US6041828A - Internally tin-coated copper pipe and method for coating a copper pipe - Google Patents

Internally tin-coated copper pipe and method for coating a copper pipe Download PDF

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Publication number
US6041828A
US6041828A US08/996,757 US99675797A US6041828A US 6041828 A US6041828 A US 6041828A US 99675797 A US99675797 A US 99675797A US 6041828 A US6041828 A US 6041828A
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US
United States
Prior art keywords
pipe
copper
tin
tin coating
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US08/996,757
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English (en)
Inventor
Achim Baukloh
Ulrich Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KM Europa Metal AG
Original Assignee
KM Europa Metal AG
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Filing date
Publication date
Assigned to KM EUROPA METAL AKTIENGESELLSCHAFT reassignment KM EUROPA METAL AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: REITER, ULRICH, BAUKLOH, ACHIM
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
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Publication of US6041828A publication Critical patent/US6041828A/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1614—Process or apparatus coating on selected surface areas plating on one side
    • C23C18/1616—Process or apparatus coating on selected surface areas plating on one side interior or inner surface
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L58/00—Protection of pipes or pipe fittings against corrosion or incrustation
    • F16L58/02—Protection of pipes or pipe fittings against corrosion or incrustation by means of internal or external coatings
    • F16L58/04—Coatings characterised by the materials used
    • F16L58/08—Coatings characterised by the materials used by metal

Definitions

  • a conventional method for coating the interior surfaces of copper pipes with tin is the chemical deposition of tin on the interior surface of the copper pipes, as described, for example, in U.S. Pat. No. 2,282,511.
  • the underlying object of the present invention is to produce an installation pipe of copper having an improved inner tin coating, which is also resistant to aggressive water or liquids.
  • a further object of the invention is to provide a method for coating copper pipes, which will render possible a homogeneous and compact structure of the inner tin coating.
  • the copper concentration of the tin coating in the area facing the pipe axis, thus at the water-side surface is less than 10%.
  • the concentration is preferably 3%.
  • a tin coating is provided which is pure and has a low concentration of copper.
  • the deposited tin crystals have a small particle size and a globulite form has a particularly advantageous effect on the consistency of the exposed surface of the tin coating.
  • the crystals are sphere-like, with roughly the same diameter in all directions, making possible compact packing.
  • the tin coating that is applied with temperature control is characterized by small crystals, packed uniformly side-by-side. This results in a substantially smaller exposed coating surface.
  • the tin coating of the installation pipe of the present invention exhibits excellent adhesive strength and corrosion resistance.
  • the homogeneity and the fine-granular structure of the tin coating minimize the surface area vulnerable to corrosion by the liquids transported in the pipes. This ensures that the amount of copper ions released lies clearly below the permissible maximum value. Also minimized are the solubility of the tin and, thus, the amount of tin ions released.
  • the installation pipe of the present invention has the distinction of high resistance of the tin coating to mechanical stress.
  • the method of the present invention is such that the temperature of the tinning solution is varied to conform to the purposes at hand, so as to produce a homogeneous, dense and compact tin coating.
  • the tinning process begins with the formation of a large number of uniformly distributed nuclei of crystallization having the same orientation.
  • the temperature is then selectively adjusted to promote crystal growth, the orientation of the growing crystals remaining constant.
  • the temperature of the tinning solution during a first rinsing operation may be lower than in a subsequent rinsing operation.
  • one begins the tinning process at a low temperature.
  • one selects a highest possible temperature to attain a high deposition rate and the desired coating thickness.
  • the temperature control can be carried out in steps.
  • the copper pipe to be tin-coated is first thoroughly rinsed with a tinning solution having a temperature of between 35° C. and 45° C.
  • the temperature of the tinning solution then lies between 70° C. and 85° C.
  • One especially advantageous specific embodiment of the general inventive idea is characterized by the temperature of the tinning solution during the thorough rinsing process being continuously raised from a temperature of between 35° C. and 45° C. to a temperature of between 70° C. and 85° C.
  • the temperature can be raised, e.g., by a continuous-flow heating of the tinning solution. In this case, one can adjust as a function of time, the deposition rate and the particle size of the tin crystals that are aspired to.
  • a copper pipe is prepared, which is preferably rolled up in coils of several hundred meters in length.
  • This pipe is initially degreased on the inside using an alkaline or an acid cleaning agent.
  • the copper pipe is pre-rinsed with water. This is followed by an additional pretreatment of the interior surface of the copper pipe by pickling, e.g., using potassium persulphate.
  • the pickling process is optionally followed by a rinsing process with completely desalinated water.
  • Conceivable also is the application of a pickling or scouring agent, which is compatible with the tinning solution used, so that there is no need to repeat the rinsing operation.
  • the copper pipe Since initially the copper concentration in the deposited tin is supposed to be kept very low, it can be advantageous for the copper pipe to enter at a cold temperature into the tinning process. This can be achieved, for example, in that the pickle or the subsequent rinsing water is cold.
  • the temperature-controlled tinning process is undertaken, in which the copper pipe is thoroughly rinsed with a chemical tinning solution.
  • the rate of deposition out of the tinning solution, as well as the particle size and the packing structure of the tin coating are regulated by a temperature adjustment or control.
  • the duration of the tinning operation and the lowering of the temperature of the tinning solution are so defined in this context that tin is even deposited during the final rinsing operation.
  • the surface of the tin coating can be further improved with respect to structure and tightness. Furthermore, large whiskers are prevented from forming. Therefore, the formation of an interior tin coating surface that is low in copper and is dense is favored.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • General Engineering & Computer Science (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Protection Of Pipes Against Damage, Friction, And Corrosion (AREA)
  • Coating With Molten Metal (AREA)
  • Laminated Bodies (AREA)
US08/996,757 1996-12-23 1997-12-23 Internally tin-coated copper pipe and method for coating a copper pipe Expired - Fee Related US6041828A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19653765 1996-12-23
DE19653765A DE19653765A1 (de) 1996-12-23 1996-12-23 Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs

Publications (1)

Publication Number Publication Date
US6041828A true US6041828A (en) 2000-03-28

Family

ID=7815843

Family Applications (1)

Application Number Title Priority Date Filing Date
US08/996,757 Expired - Fee Related US6041828A (en) 1996-12-23 1997-12-23 Internally tin-coated copper pipe and method for coating a copper pipe

Country Status (13)

Country Link
US (1) US6041828A (ja)
EP (1) EP0851041B1 (ja)
JP (1) JPH10306379A (ja)
AR (1) AR010095A1 (ja)
AT (1) ATE215621T1 (ja)
AU (1) AU723623B2 (ja)
BR (1) BR9705612A (ja)
CA (1) CA2225464C (ja)
DE (2) DE19653765A1 (ja)
DK (1) DK0851041T3 (ja)
ES (1) ES2175254T3 (ja)
PT (1) PT851041E (ja)
SI (1) SI0851041T1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030178107A1 (en) * 2002-03-23 2003-09-25 Achim Baukloh Method for reducing copper solubility at the inner surface of a copper tube
FR2867198A1 (fr) * 2004-03-05 2005-09-09 Trefimetaux Procede d'etamage de pieces tubulaires en cuivre
US20080173550A1 (en) * 2007-01-22 2008-07-24 C. Uyemura & Co., Ltd. Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19915574A1 (de) * 1999-03-30 2000-10-12 Sms Demag Ag Verfahren zur Herstellung des innen- und/oder außen verzinnten Hohlprofiles sowie innenverzinntes Kupferrohr
DE10003582A1 (de) * 2000-01-28 2001-08-02 Km Europa Metal Ag Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
FI20001467A (fi) * 2000-06-20 2001-12-21 Outokumpu Oy Menetelmä sisäpuolelta pinnoitettujen kupari- tai kupariseosputkien valmistamiseksi
FI120268B (fi) * 2003-12-12 2009-08-31 Cupori Group Oy Menetelmä putken pinnoittamiseksi
JP4880301B2 (ja) * 2005-12-26 2012-02-22 石原薬品株式会社 無電解スズメッキの後処理方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943616A (en) * 1972-11-06 1976-03-16 Vaponics, Inc. Method of coupling, and fitting for, lined tubing
US4234631A (en) * 1979-07-20 1980-11-18 Amp Incorporated Method for immersion deposition of tin and tin-lead alloys
US4269625A (en) * 1978-12-04 1981-05-26 U.S. Philips Corporation Bath for electroless depositing tin on substrates
US5248527A (en) * 1991-03-01 1993-09-28 C. Uyemura And Company, Limited Process for electroless plating tin, lead or tin-lead alloy
US5296268A (en) * 1991-09-03 1994-03-22 Shipley Company Inc. Pretreatment process of tin lead plating
US5302256A (en) * 1991-06-25 1994-04-12 Learonal Japan Inc. Immersion tin/lead alloy plating bath
US5769129A (en) * 1995-03-16 1998-06-23 Kabushiki Kaisha Kobe Seiko Sho Cold-and hot-water supply copper-alloy pipe with inner-surface protective film, method for manufacturing same, and hot-water supply heat exchanger

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
NL8403033A (nl) * 1984-10-05 1986-05-01 Philips Nv Werkwijze voor het autokatalytisch vertinnen van voorwerpen van koper of een koperlegering.
DE3800918A1 (de) * 1988-01-14 1989-07-27 Siemens Ag Bad zur stromlosen zinnabscheidung
JP2804722B2 (ja) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 銅又は銅合金管内面への錫めっき方法
DE69716222T2 (de) * 1996-06-05 2004-09-16 Sumitomo Light Metal Industries Ltd. Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943616A (en) * 1972-11-06 1976-03-16 Vaponics, Inc. Method of coupling, and fitting for, lined tubing
US4269625A (en) * 1978-12-04 1981-05-26 U.S. Philips Corporation Bath for electroless depositing tin on substrates
US4234631A (en) * 1979-07-20 1980-11-18 Amp Incorporated Method for immersion deposition of tin and tin-lead alloys
US5248527A (en) * 1991-03-01 1993-09-28 C. Uyemura And Company, Limited Process for electroless plating tin, lead or tin-lead alloy
US5302256A (en) * 1991-06-25 1994-04-12 Learonal Japan Inc. Immersion tin/lead alloy plating bath
US5296268A (en) * 1991-09-03 1994-03-22 Shipley Company Inc. Pretreatment process of tin lead plating
US5769129A (en) * 1995-03-16 1998-06-23 Kabushiki Kaisha Kobe Seiko Sho Cold-and hot-water supply copper-alloy pipe with inner-surface protective film, method for manufacturing same, and hot-water supply heat exchanger

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030178107A1 (en) * 2002-03-23 2003-09-25 Achim Baukloh Method for reducing copper solubility at the inner surface of a copper tube
FR2867198A1 (fr) * 2004-03-05 2005-09-09 Trefimetaux Procede d'etamage de pieces tubulaires en cuivre
EP1571235A3 (fr) * 2004-03-05 2008-03-19 Tréfimétaux S.A. Procédé d'étamage de pièces tubulaires en cuivre
US20080173550A1 (en) * 2007-01-22 2008-07-24 C. Uyemura & Co., Ltd. Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance
EP1947215A3 (en) * 2007-01-22 2011-03-16 C. Uyemura & Co, Ltd Method for forming a displacement tin alloy plated film, displacement tin alloy plating bath and method for maintaining a plating performance

Also Published As

Publication number Publication date
DE59706853D1 (de) 2002-05-08
AU723623B2 (en) 2000-08-31
BR9705612A (pt) 1999-05-11
PT851041E (pt) 2002-09-30
SI0851041T1 (en) 2002-10-31
EP0851041B1 (de) 2002-04-03
AR010095A1 (es) 2000-05-17
ES2175254T3 (es) 2002-11-16
CA2225464A1 (en) 1998-06-23
EP0851041A1 (de) 1998-07-01
CA2225464C (en) 2001-07-31
MX9709937A (es) 1998-07-31
AU4854897A (en) 1998-06-25
DK0851041T3 (da) 2002-07-22
JPH10306379A (ja) 1998-11-17
ATE215621T1 (de) 2002-04-15
DE19653765A1 (de) 1998-06-25

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