US5271548A - Method for applying solder to and mounting components on printed circuit boards - Google Patents

Method for applying solder to and mounting components on printed circuit boards Download PDF

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Publication number
US5271548A
US5271548A US07/929,975 US92997592A US5271548A US 5271548 A US5271548 A US 5271548A US 92997592 A US92997592 A US 92997592A US 5271548 A US5271548 A US 5271548A
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United States
Prior art keywords
solder
printed circuit
components
circuit board
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
US07/929,975
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English (en)
Inventor
Werner Maiwald
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bus Elektronik & Co KG GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAIWALD, WERNER
Application granted granted Critical
Publication of US5271548A publication Critical patent/US5271548A/en
Assigned to BUS ELEKTRONIK GMBH & CO. KG reassignment BUS ELEKTRONIK GMBH & CO. KG ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AKTIENGESELLSCHAFT, SIEMENS
Assigned to BUS ELEKTRONIK GMBH & CO. KG reassignment BUS ELEKTRONIK GMBH & CO. KG RECORD TO CORRECT ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED ON REEL 012199 FRAME 0766 AND TO ADD EXECUTION DATE Assignors: SIEMENS AKTIENGESELLSCHAFT
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to a method for applying solder to printed circuit boards and for mounting components on the printed circuit boards, in which a solder paste is applied to electrically conductive regions (soldering pads) of a printed circuit board for forming solder deposits, and in which the solder deposits are subsequently melted to make solder applications that are joined to the conductive regions.
  • German Patent DE 38 10 653 C1 corresponding to U.S. Pat. No. 5,051,339, discloses several methods for applying solder to printed circuit boards with components.
  • immersion application of solder to printed circuit boards a prepared PCB is dipped in a bath of solder, then removed and cooled.
  • the metallized regions of the PCB that are not provided with a solder resist agent then receive an application of solder.
  • curved surfaces approximately in the form of a hump are produced.
  • the height of the solder application depends on the dimensions in the PCB plane, so that solder applications of different heights are created.
  • solder paste that forms flat solder deposits is applied to the SMD soldering regions or pads with the aid of a printing process (such as screen printing) or as dispensing process.
  • a printing process such as screen printing
  • dispensing process it is known, for instance from Patents Abstracts of Japan, Vol. 14, No. 336 (E-953) [4279], July 19, 1990, to apply a solder resist mask between the soldering pads.
  • the solder deposits are then heated relatively slowly in a reflow oven to a point above the melting point of the solder alloy being used, and the soldered lead is thus produced by the melting of the solder paste.
  • solder paste is not solid but instead has a high proportion of volatile, non-metallic ingredients, such as solvents.
  • volatile, non-metallic ingredients such as solvents.
  • the non-homogeneous solder being supplied can lead to soldered joints of reduced quality, and moreover it lengthens the course of the process, since the volatile components must be evaporated out gradually by slow heating.
  • U.S. Pat. No. 4,752,027 discloses a method for applying solder to PCBs with components, in which solder paste is applied by screen printing or matrix printing to solder pads, then dried in the oven and reflow-treated.
  • solder paste is applied by screen printing or matrix printing to solder pads, then dried in the oven and reflow-treated.
  • the thus-obtained pattern on the PCB, with convex soldering spots, is carefully cleaned before the PCB is processed with rollers that press the surfaces of the soldered spots flat and level them.
  • adhesive flux is applied to the soldered spots, to establish an adhesion contact between the soldered spots and the leads of the component in the course of equipping the thus-pretreated PCB with components.
  • a method for applying solder to and mounting components on printed circuit boards which comprises applying a solder paste to electrically conductive regions of a printed circuit board to form solder deposits; subsequently melting the solder deposits into solder applications joined to the conductive regions; joining components to the printed circuit board with an adhesive applied to the printed circuit board between the electrically conductive regions, while assigning each of the electrically conductive regions to a respective one of the components; applying a flux; and performing a soldering process.
  • An advantage of the invention is that all of the components, even small ones, are joined so securely to the PCB before the soldering process that good, reliably soldered connections can be produced. Moreover, there is the advantage of permitting the components joined to the PCB to be treated with a low solid (LS) flux, so that washing of the component assembly is no longer necessary after the soldering process, which means that the overall method is simplified. Moreover, the component that is joined to the PCB is also moistened with flux upon immersion, which improves the soldered spot. PCBs with components mounted on both sides enable an application of flux and performance of the soldering process simultaneously on both sides of the board.
  • LS solid
  • the method of the invention permits longer processing times, since the application of the solder paste and the formation of solder deposits, including the joining of the PCB to components, can be done independently of the application of the flux. This means simpler checking after the various method steps. There are no restrictions as compared with previously known methods, because in principle any flux can be used, so that with components that are problematic to solder, even aggressive fluxes can be used, although in that case washing of the PCB is necessary after the soldering process.
  • the invention is preferably suited to SMDs, although other components can also be used.
  • a method which comprises flattening the solder applications prior to joining the components to the printed circuit board.
  • a method which comprises applying the adhesive in the form of one adhesive spot per component.
  • a method which comprises applying the adhesive with a mask.
  • a method which comprises applying the adhesive with a dispenser.
  • a method which comprises joining the components to the printed circuit board by curing the adhesive.
  • a method which comprises applying the flux by immersion of the printed circuit board having the glued-on components.
  • a method which comprises applying the flux by spraying the printed circuit board having the glued-on components.
  • a method which comprises gluing the components in the form of surface mounted devices to the printed circuit board or to a solder resist mask on the printed circuit board.
  • FIG. 1 is a fragmentary, diagrammatic sectional view of a printed circuit board with solder deposits
  • FIG. 2 is a fragmentary sectional view of a printed circuit board with a completed, soldered surface mounted component.
  • a printed circuit board 1 with solder applied which includes first a basic material onto which a conductive copper lining or soldering pads 2 is applied in a known manner at points intended as SMD soldering regions.
  • the soldering pads 2 may be bounded by a solder resist or stop mask 4 of plastic.
  • solder paste is applied to the solder pads 2. This is advantageously done with the aid of screen printing or metal templates within the context of the known, economical printing processes. However, application of the solder paste in spot form with the aid of a dispenser is also possible.
  • the flat solder deposits are then melted, for instance by infrared radiation or by heated steam.
  • the volatile ingredients escape from the solder deposit, resulting in a largely solid solder application that is firmly joined to the applicable soldering pad 2.
  • the solder application may be highly curved, particularly at its surface. If it is additionally necessary for the solder applications to be leveled, then the hump-shaped solder application can be pressed flat with some device, such as a press or roller. Any heat which is supplied can reinforce this process. The solder can then be brought to the liquid or pasty state, and a non-eutectic soldering paste is advantageously used for this purpose. Through the use of this method step, it is simple for single solder applications or for several or all of them, to be simultaneously pressed flat on the PCB.
  • the method of the invention provides for joining components 5 to the PCB 1 with the aid of an adhesive.
  • an adhesive 6 is applied to the PCB 1 between electrically conductive regions that can each be assigned to one component.
  • the component 5 is secured to the PCB 1 with the aid of the adhesive 6.
  • the adhesive 6 is located between the soldering pads 2, which are provided with solder applications as shown in FIG. 1. If the solder application has been performed without using a solder resist mask 4, then the adhesive 6 can be applied directly to the PCB 1.
  • solder resist mask 4 If a solder resist mask 4 was used, then depending on requirements and on the preparation of the solder applications, it can either be removed before the adhesive is applied, or the adhesive can be applied to the regions of the solder resist mask 4 that are located between solder applications and that may each be assigned to one component.
  • the component 5 can thus be joined directly to the PCB 1 by means of the adhesive 6.
  • the adhesive 6 is either applied first to the PCB 1 and the component 5 is placed on it afterward, or the adhesive is first joined to the component 5, and the component 5 with the adhesive 6 is then placed on the appropriate regions of the PCB 1.
  • the component is placed in such a way that the relationship of the leads to be soldered with the soldering pads is optimal in view of the later soldering process.
  • the adhesive 6 is preferably cured, so that a largely stable, firm connection exists between the component 5 and the PCB 1.
  • multiple adhesive spots or only one adhesive spot per component may be provided.
  • the adhesive can also be applied with a mask, for example through a printing process or with a dispenser.
  • solder resist mask has the advantage of permitting glued-on components, such as two-pole SMDs, to rest directly on the solder resist or stop mask, so that the adhesive spot or spots can therefore be very small and the adhesive can be applied especially economically.
  • components with a spacing between a lower surface of a housing and a lead plane or with a bottom spacing to be provided for instance in the case of integrated SMD circuits, it is simpler to apply the adhesive to the solder stop mask, and this is also more economical than applying it to the PCB, especially since the solder stop mask need not be removed.
  • a flux is applied.
  • a flux that is comparatively aggressive and therefore requires washing after the soldering process.
  • a less aggressive flux can also be used, such as a low solid (LS) flux. It was previously not possible to use such fluxes in the reflow technique.
  • the flux is applied by dipping the PCB along with the components secured to it. Not only the electrical leads of the component and the solder applications but the component itself as well are all moistened with flux. A better soldered connection is thus produced in the later soldering process.
  • both sides can be moistened with flux simultaneously.
  • An advantage of an LS flux is that it need not be washed off again after a soldering process.
  • the flux may also be applied by some other method, such as spraying.
  • FIG. 2 shows the soldered connections 7.
  • the process according to the invention is suitable for all types of PCBs and other base materials. Further processing can be done in the usual ways.
  • the method has the advantage of permitting the prepared PCB to be stored for a comparatively long time, since there are no additional fluxes and adhesive ingredients in the solder applications. As a result, the prepared PCB with the solder applications can be checked without difficulty before the ensuing immersion process.
  • the method also has the advantage of permitting comparatively high solder layers 3 considering the tendency toward finer and finer lead configurations. This is advantageous for tolerance reasons.
  • the thickness of the solder applications 3 may be between 20 and 300 ⁇ m. Once the solder applications have been made, it is not only possible to check the PCB, but cleaning may also be provided as needed before further processing.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
US07/929,975 1991-08-14 1992-08-14 Method for applying solder to and mounting components on printed circuit boards Expired - Fee Related US5271548A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4126913A DE4126913A1 (de) 1991-08-14 1991-08-14 Verfahren zum beloten und montieren von leiterplatten mit bauelementen
DE4126913 1991-08-14

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US5271548A true US5271548A (en) 1993-12-21

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US07/929,975 Expired - Fee Related US5271548A (en) 1991-08-14 1992-08-14 Method for applying solder to and mounting components on printed circuit boards

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US (1) US5271548A (de)
EP (1) EP0528350B1 (de)
DE (2) DE4126913A1 (de)
ES (1) ES2104778T3 (de)

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US5499756A (en) * 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
US5537739A (en) * 1994-03-28 1996-07-23 Robert Bosch Gmbh Method for electoconductively connecting contacts
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5727727A (en) * 1995-02-02 1998-03-17 Vlt Corporation Flowing solder in a gap
US5808358A (en) * 1994-11-10 1998-09-15 Vlt Corporation Packaging electrical circuits
US5931371A (en) * 1997-01-16 1999-08-03 Ford Motor Company Standoff controlled interconnection
WO2000076280A1 (es) * 1999-06-08 2000-12-14 Lear Automotive (Eeds) Spain, S.L. Diseño de patterns de componentes electronicos sobre una capa de cobre de 400 micras en los circuitos impresos
US6276593B1 (en) * 1999-07-12 2001-08-21 Agere Systems Guardian Corp. Apparatus and method for solder attachment of high powered transistors to base heatsink
US6292088B1 (en) 1994-05-16 2001-09-18 Tyco Electronics Corporation PTC electrical devices for installation on printed circuit boards
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
WO2003059032A1 (de) * 2002-01-14 2003-07-17 Endress + Hauser Gmbh + Co. Kg Lotformteil
US6640420B1 (en) 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6651315B1 (en) 1992-07-09 2003-11-25 Tyco Electronics Corporation Electrical devices
US6854176B2 (en) 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
US7478003B2 (en) 1999-08-09 2009-01-13 Cowan Peter C Revenue meter bayonet assembly and method of attachment
US20100090680A1 (en) * 2008-10-10 2010-04-15 Electro Industries/Gauge Tech. Intelligent electronic device having a terminal assembly for coupling to a meter mounting socket
US20110027942A1 (en) * 2007-10-22 2011-02-03 Infineon Technologies Ag Semiconductor package
US20110266039A1 (en) * 2010-04-28 2011-11-03 Sony Corporation Method of mounting devices in substrate and device-mounting substrate structure thereof
US8539815B2 (en) 2007-12-07 2013-09-24 Allen-Vanguard Corporation Apparatus and method for measuring and recording data from violent events
US9897461B2 (en) 2015-02-27 2018-02-20 Electro Industries/Gauge Tech Intelligent electronic device with expandable functionality
US10048088B2 (en) 2015-02-27 2018-08-14 Electro Industries/Gauge Tech Wireless intelligent electronic device
EP3506346A3 (de) * 2017-12-29 2019-08-21 INTEL Corporation Substratanordnung mit abstandselement
CN111328210A (zh) * 2018-12-13 2020-06-23 意法半导体(格勒诺布尔2)公司 用于安装部件的方法
US11009922B2 (en) 2015-02-27 2021-05-18 Electro Industries/Gaugetech Wireless intelligent electronic device
DE102018217143B4 (de) 2017-10-24 2023-02-09 Mitsubishi Electric Corporation Halbleitervorrichtung
WO2023094229A1 (de) * 2021-11-26 2023-06-01 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

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GB2268628B (en) * 1992-07-07 1995-10-11 Northern Telecom Ltd Affixing dielectric resonator on p.c.b.
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
DE19509786A1 (de) * 1995-03-17 1996-09-19 Herbert Streckfus Gmbh Verfahren zum Verlöten von elektronischen Bauelementen auf einer Leiterplatte
ES2183993T3 (es) * 1996-03-18 2003-04-01 Krone Gmbh Placa de circuitos impresos y procedimiento para montar y soldar en la posicion exacta componentes electronicos sobre la superficie de la placa de circuitos impresos.
FR2781974B1 (fr) * 1998-07-30 2000-08-25 Air Liquide Procede de brasage par refusion de composants electroniques utilisant des pre-depots d'alliage de brasure et dispositif de brasage pour la mise en oeuvre d'un tel procede

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US6651315B1 (en) 1992-07-09 2003-11-25 Tyco Electronics Corporation Electrical devices
US20040246092A1 (en) * 1992-07-09 2004-12-09 Graves Gregory A. Electrical devices
US7355504B2 (en) 1992-07-09 2008-04-08 Tyco Electronics Corporation Electrical devices
US5537739A (en) * 1994-03-28 1996-07-23 Robert Bosch Gmbh Method for electoconductively connecting contacts
US6292088B1 (en) 1994-05-16 2001-09-18 Tyco Electronics Corporation PTC electrical devices for installation on printed circuit boards
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ES2104778T3 (es) 1997-10-16
DE4126913A1 (de) 1993-02-18
EP0528350B1 (de) 1997-07-02
EP0528350A1 (de) 1993-02-24
DE59208656D1 (de) 1997-08-07

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