Classifications

• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
  • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
  • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
  • C08F20/10—Esters
  • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/04—Acids; Metal salts or ammonium salts thereof
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
  • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/075—Silicon-containing compounds
  • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
  • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/26—Processing photosensitive materials; Apparatus therefor
  • G03F7/40—Treatment after imagewise removal, e.g. baking
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
  • C08F220/12—Esters of monohydric alcohols or phenols
  • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate

Definitions

• the present invention relates to a positive-working radiation-sensitive composition used in the production of semiconductor integrated circuits, lithography masks and the like.
• Chemically amplified resists are resists which possess a mechanism whereby acid is generated in exposed regions due to the action of a photoacid generator, and the solubility of the exposed regions is modified by the catalytic action of this acid.
• alkali-soluble resins in which the alkali-soluble groups are protected by acid labile groups such as the tert-butyl group, the 1,1-diphenylethyl group (U.S. Pat. No. 5,688,628), the trityl group (JP-A-6-83057) and other such tertiary ester groups, the tert-butoxycarbonyl group, the acetal group and the like.
• the present invention relates to a positive-working radiation-sensitive, composition which is characterized in that it contains any of compounds al) to a3), plus b) an acid generator which generates acid by exposure to radiation; and to a method of producing a resist pattern employing same.
• R 1 and R 2 are aromatic rings, and R 3 represents an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring; and R 1 to R 3 may be the same or different.
• R 4 to R 6 are each an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring, and at least one of R 4 to R 6 is an aromatic ring with an electron-donating group.
• R 4 to R 6 may be the same or different.
• the positive-working radiation-sensitive composition of the present invention comprises any of compounds a1) to a3), plus b) an acid generator which generates acid by exposure to radiation.
• Compound a1) is a compound wherein a carboxyl group is protected by an acid labile group represented by general formula (1).
• R 1 and R 2 are aromatic rings, and R 3 represents an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring.
• R 1 to R 3 may be the same or different.
• Specific examples of R 1 and R 2 are the phenyl group, naphthyl group, pyridyl group, furyl group and thienyl group.
• R 3 are the methyl group, ethyl group, propyl group, butyl group, methoxymethyl group, ethoxybutyl group, hydroxy-ethyl group and cyclohexyl group, and also the groups cited above as specific examples of R 1 .
• Compound a2) is a compound in which an alkali-soluble group is protected by an acid labile group represented by general formula (2).
• R 4 to R 6 are each an alkyl group, a substituted alkyl group, a cycloalkyl group or an aromatic ring, and at least one of R 4 to R 6 is an aromatic ring with an electron-donating group.
• R 4 to R 6 may be the same or different.
• the electron-donating group is a group having a stronger tendency to donate electrons than hydrogen, and examples include acyloxy groups, amino groups, alkyl groups and alkoxy groups.
• the electron-donating groups which are preferably used from amongst these are acyloxy group with 2 to 6 carbons, alkyl groups with 1 to 4 carbons and alkoxy groups with 1 to 6 carbons, of which the alkoxy groups with 1 to 6 carbons are most preferred. There may also be two or more electron-donating groups on one aromatic ring.
• aromatic rings with an electron-donating group are the 4-acetyloxyphenyl group, 4-acetyloxynaphthyl group, 3-benzyloxyphenyl group, 4-dimethylaminophenyl group, 2-dimethylaminophenyl group, 4-aminonaphthyl group, p-tolyl group, m-tolyl group, o-tolyl group, 2,4-dimethylphenyl group, 2,4,6-trimethylphenyl group, 4-tert-butylphenyl group, 4-methylnaphthyl group, 4-methoxyphenyl group, 2-methoxyphenyl group, 3-ethoxyphenyl group, 4-tert-butoxyphenyl group, 4-phenoxyphenyl group, 4-methoxynaphthyl group, 3-isopropoxyphenyl group, 4-methoxy-3-methylphenyl group, 3,5-dimethoxyphenyl group and the like.
• the remaining groups amongst R 4 to R 6 other than the aromatic ring with an electron-donating group there are the methyl group, ethyl group, propyl group, butyl group, methoxymethyl group, ethoxybutyl group, hydroxyethyl group, cyclohexyl group and phenyl group.
• an aromatic ring on a tertiary carbon bonded to oxygen possesses an electron-donating group, the positive charge of the carbocation produced at the time of deprotection is stabilized, so deprotection is facilitated and the resist sensitivity is enhanced.
• the carboxyl group and the phenolic hydroxyl group are preferred as the alkali-soluble group in compound a2).
• a structure represented by the following general formula (3) is preferred as the aromatic ring with an electron-donating group contained in the acid labile group of general formula (2).
• R 8 , R 10 and R 12 each independently represents a hydrogen atom, an alkyl group with 1 to 4 carbons or an alkoxy group with 1 to 6 carbons, with at least one of these being such an alkyl group or alkoxy group.
• R 9 and R 11 each independently represents a hydrogen atom, an alkyl group with 1 to 4 carbons or an alkoxy group with 1 to 6 carbons. Still greater sensitivity is realized by introducing an electron-donating group at the ortho- or para-position.
• Compound a3) is a compound in which an alkali-soluble group is protected by an acid labile group a, and this acid labile group a has an alkali-soluble group or alternatively acid labile group a has an alkali-soluble group protected by an acid labile group b.
• Acid labile group a and acid labile group b may have the same structure.
• Acid labile group a preferably either has at least one phenolic hydroxyl group or carboxyl group, or this phenolic hydroxyl group or carboxyl group is further protected by acid labile group b.
• the groups represented by general formula (4) may be given as examples of the structure of such an acid labile group a.
• R 13 to R 15 are each independently an alkyl group, a substituted alkyl group, a cycloalkyl group, an aryl group, a substituted aryl group, a group containing an alkali-soluble group, or a group containing an alkali-soluble group protected by acid labile group b, with at least one being a group containing an alkali-soluble group, or a group containing an alkali-soluble group protected by acid labile group b.
• R 13 to R 15 may be the same or different.
• at least one of R 13 to R 15 in general formula (4) is preferably a group represented by general formulae (5) or (6).
• A represents an alkylene group with 1 to 4 carbons, an arylene group with 6 to 10 carbons or a single bond.
• B represents an alkylene group with 1 to 6 carbons, an arylene group with 6 to 10 carbons, an alkylenearylene group with 7 to 12 carbons or a single bond.
• R 16 to R 19 each independently represents a hydrogen atom or an alkyl group with 1 to 4 carbons.
• Y represents acid labile group b or a hydrogen atom, and m is 1 to 3. It is particularly preferred in terms of the sensitivity that at least one of R 13 to R 15 in general formula (4) be a group represented by general formulae (7) or (8).
• R 20 and R 21 each independently represents a hydrogen atom or an alkyl group with 1 to 4 carbons.
• Y represents an acid labile group b or a hydrogen atom, and in is 1 to 3.
• R 22 and R 23 represent a hydrogen atom or an alkyl group with 1 to 4 carbons.
• Y represents an acid labile group b or a hydrogen atom.
• acid labile group b examples include the methoxymethyl group, inethyithiomethyl group, ethoxymethyl group, ethyithiomethyl group, methoxyethoxymethyl group, benzyloxymethyl group, benzylthiomethyl group, phenacyl group, bromophenacyl group, methoxyphenacyl group, methylthiophenacyl group, ⁇ -methylphenacyl group, cyclopropylmethyl group, benzyl group, diphenylmethyl group, triphenylmethyl group, bromobenzyl group, nitrobenzyl group, methoxybenzyl group, methylthiobenzyl group, ethoxybenzyl group, methoxycarbonylmethyl group, ethoxycarbonylmethyl group, n-propoxycarbonylmethyl group, isopropoxycarbonylmethyl group, n-butoxycarbonylmethyl group, tert-butoxycarbonylmethyl group, propenyl group, 1-methoxyeth
• the compounds of conditions a1) to a3) are preferably polymers.
• the weight average molecular weight measured by GPC (gel permeation chromatography) based on polystyrene conversion will be 4,000-1,000,000, preferably 5,000-100,000, and more preferably 5,000-50,000. With a weight average molecular weight of less than 5,000, film formation becomes difficult, while with a weight average molecular weight of more than 50,000 the resist sensitivity is lowered.
• R 24 represents a hydrogen atom, an alkyl group with 1 to 4 carbons, a cyano group or a halogen.
• Z is a group represented by general formula (1), (2) or (4).
• R 25 represents a hydrogen atom, an alkyl group with 1 to 4 carbons, a cyano group or a halogen.
• X is an acid labile group represented by general formula (2) or (4).
• R 24 be a cyano group or halogen.
• the polymer containing the structural units represented by general formula (9) or (10) may be a polymer containing only structural units represented by general formula (9) or (10), but it may also be a polymer containing other monomer units providing the characteristics as a chemically amplified resist are not impaired.
• Examples of other monomer structures are acrylic acid, methyl acrylate, ethyl acrylate, hydroxyethyl methacrylate, isopropyl acrylate, n-butyl acrylate, tert-butyl acrylate, methacrylic acid, methyl methacrylate, ethyl methacrylate, hydroxyethyl acrylate, isopropyl methacrylate, n-butyl methacrylate, tert-butyl methacrylate, methyl ⁇ -chloroacrylate, ethyl ⁇ -chloroacrylate, hydroxyethyl ⁇ -chloroacrylate, isopropyl ⁇ -chloroacrylate, n-butyl ⁇ -chloroacrylate, tert-butyl ⁇ -chloroacrylate, methyl ⁇ -cyanoacrylate, ethyl ⁇ -cyanoacrylate, hydroxyethyl ⁇ -cyanoacrylate,
• polymer containing structural units represented by aforesaid general formula (9) or (10) preferably used in the present invention may also contain the following cyclic structures in the main chain in order to enhance the dry etching resistance, etc.
• the positive-working radiation-sensitive composition of the present invention also contains b), an acid generator which generates acid by exposure to radiation.
• an acid generator which generates acid by exposure to radiation.
• the acid generator employed here may be of any kind providing that, as a result of the acid generated, the rate of dissolution of the compound of al) to a3) in aqueous alkali solution is increased, and as examples thereof there are onium salts, halogen-containing compounds, diazoketone compounds, diazomethane compounds, sulphone compounds, sulphonic acid ester compounds, sulphonimide compounds and the like.
• the onium salts there are diazonium salts, ammonium salts, iodonium salts, sulphonium salts, phosphonium salts, oxonium salt and the like.
• Preferred examples of the onium salts are diphenyliodonium triflate, diphenyliodonium pinenesuphonate, diphenyliodonium dodecylbenzene-sulphonate, triphenylsulphonium triflate, triphenylsulphonium hexafluoroantimonate, triphenylsulphonium naphthalenesulphonate, (hydroxyphenyl)benzylmethylsulphonium toluenesulphonate and the like.
• halogen-containing compounds there are hydrocarbon compounds containing haloalkyl groups and heterocyclic compounds containing haloalkyl groups.
• Preferred halogen-containing compounds are 1,1-bis(4-chlorophenyl)-2,2,2-trichloroethane, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-napthyl-4,6-bis(trichloromethyl)-s-triazine and the like.
• diazoketone compounds are 1,3-diketo-2-diazo compounds, diazobenzoquinone compounds, diazonaphthoquinone compounds and the like.
• preferred diazoketone compounds there are the ester of 2,3,4,4′-tetrahydroxybenzophenone and 1,2-naphthoquinonediazide-4-Sulphonic acid, and the ester of 1,1,1-tris(4-hydroxyphenyl)ethane and 1,2-naphthoquinonediazide-4-sulphonic acid.
• diazomethane compounds are bis(trifluoromethylsulphonyl)diazomethane, bis(cyclohexylsulphonyl)diazomethane, bis(phenylsulphonyl)diazomethane, bis(p-tolylsulphonyl)diazomethane, bis(2,4-xylylsulphonyl)diazomethane, bis(p-chlorophenylsulphonyl)diazomethane, methylsulphonyl-p-toluenesulphonyldiazomethane, cyclohexylsulphonyl(1,1-dimethylethylsulphonyl)diazomethane, bis(1,1-dimethylethylsulphonyl)diazomethane, phenylsulphonyl(benzoyl)diazomethane and the like.
• sulphone compounds are ⁇ -ketosulphone compounds and ⁇ -sulphonylsulphone compounds.
• Preferred examples of such compounds are 4-trisphenacylsulphone, mesitylphenacylsulphone and bis(phenylsulphonyl)methane.
• sulphonic acid ester compounds examples include alkylsulphonates, haloalkylsulphonates, arylsulphonates, imino-sulphonates and the like.
• Specific examples of the sulphonic acid compounds are benzoin tosylate, pyrogallol trimesylate, nitrobenzyl-9,10-diethoxyanthracene-2-sulphonate and the like.
• sulphonimide compounds are N-(trifluoromethylsulphonyloxy)succinimide, N-(trifluoromethylsulphonyloxy)phthalimide, N-(trifluoromethylsulphonyloxy)diphenylmaleimide, N-(trifluoromethylsulphonyloxy)bicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(trifluoromethylsulphonyloxy)-7-oxabicyclo[2.2.1]hept-5-ene-2,3-dicarboxylimide, N-(camphorsulphonyloxy)bicyclo[2.2.1]heptane-5,6-oxy -2,3-dicarboxylimide, N-(trifluoromethylsulphonyloxy)naphthyldicarboxylimide, N-(camphorsulphonyloxy)succinimide, N-(camphorsulphonyloxy)succ
• the amount of the acid generator added is normally from 0.01 to 50 wt % in terms of the polymer, and more preferably 0.1 to 10 wt %. With less than 0.01 wt %, pattern formation becomes impossible, while with more than 50 wt % the affinity for the developer liquid is lowered and developing faults and the like arise.
• the positive-working radiation-sensitive composition of the present invention may include alkali-soluble resin.
• additives such as surfactants, sensitizers, stabilizers, antifoaming agents, acid diffusion inhibitors and the like.
• the positive-working radiation-sensitive composition of the present invention is obtained by dissolving the aforesaid components in a solvent.
• the amount of solvent used is not particularly restricted but is adjusted such that the solids content is from 5 to 35 wt %.
• preferably-used solvents are solvents selected from esters such as ethyl acetate, butyl acetate, amyl acetate, ethyl propionate, methyl acetate, methyl benzoate, methyl lactate, ethyl lactate, ethyl pyruvate, methyl ⁇ -isobutyrate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate and ⁇ -butyrolactone, Cellosolves such as Methyl Cellosolve, Ethyl Cellosolve and Butyl Cellosolve, Cellosolve esters such as Methyl Cellosolve Acetate, Ethyl Cellosolve Acetate and But
• the positive-working radiation-sensitive composition of the present invention is employed in the form of a thin film, normally in the range 0.2 ⁇ m to 2 ⁇ m, obtained by coating onto the substrate undergoing processing, and then drying.
• a fine pattern can be obtained by pattern-exposure of this thin film using radiation such as an electron beam, X-rays, vacuum ultraviolet or the like and then, following the exposure, carrying out baking and developing.
• the effects are still more marked in the case where an electron beam is used.
• the developing of the positive-working radiation-sensitive composition of the present invention can be carried out using known developing liquids.
• aqueous solutions containing an alkali metal hydroxide, carbonate, phosphate, silicate, borate or other such inorganic alkali, 2-diethylaminoethanol, monoethanolamine, diethanolamine or other such amine, or tetramethylammonium hydroxide, choline or other such quaternary ammonium compound, or containing a combination of these.
• the weight average molecular weight in these examples is the GPC (gel permeation chromatography) measurement value based on polystyrene conversion.
• GPC gel permeation chromatography
• tetrahydrofuran was employed as the mobile phase, at a flow-rate of 0.8 ml per minute.
• the sample concentration was 0.2 wt % and the amount of injected sample was 0.1 ml.
• the detector was a differential refractometer.
• a 60:40 (molar ratio) mixture of 1,1-diphenylethyl methacrylate and p-hydroxy- ⁇ -methylstyrene was polymerized at 70° C. in 1,4-dioxane using azobisisobutyronitrile as the initiator, and a polymer of the following chemical formula (11) obtained (weight average molecular weight 8200).
• 3 g of this polymer and 300 mg of triphenylsulphonium triflate were dissolved in Methyl Cellosolve Acetate and, by filtering with a 0.2 ⁇ m filter, there was obtained a resist composition.
• the resist composition obtained was spin-coated onto a silicon wafer which had been HMDS treated, after which heating was carried out for 2 minutes at 100° C. and a resist film of film thickness 0.5 ⁇ m obtained.
• this resist film was subjected to electron beam irradiation in the form of a pattern at an accelerating voltage of 20 kV.
• development was carried out for 1 minute with 2.38% tetramethylammonium hydroxide solution (ELM-D, produced by the Mitsubishi Gas Chemical Co.).
• ELM-D tetramethylammonium hydroxide solution
• a resist film was obtained in the same way as in Example 1 except that there was used polymer (weight average molecular weight 24000) of the following chemical formula (12) instead of the copolymer employed in Example 1, and then election beam irradiation and development were carried out. At an exposure of 3.9 ⁇ C/cm 2 , there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used polymer (weight average molecular weight 10000) of the following chemical formula (13) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 4.1 ⁇ C/cm 2 , there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 9000) of the following chemical formula (14) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.9 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 7900) of the following chemical formula (15) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.4 ⁇ C/cm 2 , there was obtained a 0.19 ⁇ m pattern.
• Example 4 Testing was carried out in the same way as in Example 4, except that there was used an 1-line stepper as the exposure device. At an exposure of 49 ⁇ J/cm 2 , there was obtained a 2.6 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 10000) of the following chemical formula (16) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.6 ⁇ C/cm 2 , there was obtained a 0.20 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 13000) of the following chemical formula (17) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.7 ⁇ C/cm 2 , there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used polymer (weight average molecular weight 13000) of the following chemical formula (17) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.7 ⁇ C/cm 2 , there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 26000) of the following chemical formula (19) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.0 ⁇ C/cm 2 , there was obtained a 0.21 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 58000) of the following chemical formula (20) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.6 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• Example 10 Testing was carried out in the same way as in Example 10 except that there was used an 1-line stepper as the exposure device. At an exposure of 34 mJ/cm 2 , there was obtained a 0.35 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 9700) of the following chemical formula (21) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.6 ⁇ C/cm 2 , there was obtained a 0.19 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 19000) of the following chemical formula (22) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.9 ⁇ C/cm 2 , there was obtained a 0.20 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 11000) of the following chemical formula (23) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.4 ⁇ C/cm 2 , there was obtained a 0.20 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 9500) of the following chemical formula (24) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.2 ⁇ C/cm 2 , there was obtained a 0.19 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 4500) of the following chemical formula (25) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.0 ⁇ C/cm 2 , there was obtained a 0.24 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 56000) of the following chemical formula (26) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.5 ⁇ C/cm 2 , there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 18000) of the following chemical formula (27) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.4 ⁇ C/cm 2 , there was obtained a 0.21 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 25000) of the following chemical formula (28) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.7 ⁇ C/cm 2 , there was obtained a. 0.20 ⁇ m pattern.
• Example 13 Testing was carried out in the same way as in Example 13 except that there was used an i-line stepper as the exposure device. At an exposure of 29 mJ/cm 2 , there was obtained a 0.31 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 23000) of the following chemical formula (29) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.0 ⁇ C/cm 2 , there was obtained a 0.19 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 18000) of the following chemical formula (30) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.7 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 57000) of the following chemical formula (31) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.7 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 35000) of the following chemical formula (32) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.5 ⁇ C/cm 2 , there was obtained a 0.21 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 4500) of the following chemical formula (33) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.2 ⁇ C/cm 2 there was obtained a 0.23 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 18000) of the following chemical formula (34) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.6 ⁇ C/cm 2 , there was obtained a 0.20 ⁇ m pattern.
• Example 22 Testing was carried out in the same way as in Example 22 except that there was used an 1-line stepper as the exposure device. At an exposure of 36 mJ/cm 2 , there was obtained a 0.33 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 21000) of the following chemical formula (35) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.7 ⁇ C/cm 2 , there was obtained a 0.19 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 31000) of the following chemical formula (36) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 2.4 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 19000) of the following chemical formula (37) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 1.6 ⁇ C/cm 2 , there was obtained a 0.20 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used polymer (weight average molecular weight 8000) of the following chemical formula (38) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.5 ⁇ C/cm 2 , there was obtained a 0.24 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 11000) of the following chemical formula (39) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.3 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 9000) of the following chemical formula (40) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 3.2 ⁇ C/cm 2 , there was obtained a 0.22 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 14000) of the following chemical formula (41) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out.
• Example 34 Testing was carried out in the same way as in Example 34 except that there was used and i-line stepper as the exposure device. At an exposure of 36 mJ/cm 2 , there was obtained a 0.33 ⁇ m pattern.
• a resist film was obtained in the same way as in Example 1 except that there was used poly(tert-butyl ⁇ -chloroacrylate) (weight average molecular weight 21000) instead of the copolymer employed in Example 1, and then electron beam irradiation and development were carried out. At an exposure of 6.2 ⁇ C/cm 2 , there was obtained a 0.33 ⁇ m pattern, and in terms of sensitivity and resolution the properties were inadequate.
• poly(tert-butyl ⁇ -chloroacrylate) weight average molecular weight 21000
• a resist film was obtained in the same way as in Example 1 except that there was used copolymer (weight average molecular weight 12000) of the following chemical formula (42) instead of the copolymer employed in Example 1, and then evaluation carried out.
• a compound containing a specified acid labile group and an acid generator which generates acid as a result of irradiation with radiation are employed, so that it is possible to obtained a composition of high resolution and high sensitivity.

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