JPS5531142A - Pressed magnetic field type magnetron sputter by focusing magnetic field - Google Patents

Pressed magnetic field type magnetron sputter by focusing magnetic field

Info

Publication number
JPS5531142A
JPS5531142A JP10366378A JP10366378A JPS5531142A JP S5531142 A JPS5531142 A JP S5531142A JP 10366378 A JP10366378 A JP 10366378A JP 10366378 A JP10366378 A JP 10366378A JP S5531142 A JPS5531142 A JP S5531142A
Authority
JP
Japan
Prior art keywords
magnetic field
target
pressed
sputter
focusing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10366378A
Other languages
Japanese (ja)
Inventor
Tomonobu Hata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10366378A priority Critical patent/JPS5531142A/en
Publication of JPS5531142A publication Critical patent/JPS5531142A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To improve sputter effect and to increase film-forming rate, by arranging a solenoid coil around a magnet at the back side of a target of a plate magnetron unit and a bell jar so as to strengthen the magnetic field which is parallel to the surface of the target. CONSTITUTION:A solenoid coil 4 is arranged around a bell jar 7 of a plate magnetron sputter apparatus to generate a magnetic field of a polarity equal to the magnetic pole due to a magnet 2 set at the back side center of a target 1. Hereby leakage magnetic field 3 on the surface of the target 1 is pressed by the magnetic field 5 to the target surface, consequently most portion of the leakage magnetic field 3 on the surface is used effectively as a magnetic field component parallel with the surface, so that the sputter efficiency and the film-forming rate are increased. The solenoid 4 performs simultaneously its duty as a focusing magnetic field to change the strength of the magnetic field (the current of the coil) also after the saturation of the current and makes it possible to control the area of uniform film thickness according to the surface area of the substrate 6.
JP10366378A 1978-08-25 1978-08-25 Pressed magnetic field type magnetron sputter by focusing magnetic field Pending JPS5531142A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10366378A JPS5531142A (en) 1978-08-25 1978-08-25 Pressed magnetic field type magnetron sputter by focusing magnetic field

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10366378A JPS5531142A (en) 1978-08-25 1978-08-25 Pressed magnetic field type magnetron sputter by focusing magnetic field

Publications (1)

Publication Number Publication Date
JPS5531142A true JPS5531142A (en) 1980-03-05

Family

ID=14360016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10366378A Pending JPS5531142A (en) 1978-08-25 1978-08-25 Pressed magnetic field type magnetron sputter by focusing magnetic field

Country Status (1)

Country Link
JP (1) JPS5531142A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155824U (en) * 1982-04-13 1983-10-18 ティーディーケイ株式会社 trimming capacitor
JPS58189372A (en) * 1982-04-30 1983-11-05 Toshiba Corp Magnetron sputtering device
JPS61124567A (en) * 1984-11-20 1986-06-12 Matsushita Electric Ind Co Ltd Sputtering device
JPH02254160A (en) * 1989-03-27 1990-10-12 Ube Ind Ltd Plasma controller
WO2002011176A1 (en) * 2000-07-27 2002-02-07 Trikon Holdings Limited Magnetron sputtering
US10900114B2 (en) * 2015-03-31 2021-01-26 Spts Technologies Limited Method and apparatus for depositing a material

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155824U (en) * 1982-04-13 1983-10-18 ティーディーケイ株式会社 trimming capacitor
JPS645875Y2 (en) * 1982-04-13 1989-02-14
JPS58189372A (en) * 1982-04-30 1983-11-05 Toshiba Corp Magnetron sputtering device
JPH0411625B2 (en) * 1982-04-30 1992-03-02 Toshiba Kk
JPS61124567A (en) * 1984-11-20 1986-06-12 Matsushita Electric Ind Co Ltd Sputtering device
JPH02254160A (en) * 1989-03-27 1990-10-12 Ube Ind Ltd Plasma controller
WO2002011176A1 (en) * 2000-07-27 2002-02-07 Trikon Holdings Limited Magnetron sputtering
GB2377228A (en) * 2000-07-27 2003-01-08 Trikon Holdings Ltd Magnetron sputtering
GB2377228B (en) * 2000-07-27 2004-06-30 Trikon Holdings Ltd Magnetron sputtering
US7378001B2 (en) 2000-07-27 2008-05-27 Aviza Europe Limited Magnetron sputtering
US10900114B2 (en) * 2015-03-31 2021-01-26 Spts Technologies Limited Method and apparatus for depositing a material

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