US20160001418A1 - Cmp apparatus and cmp method - Google Patents

Cmp apparatus and cmp method Download PDF

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Publication number
US20160001418A1
US20160001418A1 US14/768,112 US201314768112A US2016001418A1 US 20160001418 A1 US20160001418 A1 US 20160001418A1 US 201314768112 A US201314768112 A US 201314768112A US 2016001418 A1 US2016001418 A1 US 2016001418A1
Authority
US
United States
Prior art keywords
polishing
rotating head
air
contact
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/768,112
Other languages
English (en)
Inventor
Tokinori Terada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEAP Co Ltd
Original Assignee
LEAP Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEAP Co Ltd filed Critical LEAP Co Ltd
Priority to PCT/JP2013/000917 priority Critical patent/WO2014128754A1/ja
Assigned to LEAP CO., LTD. reassignment LEAP CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TERADA, Tokinori
Publication of US20160001418A1 publication Critical patent/US20160001418A1/en
Abandoned legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
US14/768,112 2013-02-19 2013-02-19 Cmp apparatus and cmp method Abandoned US20160001418A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/000917 WO2014128754A1 (ja) 2013-02-19 2013-02-19 Cmp装置及びcmp方法

Publications (1)

Publication Number Publication Date
US20160001418A1 true US20160001418A1 (en) 2016-01-07

Family

ID=50396574

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/768,112 Abandoned US20160001418A1 (en) 2013-02-19 2013-02-19 Cmp apparatus and cmp method

Country Status (6)

Country Link
US (1) US20160001418A1 (zh)
JP (1) JP5432421B1 (zh)
KR (1) KR20150121029A (zh)
CN (1) CN105009257A (zh)
TW (1) TW201501861A (zh)
WO (1) WO2014128754A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170179371A1 (en) * 2015-09-15 2017-06-22 Ngk Insulators, Ltd. Production method for composite substrate
WO2017222999A1 (en) * 2016-06-24 2017-12-28 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10124855B2 (en) 2016-11-14 2018-11-13 Lee Chi Enterprises Company Ltd. Disc brake caliper of bicycle

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931722A (en) * 1996-02-15 1999-08-03 Tadahiro Ohmi Chemical mechanical polishing apparatus
US6159080A (en) * 1993-11-16 2000-12-12 Applied Materials, Inc. Chemical mechanical polishing with a small polishing pad
US6270392B1 (en) * 1998-06-19 2001-08-07 Nec Corporation Polishing apparatus and method with constant polishing pressure
US6299506B2 (en) * 1997-03-21 2001-10-09 Canon Kabushiki Kaisha Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using
US20020037649A1 (en) * 1999-12-15 2002-03-28 Matsushita Electric Industrial Co., Ltd. Method for carrying out planarization processing
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US6857950B2 (en) * 2000-09-21 2005-02-22 Nikon Corporation Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method
US6913525B2 (en) * 2000-08-22 2005-07-05 Nikon Corporation CMP device and production method for semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757464B2 (ja) * 1988-01-29 1995-06-21 住友金属鉱山株式会社 基板上の薄膜の研磨方法
JPH0727061Y2 (ja) * 1992-09-29 1995-06-21 嘉市郎 芦北 エアーリフター
JPH08162432A (ja) * 1994-11-30 1996-06-21 Ricoh Co Ltd 半導体基板の研磨方法及び研磨装置並びに研磨されたウエハ
JP3076291B2 (ja) * 1997-12-02 2000-08-14 日本電気株式会社 Polishing equipment
JP2000024914A (ja) * 1998-07-03 2000-01-25 Hitachi Ltd 半導体ウエハの研磨装置
JP2004319730A (ja) * 2003-04-16 2004-11-11 Nikon Corp 加工装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
JP2008044063A (ja) * 2006-08-14 2008-02-28 Nikon Corp 研磨装置
KR101004435B1 (ko) * 2008-11-28 2010-12-28 세메스 주식회사 기판 연마 장치 및 이를 이용한 기판 연마 방법

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6159080A (en) * 1993-11-16 2000-12-12 Applied Materials, Inc. Chemical mechanical polishing with a small polishing pad
US5931722A (en) * 1996-02-15 1999-08-03 Tadahiro Ohmi Chemical mechanical polishing apparatus
US6299506B2 (en) * 1997-03-21 2001-10-09 Canon Kabushiki Kaisha Polishing apparatus including holder and polishing head with rotational axis of polishing head offset from rotational axis of holder and method of using
US6270392B1 (en) * 1998-06-19 2001-08-07 Nec Corporation Polishing apparatus and method with constant polishing pressure
US6652354B2 (en) * 1998-06-19 2003-11-25 Nec Corporation Polishing apparatus and method with constant polishing pressure
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US20020037649A1 (en) * 1999-12-15 2002-03-28 Matsushita Electric Industrial Co., Ltd. Method for carrying out planarization processing
US6913525B2 (en) * 2000-08-22 2005-07-05 Nikon Corporation CMP device and production method for semiconductor device
US6857950B2 (en) * 2000-09-21 2005-02-22 Nikon Corporation Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US6974525B2 (en) * 2001-02-12 2005-12-13 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
US8268135B2 (en) * 2001-02-12 2012-09-18 Novellus Systems, Inc. Method and apparatus for electrochemical planarization of a workpiece

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170179371A1 (en) * 2015-09-15 2017-06-22 Ngk Insulators, Ltd. Production method for composite substrate
US9935257B2 (en) * 2015-09-15 2018-04-03 Ngk Insulators, Ltd. Production method for composite substrate
WO2017222999A1 (en) * 2016-06-24 2017-12-28 Applied Materials, Inc. Slurry distribution device for chemical mechanical polishing

Also Published As

Publication number Publication date
TW201501861A (zh) 2015-01-16
JPWO2014128754A1 (ja) 2017-02-02
JP5432421B1 (ja) 2014-03-05
WO2014128754A1 (ja) 2014-08-28
KR20150121029A (ko) 2015-10-28
CN105009257A (zh) 2015-10-28

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Legal Events

Date Code Title Description
AS Assignment

Owner name: LEAP CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:TERADA, TOKINORI;REEL/FRAME:036330/0927

Effective date: 20150810

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION