ATE169349T1 - Flachen magnetronzerstäubungsanlage - Google Patents

Flachen magnetronzerstäubungsanlage

Info

Publication number
ATE169349T1
ATE169349T1 AT93914096T AT93914096T ATE169349T1 AT E169349 T1 ATE169349 T1 AT E169349T1 AT 93914096 T AT93914096 T AT 93914096T AT 93914096 T AT93914096 T AT 93914096T AT E169349 T1 ATE169349 T1 AT E169349T1
Authority
AT
Austria
Prior art keywords
magnetic
pole piece
central magnet
magnets
lobe
Prior art date
Application number
AT93914096T
Other languages
English (en)
Inventor
Barry W Manley
Original Assignee
Manley Kelly
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25398683&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE169349(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Manley Kelly filed Critical Manley Kelly
Application granted granted Critical
Publication of ATE169349T1 publication Critical patent/ATE169349T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Catching Or Destruction (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Microwave Tubes (AREA)
AT93914096T 1992-06-01 1993-05-25 Flachen magnetronzerstäubungsanlage ATE169349T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/891,707 US5262028A (en) 1992-06-01 1992-06-01 Planar magnetron sputtering magnet assembly

Publications (1)

Publication Number Publication Date
ATE169349T1 true ATE169349T1 (de) 1998-08-15

Family

ID=25398683

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93914096T ATE169349T1 (de) 1992-06-01 1993-05-25 Flachen magnetronzerstäubungsanlage

Country Status (9)

Country Link
US (1) US5262028A (de)
EP (1) EP0600070B1 (de)
JP (1) JP3473954B2 (de)
AT (1) ATE169349T1 (de)
AU (1) AU4388293A (de)
DE (1) DE69320151T2 (de)
DK (1) DK0600070T3 (de)
ES (1) ES2122024T3 (de)
WO (1) WO1993024674A1 (de)

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US6146509A (en) * 1999-06-11 2000-11-14 Scivac Inverted field circular magnetron sputtering device
US6432285B1 (en) 1999-10-15 2002-08-13 Cierra Photonics, Inc. Planar magnetron sputtering apparatus
US6299740B1 (en) 2000-01-19 2001-10-09 Veeco Instrument, Inc. Sputtering assembly and target therefor
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US6863699B1 (en) * 2000-11-03 2005-03-08 Front Edge Technology, Inc. Sputter deposition of lithium phosphorous oxynitride material
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US6740212B2 (en) * 2002-10-18 2004-05-25 Qi Hua Fan Rectangular magnetron sputtering cathode with high target utilization
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US20060049040A1 (en) * 2004-01-07 2006-03-09 Applied Materials, Inc. Apparatus and method for two dimensional magnetron scanning for sputtering onto flat panels
US7513982B2 (en) * 2004-01-07 2009-04-07 Applied Materials, Inc. Two dimensional magnetron scanning for flat panel sputtering
US8500975B2 (en) * 2004-01-07 2013-08-06 Applied Materials, Inc. Method and apparatus for sputtering onto large flat panels
US7087145B1 (en) 2005-03-10 2006-08-08 Robert Choquette Sputtering cathode assembly
US7846579B2 (en) 2005-03-25 2010-12-07 Victor Krasnov Thin film battery with protective packaging
US8679674B2 (en) 2005-03-25 2014-03-25 Front Edge Technology, Inc. Battery with protective packaging
US8470141B1 (en) * 2005-04-29 2013-06-25 Angstrom Sciences, Inc. High power cathode
US7316763B2 (en) * 2005-05-24 2008-01-08 Applied Materials, Inc. Multiple target tiles with complementary beveled edges forming a slanted gap therebetween
JP2008542535A (ja) * 2005-06-04 2008-11-27 アプライド マテリアルズ ゲーエムベーハー アンド コンパニー カーゲー スパッタ用マグネトロン
JP2007092136A (ja) 2005-09-29 2007-04-12 Shin Meiwa Ind Co Ltd マグネトロンスパッタリング用の磁石構造体およびカソード電極ユニット並びにマグネトロンスパッタリング装置
US7498587B2 (en) * 2006-05-01 2009-03-03 Vapor Technologies, Inc. Bi-directional filtered arc plasma source
EP2466614A3 (de) * 2006-05-16 2013-05-22 Oerlikon Trading AG, Trübbach Arcquelle und Magnetanordnung
DE602006002264D1 (de) * 2006-06-01 2008-09-25 Varian Spa Magnetanordnung für eine Sputter-Ionenpumpe
US8236152B2 (en) * 2006-11-24 2012-08-07 Ascentool International Ltd. Deposition system
JP5217051B2 (ja) * 2006-11-27 2013-06-19 オムロン株式会社 薄膜製造方法
US7862927B2 (en) 2007-03-02 2011-01-04 Front Edge Technology Thin film battery and manufacturing method
US7862627B2 (en) 2007-04-27 2011-01-04 Front Edge Technology, Inc. Thin film battery substrate cutting and fabrication process
US8870974B2 (en) 2008-02-18 2014-10-28 Front Edge Technology, Inc. Thin film battery fabrication using laser shaping
US8628645B2 (en) 2007-09-04 2014-01-14 Front Edge Technology, Inc. Manufacturing method for thin film battery
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US8016982B2 (en) * 2007-11-30 2011-09-13 Panasonic Corporation Sputtering apparatus and sputtering method
US10043642B2 (en) * 2008-02-01 2018-08-07 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and arrangement with adjustable secondary magnet arrangement
WO2010021613A1 (en) * 2008-08-20 2010-02-25 Ascentool, Inc. Deposition system
KR101094995B1 (ko) 2009-08-25 2011-12-19 금오공과대학교 산학협력단 스퍼터링 장치
US8502494B2 (en) 2009-08-28 2013-08-06 Front Edge Technology, Inc. Battery charging apparatus and method
WO2012035603A1 (ja) * 2010-09-13 2012-03-22 株式会社シンクロン 磁場発生装置、マグネトロンカソード及びスパッタ装置
US9378934B2 (en) * 2011-05-30 2016-06-28 Hitachi Metals, Ltd. Racetrack-shaped magnetic-field-generating apparatus for magnetron sputtering
US8865340B2 (en) 2011-10-20 2014-10-21 Front Edge Technology Inc. Thin film battery packaging formed by localized heating
US9887429B2 (en) 2011-12-21 2018-02-06 Front Edge Technology Inc. Laminated lithium battery
US8864954B2 (en) 2011-12-23 2014-10-21 Front Edge Technology Inc. Sputtering lithium-containing material with multiple targets
US9257695B2 (en) 2012-03-29 2016-02-09 Front Edge Technology, Inc. Localized heat treatment of battery component films
US9077000B2 (en) 2012-03-29 2015-07-07 Front Edge Technology, Inc. Thin film battery and localized heat treatment
KR101654660B1 (ko) * 2012-07-11 2016-09-07 캐논 아네르바 가부시키가이샤 스퍼터링 장치 및 자석 유닛
US9159964B2 (en) 2012-09-25 2015-10-13 Front Edge Technology, Inc. Solid state battery having mismatched battery cells
US8753724B2 (en) 2012-09-26 2014-06-17 Front Edge Technology Inc. Plasma deposition on a partially formed battery through a mesh screen
US9356320B2 (en) 2012-10-15 2016-05-31 Front Edge Technology Inc. Lithium battery having low leakage anode
JP2015017304A (ja) * 2013-07-11 2015-01-29 ソニー株式会社 磁界発生装置、及びスパッタリング装置
TWI527924B (zh) * 2014-02-12 2016-04-01 兆陽真空動力股份有限公司 電磁控濺鍍陰極
US9968016B2 (en) * 2014-08-11 2018-05-08 Toyota Motor Engineering & Manufacturing North America, Inc. Magnetic field shield
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WO2016148058A1 (ja) * 2015-03-19 2016-09-22 日立金属株式会社 マグネトロンスパッタリング用磁場発生装置
DE102016116568A1 (de) 2016-09-05 2018-03-08 Von Ardenne Gmbh Sputtervorrichtung und -verfahren
US20190043701A1 (en) * 2017-08-02 2019-02-07 HIA, Inc. Inverted magnetron for processing of thin film materials
WO2019110288A1 (en) * 2017-12-05 2019-06-13 Oerlikon Surface Solutions Ag, Pfäffikon Magnetron sputtering source and coating system arrangement
GB201817176D0 (en) * 2018-10-22 2018-12-05 Univ Sheffield Apparatus and methods for targeted drug delivery
CN113755808A (zh) * 2021-09-28 2021-12-07 北海惠科半导体科技有限公司 磁控溅射装置及其控制方法

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Also Published As

Publication number Publication date
EP0600070B1 (de) 1998-08-05
EP0600070A1 (de) 1994-06-08
DE69320151T2 (de) 1999-01-14
EP0600070A4 (de) 1994-10-26
DE69320151D1 (de) 1998-09-10
WO1993024674A1 (en) 1993-12-09
US5262028A (en) 1993-11-16
JPH07507360A (ja) 1995-08-10
DK0600070T3 (da) 1999-05-10
JP3473954B2 (ja) 2003-12-08
AU4388293A (en) 1993-12-30
ES2122024T3 (es) 1998-12-16

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee