US3522112A - Process for treating copper base alloy - Google Patents

Process for treating copper base alloy Download PDF

Info

Publication number
US3522112A
US3522112A US648742A US3522112DA US3522112A US 3522112 A US3522112 A US 3522112A US 648742 A US648742 A US 648742A US 3522112D A US3522112D A US 3522112DA US 3522112 A US3522112 A US 3522112A
Authority
US
United States
Prior art keywords
temperature
alloy
alloys
annealing
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US648742A
Other languages
English (en)
Inventor
Charles D Mclain
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olin Corp
Original Assignee
Olin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olin Corp filed Critical Olin Corp
Application granted granted Critical
Publication of US3522112A publication Critical patent/US3522112A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present disclosure teaches a process for treating a copper base alloy containing iron and optionally other additives.
  • the process is characterized by hot rolling followed by cold rolling with numerous process variation.
  • copper is an excellent conductor of electricity. However, it is deficient in strength for many applications.
  • the process of the present invention comprises:
  • the strength and physical properties of the alloys are not significantly variable if small amounts of impurities are present.
  • the alloys resist softening during soldering 700800 F.
  • the process of the present invention is inexpensive and readily enables the attainment of alloys having excellent physical properties.
  • the particular method of casting is not critical and any method used for alloys of this type may be conveniently employed. It should be noted that since iron is used as an alloying addition higher temperatures should be used in order to solutionize the iron. It is preferred to cast the alloy into billets of conventional size and thereafter subject them to hot working in the conventional manner.
  • the particular alloys utilized in accordance with the present invention are, as stated hereinabove, any copper base alloy containing from 1 to 3.5% iron, preferably 1.5 to 2.9% iron, and preferably containing certain additional additives.
  • the process of the present invention may readily utilize an alloy containing one or more of the following: silicon in an amount from 0.01 to 0.5%; phosphorus in an amount from 0.01 to 0.5%; and zinc in an amount from 0.01 to 0.5%.
  • small amounts of one or more additional additives may be utilized, for example, 0.01 to 0.5% of the following: manganese, tin, aluminum, nickel, calcium, titanium, chromium, tungsten and vanadium.
  • small amounts of impurities may, of course, be tolerated.
  • hot rolling and cold rolling are utilized as these are the preferred modes of operation. It should be understood, however, that hot or cold working may be utilized, e.g., forging, extrusion, the piercing of billets for seamless pipe or tubes and wire drawing, etc.
  • the alloys are hot rolled at an elevated temperature.
  • the hot rolling temperature may vary from 800 to 1050 C., i.e., the material may enter the hot rolling mill within the foregoing temperature range.
  • the hot rolling finishing temperatures are not particularly critical. It is preferred to utilize a hot rolling temperature range of from 875 to 975 C.
  • the high temperature treatment in the range of 800 to 1050 C. is required to develop optimum electrical conductivity.
  • the high temperature treatment may be combined with hot rolling, but if not convenient may be before or after hot rolling and should be before the cold rolling and annealing.
  • the high temperature solution treatment will enable a lower hot rolling temperature, provided it is followed by a high temperature treatment within the range of 800 to 1050 C.
  • the material is preferably subjected to a high temperature holding step, namely at a temperature of from 800 to 1050 C., and preferably 875 to 975 C. for at least minutes and preferably for minutes or more before rolling.
  • a high temperature holding step namely at a temperature of from 800 to 1050 C., and preferably 875 to 975 C. for at least minutes and preferably for minutes or more before rolling.
  • the amount of reduction taken in the hot rolling step is not particularly critical, being dictated by gage requirements.
  • the material is cooled to a holding temperature of 400 to 550 C. and held at metal temperature for at least 30 minutes.
  • the manner of cooling to holding temperature is not critical, but preferably the material is slowly cooled following holding.
  • the material should be cooled slowly at a rate less than 200 C. per hour to a temperature of at least 350 C., and preferably at a rate less than 75 C. per hour, and optimally less than C. per hour. Controlled cooling rates following holding at temperatures below 350 C. are not particularly critical.
  • the holding step is not essential, it results in some improvement in final properties. In fact, when the material is held as above, improved results are obtained even with one cycle of cold rolling and annealing.
  • the material is then cold rolled, followed by low temperature anneals.
  • the annealing steps should be in the temperature range of 400 to 550 C., preferably 440 to 520 C. and the cold rolling reduction should be reductions of at least and preferably at least 50% in each cold reduction step.
  • the preferred annealing temperatures are as follows.
  • the first anneal utilizes preferably a temperature of 470 to 510 C.
  • the second anneal utilizes preferably a temperature of from 400 to 5 00 C.
  • the last anneal utilizes preferably a temperature range of from 400 to 500 C.
  • the annealed tensile strength properties can be controlled from about 40,000 to 70,000 p.s.i. within these temperature ranges for the last anneals.
  • cold reductions of less than 60% should preferably be utilized, i.e., reductions greater than 70% result in a slight decrease of electrical conductivity after the final anneal.
  • the time at annealing temperature for the first anneal should be at least 30 minutes, preferably at least 3 hours, and preferably for economic reasons under 8 hours, although, longer annealing times may be utilized, if desired.
  • subsequent anneals one may if desired utilize strip annealing as an in process and/or as the final anneal, i.e., subsequent anneals may be for at least 5 seconds at a metal temperature of from 400' to 550 C.
  • subsequent anneals may be for at least 5 seconds at a metal temperature of from 400' to 550 C.
  • the final anneal may utilize strip annealing prior to the final anneal, i.e., at 400 to 800 C. for at least 5 sec onds.
  • the final anneal should be a bell anneal at from 400 to 500 C. for at least 30 minutes as hereinabove described.
  • the cooling rate from low temperature anneals should be less than 200 C. per hour down to at least 375 C. and preferably be less than 75 C. per hour and optimally less than 20 C. per hour down to a temperature of 350 C. for optimum electrical conductivity. Below 350 C. the cooling rate is not critical. In addition, it has been found to be highly advantageous to slowly cool in the foregoing manner following low temperature anneals, particularly with one cycle of cold rolling and annealing. If the long soak time and slow cooling rate can only be controlled on one anneal of a multiple anneal process, it is best for the last anneal to be controlled for development of maximum electrical conductivity.
  • the present invention comprehends within its scope an improved thermal treatment for obtaining high electrical conductivity in cast parts.
  • a casting or forging may be treated in the following manner:
  • step (B) the material should be immediately transferred to a furnace and held at metal temperature as indicated in step (C). Subsequent cool down rates are not critical.
  • the alloys thus prepared had the following composition.
  • Alloys 1, 2 and 3 prepared in Example I were processed as follows.
  • the alloys were hot rolled at from 900 to 940 C. in eleven passes to 0.350", followed by a water spray quench to room temperature.
  • the materials were then milled to 0.300" and cold rolled to 0.100", bell annealed at 480-600 C. (1 to 4 hours at temperature), cold rolled to 0.050", bell annealed at 460 to 480 C. (l to 3 hours at temperature), and cold rolled to 0.02 gage and bell annealed at 440 to 480 C. (1 to 3 hours at temperature).
  • the alloys were slow cooled to about 200 C. at a rate of about 75 C. per hour.
  • the alloys were milled to 0.300", cold TABLE H rolled to 0.100", annealed for two hours at 490 C., cold E I rolled to 0.050", annealed at 440 C. for two hours and Yield Tensile Elonlectrica u strength, Strength gation, Conductivity, 5 cold rolled to 0.025 and annealed for two hours at Alloy p.s.i. p.s.i.
  • FIGS. 1 and 2 are curve of Rockwell 1ST hardness versus temperature and FIG. 2 is a curve of strength versus temperature.
  • the solid lines represent the data after 3 minutes immersion in the salt bath and the dashed lines represent the data after 4 minutes 5 immersion in the salt bath.
  • An alloy was prepared in accordance with Example I having a composition corresponding to Alloy 3.
  • the ma terial was then heated to a temperature in the range of 850 to 975 C. and held with the metal at temperature for 30 minutes.
  • the material was then transferred to a second furnace and held for three (3) hours with the metal at a temperature in the range of 425 to 550 C.
  • the material was then air cooled to room temperature and had the following properties:
  • the alloys were processed in the following manner.
  • the (five inch thick slabs were hot rolled at 925 C. to 0.350".
  • alloys 7, 9 and 11 were water quenched to room temperature and alloys 8 and Both alloys were hot rolled at about 940 C. in eleven passes to 0.350".
  • Alloy 13 was then held at a temperature of 500 C. for 30 minutes at temperature followed by slow cooling to room temperature at a rate of less than 200 C. per hour.
  • Alloy 14 was water spray quenched after the last hot rolling pass.
  • Both alloys were then cold rolled to 0.070" and strip annealed such that the metal temperature was 485 C., with the metal at this temperature for about 10 seconds, followed by rapid cooling in a continuous strand annealing furnace.
  • the resulting properties were as follows:
  • a process for the preparation of high conductivity high strength copper base alloys which comprises:
  • alloy (A) contains from 0.01 to 0.5% of a material selected from the group consisting of zinc, phosphorus, silicon, manganese, aluminum, tin and mixtures thereof.
  • step (B) 4. A process according to claim 1 wherein the material is held for at least 30 minutes at a temperature of from 400 to 550 C. after step (B).
  • cooling rate from hot working temperature is less than 75 C. per hour down .to 350 C.
  • a process according to claim 1 including an additional cold working step after the final anneal.
  • cooling rate from annealing temperature is less than 200 C. per hour down .to at least 350 C.
  • cooling rate from annealing temperatures is less than 75 C. per hour down to at least 350 C.
  • a process according to claim 1 wherein the first anneal is for a period of time of at least 3 hours.
  • a process for the preparation of high conductivity high strength copper base alloys which comprises:
  • a process according to claim 11 including an additional cold working step after the final anneal.
  • a process according to claim 14 wherein both annealing steps utilize a period of time of at least 3 hours.
  • a process for the preparation of high conductivity high strength copper base alloys which comprises:
  • alloy (A) contains from 0.01 to 0.5% of a material selected from the group consisting of zinc, phosphorus, silicon, manganese, aluminum, tin and mixtures thereof.
  • a process according to claim 16 including an additional cold working step after the final anneal.
  • a process for the preparation of high conductivity high strength copper base alloys which comprises:
  • alloy (A) contains from 0.01 to 0.5% of a material selected from the group consisting of zinc, phosphorus, silicon, manganese, aluminum, tin and mixtures thereof.
  • a process for the preparation of high conductivity high strength copper base alloys which comprises:
  • a process for the preparation of high conductivity high strength copper base alloys, castings or forgings which comprises:

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Conductive Materials (AREA)
  • Heat Treatment Of Nonferrous Metals Or Alloys (AREA)
  • Ceramic Products (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Heat Treatment Of Steel (AREA)
  • Heat Treatment Of Sheet Steel (AREA)
US648742A 1967-06-26 1967-06-26 Process for treating copper base alloy Expired - Lifetime US3522112A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64874267A 1967-06-26 1967-06-26

Publications (1)

Publication Number Publication Date
US3522112A true US3522112A (en) 1970-07-28

Family

ID=24602035

Family Applications (1)

Application Number Title Priority Date Filing Date
US648742A Expired - Lifetime US3522112A (en) 1967-06-26 1967-06-26 Process for treating copper base alloy

Country Status (8)

Country Link
US (1) US3522112A (enrdf_load_html_response)
JP (5) JPS5220404B1 (enrdf_load_html_response)
BE (1) BE717177A (enrdf_load_html_response)
CH (2) CH529220A (enrdf_load_html_response)
DE (3) DE1783163B2 (enrdf_load_html_response)
FR (1) FR1570994A (enrdf_load_html_response)
GB (4) GB1225284A (enrdf_load_html_response)
SE (3) SE372041B (enrdf_load_html_response)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941620A (en) * 1974-07-11 1976-03-02 Olin Corporation Method of processing copper base alloys
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
US4466939A (en) * 1982-10-20 1984-08-21 Poong San Metal Corporation Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US4810310A (en) * 1986-05-27 1989-03-07 Olin Corporation Composites having improved resistance to stress relaxation
US5026433A (en) * 1990-01-02 1991-06-25 Olin Corporation Grain refinement of a copper base alloy
US5814168A (en) * 1995-10-06 1998-09-29 Dowa Mining Co., Ltd. Process for producing high-strength, high-electroconductivity copper-base alloys
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance
US20050092404A1 (en) * 2003-11-05 2005-05-05 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Softening-resistant copper alloy and method of forming sheet of the same
US10446293B2 (en) 2016-03-31 2019-10-15 Autonetworks Technologies, Ltd. Shielded communication cable
US10553329B2 (en) 2016-03-31 2020-02-04 Autonetworks Technologies, Ltd. Communication cable having single twisted pair of insulated wires

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3109438A1 (de) * 1981-03-12 1982-09-30 Kabel- und Metallwerke Gutehoffnungshütte AG, 3000 Hannover "verfahren zur herstellung von rohrfoermigen, geraden oder gekruemmten stranggiesskokillen mit parallelen oder konischen innenkonturen aus aushaertbaren kupferlegierungen"
JPS6039139A (ja) * 1983-08-12 1985-02-28 Mitsui Mining & Smelting Co Ltd 耐軟化高伝導性銅合金
DE3417273C2 (de) * 1984-05-10 1995-07-20 Poong San Metal Corp Kupfer-Nickel-Legierung für elektrisch leitendes Material für integrierte Schaltkreise
JPS61252987A (ja) * 1985-05-02 1986-11-10 N T C Kogyo Kk サ−モモ−タ−
US4911769A (en) * 1987-03-25 1990-03-27 Matsushita Electric Works, Ltd. Composite conductive material
JPH0491314A (ja) * 1990-08-06 1992-03-24 Calsonic Corp 水冷式エンジンの冷却制御装置
KR0157258B1 (ko) * 1995-12-08 1998-11-16 정훈보 석출 경화형 동합금의 제조방법
DE19611531A1 (de) * 1996-03-23 1997-09-25 Berkenhoff Gmbh Kupferlegierung für Steuerleitungen und Steckverbinder
JP4567906B2 (ja) * 2001-03-30 2010-10-27 株式会社神戸製鋼所 電子・電気部品用銅合金板または条およびその製造方法
US7291232B2 (en) * 2003-09-23 2007-11-06 Luvata Oy Process for high strength, high conductivity copper alloy of Cu-Ni-Si group

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039867A (en) * 1960-03-24 1962-06-19 Olin Mathieson Copper-base alloys

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039867A (en) * 1960-03-24 1962-06-19 Olin Mathieson Copper-base alloys

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3941620A (en) * 1974-07-11 1976-03-02 Olin Corporation Method of processing copper base alloys
JPS5174925A (ja) * 1974-12-26 1976-06-29 Nippon Musical Instruments Mfg Dogokin
US4466939A (en) * 1982-10-20 1984-08-21 Poong San Metal Corporation Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
US4810310A (en) * 1986-05-27 1989-03-07 Olin Corporation Composites having improved resistance to stress relaxation
US5026433A (en) * 1990-01-02 1991-06-25 Olin Corporation Grain refinement of a copper base alloy
US5814168A (en) * 1995-10-06 1998-09-29 Dowa Mining Co., Ltd. Process for producing high-strength, high-electroconductivity copper-base alloys
US6132529A (en) * 1995-10-09 2000-10-17 Dowa Mining Co., Ltd. Leadframe made of a high-strength, high-electroconductivity copper alloy
US6632300B2 (en) 2000-06-26 2003-10-14 Olin Corporation Copper alloy having improved stress relaxation resistance
US20050092404A1 (en) * 2003-11-05 2005-05-05 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Softening-resistant copper alloy and method of forming sheet of the same
DE102004053346B4 (de) * 2003-11-05 2017-12-28 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Verfahren zum Bilden eines erweichungsbeständigen Kupferlegierungsbleches
US10446293B2 (en) 2016-03-31 2019-10-15 Autonetworks Technologies, Ltd. Shielded communication cable
US10553329B2 (en) 2016-03-31 2020-02-04 Autonetworks Technologies, Ltd. Communication cable having single twisted pair of insulated wires
US10818412B2 (en) 2016-03-31 2020-10-27 Autonetworks Technologies, Ltd. Communication cable
US10825577B2 (en) 2016-03-31 2020-11-03 Autonetworks Technologies, Ltd. Communication cable having single twisted pair of insulated wires

Also Published As

Publication number Publication date
SE380293B (sv) 1975-11-03
GB1225282A (enrdf_load_html_response) 1971-03-17
JPS5514134B1 (enrdf_load_html_response) 1980-04-14
JPS5220404B1 (enrdf_load_html_response) 1977-06-03
DE1783163B2 (de) 1974-01-31
JPS549129B1 (enrdf_load_html_response) 1979-04-21
SE372041B (enrdf_load_html_response) 1974-12-09
DE1783164A1 (de) 1973-07-26
DE1783163A1 (de) 1973-07-26
SE343605B (enrdf_load_html_response) 1972-03-13
BE717177A (enrdf_load_html_response) 1968-12-27
CH548454A (de) 1974-04-30
GB1225284A (enrdf_load_html_response) 1971-03-17
FR1570994A (enrdf_load_html_response) 1969-06-13
JPS5514133B1 (enrdf_load_html_response) 1980-04-14
GB1225283A (enrdf_load_html_response) 1971-03-17
GB1225285A (enrdf_load_html_response) 1971-03-17
CH529220A (de) 1972-10-15
JPS5514132B1 (enrdf_load_html_response) 1980-04-14
DE1758120A1 (de) 1972-04-27
DE1758120C3 (de) 1978-04-27
DE1758120B2 (de) 1973-04-12

Similar Documents

Publication Publication Date Title
US3522112A (en) Process for treating copper base alloy
US4073667A (en) Processing for improved stress relaxation resistance in copper alloys exhibiting spinodal decomposition
US4067750A (en) Method of processing copper base alloys
US3039867A (en) Copper-base alloys
US3522039A (en) Copper base alloy
US3698965A (en) High conductivity,high strength copper alloys
JPS6132386B2 (enrdf_load_html_response)
US3639119A (en) Copper base alloy
US4007039A (en) Copper base alloys with high strength and high electrical conductivity
US2798827A (en) Method of casting and heat treating nickel base alloys
US2033709A (en) Copper alloys
US3640779A (en) High-conductivity copper alloys
US3574001A (en) High conductivity copper alloys
JPS6012422B2 (ja) リ−ド線材の製造方法
US3522038A (en) Copper base alloy
US3573110A (en) Process for obtaining high conductivity copper alloys
US3347717A (en) High strength aluminum-bronze alloy
US3773503A (en) Copper base alloy
US3671225A (en) Copper base alloy
US3399084A (en) Method of making aluminum bronze articles
US1261987A (en) Method of making aluminum-alloy articles.
US3484307A (en) Copper base alloy
JPS628491B2 (enrdf_load_html_response)
US3661568A (en) Copper base alloy
US3376171A (en) Copper alloy