US3878085A - Cathode sputtering apparatus - Google Patents

Cathode sputtering apparatus Download PDF

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Publication number
US3878085A
US3878085A US376322A US37632273A US3878085A US 3878085 A US3878085 A US 3878085A US 376322 A US376322 A US 376322A US 37632273 A US37632273 A US 37632273A US 3878085 A US3878085 A US 3878085A
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Prior art keywords
cathode
sputtering apparatus
face
magnetic
cathode sputtering
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Expired - Lifetime
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US376322A
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English (en)
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John F Corbani
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Sloan Technology Corp
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Sloan Technology Corp
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Priority to US376322A priority Critical patent/US3878085A/en
Priority to JP12586973A priority patent/JPS5319319B2/ja
Priority to DE2431832A priority patent/DE2431832B2/de
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Publication of US3878085A publication Critical patent/US3878085A/en
Assigned to CHEMICAL BANK, AS AGENT reassignment CHEMICAL BANK, AS AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VEECO INSTRUMENT ACQUISTION CORP.
Anticipated expiration legal-status Critical
Assigned to SLOAN TECHNOLOGY CORPORATION reassignment SLOAN TECHNOLOGY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: SLOAN TECHNOLOGY CORPORATION, A CORP. OF CA
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
US376322A 1973-07-05 1973-07-05 Cathode sputtering apparatus Expired - Lifetime US3878085A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US376322A US3878085A (en) 1973-07-05 1973-07-05 Cathode sputtering apparatus
JP12586973A JPS5319319B2 (de) 1973-07-05 1973-11-08
DE2431832A DE2431832B2 (de) 1973-07-05 1974-07-02 Kathodenzerstäubungsgerät

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US376322A US3878085A (en) 1973-07-05 1973-07-05 Cathode sputtering apparatus

Publications (1)

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US3878085A true US3878085A (en) 1975-04-15

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US376322A Expired - Lifetime US3878085A (en) 1973-07-05 1973-07-05 Cathode sputtering apparatus

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JP (1) JPS5319319B2 (de)
DE (1) DE2431832B2 (de)

Cited By (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
US4013532A (en) * 1975-03-03 1977-03-22 Airco, Inc. Method for coating a substrate
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
US4046659A (en) * 1974-05-10 1977-09-06 Airco, Inc. Method for coating a substrate
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
FR2352393A1 (fr) * 1976-05-19 1977-12-16 Battelle Memorial Institute Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4155825A (en) * 1977-05-02 1979-05-22 Fournier Paul R Integrated sputtering apparatus and method
US4162954A (en) * 1978-08-21 1979-07-31 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4180450A (en) * 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4183797A (en) * 1978-12-22 1980-01-15 International Business Machines Corporation Two-sided bias sputter deposition method and apparatus
US4194962A (en) * 1978-12-20 1980-03-25 Advanced Coating Technology, Inc. Cathode for sputtering
US4204936A (en) * 1979-03-29 1980-05-27 The Perkin-Elmer Corporation Method and apparatus for attaching a target to the cathode of a sputtering system
US4219397A (en) * 1978-11-24 1980-08-26 Clarke Peter J Magnetron sputter apparatus
FR2454178A1 (fr) * 1979-04-09 1980-11-07 Vac Tec Syst Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique
US4247383A (en) * 1977-08-06 1981-01-27 Leybold Heraeus Gmbh Cathodic system with target, for vacuum sputtering apparatus for the application of dielectric or nonmagnetic coatings to substrates
US4312731A (en) * 1979-04-24 1982-01-26 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device and method
US4336119A (en) * 1981-01-29 1982-06-22 Ppg Industries, Inc. Method of and apparatus for control of reactive sputtering deposition
US4361472A (en) * 1980-09-15 1982-11-30 Vac-Tec Systems, Inc. Sputtering method and apparatus utilizing improved ion source
US4379040A (en) * 1981-01-29 1983-04-05 Ppg Industries, Inc. Method of and apparatus for control of reactive sputtering deposition
US4385979A (en) * 1982-07-09 1983-05-31 Varian Associates, Inc. Target assemblies of special materials for use in sputter coating apparatus
US4394245A (en) * 1981-02-18 1983-07-19 Hitachi, Ltd. Sputtering apparatus
US4415427A (en) * 1982-09-30 1983-11-15 Gte Products Corporation Thin film deposition by sputtering
US4457825A (en) * 1980-05-16 1984-07-03 Varian Associates, Inc. Sputter target for use in a sputter coating source
US4466872A (en) * 1982-12-23 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for depositing a continuous film of minimum thickness
US4472259A (en) * 1981-10-29 1984-09-18 Materials Research Corporation Focusing magnetron sputtering apparatus
US4500409A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Magnetron sputter coating source for both magnetic and non magnetic target materials
US4500408A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Apparatus for and method of controlling sputter coating
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
US4517070A (en) * 1984-06-28 1985-05-14 General Motors Corporation Magnetron sputtering cathode assembly and magnet assembly therefor
US4521287A (en) * 1984-06-28 1985-06-04 General Motors Corporation High rate sputtering of exhaust oxygen sensor electrode
DE3603646A1 (de) * 1985-04-03 1986-10-16 Balzers Hochvakuum Gmbh, 6200 Wiesbaden Haltevorrichtung fuer targets fuer kathodenzerstaeubung
US4673480A (en) * 1980-05-16 1987-06-16 Varian Associates, Inc. Magnetically enhanced sputter source
US4724058A (en) * 1984-08-13 1988-02-09 Vac-Tec Systems, Inc. Method and apparatus for arc evaporating large area targets
US4766813A (en) * 1986-12-29 1988-08-30 Olin Corporation Metal shaped charge liner with isotropic coating
EP0318441A2 (de) * 1987-11-27 1989-05-31 SOCIETA' ITALIANA VETRO- SIV-SpA Anlage und Verfahren zur Ablagerung einer dünnen Schicht auf ein durchsichtiges Substrat, insbesondere zur Herstellung von Glasscheiben
US4865708A (en) * 1988-11-14 1989-09-12 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4872964A (en) * 1985-08-02 1989-10-10 Fujitsu Limited Planar magnetron sputtering apparatus and its magnetic source
US4892633A (en) * 1988-11-14 1990-01-09 Vac-Tec Systems, Inc. Magnetron sputtering cathode
US4941915A (en) * 1988-02-08 1990-07-17 Nippon Telegraph And Telephone Corporation Thin film forming apparatus and ion source utilizing plasma sputtering
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US4966677A (en) * 1988-12-28 1990-10-30 Leybold Aktiengesellschaft Cathode sputtering apparatus on the magnetron principle with a hollow cathode and a cylindrical target
US5073245A (en) * 1990-07-10 1991-12-17 Hedgcoth Virgle L Slotted cylindrical hollow cathode/magnetron sputtering device
US5178743A (en) * 1989-06-15 1993-01-12 Microelectronics And Computer Technology Corporation Cylindrical magnetron sputtering system
US5234560A (en) * 1989-08-14 1993-08-10 Hauzer Holdings Bv Method and device for sputtering of films
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
US5262028A (en) * 1992-06-01 1993-11-16 Sierra Applied Sciences, Inc. Planar magnetron sputtering magnet assembly
US5277779A (en) * 1992-04-14 1994-01-11 Henshaw William F Rectangular cavity magnetron sputtering vapor source
US5298137A (en) * 1991-04-19 1994-03-29 Surface Solutions, Inc. Method and apparatus for linear magnetron sputtering
US5298136A (en) * 1987-08-18 1994-03-29 Regents Of The University Of Minnesota Steered arc coating with thick targets
US5328582A (en) * 1992-12-04 1994-07-12 Honeywell Inc. Off-axis magnetron sputter deposition of mirrors
US5334302A (en) * 1991-11-15 1994-08-02 Tokyo Electron Limited Magnetron sputtering apparatus and sputtering gun for use in the same
US5336386A (en) * 1991-01-28 1994-08-09 Materials Research Corporation Target for cathode sputtering
US5437778A (en) * 1990-07-10 1995-08-01 Telic Technologies Corporation Slotted cylindrical hollow cathode/magnetron sputtering device
US5441614A (en) * 1994-11-30 1995-08-15 At&T Corp. Method and apparatus for planar magnetron sputtering
US5935397A (en) * 1998-04-30 1999-08-10 Rockwell Semiconductor Systems, Inc. Physical vapor deposition chamber
US5985115A (en) * 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
US6132566A (en) * 1998-07-30 2000-10-17 Applied Materials, Inc. Apparatus and method for sputtering ionized material in a plasma
US6152040A (en) * 1997-11-26 2000-11-28 Ashurst Government Services, Inc. Shaped charge and explosively formed penetrator liners and process for making same
US6217716B1 (en) 1998-05-06 2001-04-17 Novellus Systems, Inc. Apparatus and method for improving target erosion in hollow cathode magnetron sputter source
US6258217B1 (en) 1999-09-29 2001-07-10 Plasma-Therm, Inc. Rotating magnet array and sputter source
US6345588B1 (en) 1997-08-07 2002-02-12 Applied Materials, Inc. Use of variable RF generator to control coil voltage distribution
US6436252B1 (en) 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
US6444100B1 (en) 2000-02-11 2002-09-03 Seagate Technology Llc Hollow cathode sputter source
US6565717B1 (en) * 1997-09-15 2003-05-20 Applied Materials, Inc. Apparatus for sputtering ionized material in a medium to high density plasma
US6579426B1 (en) 1997-05-16 2003-06-17 Applied Materials, Inc. Use of variable impedance to control coil sputter distribution
US20030183518A1 (en) * 2002-03-27 2003-10-02 Glocker David A. Concave sputtering apparatus
US6689253B1 (en) * 2001-06-15 2004-02-10 Seagate Technology Llc Facing target assembly and sputter deposition apparatus
US6758948B2 (en) 2000-02-25 2004-07-06 Tokyo Electron Limited Method and apparatus for depositing films
US6761804B2 (en) * 2002-02-11 2004-07-13 Applied Materials, Inc. Inverted magnetron
US20040262148A1 (en) * 2003-06-23 2004-12-30 Cheng Yuanda Randy Sputter cathode assembly for uniform film deposition
US20050145478A1 (en) * 2004-01-07 2005-07-07 Applied Materials, Inc. Two dimensional magnetron scanning for flat panel sputtering
US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
US20060152162A1 (en) * 2002-09-19 2006-07-13 Madocks John E Beam plasma source
US20060177599A1 (en) * 2002-09-19 2006-08-10 Madocks John E Dual plasma beam sources and method
US20070006234A1 (en) * 2005-07-01 2007-01-04 Fuji Xerox Co., Ltd. Batch processing support apparatus and method, and storage medium storing program therefor
US20070012559A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Method of improving magnetron sputtering of large-area substrates using a removable anode
US20070012562A1 (en) * 2004-01-07 2007-01-18 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
US20070012558A1 (en) * 2005-07-13 2007-01-18 Applied Materials, Inc. Magnetron sputtering system for large-area substrates
US20070012663A1 (en) * 2005-07-13 2007-01-18 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070051616A1 (en) * 2005-09-07 2007-03-08 Le Hienminh H Multizone magnetron assembly
US20070056843A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Method of processing a substrate using a large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070056850A1 (en) * 2005-09-13 2007-03-15 Applied Materials, Inc. Large-area magnetron sputtering chamber with individually controlled sputtering zones
US20070084720A1 (en) * 2005-07-13 2007-04-19 Akihiro Hosokawa Magnetron sputtering system for large-area substrates having removable anodes
US20070205101A1 (en) * 2005-09-13 2007-09-06 Applied Materials, Inc. Thermally conductive dielectric bonding of sputtering targets using diamond powder filler or thermally conductive ceramic fillers
US20080105543A1 (en) * 2004-10-18 2008-05-08 Bekaert Advanced Coatings Flat End-Block For Carrying A Rotatable Sputtering Target
US20080202925A1 (en) * 2005-03-11 2008-08-28 Bekaert Advanced Coatings Single, Right-Angled End-Block
US20110068691A1 (en) * 2009-04-28 2011-03-24 Leybold Optics Gmbh Method for producing a plasma beam and plasma source
WO2016140833A1 (en) * 2015-03-02 2016-09-09 Tosoh Smd, Inc. Sputtering target having reverse bowing target geometry
RU2620845C1 (ru) * 2015-12-17 2017-05-30 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Устройство для синтеза и осаждения покрытий
RU2649904C1 (ru) * 2016-11-18 2018-04-05 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Устройство для синтеза и осаждения металлических покрытий на токопроводящих изделиях
US20190203346A1 (en) * 2016-03-30 2019-07-04 Keihin Ramtech Co., Ltd. Sputtering Cathode, Sputtering Device, and Method for Producing Film-Formed Body
WO2020083948A1 (en) 2018-10-22 2020-04-30 Soleras Advanced Coatings Bvba Magnetron with controller for monitoring and control
RU2726223C1 (ru) * 2019-11-28 2020-07-10 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский государственный технологический университет "СТАНКИН" (ФГБОУ ВО "МГТУ "СТАНКИН") Магнетронное распылительное устройство
RU2761900C1 (ru) * 2021-02-08 2021-12-13 Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук Магнетронное распылительное устройство
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JPS561723Y2 (de) * 1975-02-03 1981-01-16
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
JPS51137681A (en) * 1975-05-23 1976-11-27 Tokuda Seisakusho Ltd Sputtering apparatus
JPS5252133A (en) * 1975-07-11 1977-04-26 Tokuda Seisakusho Continuous film coating apparatus
JPS557554Y2 (de) * 1975-10-31 1980-02-20
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DE2655942A1 (de) * 1976-12-10 1978-06-15 Tokuda Seisakusho Kawasaki Kk Zerstaeubungsvorrichtung
JPS5379776A (en) * 1976-12-24 1978-07-14 Ulvac Corp Sputtering apparatus
US4100055A (en) * 1977-06-10 1978-07-11 Varian Associates, Inc. Target profile for sputtering apparatus
JPS5813622B2 (ja) * 1979-05-04 1983-03-15 株式会社東芝 マグネトロン型スパッタ装置
DE3030329C2 (de) * 1980-08-11 1983-06-01 W.C. Heraeus Gmbh, 6450 Hanau Sputterkörper
JPS58189372A (ja) * 1982-04-30 1983-11-05 Toshiba Corp マグネトロンスパツタ装置
JPS6010029U (ja) * 1983-06-30 1985-01-23 ワイケイケイ株式会社 日除け装置
DE3429988A1 (de) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
DE3442206A1 (de) * 1983-12-05 1985-07-11 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
JPS6186459U (de) * 1984-11-14 1986-06-06
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CH691643A5 (de) * 1995-10-06 2001-08-31 Unaxis Balzers Ag Magnetronzerstäubungsquelle und deren Verwendung.
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Cited By (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US4046659A (en) * 1974-05-10 1977-09-06 Airco, Inc. Method for coating a substrate
US4060470A (en) * 1974-12-06 1977-11-29 Clarke Peter J Sputtering apparatus and method
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
US4013532A (en) * 1975-03-03 1977-03-22 Airco, Inc. Method for coating a substrate
US4025410A (en) * 1975-08-25 1977-05-24 Western Electric Company, Inc. Sputtering apparatus and methods using a magnetic field
FR2352393A1 (fr) * 1976-05-19 1977-12-16 Battelle Memorial Institute Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede
US4116791A (en) * 1976-05-19 1978-09-26 Battelle Memorial Institute Method and apparatus for forming a deposit by means of ion plating using a magnetron cathode target as source of coating material
US4155825A (en) * 1977-05-02 1979-05-22 Fournier Paul R Integrated sputtering apparatus and method
US4247383A (en) * 1977-08-06 1981-01-27 Leybold Heraeus Gmbh Cathodic system with target, for vacuum sputtering apparatus for the application of dielectric or nonmagnetic coatings to substrates
US4116806A (en) * 1977-12-08 1978-09-26 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4175030A (en) * 1977-12-08 1979-11-20 Battelle Development Corporation Two-sided planar magnetron sputtering apparatus
US4180450A (en) * 1978-08-21 1979-12-25 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4162954A (en) * 1978-08-21 1979-07-31 Vac-Tec Systems, Inc. Planar magnetron sputtering device
US4219397A (en) * 1978-11-24 1980-08-26 Clarke Peter J Magnetron sputter apparatus
US4194962A (en) * 1978-12-20 1980-03-25 Advanced Coating Technology, Inc. Cathode for sputtering
US4183797A (en) * 1978-12-22 1980-01-15 International Business Machines Corporation Two-sided bias sputter deposition method and apparatus
US4204936A (en) * 1979-03-29 1980-05-27 The Perkin-Elmer Corporation Method and apparatus for attaching a target to the cathode of a sputtering system
FR2454178A1 (fr) * 1979-04-09 1980-11-07 Vac Tec Syst Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique
US4312731A (en) * 1979-04-24 1982-01-26 Vac-Tec Systems, Inc. Magnetically enhanced sputtering device and method
US4457825A (en) * 1980-05-16 1984-07-03 Varian Associates, Inc. Sputter target for use in a sputter coating source
US4673480A (en) * 1980-05-16 1987-06-16 Varian Associates, Inc. Magnetically enhanced sputter source
US4361472A (en) * 1980-09-15 1982-11-30 Vac-Tec Systems, Inc. Sputtering method and apparatus utilizing improved ion source
US4336119A (en) * 1981-01-29 1982-06-22 Ppg Industries, Inc. Method of and apparatus for control of reactive sputtering deposition
US4379040A (en) * 1981-01-29 1983-04-05 Ppg Industries, Inc. Method of and apparatus for control of reactive sputtering deposition
US4394245A (en) * 1981-02-18 1983-07-19 Hitachi, Ltd. Sputtering apparatus
US4472259A (en) * 1981-10-29 1984-09-18 Materials Research Corporation Focusing magnetron sputtering apparatus
US4385979A (en) * 1982-07-09 1983-05-31 Varian Associates, Inc. Target assemblies of special materials for use in sputter coating apparatus
US4415427A (en) * 1982-09-30 1983-11-15 Gte Products Corporation Thin film deposition by sputtering
US4466872A (en) * 1982-12-23 1984-08-21 At&T Technologies, Inc. Methods of and apparatus for depositing a continuous film of minimum thickness
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
US4500408A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Apparatus for and method of controlling sputter coating
US4500409A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Magnetron sputter coating source for both magnetic and non magnetic target materials
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DE2431832A1 (de) 1975-01-30
JPS5023382A (de) 1975-03-13
DE2431832B2 (de) 1981-07-02

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