FR2454178A1 - Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique - Google Patents

Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique

Info

Publication number
FR2454178A1
FR2454178A1 FR8007827A FR8007827A FR2454178A1 FR 2454178 A1 FR2454178 A1 FR 2454178A1 FR 8007827 A FR8007827 A FR 8007827A FR 8007827 A FR8007827 A FR 8007827A FR 2454178 A1 FR2454178 A1 FR 2454178A1
Authority
FR
France
Prior art keywords
magnetically
cathode spraying
improving
permeable targets
spraying device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8007827A
Other languages
English (en)
Other versions
FR2454178B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vac Tec Systems Inc
Original Assignee
Vac Tec Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vac Tec Systems Inc filed Critical Vac Tec Systems Inc
Publication of FR2454178A1 publication Critical patent/FR2454178A1/fr
Application granted granted Critical
Publication of FR2454178B1 publication Critical patent/FR2454178B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Coating By Spraying Or Casting (AREA)

Abstract

PROCEDE POUR AMELIORER MAGNETIQUEMENT LA PULVERISATION CATHODIQUE DE CIBLES PERMEABLES MAGNETIQUEMENT ET DISPOSITIF DE PULVERISATION CATHODIQUE A EFFET AMELIORE MAGNETIQUEMENT. DES AIMANTS 20, 22 SONT DISPOSES AU VOISINAGE DES COTES OPPOSES D'UNE CIBLE 37 DE SORTE QU'UN CHAMP MAGNETIQUE UNIFORME EST CREE AU-DESSUS DE LA SURFACE DE LA CIBLE 37 ENTRE LE PREMIER AIMANT 20 ET LE SECOND AIMANT 22, CEUX-CI ETANT COMPOSES DE PREFERENCE DE COUCHES DE RUBANS ENRICHIS DE PARTICULES ORIENTEES DE FERRITE.
FR8007827A 1979-04-09 1980-04-08 Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique Granted FR2454178A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2843479A 1979-04-09 1979-04-09

Publications (2)

Publication Number Publication Date
FR2454178A1 true FR2454178A1 (fr) 1980-11-07
FR2454178B1 FR2454178B1 (fr) 1983-11-25

Family

ID=21843423

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8007827A Granted FR2454178A1 (fr) 1979-04-09 1980-04-08 Procede pour ameliorer magnetiquement la pulverisation cathodique de cibles permeables magnetiquement et dispositif de pulverisation cathodique

Country Status (5)

Country Link
JP (1) JPS593546B2 (fr)
CA (1) CA1153733A (fr)
DE (1) DE3012935C2 (fr)
FR (1) FR2454178A1 (fr)
GB (1) GB2051877B (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051635A1 (fr) * 1980-05-16 1982-05-19 Varian Associates Cible à pulvérisation et appareil à décharge luminescente pour effectuer un revêtement.
FR2517330A1 (fr) * 1981-11-30 1983-06-03 Anelva Corp Appareil de projection de metal sur un substrat, en particulier du type a magnetron
FR2531810A1 (fr) * 1982-08-16 1984-02-17 Vac Tec Syst Appareil a magnetron pour pulverisation a debit eleve de matiere a permeabilite elevee
EP0223975A2 (fr) * 1985-11-29 1987-06-03 Materials Research Corporation Dispositif magnétique déviateur pour système de traitement par plasma

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH649578A5 (de) * 1981-03-27 1985-05-31 Ulvac Corp Hochgeschwindigkeits-kathoden-zerstaeubungsvorrichtung.
GB2096177B (en) * 1981-04-07 1985-07-17 Fournier Paul R Improved integrated sputtering apparatus and method
JPS58130277A (ja) * 1982-01-27 1983-08-03 Clarion Co Ltd マグネトロンスパツタ装置
JPS5989769A (ja) * 1982-11-15 1984-05-24 Hitachi Ltd プレ−ナマグネトロン型スパツタ電極
US4581118A (en) * 1983-01-26 1986-04-08 Materials Research Corporation Shaped field magnetron electrode
US4515675A (en) * 1983-07-06 1985-05-07 Leybold-Heraeus Gmbh Magnetron cathode for cathodic evaportion apparatus
DE3429988A1 (de) * 1983-12-05 1985-06-13 Leybold-Heraeus GmbH, 5000 Köln Magnetronkatode zum zerstaeuben ferromagnetischer targets
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.
JPH0633454B2 (ja) * 1984-11-20 1994-05-02 松下電器産業株式会社 スパツタリング装置
JPS62153365U (fr) * 1987-02-12 1987-09-29
GB2209769A (en) * 1987-09-16 1989-05-24 Ion Tech Ltd Sputter coating
JPH0219462A (ja) * 1988-07-06 1990-01-23 Ube Ind Ltd マグネトロンスパッタリング方法及びその装置
KR20130133015A (ko) * 2011-04-26 2013-12-05 가부시키가이샤 아루박 캐소드 유닛

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
FR2352393A1 (fr) * 1976-05-19 1977-12-16 Battelle Memorial Institute Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede
US4094761A (en) * 1977-07-25 1978-06-13 Motorola, Inc. Magnetion sputtering of ferromagnetic material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956093A (en) * 1974-12-16 1976-05-11 Airco, Inc. Planar magnetron sputtering method and apparatus
NL7607473A (nl) * 1976-07-07 1978-01-10 Philips Nv Verstuifinrichting en werkwijze voor het ver- stuiven met een dergelijke inrichting.

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
FR2352393A1 (fr) * 1976-05-19 1977-12-16 Battelle Memorial Institute Procede pour effectuer un depot dans une decharge luminescente sur au moins un substrat, et un decapage ionique de ce substrat et dispositif pour la mise en oeuvre de ce procede
US4094761A (en) * 1977-07-25 1978-06-13 Motorola, Inc. Magnetion sputtering of ferromagnetic material
FR2398810A1 (fr) * 1977-07-25 1979-02-23 Motorola Inc Procede de projection d'une matiere ferromagnetique

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0051635A1 (fr) * 1980-05-16 1982-05-19 Varian Associates Cible à pulvérisation et appareil à décharge luminescente pour effectuer un revêtement.
EP0051635A4 (fr) * 1980-05-16 1983-09-26 Varian Associates Cible à pulvérisation et appareil à décharge luminescente pour effectuer un revêtement.
FR2517330A1 (fr) * 1981-11-30 1983-06-03 Anelva Corp Appareil de projection de metal sur un substrat, en particulier du type a magnetron
FR2531810A1 (fr) * 1982-08-16 1984-02-17 Vac Tec Syst Appareil a magnetron pour pulverisation a debit eleve de matiere a permeabilite elevee
EP0223975A2 (fr) * 1985-11-29 1987-06-03 Materials Research Corporation Dispositif magnétique déviateur pour système de traitement par plasma
EP0223975A3 (fr) * 1985-11-29 1989-02-08 Materials Research Corporation Dispositif magnétique déviateur pour système de traitement par plasma

Also Published As

Publication number Publication date
FR2454178B1 (fr) 1983-11-25
CA1153733A (fr) 1983-09-13
DE3012935C2 (de) 1983-04-14
JPS55148770A (en) 1980-11-19
DE3012935A1 (de) 1980-10-23
GB2051877B (en) 1983-03-02
GB2051877A (en) 1981-01-21
JPS593546B2 (ja) 1984-01-24

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Legal Events

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ST Notification of lapse