly or by way of the hydraulic pressure lines formed in the interior of the base body 1 .
  • the pressure sensor 2 is an electric component which measures a brake hydraulic pressure in the hydraulic pressure lines in the base body 1 .
  • the pressure sensor 2 has a cylindrical sensor housing 2 a .
  • a base portion of the sensor housing 2 a is inserted in a mounting hole 1 b which is formed in the one surface 1 a of the base body 1 .
  • a distal end portion of the sensor housing 2 a projects from the mounting hole 1 b.
  • terminals 2 c are provided at a distal end face 2 b of the pressure sensor 2 so as to project therefrom.
  • the terminals 2 c are metallic cylindrical members, and distal end portions are closed into a semi-spherical shape.
  • the four terminals 2 c are disposed into a square matrix configuration (refer to FIG. 2A ).
  • a coil spring is accommodated in an interior of the terminal 2 c in a compressed state.
  • the distal end portion of the terminal 2 c is biased in a direction in which the terminal 2 c projects from the distal end face 2 b of the sensor housing 2 a by means of a pressing force of the coil spring.
  • a detecting portion (not shown) is accommodated in the sensor housing 2 a , and this detecting portion measures a brake hydraulic pressure in the hydraulic pressure lines.
  • the detecting portion converts a value of the brake hydraulic pressure so measured into an electric signal and outputs the electric signal to the terminals 2 c.
  • the electronic control unit 8 includes a circuit board 10 and a housing 9 which accommodates the circuit board 10 .
  • the housing 9 is a synthetic resin box member which is secured to the one surface 1 a of the base body 1 in such a state that the housing 9 covers the electric components such as the solenoid valves 3 and the pressure sensor 2 which project from the one surface 1 a of the base body 1 .
  • the solenoid valves 3 , the pressure sensor 2 and the like are accommodated in a rear side (a base body 1 side) area in an interior space of the housing 9 . Additionally, the circuit board 10 is accommodated in a front side area of the interior space of the housing 9 .
  • the circuit board 10 controls the operations of the electric components such as the solenoid valves 3 , the motor 7 and the like based on pieces of information which are obtained from the pressure sensor 2 and various sensors, as well as programs which are stored in advance therein.
  • the circuit board 10 has a synthetic resin, rectangular substrate 11 . As shown in FIG. 2A , electronic components (not shown) such as semiconductor chips are mounted on a surface of the substrate 11 , and wirings 12 which connect electrically the electronic components together are printed on the substrate 11 , whereby an electronic circuit 13 is provided.
  • electrode portions 20 are provided on the electronic circuit 13 , and the terminals 2 c of the pressure sensor 2 are connected to these electrode portions 20 .
  • the electrode portions 20 are provided on one surface 11 a (a base body 1 side surface) of the substrate 11 .
  • the terminals 2 c of the pressure sensor 2 are connected individually to the set of four electrode portions 20 .
  • the four electrode portions 20 are disposed into a square matrix configuration. Then, the distal end portions of the terminals 2 c are pressed individually against surfaces of the electrode portions 20 , whereby the pressure sensor 2 is electrically connected to the electronic circuit 13 (refer to FIG. 2B ).
  • the electrode portion 20 includes a land 21 (refer to FIG. 4 ) which is provided on the one surface 11 a of the substrate 11 , a solder layer 22 which is superposed on the land 21 , and a pad 23 which is superposed on the solder layer 22 .
  • the electrode portion 20 is formed by soldering the pad 23 on to the land 21 .
  • the electrode portion 20 is formed into a square shape when seen from thereabove. Additionally, exposed portions 24 are formed at four corners of a front surface of the electrode portion 20 . The solder layer 22 is exposed to the front surface side at the exposed portions 24 .
  • the electrode portion 20 has a square shape when seen from thereabove, the electrode portion 20 may have a rectangular shape.
  • the land 21 is a square metallic foil which is printed on the one surface 11 a of the substrate 11 .
  • the wiring 12 which is printed on the one surface 11 a of the substrate 11 is connected to the land 21 .
  • a whole surface of the land 21 is covered by the solder layer 22 .
  • the square solder layer 22 is superposed on the front surface of the land 21 .
  • four sides of the solder layer 22 are superposed on four sides of the land 21 .
  • the pad 23 is a quadrangular metallic plate.
  • the quadrangular shape also includes a shape which is chamfered at four corners thereof.
  • the pad 23 is superposed on the front surface of the solder layer 22 .
  • four sides of the pad 23 are superposed on the four sides of the solder layer 22 and the four sides of the land 21 .
  • Side surfaces of the pad 23 which extend along the four sides thereof are exposed to front sides of side surfaces of the solder layer 22 .
  • the pad 23 In the pad 23 , four corner portions of the square metallic plate are chamfered equally. In a state resulting before the corner portions of the metallic plate are chambered, a length of each side of the metallic plate is the same as a length of each side of the land 21 .
  • the corner portions 23 a of the pad 23 of the first embodiment are cut into a straight line relative to one side of the pad 23 . In this way, the corner portions 23 a of the pad 23 are C chamfered.
  • the exposed portions 24 are formed in which the solder layer 22 is exposed at the four corners of the front surface of the electrode portion 20 .
  • the exposed portions 24 have the same rectangular equilateral triangular shapes when viewed from thereabove.
  • part of the solder layer 22 flows into the individual exposed portions 24 , and part of the solder layer 22 is disposed outside the corner portions 23 a of the pad 23 (refer to FIG. 3A ).
  • a paste solder is applied to the whole of the front surface of the land 21 which is provided on the one surface 11 a of the substrate 11 , and the solder layer 22 is laminated on the whole of the front surface of the land 21 . Further, the pad 23 is superposed on the front surface of the solder layer 22 . The pad 23 is disposed on the front surface of the solder layer 22 so that the four sides of the pad 23 are disposed in the same direction as the four sides of the land 21 .
  • the substrate 11 is heated in such a state that the land 21 , the solder layer 22 and the pad 23 are superposed one on another. By doing so, the solder layer 22 is melted, creating a state in which the pad 23 is floating on the front surface of the solder layer 22 .
  • the solder layer 22 flows upwards along the side surfaces of the corner portions 23 a of the pad 23 by means of the surface tension of the solder layer 22 which is melted. This causes part of the solder layer 22 to flow on to upper portions of the exposed portions 24 as shown in FIG. 3A , whereby part of the solder layer 22 is disposed to sides of the corner portions 23 a of the pad 23 .
  • the solder layer 22 visible at the exposed portions 24 has the same shape when viewed from thereabove, and the volume of the solder which flows to the exposed portions 24 to stay thereat is equal at the individual exposed portions 24 .
  • the solder layer 22 is joined to the front surface of the land 21 , and the pad 23 is joined to the front surface of the solder layer 22 . This causes the pad 23 to be joined to the land 21 by the solder layer 22 .
  • the pad 23 is disposed directly above the land 21 , and in such a state that the solder layer 22 is melted, the pressing force or the pulling force acts equally on the corner portions 23 a of the pad 23 from the solder layer 22 at the exposed portions 24 . Because of this, when the pad 23 is soldered to the land 21 , even in the event that an impact or vibration is applied to the substrate 11 , the pad 23 can be prevented from being moved relative to the land 21 .
  • the exposed portions 24 may be formed by chamfering round the corner portions 23 a of the pad 23 (R chamfer) as shown in FIG. 5A .
  • R chamfer the corner portions 23 a of the pad 23
  • the pad should have a shape which allows the four sides of the pad are superposed on the four sides of the land 21 , and hence, for example, an octagonal pad can also be used.
  • a shape of the electrode portion 20 when seen from thereabove is not limited to a square shape, but can be a rectangular shape, as long as the pressing force or the pulling force acts equally on the corner portions 23 a of the pad 23 when the solder layer 22 is melted.
  • a circuit board of the second embodiment has substantially the same configuration as that of the circuit board 10 of the first embodiment, and as shown in FIG. 5B , the circuit board of the second embodiment differs from the circuit board 10 of the first embodiment in that a pad 25 has a different shape.
  • the pad 25 of the second embodiment is a circular metallic plate.
  • the pad 25 is disposed in relation to a land 21 so that when an electrode portion 20 is seen from thereabove, an outer circumferential line of the pad 25 is inscribed in four sides of the land 21 . Then, exposed portions 26 having the same shape are formed at four corners of a front surface of the electrode portion 20 .
  • the pressing forces and the pulling forces act equally on the pad 25 from the exposed portions 26 along diagonal lines of the land 21 .
  • the pad 25 is disposed directly above the land 21 , and in such a state that the solder layer 22 is melted, the pressing forces or pulling forces act equally on the pad 25 from the solder layer 22 within the exposed portions 26 . Because of this, even in the event that an impact or vibration is applied to a substrate 11 , the pad 25 can be prevented from being moved in relation to the land 21 .
  • the electrode portion 20 may have a rectangular shape when seen from thereabove, and the pad 25 may have an ellipsoidal shape when seen from thereabove, as long as the pressing force or the pulling force acts equally on the pad 25 from the exposed portions 26 when the solder layer 22 is melted.
  • a circuit board of the third embodiment has substantially the same configuration as that of the circuit board 10 of the first embodiment, and as shown in FIG. 6A , the circuit board of the second embodiment differs from the circuit board 10 of the first embodiment in that the shape and position of exposed portions 28 are different.
  • semicircular recess portions 27 a are formed individually in four sides of a pad 27 .
  • the recess portions 27 a are formed to have the same shape when seen from thereabove.
  • An outer circumferential line of the pad 27 touches each of the four sides of the land 21 when seem from thereabove. More specifically, the four sides of the pad 27 are superposed on four sides of a land 21 , such that exposed portions 28 are formed in four sides of a front surface of the electrode portion 20 . The exposed portions 28 are formed individually at middle portions of the four sides of the electrode portion 20 . The exposed portions 28 are formed to have the same shape when seen from thereabove.
  • the pressing forces or pulling forces act equally on the middle portions of the four sides of the pad 27 from the solder layer 22 in the exposed portions 28 in the directions which are at right angles to the corresponding sides of the pad 27 in such a state that the pad 27 is disposed directly above the land 21 and the solder layer 22 is melted. Because of this, even in the event that an impact or vibration is applied to a substrate 11 , the pad 27 can be prevented from being moved in relation to the land 21 .
  • a limitation is not imposed on the shape of the recess portions 27 a of the pad 27 , that is, the shape of the exposed portions 28 , and hence, quadrangular or triangular recess portions (exposed portions) may be formed.
  • circuit board is applied to the vehicle brake hydraulic pressure control unit, the circuit board may be applied to control units of various apparatuses.
  • the electrode portion 20 may have a rectangular shape when seen from thereabove, as long as the pressing force or the pulling force acts equally on the pad 27 from the exposed portions 28 when the solder layer 22 is melted.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Regulating Braking Force (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Structure Of Printed Boards (AREA)
US14/632,574 2014-02-27 2015-02-26 Circuit board and vehicle brake hydraulic pressure control unit Active 2035-03-25 US9821787B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014036346A JP6007358B2 (ja) 2014-02-27 2014-02-27 回路基板および車両用ブレーキ液圧制御装置
JP2014-036346 2014-02-27

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US20150245483A1 US20150245483A1 (en) 2015-08-27
US9821787B2 true US9821787B2 (en) 2017-11-21

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US (1) US9821787B2 (ja)
EP (1) EP2914072B1 (ja)
JP (1) JP6007358B2 (ja)
CN (1) CN104883816B (ja)

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JP2018046047A (ja) * 2016-09-12 2018-03-22 トヨタ自動車株式会社 電子制御装置
DE102017119235B3 (de) * 2017-08-23 2018-12-13 Trw Automotive Electronics & Components Gmbh Kraftfahrzeugbedienvorrichtung sowie Verfahren zur Herstellung einer zumindest teilweise elektrisch leitfähigen Bedieneinheit für eine Kraftfahrzeugbedienvorrichtung
US11357981B2 (en) 2018-03-01 2022-06-14 Adventus Ventures, Llc Systems and methods for controlling blood pressure
JP7166818B2 (ja) * 2018-07-13 2022-11-08 スタンレー電気株式会社 光半導体素子
JP2021030996A (ja) * 2019-08-29 2021-03-01 ロベルト・ボッシュ・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ 液圧制御ユニット、ブレーキシステム及び鞍乗型車両
DE102022204294A1 (de) 2022-05-02 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungsanordnung mit einem ein Bauelement zentrierenden Schaltungsträger

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US20150245483A1 (en) 2015-08-27
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