US20220275199A1 - Polyester resin composition and molded product thereof - Google Patents

Polyester resin composition and molded product thereof Download PDF

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US20220275199A1
US20220275199A1 US17/627,215 US202017627215A US2022275199A1 US 20220275199 A1 US20220275199 A1 US 20220275199A1 US 202017627215 A US202017627215 A US 202017627215A US 2022275199 A1 US2022275199 A1 US 2022275199A1
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resin composition
polyester resin
mass
parts
composition according
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Xianwen TANG
Junrui XU
Lezhen Zhang
Koya Kato
Kenji Ota
Akitoshi Omayu
Wenbo ZHU
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Toray Industries Inc
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Toray Industries Inc
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Assigned to TORAY INDUSTRIES, INC. reassignment TORAY INDUSTRIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OMAYU, Akitoshi, TANG, Xianwen, XU, JUNRUI, ZHANG, Lezhen, ZHU, WENBO, KATO, KOYA, OTA, KENJI
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1603—Laser beams characterised by the type of electromagnetic radiation
    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
    • B29C65/1616—Near infrared radiation [NIR], e.g. by YAG lasers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B29K2995/0027—Transparent for light outside the visible spectrum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Definitions

  • This disclosure relates to the field of polymer materials and, in particular, a polyester resin composition and a molded product thereof.
  • Polybutylene terephthalate (PBT) resin has been widely applied to mechanical components, electrical communication components, automotive components and other fields due to its various excellent properties such as heat resistance, chemical resistance, electrical properties, mechanical properties and molding processability. Especially in recent years, its application to various automotive electrical mounting components has attracted extensive attention. However, the airtightness of these components must occasionally be ensured.
  • Traditional coupling methods such as screw fastening, adhesive bonding, heating-plate deposition and ultrasonic deposition pose issues such as long process time and insufficient design freedom.
  • Laser welding as an external heating welding technology, is an engineering method of melting and fusing by irradiating a laser beam on a laminated resin molded body and making the laser beam pass through the irradiated surface and be absorbed by the other surface. That method attracted extensive attention since it can meet the requirements for three-dimensional connection, non-contact processing and the absence of welding spatters. It also has the characteristics of rapid process, high design freedom and high bonding strength. Meanwhile, it can be seen from the above laser welding process that the laser transmittance of a welded material is one of the important parameters. When a PBT resin is bonded by laser welding, heat absorption deficiency would be easily caused if the laser transmittance of the resin is too low such that the welding and bonding cannot be completed finally.
  • the material may be easily ablated and carbonized due to overheating. Therefore, it has been an ongoing concern in the field that how to effectively increase the laser transmittance of the welded material.
  • Japanese Laid-Open Pub. No. 2010-70626 discloses a polyester resin composition that shows excellent laser transmittance as well as excellent cold and heat resistance and mechanical strength and is very effective for the laser welding of resin products.
  • a polyester resin composition comprising (A) 29-84% by weight of polybutylene terephthalate (PBT) resin, (B) 5-60% by weight of at least one resin selected from a polyester resin in which repeating units formed by terephthalate groups and 1,4-cyclohexane dimethanol groups account for more than 25 mol %, and a polycarbonate resin, (C) 10-50% by weight of reinforcing fibers, (D) 1-20% by weight of a block copolymer of polyalkyl methacrylate and butyl acrylate, wherein the composition is a polyester resin composition applicable to laser welding.
  • the compatibility between the PBT resin and an amorphous resin is insufficient, and the laser transmittance still requires improvement.
  • Japanese Laid-Open Pub. No. 2007-186584 discloses a polyester resin composition that provides excellent laser weldability and a molded product that is firmly bonded by laser welding. Its solution is as follows: the polyester resin composition is prepared by adding (b) 0 to 100 parts by weight of a reinforcing filler and (c) 0.1 to 100 parts by weight of an epoxy compound with respect to (a) 100 parts by weight of a polyester resin, and the polyester resin composition is applicable to laser welding.
  • an epoxy resin is added into the composition, there is no mention of the addition of an epoxy resin with a special structure as used in our resin compositions or the improvement of the compatibility between the PBT resin and the amorphous polyester resin, and the polyester resin composition is insufficient in transmittance.
  • Ciba 1863870 A discloses a composition composed of a specific composition such as a polybutylene terephthalate resin, a polystyrene elastomer, a polycarbonate resin and a plasticizer. It achieves the effects of improving the transmittance uniformity and reducing the transmittance difference among different parts of a molded part, but it cannot greatly increase the transmittance (the transmittance under the laser condition of 940 nm is 20% to 34%).
  • a specific composition such as a polybutylene terephthalate resin, a polystyrene elastomer, a polycarbonate resin and a plasticizer. It achieves the effects of improving the transmittance uniformity and reducing the transmittance difference among different parts of a molded part, but it cannot greatly increase the transmittance (the transmittance under the laser condition of 940 nm is 20% to 34%).
  • Japanese Laid-Open Pub. No. 2005-336409 discloses that in a polymer alloy formed by at least compounding a polybutylene terephthalate resin and polycarbonate, a molded product can be effectively used as a transmission material for a laser welding part by a method of controlling a phase structure.
  • a molded product can be effectively used as a transmission material for a laser welding part by a method of controlling a phase structure.
  • it does not mention the improvement of the compatibility between the PBT resin and the amorphous polyester resin, and therefore such a technology increases the transmittance to a limited extent.
  • a polyester resin composition prepared by at least compounding (A) a polybutylene terephthalate resin, (B) an amorphous resin and (C) an epoxy resin with a special structure and adjusting the melting point to 210° C.-221° C., can acquire high laser transmittance.
  • a molded product manufactured from the polyester resin composition can allow a laser to transmit through even when the laser power is small or the molded product has significant thickness. Therefore, the polyester resin composition is applicable to a laser-transmitting material of a laser welding part to allow it to be tightly combined with a laser-absorbent material.
  • polyester resin composition wherein the polyester resin composition is prepared by compounding at least the following (A) to (C):
  • amorphous resin (B) is at least one selected from polycarbonate, amorphous polyester containing a cyclohexane dimethylene terephthalate unit or a styrene/acrylonitrile copolymer.
  • X indicates a divalent group represented by general formula (2) or general formula (3); in general formulae (1) and (3), R 1 , R 2 , R 4 and R 5 are the same or different and each independently represent any one of an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms or an alkyl ether group having 1 to 8 carbon atoms, and R 3 indicates any one of a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 10 carbon atoms; in general formula (1), n indicates a value greater than 0 but less than or equal to 10; and in general formulae (1) and (3), a, c and d each independently represent integers of 0 to 4 while b is an integer of 0 to 3.
  • polyester resin composition according to the above item 1 wherein the content of the epoxy resin (C) is 0.05 to 3 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate resin (A).
  • polyester resin composition according to the above item 1 wherein the polyester resin composition further comprises a filler material (D).
  • polyester resin composition according to the above item 1, wherein the polyester resin composition further comprises a transesterification inhibitor (E).
  • R 6 indicates an alkyl group having 1 to 30 carbon atoms, and m is 1 or 2.
  • polyester resin composition according to the above item 1 wherein the polyester resin composition further comprises a nucleating agent (F).
  • nucleating agent (F) is at least one selected from the group consisting of silica, alumina, zirconia, titania, wollastonite, kaolin, talcum powder, mica, silicon carbide, ethylene bislauramide or a sorbitol derivative.
  • the polyester resin composition according to the above item 1 wherein the polyester resin composition is molded under the conditions of a molding temperature of 260° C. and a mold temperature of 80° C. to prepare a molded piece with a thickness of 1 mm, which has the transmittance of more than 48% as measured with a spectrophotometer under the condition of a wavelength of 940 nm.
  • a molded product which is made of the polyester resin composition according to any one of the above items 1 to 15.
  • the polyester resin composition due to its excellent laser transmittance can be used in various automotive electrical mounting components (various control units, various sensors, and the like), connectors, switch components, relay components, and the like.
  • FIG. 1(A) shows a top view and FIG. 1(B) shows a side view, which represent test samples for transmittance evaluation.
  • the (A) polybutylene terephthalate (PBT) resin as a matrix resin in the polyester resin composition may be exemplified as a homopolyester or copolyester taking butylene terephthalate as a main component.
  • Monomers that are copolymerizable in the copolyester may be exemplified as dicarboxylic acids other than a terephthalic acid, diols other than 1,4-butanediol, oxyacids or lactones, and the like. Copolymeric monomers may be used singly or in a combination of two or more thereof. Herein, the amount of the copolymeric monomers is preferably 30 mol % or less of the total amount of monomers.
  • the dicarboxylic acids other than the terephthalic acid may be exemplified as aliphatic dicarboxylic acids (e.g., glutaric acid, hexanedioic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecyl dicarboxylic acid, dodecyl dicarboxylic acid and hexadecyl dicarboxylic acid), alicyclic dicarboxylic acids (e.g., hexahydrophthalic acid, hexahydroisophthalic acid and hexahydroterephthalic acid), aromatic dicarboxylic acids (e.g., phthalic acid, isophthalic acid, 2,6-naphtha-lenedicarboxylic acid, 4,4′-diphenyldicarboxylic acid, 4,4′-diphenylether dicarboxylic acid, 4,4′-diphenylmethane dicarboxy
  • the diols other than 1,4-butanediol may be exemplified as aliphatic alkylene glycols (e.g., ethylene
  • the diols other than 1,4-butanediol may be exemplified as aliphatic alkylene glycols (e.g., ethylene glycol, propylene glycol, pentanediol, neopentyl glycol, hexanediol, heptanediol, octanediol, nonanediol, decanediol or other C2-12 alkanediols but preferably C2-10 alkanediols), polyalkoxy glycols (e.g., diethylene glycol, dipropylene glycol, dibutylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, polybutylene glycol or other
  • polyhydric alcohols such as glycerol, trimethylolpropane, trimethylolethane or pentaerythritol may be mixed and used as needed.
  • glycol propylene glycol, pentanediol, neopentyl glycol, hexanediol, heptanediol, octanediol, nonanediol, decanediol or other C2-12 alkanediols but preferably C2-10 alkanediols), polyalkoxy glycols (e.g., diethylene glycol, dipropylene glycol, dibutylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, polybutylene glycol or other oxyalkyl-containing glycols), aromatic diols (e.g., hydroquinone, resorcinol, naphthalenedi
  • the oxyacids may be exemplified as hydroxy acids such as oxybenzoic acid, oxynaphthoic acid, hydroxyphenylacetic acid, glycolic acid or oxycaproic acid and derivatives thereof
  • the lactones may be exemplified as C3-12 lactones such as propiolactone, butyrolactone, valerolactone or caprolactone.
  • the inherent viscosity of the polybutylene terephthalate resin (A) measured in a solution of o-chlorophenol at 25° C. is 0.36-3.0 dl/g but more preferably 0.42-2.0 dl/g.
  • One type of polybutylene terephthalate resin may be used but two or more polybutylene terephthalate resins with different inherent viscosities may also be used. However, it is preferable that their inherent viscosities be within the above ranges.
  • the carboxyl content of the polybutylene terephthalate resin (A) is preferably below 50 mol/ton.
  • the carboxyl content of the polybutylene terephthalate resin (A) is obtained under the condition of titration with potassium hydroxide ethanolate after being dissolved in an o-cresol/chloroform solvent.
  • the polybutylene terephthalate resin (A) may be prepared by polymerizing a terephthalic acid or an ester-forming derivative thereof, 1,4-butanediol and a copolymeric monomer added as needed with a conventional method (e.g., transesterification, direct esterification, and the like).
  • the amorphous resin (B) in the polyester resin composition may be exemplified as a styrene homopolymer/copolymer, aromatic polyethers (such as polyphenylene ether and polyetherimide), polycarbonate, polyarylester, polysulfone, polyethersulfone, polyimide or an amorphous polyester containing a cyclohexane dimethylene terephthalate unit, and the like.
  • aromatic polyethers such as polyphenylene ether and polyetherimide
  • polycarbonate polyarylester
  • polysulfone polyethersulfone
  • polyimide polyimide
  • an amorphous polyester containing a cyclohexane dimethylene terephthalate unit and the like.
  • the styrene homopolymer/copolymer may be exemplified as polystyrene, polychlorostyrene, poly ⁇ -methylstyrene, a styrene/chlorostyrene copolymer, a styrene/propylene copolymer, a styrene/acrylonitrile copolymer, a styrene/butadiene copolymer, a styrene/vinyl chloride copolymer, a styrene/vinyl acetate copolymer, a styrene/maleate copolymer, a styrene/acrylate copolymer (e.g., a styrene/methyl acrylate copolymer, a styrene/ethyl acrylate copolymer, a styrene/butyl acrylate cop
  • the polycarbonate is prepared from one or more dihydroxy compounds, as a main raw material(s), selected from 2,2′-bis (4-hydroxyphenyl) propane (bisphenol A), 4,4′-dihydroxydiphenylalkane, 4,4′-dihydroxydiphenyl sulfone, 4,4′-dihydroxydiphenyl ether, 2,2′-bis (3,5-dimethyl-4-hydroxyphenyl) propane or 1,1′-bis (4-hydroxyphenyl) cyclohexane.
  • the polycarbonate is preferably prepared by taking 2,2′-bis (4-hydroxyphenyl) propane (bisphenol A) as a main raw material.
  • polycarbonate prepared by taking the bisphenol A as the main raw material other dihydroxy compounds for example 4,4′-dihydroxydiphenylalkane or 4,4′-dihydroxydiphenyl sulfone or 4,4′-dihydroxyphenyl ether (other than the bisphenol A) may also be copolymerized.
  • the amount of other dihydroxy compounds used is preferably 10 mol % or less with respect to the total amount of the dihydroxy compounds.
  • the degree of polymerization of the polycarbonate is not specifically defined, but is intended to increase the compatibility between the polycarbonate (B) and the polybutylene terephthalate (A) and improve the moldability of the polycarbonate
  • the viscosity average molecular weight (Mv) of the polycarbonate (B) is preferably 10,000 to 50,000.
  • the lower limit of the viscosity average molecular weight is more preferably 15,000 or more but even more preferably 18,000 or more.
  • the upper limit of the viscosity average molecular weight is more preferably 40,000 or less but even more preferably 35,000 or less.
  • the limiting viscosity[ ⁇ ] is calculated with formula (9) by using the specific viscosity[ ⁇ sp ]of the concentration[c] (g/dl) of each solution:
  • the amorphous polyester containing the cyclohexane dimethylene terephthalate unit refers to polyester obtained by polymerizing terephthalic acid-based dicarboxylic acid and 1,4-cyclohexanedimethanol and other diols.
  • diols include aliphatic alkylene glycols (e.g., ethylene glycol, propylene glycol, butylene glycol, pentanediol, neopentyl glycol, hexanediol, heptanediol, octanediol, nonanediol, decanediol or other C2-12 alkyl diols but preferably C2-10 alkyl diols), polyoxyalkylene diols (e.g., diols having an oxyalkylene unit such as diethylene glycol, dipropylene glycol, dibutylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol and polybutylene glycol), alicyclic group diols (e.g., 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cycl
  • a molar ratio [(I)/(II)] of the other diol units (I) to the 1,4-cyclohexanedimethanol unit (II) is between 1/99 and 99/1. From the standpoint of improving the compatibility with the polybutylene terephthalate (A),[(I)/(II)] is preferably less than 80/20, more preferably less than 75/25 but even more preferably less than 50/50. Meanwhile, [(I)/(II)] is preferably greater than 25/75, more preferably greater than 30/70.
  • the amorphous resin (B) is preferably at least one of polycarbonate, amorphous polyester containing a cyclohexane dimethylene terephthalate unit or a styrene/acrylonitrile copolymer.
  • the content of the amorphous resin (B) is 15 to 100 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate (A). Within that range, the laser transmittance and the molding processability of the polyester resin composition may be improved. Furthermore, the lower limit of the content of the amorphous resin (B) is preferably 20 parts by mass or more but even more preferably 30 or more parts by mass. Meanwhile, the upper limit of the content is preferably 90 or fewer parts by mass but more preferably 80 or fewer parts by mass.
  • the polyester resin composition comprises at least one epoxy resin (C) selected from trisphenol methane epoxy resin, tetrakisphenol ethane epoxy resin, novolac epoxy resin and naphthalene epoxy resin.
  • the epoxy resin (C) preferably has a glycidyl ether structure or a glycidyl ester structure.
  • the novolac epoxy resin may be exemplified as a novolac epoxy resin having a glycidyl ether structure of formula (1):
  • X represents a divalent group, which is represented by an alkyl, aryl, aralkyl or alicyclic hydrocarbon group having one to eight carbon atoms and may contain a plurality of groups.
  • R 1 and R 2 may be the same or different. Each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms or an alkyl ether group having 1 to 8 carbon atoms.
  • R 3 indicates a hydrogen atom, an alkyl group having one to eight carbon atoms or an aryl group having 6 to 10 carbon atoms.
  • n represents a value greater than 0 but less than or equal to 20; a represents an integer of 0 to 4, and b is an integer of 0 to 3.
  • the epoxy resin (C) is preferably solid at room temperature (25° C.). From this, it is contemplated that the novolac epoxy resin having the glycidyl ether structure represented by the above structural formula (1) more preferably has the following structure:
  • X preferably indicates a divalent group represented by general formula (2) or general formula (3); in general formulae (1) and (3), R 1 , R 2 , R 4 and R 5 are the same or different and each independently represent any one of an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms or an alkyl ether group having 1 to 8 carbon atoms, and R 3 indicates any one of a hydrogen atom, an alkyl group having 1 to 8 carbon atoms or an aryl group having 6 to 10 carbon atoms; in general formula (1), n preferably indicates a value greater than 0 but less than or equal to 10; and in general formulae (1) and (3), a, c and d each independently represent integers of 0 to 4 while b is an integer of 0 to 3.
  • the trisphenol methane epoxy resin has a structure shown in structural formula (5); the tetrakisphenol ethane epoxy resin has a structure shown in structural formula (6); and the naphthalene epoxy resin has structures shown in structural formulae (7) and (8):
  • An epoxy value of the above epoxy compounds is preferably 100-1,000 g/eq.
  • the polyester resin composition may be suppressed from generating a gas during melt processing and, at the same time, may effectively react with a carboxyl group of the polybutylene terephthalate (A).
  • the lower limit of the epoxy value is more preferably 200 g/eq or more.
  • the upper limit of the epoxy value is more preferably 500 g/eq or less but even more preferably 400 g/eq or less.
  • the content of the epoxy resin (C) is 0.010 to 5.0 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate resin (A).
  • the compatibility between the polybutylene terephthalate (A) and the amorphous resin (B) is improved, thereby increasing the transmittance.
  • the content of the epoxy resin (C) is 5.0 or fewer parts by mass, the epoxy resin (C) in the polyester composition has good dispersibility, thereby increasing the transmittance.
  • the lower limit of the content of the epoxy resin (C) is preferably 0.050 parts by mass or more but even more preferably 0.10 parts by mass or more but even more preferably 0.40 or more parts by mass.
  • the upper limit of the content of the epoxy resin (C) is preferably 3.0 or fewer parts by mass but more preferably 1.5 or fewer parts by mass.
  • a filler material (D) may be further added into the polyester resin composition.
  • the filler material (D) is not specifically defined as long as it is a filler material commonly used in known resins.
  • the filler material may also be a structurally hollow filler material, but two or more of these filler materials may be selected and used in combination.
  • the average diameter of the filler material is not specifically defined but is preferably 0.001-20 ⁇ m to obtain a better appearance for the polyester resin composition.
  • the filler material is preferably at least one of the glass fibers or the carbon fibers to acquire a polyester resin composition with excellent performances.
  • the glass fibers are not specifically defined but may be those used in the prior art.
  • the glass fibers may be fibers in the shape of chopped strands cut to length, coarse sand or ground fibers. Generally, the average diameter of the glass fibers preferably used is 5 to 15 ⁇ m.
  • the length is not specifically defined, but it is preferable to use the fibers having a standard length of 3 mm, which are suitable for extrusion and mixing operations.
  • the cross-sectional shape of the above-mentioned fibrous filler material is not specifically defined. Therefore, any one or more of round or flat fibers may be selected and used in combination.
  • the content of the filler material (D) is preferably 1 to 150 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate (A). Additionally, the lower limit of the filler material (D) is more preferably 10 parts by mass or more but even more preferably 30 or more parts by mass. An upper limit of the filler material (D) is more preferably 100 or fewer parts by mass but even more preferably 80 or fewer parts by mass.
  • a transesterification inhibitor (E) may be further added.
  • the transesterification inhibitor is a compound that may be used to deactivate a transesterification catalyst contained in the polybutylene terephthalate resin (A). It is not specifically defined, but phosphite and phosphate compounds are preferred.
  • phosphite compound one or more of triphenyl phosphite, trinonyl phenyl phosphite, tricresyl phosphite, trimethyl phosphite, triethyl phosphite, tris (2-ethylhexyl)phosphite, tridecyl phosphite, tris (dodecyl) phosphite, tris (tridecyl) phosphite, trioleyl phosphite, 2-ethylhexyl diphenyl phosphite, diphenyl monodecyl phosphite, diphenyl mono (tridecyl) phosphite, phenyl didecyl phosphite, tris (dodecyl) trithiophosphite, diethyl phosphite, bis (2-ethyl
  • the phosphate compound is preferably a compound exemplified and represented by general formula (4):
  • R 6 indicates an alkyl group having one to 30 carbon atoms, and m is 1 or 2.
  • the compound represented by general formula (4) may be specifically exemplified as methyl phosphate, dimethyl phosphate, ethyl phosphate, diethyl phosphate, isopropyl phosphate, diisopropyl phosphate, butyl phosphate, dibutyl phosphate, butoxyethyl phosphate, dibutoxyethyl phosphate, 2-ethyl hexanoate phosphate, di-2-ethyl hexanoate phosphate, octyl phosphate, dioctyl phosphate, isodecyl phosphate, diisodecyl phosphate, isotridecyl phosphate, diisotridecyl phosphate, n-dodecyl phosphate, di (dodecyl) phosphate), octadecyl phosphate, di(octadecyl) phosphate, te
  • the phosphate compound is more preferably octadecyl phosphate or di (octadecyl) phosphate.
  • These phosphate compounds may be used singly or in a combination of two or more thereof.
  • the phosphate compounds listed above may also be used as a metal salt that is formed together with zinc, aluminum or the like.
  • the use of the phosphate compound shows a higher deactivation rate than that of the phosphite compound. Therefore, the phosphate compound is preferred.
  • the content of the transesterification inhibitor (E) is preferably 0.025 to 0.5 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate resin (A).
  • the lower limit of the content of (E) is more preferably 0.03 or more parts by mass but even more preferably 0.1 or more parts by mass.
  • the upper limit of the content of (E) is more preferably 0.3 or fewer parts by mass but even more preferably 0.25 or fewer parts by mass.
  • the nucleating agent (F) used as a crystallization accelerator in the polyester resin composition is not specifically defined, and therefore a substance generally used as a crystallization nucleating agent for a polymer is satisfactory.
  • the nucleating agent (F) may be any one or more selected from inorganic crystallization nucleating agents or organic crystallization nucleating agents.
  • the inorganic crystallization nucleating agent may be exemplified as silica, alumina, zirconia, titania, wollastonite, kaolin, talcum powder, mica, silicon carbide, and the like.
  • aliphatic carboxylamide may be used as the organic crystallization nucleating agents.
  • the aliphatic carboxylamide may be exemplified as an aliphatic monocarboxylic acid amide such as lauroylamide, palmitamide, oleamide, stearamide, erucylamide, behenamide, ricinolamide or hydroxy stearamide; N-substituted aliphatic monocarboxyl amides such as N-oleyl palmitamide, N-oleyl oleamide, N-oleyl stearamide, N-stearyl oleamide, N-stearyl stearamide, N-stearyl erucylamide, N-hydroxymethyl steariamide or N-hydroxymethyl behenamide; an aliphatic bis-carboxylamide such as methylene bis stearamide, ethylene bis-lauroamide, ethylidene bis-decano
  • the sorbitol derivatives may be exemplified as, for example, bis (benzylidene) sorbitol, bis (p-methylbenzylidene) sorbitol, bis (p-ethylbenzylidene) sorbitol, bis (p-chlorobenzylidene) sorbitol, bis (p-bromobenzylidene) sorbitol or sorbitol derivatives obtained by chemical modification of the above-mentioned sorbitol derivatives, and the like.
  • the nucleating agent (F) is preferably at least one selected from the group consisting of silica, alumina, zirconia, titania, wollastonite, kaolin, talcum powder, mica, silicon carbide, ethylene bislauramide or a sorbitol derivative.
  • the content of the nucleating agent (F) is preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the polybutylene terephthalate resin (A). Within this range of mass, the effect of promoting crystallization may be maintained and laser transmittance may be improved.
  • the content of the nucleating agent (F) is more preferably 0.1 or more parts by mass but is even more preferably three or fewer parts by mass but even more preferably two or fewer parts by mass.
  • the polyester resin composition may further include additives such as an antioxidant, a mold-releasing agent, a flame retardant or color master batches.
  • the antioxidant is preferably at least one of a phenolic antioxidant or a sulfur antioxidant. To achieve better heat resistance and higher thermal stability, the combined use of the phenol-based antioxidant and the sulfur antioxidant is preferred.
  • the phenolic antioxidant may be exemplified as, for example, 2,4-dimethyl-6-tert -butylphenol, 2,6-di-tert-butylphenol, 2,6-di-tert-butyl-p-cresol, 2,6-di-tert-butyl-4-ethylphenol, 4,4′-butylene bis (6-tert-butyl-3-methylphenol), 2,2′-methylene bis (4-methyl 6-tert-butylphenol), 2,2′-methylene-bis (4-ethyl-6-tert-butylphenol), octadecyl-3-(3′,5′-di-tert-butyl-4′-hydroxybenzene) propionate, pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxybenzene)]propionate], 1,1,3-tris (2-methyl-4-hydroxy-5-di-tert-buty
  • the sulfur antioxidant may be exemplified as, for example, dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, bis (tridecane) thiodipropionate, pentaerythryl(3-lauryl thiopropionate) or 2-mercapto benzimidazole, and the like.
  • antioxidants may be used singly but may also be used in combination of more thereof, since a synergistic effect would be produced by combining two or more antioxidants.
  • the content of the antioxidant is preferably 0.01 to 3 parts by mass with respect to the total of 100 parts by mass of the polybutylene terephthalate (A) and the amorphous resin (B). Within this range, an anti-oxidation effect may be maintained, and a gas may be suppressed from being generated during melt processing.
  • the content is more preferably 0.05 or more parts by mass but even more preferably 0.1 or more parts by mass. Additionally, the content is preferably two or fewer parts by mass but even more preferably one or fewer parts by mass.
  • the mold-releasing agent is not specifically defined, and any mold-releasing agent for general thermoplastic resins may be used.
  • the mold-releasing agent may be exemplified as fatty acid, fatty acid metal salt, hydroxy fatty acid, fatty acid ester, aliphatic partially saponified ester, paraffin, low-molecular-weight polyolefin, fatty acid amide, alkylene fatty acid bis-amide, aliphatic ketone, fatty acid lower alcohol ester, fatty acid polyol ester, fatty acid polyglycol ester or modified polysiloxane, and the like.
  • the fatty acid is preferably a fatty acid having 6 to 40 carbon atoms and may be specifically exemplified as oleic acid, lauric acid, stearic acid, hydroxystearic acid, behenic acid, arachidonic acid, linoleic acid, linolenic acid, ricinoleic acid, palmitic acid, stearic acid, montanic acid or a mixture thereof.
  • the fatty acid metal salt is preferably a fatty-acid alkali metal salt or alkaline earth metal salt having 6 to 40 carbon atoms and may be specifically exemplified as calcium stearate, sodium montanate or calcium montanate, and the like.
  • the hydroxy fatty acid may be exemplified as 1,2-hydroxy fatty acid, and the like.
  • the fatty acid ester may be exemplified as stearate, oleate, linoleate, linolenate, adipate, behenate, arachidonate, montanate, isostearate or polymeric acid ester, and the like.
  • the aliphatic partially saponified ester may be exemplified as partially saponified montanate.
  • the paraffin preferably has 18 or more carbon atoms and may be exemplified as liquid paraffin, natural paraffin, microcrystalline wax or petrolatum, and the like.
  • the low-molecular-weight polyolefin preferably has a weight-average molecular weight of 5,000 or less and may be specifically exemplified as polyethylene wax, maleic acid-modified polyethylene wax, oxidized polyethylene wax, chlorinated polyethylene wax or polypropylene wax.
  • the fatty acid amide preferably has six or more carbon atoms and may be specifically exemplified as oleamide, erucylamide or behenic amide, and the like.
  • the alkylene bis-fatty acid amide preferably has six or more carbon atoms and may be specifically exemplified as methylene bis stearamide, ethylene bis stearamide or N,N-bis (2-hydroxylethyl) stearamide, and the like.
  • the aliphatic ketone may be exemplified as higher aliphatic ketone, and the like.
  • the fatty acid low alcohol ester preferably has six or more carbon atoms and may be specifically exemplified as ethyl stearate, butyl stearate, ethyl behenate or rice wax, and the like.
  • the fatty acid polyol ester may be exemplified as glycerol monostearate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol adipate stearate, dipentaerythritol adipate stearate or sorbitan monobehenate, and the like.
  • the fatty acid polyglycol ester may be exemplified as polyethylene glycol fatty acid ester or polypropylene glycol fatty acid ester.
  • the modified polysiloxane may be exemplified as methyl styryl-modified polysiloxane, polyether-modified polysiloxane, high fatty acid alkoxy-modified polysiloxane, higher fatty acid-containing polysiloxane, high fatty acid ester-modified polysiloxane, methacrylic acid-modified polysiloxane or fluorine-modified polysiloxane, and the like.
  • the flame retardant described above may also be exemplified as a chlorine-based flame retardant, including chlorinated paraffin, chlorinated polyethylene, perchlorocyclopentadecane or tetrachlorophthalic anhydride, and the like.
  • the polyester resin composition For the polyester resin composition, with a differential scanning calorimeter in a nitrogen environment, the polyester resin composition is cooled from a molten state to 20° C. at a cooling rate of 20° C./min and then heated at a heating-up rate of 20° C./min, wherein an endothermic peak during the heat-up occurs at the temperature of higher than 210° C. but lower than 221° C.
  • the compatibility between the polybutylene terephthalate resin (A) and the amorphous resin (B) is improved, the transmittance is improved and the polyester resin composition with excellent heat resistance may be obtained.
  • the upper limit of the endothermic peak temperature is preferably 220° C. or lower but more preferably 219° C. or lower.
  • the lower limit of the endothermic peak temperature is preferably 215° C. or higher but more preferably 217° C. or higher.
  • the polyester resin composition may be produced by the following production method:
  • the main components (A), (B), (C) and the components (E), (F) and the like added as needed are mixed in a commonly used melt mixer such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader and a mixer in accordance with corresponding melt-mixing methods.
  • a commonly used melt mixer such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader and a mixer in accordance with corresponding melt-mixing methods.
  • the polyester resin composition may be prepared by injection molding, extrusion molding and other methods to obtain a molded product.
  • the mold temperature is preferably more than 40° C. but less than 250° C., and it is contemplated that the advantages of high molding efficiency and good appearance of the molded product may be achieved when the curing is performed in a temperature range of more than the glass transition temperature but less than the melting point of the polybutylene terephthalate resin (A). Therefore, the mold temperature is preferably more than 60° C. but less than 140° C.
  • the polyester resin composition is molded under the conditions of a molding temperature of 260° C. and a mold temperature of 80° C. to prepare a molded product with a thickness of 1 mm, which has the transmittance of preferably more than 48% as measured with a spectrophotometer under the condition of a wavelength of 940 nm.
  • the molded product has high transmittance and may be used as a transmission material for laser welding.
  • the transmittance here refers to a value measured by the spectrophotometer with an integrating sphere as a detector.
  • the thickness of the molded product is not specifically defined, the thickness of the laser transmitting portion of the molded product is preferably 3 mm or less from the standpoint of improving the transmittance.
  • compositions and molded products will be further illustrated in the following examples, which are provided here merely for the purpose of illustration rather than limiting the range thereof.
  • Raw materials and test devices as used in the following examples are shown herein:
  • PBT Polybutylene terephthalate resin
  • PC Polycarbonate
  • HP-7200H from DIC Corporation (a novolac epoxy resin with an aromatic glycidyl ether structure, with an epoxy value of 280 g/eq)
  • HP4700 from DIC Corporation (a naphthalene epoxy resin with an aromatic glycidyl ether structure, with an epoxy value of 160 g/eq)
  • Hexion Cardura E10P branched alkane glycidyl carboxylate, with an epoxy value of 244 g/eq
  • Glass fibers T187 from Nippon Electric Glass Corporation
  • AX71 (a mixture of distearic acid phosphate and stearic acid phosphate) from ADEKA Corporation
  • Nucleating agent 1 Hightron (talcum powder) from Takehara Chemical Industry Corporation
  • Nucleating agent 2 Ethylene bislauramide (EBL) from Guangzhou Ouying Chemical Co., Ltd.
  • the transmittance was evaluated by using an ultraviolet near-infrared spectrophotometer (UV-3100) manufactured by Shimadzu Corporation. Additionally, an integrating sphere was used as a detector.
  • UV-3100 ultraviolet near-infrared spectrophotometer
  • the light transmittance of a sample with a thickness of 1 mm was measured in a near-infrared region at the wavelength of 940 nm, and a ratio of the amount of transmitted light to the amount of incident light was expressed in percentage in the table.
  • the transmittance was measured every 10 nm, and the maximum and minimum transmittances in the near-infrared region at the wavelength of 940 nm were determined. The measurement was performed five times to determine the average value of the upper limit and the lower limit.
  • the polyester resin composition prepared in each of the Examples and Comparative Examples was accurately weighed to 5-7 mg and then heated at a heating-up rate of 20° C/min in a nitrogen atmosphere from 20° C. to a temperature 30° C. higher than the temperature T0 of an endothermic peak that appeared; the polyester resin composition was maintained at this temperature for two minutes and then cooled to 20° C. at a cooling rate of 20° C./min; and the polyester resin composition was maintained at 20° C. for two minutes and then heated again at a heating-up rate of 20° C./min to a temperature 30° C. higher than T0, thereby obtaining the melting point Tm.
  • Tm indicates the temperature corresponding to a tip of the endothermic peak during the secondary heating process.
  • the extruder was provided with 13 heating zones and two sets of feeding apparatuses with measuring instruments and was also provided with a vacuum exhaust device.
  • other raw materials were mixed and then added from a main feeding port of the extruder, and the glass fibers were added from a side feeding port of the extruder.
  • the temperature of the extruder was set within the range of 100° C. to 260° C. All the materials were molten and mixed, cooled and granulated to obtain a granular polyester resin composition. The granules were dried in an oven at 130° C.
  • test piece was tested based on the above-mentioned transmittance and melting point test methods, with the test results shown in Table 1.
  • a preparation method is the same as that in Example 1, the raw materials are shown in Table 2, and the test is conducted based on the above-mentioned transmittance and melting point test methods, with the test results shown in Table 2.
  • Example 1 Example 2
  • Example 3 Example 4
  • Example 5 Example 6
  • Example 7 PBT Parts by mass 100 100 100 100 100 100 100 100 100 100 PC S1000 Parts by mass 25 25 33.3 33.3 81.8 33.3 PCTG EB062 Parts by mass 57.5
  • Transesterification AX71 Parts by mass 0.179 0.179 0.19 0.19 0.26 0.19 0.057 inhibitor
  • Nucleating Hightron Parts by mass 0.446 0.476 0.65 0.476 agent EBL Parts by mass 0.446 Tm ° C. 220 219 218 218 217 218 220 Transmittance at 1 mmt % 49 55 54 51 74 50 63
  • the amorphous resin (B) and the specific epoxy resin (C) as the specific components are satisfactory and the requirement that the melting point of the composition (under the test conditions specified by DSC) is higher than 210° C. but lower than 221° C. is met, the transmittance (>48%) of the resin composition is far higher than that of the resin composition that does not meet the above conditions at the same time.
  • Example 1 As can be seen from the comparison between Example 1 and Comparative Example 7, in addition to the specific contents of the polybutylene terephthalate resin (A), the amorphous resin (B) and the specific epoxy resin (C), the effect of improving the transmittance according to our resin compositions can also be achieved by allowing the melting point of the resin composition to be within our specific range.

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