JP5432421B1 - Ｃｍｐ装置 - Google Patents

Ｃｍｐ装置 Download PDF

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Publication number
JP5432421B1
JP5432421B1 JP2013528872A JP2013528872A JP5432421B1 JP 5432421 B1 JP5432421 B1 JP 5432421B1 JP 2013528872 A JP2013528872 A JP 2013528872A JP 2013528872 A JP2013528872 A JP 2013528872A JP 5432421 B1 JP5432421 B1 JP 5432421B1
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Japan
Prior art keywords
pressure
chemical mechanical
air
polished
mechanical polishing
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Active
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JP2013528872A
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English (en)
Japanese (ja)
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JPWO2014128754A1 (ja
Inventor
常徳 寺田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEAP Co., Ltd
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LEAP Co., Ltd
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Publication of JP5432421B1 publication Critical patent/JP5432421B1/ja
Publication of JPWO2014128754A1 publication Critical patent/JPWO2014128754A1/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2013528872A 2013-02-19 2013-02-19 Ｃｍｐ装置 Active JP5432421B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2013/000917 WO2014128754A1 (ja) 2013-02-19 2013-02-19 Ｃｍｐ装置及びｃｍｐ方法

Publications (2)

Publication Number Publication Date
JP5432421B1 true JP5432421B1 (ja) 2014-03-05
JPWO2014128754A1 JPWO2014128754A1 (ja) 2017-02-02

Family

ID=50396574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013528872A Active JP5432421B1 (ja) 2013-02-19 2013-02-19 Ｃｍｐ装置

Country Status (6)

Country Link
US (1) US20160001418A1 (zh)
JP (1) JP5432421B1 (zh)
KR (1) KR20150121029A (zh)
CN (1) CN105009257A (zh)
TW (1) TW201501861A (zh)
WO (1) WO2014128754A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI599445B (zh) * 2015-09-15 2017-09-21 Ngk Insulators Ltd Method of manufacturing a composite substrate
KR20230165381A (ko) 2016-06-24 2023-12-05 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 슬러리 분배 디바이스
US10124855B2 (en) 2016-11-14 2018-11-13 Lee Chi Enterprises Company Ltd. Disc brake caliper of bicycle
CN112440203B (zh) * 2019-09-03 2022-04-05 芯恩（青岛）集成电路有限公司 一种晶圆研磨系统和晶圆研磨方法
JP2021091033A (ja) 2019-12-10 2021-06-17 キオクシア株式会社 研磨装置、研磨ヘッド、研磨方法、及び半導体装置の製造方法
CN113547445B (zh) * 2020-04-03 2023-03-24 重庆超硅半导体有限公司 一种抛光头中心压力精确监测方法
JP7530237B2 (ja) 2020-08-17 2024-08-07 キオクシア株式会社 研磨装置および研磨方法
WO2023101842A1 (en) * 2021-11-30 2023-06-08 Corning Incorporated Localized polishing fixture and processes of using the same

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757464B2 (ja) * 1988-01-29 1995-06-21 住友金属鉱山株式会社 基板上の薄膜の研磨方法
JPH0727061Y2 (ja) * 1992-09-29 1995-06-21 嘉市郎 芦北 エアーリフター
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08162432A (ja) * 1994-11-30 1996-06-21 Ricoh Co Ltd 半導体基板の研磨方法及び研磨装置並びに研磨されたウエハ
JP3850924B2 (ja) * 1996-02-15 2006-11-29 財団法人国際科学振興財団 化学機械研磨装置及び化学機械研磨方法
JPH10329012A (ja) * 1997-03-21 1998-12-15 Canon Inc 研磨装置および研磨方法
JP3076291B2 (ja) * 1997-12-02 2000-08-14 日本電気株式会社 研磨装置
JP2968784B1 (ja) * 1998-06-19 1999-11-02 日本電気株式会社 研磨方法およびそれに用いる装置
JP2000024914A (ja) * 1998-07-03 2000-01-25 Hitachi Ltd 半導体ウエハの研磨装置
US6602121B1 (en) * 1999-10-28 2003-08-05 Strasbaugh Pad support apparatus for chemical mechanical planarization
US20020037649A1 (en) * 1999-12-15 2002-03-28 Matsushita Electric Industrial Co., Ltd. Method for carrying out planarization processing
JP2002141313A (ja) * 2000-08-22 2002-05-17 Nikon Corp Ｃｍｐ装置及び半導体デバイスの製造方法
JP2002100593A (ja) * 2000-09-21 2002-04-05 Nikon Corp 研磨装置、これを用いた半導体デバイスの製造方法及びこの製造方法により製造された半導体デバイス
US6736952B2 (en) * 2001-02-12 2004-05-18 Speedfam-Ipec Corporation Method and apparatus for electrochemical planarization of a workpiece
JP2004319730A (ja) * 2003-04-16 2004-11-11 Nikon Corp 加工装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
JP2008044063A (ja) * 2006-08-14 2008-02-28 Nikon Corp 研磨装置
KR101004435B1 (ko) * 2008-11-28 2010-12-28 세메스 주식회사 기판 연마 장치 및 이를 이용한 기판 연마 방법

Also Published As

Publication number Publication date
JPWO2014128754A1 (ja) 2017-02-02
CN105009257A (zh) 2015-10-28
TW201501861A (zh) 2015-01-16
KR20150121029A (ko) 2015-10-28
US20160001418A1 (en) 2016-01-07
WO2014128754A1 (ja) 2014-08-28

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