US3639119A - Copper base alloy - Google Patents

Copper base alloy Download PDF

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Publication number
US3639119A
US3639119A US34605A US3639119DA US3639119A US 3639119 A US3639119 A US 3639119A US 34605 A US34605 A US 34605A US 3639119D A US3639119D A US 3639119DA US 3639119 A US3639119 A US 3639119A
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base alloy
copper base
percent
alloy according
present
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US34605A
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Charles D Mclain
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Olin Corp
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Olin Corp
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Definitions

  • ABSTRACT The present disclosure teaches an improved copper base alloy containing iron and tin and a material selected from the group consisting of phosphorous and zinc and mixtures thereof.
  • the alloys of the present invention are characterized by improved physical properties, in particular high strength and high conductivity.
  • copper is an excellent conductor of electricity. Numerous alloying additions have been proposed in order to increase the strength of copper. In so doing, the electrical conductivity of the copper is markedly reduced.
  • the alloy of the present invention comprises a copper base alloy consisting essentially of from 1.5 to 3.5 percent iron, from 0.02 to'0.10 percent tin, a material selected from the group consisting of phosphorus from 0.01 to 0.08 percent, zinc from 0.05 to 0.20 percent and mixtures thereof and the balance essentially copper. Throughout the ensuing specification all percentages are percentages by weight.
  • the alloys of the present invention have anunexpectedimprovement in electrical conductivity. Namely, there is readily obtained an IACS electrical conductivity in excess of'60 percent lACS and generally over 70 percent IACS. Furthennore, the alloys of the present invention have excellent annealing characteristics, with the ability to attain various strength levels as a result of different annealing treatments. in addition, the alloys of the present invention attain high rolled temper strength levels. Still further the high electrical conductivity of the alloys of the present invention is coupled with excellent annealed tensile strength properties of approximately 55,000 p.s.i. and higher. The strength and physical properties of the alloys of the present invention are not significantly variable if small amounts of impurities are present. In addition to the foregoing, the alloys of the present invention are inexpensive and their excellent physical properties are easily obtainable.
  • the composition of the alloys of the present invention is as stated heretofore.
  • the preferred iron content is from 1.8 to 2.9 percent and the preferred tin content is from 0.03 to 0.10 percent.
  • the preferred zinc content is 0.05 to 0.15 percent.
  • the percentage ranges of the alloying ingredients are important.
  • the alloys of the present invention attain improvement over conventional alloys'in a wide range of processing. Naturally, however,particularprocessing will result in variation in proloys being readily utilizable, it being noted that higher temperatures shouldbe used in order to solutionize the iron. it is preferred to cast the alloy into billets of conventional size,
  • the alloy After casting the alloy should be hot rolled at an elevated temperature, i.e., from '800" to 1,050 C., with a temperature of about 950 C. being preferred. The alloy should then be cold rolled to gage, with intermediate anneals, with cold reduction in excess of 50 percent between anneals being preferred. Annealing temperatures of from 400 to 600 C. are preferred, with annealing time at temperature preferably being a minimum of 2 hours. Longer times may be utilized, if desired, to improve electrical conductivity. Continuous strand annealing of strip or mill products will achieve the same high level of physical properties as with bell annealing, but will not achieve as high a level of electrical conductivity. Therefore, for development of .both high annealed strength and electrical conductivity,final annealing and preferably in process annealing must be in batches with conventional furnace cooling, such as bell annealing.
  • EXAMPLE 1 Alloys were prepared in the following; manner. High purity copper and high purity iron were melted together in a low frequency, slot-type induction furnace under a charcoal cover .at approximately l,200 C. About 10 percent of the copper charge was held back and the melt was slightly overheated to about 1,300 C. in order'to put the iron into solution. High purity alloying additions were added when the molten mass was at about l,300 C. The balance of the copper was added and the melt brought to the pouring temperature of about l,200 C. The melt was then poured into a water-cooled ingot mold of 28%X5X96 inches at a pouring rate of 21.3 inches per minute.
  • the alloys thus prepared had the following composition.
  • the alloys were hot rolled at from 900 to 940 C., followed by a water spray quench to room temperature. The materials were then cold rolled to 0.100 inch, bell annealed at 480-600 C. (l to 4 hours at temperature,) cold rolled to 0.050 inch, bell annealed at 460480 C. 1 to 3 hours at temperature,) and cold rolled to 0.025 inch gage and bell an nealed at 440480C. (l to 3 hours at temperature.)
  • tin a material selected from the group consisting TABLE II H Electrlca: eonduc Yield Tensile Elontivlty strength, strength, gatlon, percent p.s.i. p.s.i. percent IACB Alloy:
  • alloy 1 the alloy of the present invention, develops greater annealed strength levels than conventionalalloy 2 at comparable electrical conductiviing and range of equivalency are intended to be embraced therein.
  • a high conductivity, high strength copper base alloy con sisting essentially of from 1.5 to 3.5 percent iron, from 0.02 to of phosphorus from 0.0] to 0.08 percent, zinc from 0.05 to 0.20 percent and mixtures thereof and the balance copper.
  • a copper base alloy according to claim 1 containing both phosphorus and zinc.
  • a copper basealloy according to claim I in the flat rolled condition 3.
  • a copper base alloy according to claim I having an electrical conductivity of at least 70 percent IACS and an annealed tensile strength of at least 55,000 p.s.i.
  • a copper base alloy according to claim 1 having an electrical conductivity of at least 60 percent lACS.
  • a copper base alloy according to-claim l in the coldrolled and annealed condition.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The present disclosure teaches an improved copper base alloy containing iron and tin and a material selected from the group consisting of phosphorous and zinc and mixtures thereof. The alloys of the present invention are characterized by improved physical properties, in particular high strength and high conductivity.

Description

United States Patent McLain [63] Continuation-impart of Ser. No. 648,946, June 26,
1971, abandoned.
[52] US. Cl ..75/157, 75/153, 75/154 [51] Int. Cl. v.C22c 9/00, C220 9/02 [58] Field of Search ..75/153, 154,157;148/11.5,
[561 Referees-9599s? UNITED STATES PATENTS 2,031,315 2/1936 Jennison ..75/162 1 Feb. 1, 1972 2,155,406 4/1939 Crampton etal ..75/l57.5 2,210,670 8/1940 Kelly. ..75/l54 Primary Examiner-Charles N. Lovell Attorney-Robert l-l. Bachman and Gordon G. Menzies [57] ABSTRACT The present disclosure teaches an improved copper base alloy containing iron and tin and a material selected from the group consisting of phosphorous and zinc and mixtures thereof. The alloys of the present invention are characterized by improved physical properties, in particular high strength and high conductivity.
10 Claims, No Drawings COPPER BASE ALLOY This application is a continuation-in-part of copending application Ser. No. 648,946 for Copper Base Alloy" by Charles D. McLain, filed June'26, 1967, now abandoned.
As is well known in the art, copper is an excellent conductor of electricity. Numerous alloying additions have been proposed in order to increase the strength of copper. In so doing, the electrical conductivity of the copper is markedly reduced.
It is, therefore, highly desirable to provide a copper base alloy characterized by high conductivity and increased strength.
Accordingly, it is a principal object of the present invention to provide a copper base alloy characterized by high electrical conductivity and high strength properties.
It is a further object of the presentinvention to provide a copper base alloy with annealed physical properties which do not have a wide variation.
It is a further object of the present invention to provide a copper base alloy having the ability'to attain various strength levels as a result of different annealing treatments, even when small amounts of impurities are present.
It is a further object of the present invention to provide an improved copper base alloy having a combination of high strength, high conductivity, and other excellent physical properties.
It is an additional object of the present invention to provide a copper base alloy which is inexpensive and wherein the excellent physical properties are easily obtainable.
Further objects and advantages of the present invention will appear from the ensuing specification.
In accordance with the present invention it has been found that an improved copper base alloy is provided' which effectively achieves the foregoing objects and advantages. The alloy of the present invention comprises a copper base alloy consisting essentially of from 1.5 to 3.5 percent iron, from 0.02 to'0.10 percent tin, a material selected from the group consisting of phosphorus from 0.01 to 0.08 percent, zinc from 0.05 to 0.20 percent and mixtures thereof and the balance essentially copper. Throughout the ensuing specification all percentages are percentages by weight.
In accordance with the present invention, 'it has been surprisingly found that the foregoing alloys are characterized by numerous unexpected and surprising advantages. For example, the alloys of the present invention have anunexpectedimprovement in electrical conductivity. Namely, there is readily obtained an IACS electrical conductivity in excess of'60 percent lACS and generally over 70 percent IACS. Furthennore, the alloys of the present invention have excellent annealing characteristics, with the ability to attain various strength levels as a result of different annealing treatments. in addition, the alloys of the present invention attain high rolled temper strength levels. Still further the high electrical conductivity of the alloys of the present invention is coupled with excellent annealed tensile strength properties of approximately 55,000 p.s.i. and higher. The strength and physical properties of the alloys of the present invention are not significantly variable if small amounts of impurities are present. In addition to the foregoing, the alloys of the present invention are inexpensive and their excellent physical properties are easily obtainable.
The composition of the alloys of the present invention is as stated heretofore. The preferred iron content is from 1.8 to 2.9 percent and the preferred tin content is from 0.03 to 0.10 percent. The preferred zinc content is 0.05 to 0.15 percent.
In view of the high and in fact surprising physical properties of the alloys of the present invention, the percentage ranges of the alloying ingredients are important.
In addition to the foregoing, small amounts of additional alloying ingredients may be, of course, included in order to uchievc particularly desirable results, for example, phosphorus from 0.01 to 0.10 percent and zinc from (HlS to 0.20 percent. Also, small amounts of impurities may be tolerated.
The alloys of the present invention attain improvement over conventional alloys'in a wide range of processing. Naturally, however,particularprocessing will result in variation in proloys being readily utilizable, it being noted that higher temperatures shouldbe used in order to solutionize the iron. it is preferred to cast the alloy into billets of conventional size,
subjecting them to hot working, as by rolling in the conventional size.
After casting the alloy should be hot rolled at an elevated temperature, i.e., from '800" to 1,050 C., with a temperature of about 950 C. being preferred. The alloy should then be cold rolled to gage, with intermediate anneals, with cold reduction in excess of 50 percent between anneals being preferred. Annealing temperatures of from 400 to 600 C. are preferred, with annealing time at temperature preferably being a minimum of 2 hours. Longer times may be utilized, if desired, to improve electrical conductivity. Continuous strand annealing of strip or mill products will achieve the same high level of physical properties as with bell annealing, but will not achieve as high a level of electrical conductivity. Therefore, for development of .both high annealed strength and electrical conductivity,final annealing and preferably in process annealing must be in batches with conventional furnace cooling, such as bell annealing.
Detailed processing and preferred processing parameters consonant with the foregoing are found in copending application Ser. No. 648,742 for Process For Treating Copper Base Alloy," filed June 26, 1967 by C. D. McLain, now US. Pat. No. 3,522,1 12. i
The present invention will be more readily understandable from a consideration of the following illustrative examples.
EXAMPLE 1 Alloys were prepared in the following; manner. High purity copper and high purity iron were melted together in a low frequency, slot-type induction furnace under a charcoal cover .at approximately l,200 C. About 10 percent of the copper charge was held back and the melt was slightly overheated to about 1,300 C. in order'to put the iron into solution. High purity alloying additions were added when the molten mass was at about l,300 C. The balance of the copper was added and the melt brought to the pouring temperature of about l,200 C. The melt was then poured into a water-cooled ingot mold of 28%X5X96 inches at a pouring rate of 21.3 inches per minute.
The alloys thus prepared had the following composition.
lows. The alloys were hot rolled at from 900 to 940 C., followed by a water spray quench to room temperature. The materials were then cold rolled to 0.100 inch, bell annealed at 480-600 C. (l to 4 hours at temperature,) cold rolled to 0.050 inch, bell annealed at 460480 C. 1 to 3 hours at temperature,) and cold rolled to 0.025 inch gage and bell an nealed at 440480C. (l to 3 hours at temperature.)
The alloys were then tested for physical properties, with the results being shownin the following table.
. 0.10 percent tin, a material selected from the group consisting TABLE II H Electrlca: eonduc Yield Tensile Elontivlty strength, strength, gatlon, percent p.s.i. p.s.i. percent IACB Alloy:
l... 25,000 mom 24.15 12.0 2 28,100 50,100 27.5 1 73.5
The foregoing demonstrates that alloy 1, the alloy of the present invention, develops greater annealed strength levels than conventionalalloy 2 at comparable electrical conductiviing and range of equivalency are intended to be embraced therein.
What is claimed is: 1. A high conductivity, high strength copper base alloy con sisting essentially of from 1.5 to 3.5 percent iron, from 0.02 to of phosphorus from 0.0] to 0.08 percent, zinc from 0.05 to 0.20 percent and mixtures thereof and the balance copper.
2. A copper base alloy according to claim 1 containing both phosphorus and zinc.
3. A copper basealloy according to claim I in the flat rolled condition.
4. A copper base alloy according to claim I having an electrical conductivity of at least 70 percent IACS and an annealed tensile strength of at least 55,000 p.s.i.
5. A copper base alloy according to claim 1 having an electrical conductivity of at least 60 percent lACS.
6. A copper base alloy according to claim I wherein the zinc content is from 0.05 to 0.15 percent.
7. A copper base alloy according to claim 1 wherein the iron content is from 1.8 to 2.9 percent.
8. A copper base alloy according to claim 1 wherein the tin content is from 0.03 to 0.10 percent.
9. A copper base alloy according to claim 1 in the coldrolled condition.
10. A copper base alloy according to-claim l in the coldrolled and annealed condition.

Claims (9)

  1. 2. A copper base alloy according to claim 1 containing both phosphorus and zinc.
  2. 3. A copper base alloy according to claim 1 in the flat rolled condition.
  3. 4. A copper base alloy according to claim 1 having an electrical conductivity of at least 70 percent IACS and an annealed tensile strength of at least 55,000 p.s.i.
  4. 5. A copper base alloy according to claim 1 having an electrical conductivity of at least 60 percent IACS.
  5. 6. A copper base alloy according to claim 1 wherein the zinc content is from 0.05 to 0.15 percent.
  6. 7. A copper base alloy according to claim 1 wherein the iron content is from 1.8 to 2.9 percent.
  7. 8. A copper base alloy according to claim 1 wherein the tin content is from 0.03 to 0.10 percent.
  8. 9. A copper base alloy according to claim 1 in the cold-rolled condition.
  9. 10. A copper base alloy according to claim 1 in the cold-rolled and annealed condition.
US34605A 1970-05-04 1970-05-04 Copper base alloy Expired - Lifetime US3639119A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249941A (en) * 1978-11-20 1981-02-10 Tamagawa Kikai Kinzoku Kabushiki Kaisha Copper base alloy for leads of integrated circuit
US4451430A (en) * 1979-08-07 1984-05-29 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing copper alloy by melting technique
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
DE3613594A1 (en) * 1985-05-08 1986-11-13 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo COPPER ALLOY CONDUCTOR MATERIAL FOR CONNECTING SEMICONDUCTOR DEVICES
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass
US20090010797A1 (en) * 2004-08-17 2009-01-08 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy plate for electric and electronic parts having bending workability

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2031315A (en) * 1933-08-05 1936-02-18 American Brass Co Copper base alloy
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor
US2210670A (en) * 1939-02-18 1940-08-06 Westinghouse Electric & Mfg Co Copper alloy

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2031315A (en) * 1933-08-05 1936-02-18 American Brass Co Copper base alloy
US2155406A (en) * 1938-04-28 1939-04-25 Chase Brass & Copper Co Electrical conductor
US2210670A (en) * 1939-02-18 1940-08-06 Westinghouse Electric & Mfg Co Copper alloy

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4249941A (en) * 1978-11-20 1981-02-10 Tamagawa Kikai Kinzoku Kabushiki Kaisha Copper base alloy for leads of integrated circuit
US4451430A (en) * 1979-08-07 1984-05-29 Tokyo Shibaura Denki Kabushiki Kaisha Method of producing copper alloy by melting technique
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
DE3613594A1 (en) * 1985-05-08 1986-11-13 Tamagawa Kikai Kinzoku K.K., Tokio/Tokyo COPPER ALLOY CONDUCTOR MATERIAL FOR CONNECTING SEMICONDUCTOR DEVICES
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass
US20090010797A1 (en) * 2004-08-17 2009-01-08 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Copper alloy plate for electric and electronic parts having bending workability
US8715431B2 (en) * 2004-08-17 2014-05-06 Kobe Steel, Ltd. Copper alloy plate for electric and electronic parts having bending workability

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