US20150096682A1 - Chemical liquid container replacement device, container mounting module, chemical liquid container replacement method, and substrate processing apparatus - Google Patents

Chemical liquid container replacement device, container mounting module, chemical liquid container replacement method, and substrate processing apparatus Download PDF

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Publication number
US20150096682A1
US20150096682A1 US14/508,005 US201414508005A US2015096682A1 US 20150096682 A1 US20150096682 A1 US 20150096682A1 US 201414508005 A US201414508005 A US 201414508005A US 2015096682 A1 US2015096682 A1 US 2015096682A1
Authority
US
United States
Prior art keywords
chemical liquid
container
block
liquid container
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/508,005
Other languages
English (en)
Inventor
Tsunenaga Nakashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013211066A external-priority patent/JP5987807B2/ja
Priority claimed from JP2013211079A external-priority patent/JP5987808B2/ja
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Assigned to TOKYO ELECTRON LIMITED reassignment TOKYO ELECTRON LIMITED ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKASHIMA, TSUNENAGA
Publication of US20150096682A1 publication Critical patent/US20150096682A1/en
Priority to US16/666,717 priority Critical patent/US11630392B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
US14/508,005 2013-10-08 2014-10-07 Chemical liquid container replacement device, container mounting module, chemical liquid container replacement method, and substrate processing apparatus Abandoned US20150096682A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/666,717 US11630392B2 (en) 2013-10-08 2019-10-29 Substrate processing apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-211079 2013-10-08
JP2013-211066 2013-10-08
JP2013211066A JP5987807B2 (ja) 2013-10-08 2013-10-08 薬液容器交換装置、容器載置モジュール及び薬液容器の交換方法
JP2013211079A JP5987808B2 (ja) 2013-10-08 2013-10-08 基板処理装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US16/666,717 Division US11630392B2 (en) 2013-10-08 2019-10-29 Substrate processing apparatus

Publications (1)

Publication Number Publication Date
US20150096682A1 true US20150096682A1 (en) 2015-04-09

Family

ID=52776008

Family Applications (2)

Application Number Title Priority Date Filing Date
US14/508,005 Abandoned US20150096682A1 (en) 2013-10-08 2014-10-07 Chemical liquid container replacement device, container mounting module, chemical liquid container replacement method, and substrate processing apparatus
US16/666,717 Active 2035-09-03 US11630392B2 (en) 2013-10-08 2019-10-29 Substrate processing apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US16/666,717 Active 2035-09-03 US11630392B2 (en) 2013-10-08 2019-10-29 Substrate processing apparatus

Country Status (3)

Country Link
US (2) US20150096682A1 (zh)
KR (1) KR102245902B1 (zh)
TW (1) TWI584351B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9989855B2 (en) 2016-02-18 2018-06-05 Samsung Electronics Co., Ltd. Chemical supply unit capable of automatically replacing a canister and a substrate treatment apparatus having the same
CN111263973A (zh) * 2017-11-01 2020-06-09 东京毅力科创株式会社 处理液供给系统、处理液供给装置和承载器保管装置
US11199785B2 (en) * 2019-10-02 2021-12-14 Tokyo Electron Limited Coating and developing apparatus and coating and developing method
US11322346B2 (en) 2020-09-18 2022-05-03 Samsung Electronics Co., Ltd. Cleaning substrate method and method of processing substrate using the same
US20220206392A1 (en) * 2020-12-30 2022-06-30 Semes Co., Ltd. Nozzel standby port, apparatus for treating substrate including the same and method for cleaning nozzle using the same
US20220258198A1 (en) * 2021-02-15 2022-08-18 SCREEN Holdings Co., Ltd. Substrate processing apparatus and method of machining tubular guard
WO2022197475A3 (en) * 2021-03-16 2022-10-20 Anderson Group, Ltd Adjustable linear substrate infusion

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102527659B1 (ko) 2017-11-27 2023-05-03 삼성전자주식회사 공기청정기
KR102040716B1 (ko) * 2018-07-10 2019-11-06 에이엠티 주식회사 가스통 자동 교체방법
KR20200117199A (ko) * 2019-04-03 2020-10-14 캡시스템(주) 디스플레이 제조용 잉크젯 프린터에 이용되는 약액을 공급하는 약액 공급 장치
TWI802401B (zh) * 2022-05-10 2023-05-11 萬潤科技股份有限公司 液筒安裝機構、液材擠出裝置、塗佈設備及液筒安裝方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979643A (en) * 1985-06-21 1990-12-25 Air Products And Chemicals, Inc. Chemical refill system
JP2000031000A (ja) * 1998-07-15 2000-01-28 Nec Kyushu Ltd 半導体製造装置におけるレジスト液供給装置
US6165255A (en) * 1999-03-12 2000-12-26 United Microelectronics Corp. Chemical-liquid controlling apparatus
JP2010171258A (ja) * 2009-01-23 2010-08-05 Sokudo Co Ltd 基板処理装置及び基板処理方法
US20120181239A1 (en) * 2011-01-18 2012-07-19 Tokyo Electron Limited Chemical liquid supply method and chemical liquid supply system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2874328B2 (ja) * 1990-10-29 1999-03-24 味の素株式会社 自動前処理装置
JPH0582896A (ja) 1991-09-19 1993-04-02 Mitsubishi Electric Corp 半導体レーザ装置
JPH0582896U (ja) 1992-04-14 1993-11-09 東京応化工業株式会社 液体の連続供給装置
JP3798454B2 (ja) * 1995-10-25 2006-07-19 正二 湯山 薬品容器の識別装置を備えた調剤台
JP4030697B2 (ja) * 1999-10-20 2008-01-09 東京エレクトロン株式会社 基板処理装置
JP3367655B2 (ja) * 1999-12-24 2003-01-14 島田理化工業株式会社 めっき処理装置及びめっき処理方法
KR100797435B1 (ko) * 2000-06-30 2008-01-24 동경 엘렉트론 주식회사 액처리장치
JP2003071367A (ja) 2001-09-04 2003-03-11 Tokyo Electron Ltd 液処理装置
JP3986854B2 (ja) * 2002-03-14 2007-10-03 富士通株式会社 薬液塗布装置及びその薬液管理方法
JP4685584B2 (ja) * 2005-03-11 2011-05-18 東京エレクトロン株式会社 塗布、現像装置
JP4251580B1 (ja) * 2008-01-08 2009-04-08 Ｔｄｋ株式会社 被収容物搬送システム
JP5371854B2 (ja) 2010-03-26 2013-12-18 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP5610009B2 (ja) * 2013-02-26 2014-10-22 東京エレクトロン株式会社 基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4979643A (en) * 1985-06-21 1990-12-25 Air Products And Chemicals, Inc. Chemical refill system
JP2000031000A (ja) * 1998-07-15 2000-01-28 Nec Kyushu Ltd 半導体製造装置におけるレジスト液供給装置
US6165255A (en) * 1999-03-12 2000-12-26 United Microelectronics Corp. Chemical-liquid controlling apparatus
JP2010171258A (ja) * 2009-01-23 2010-08-05 Sokudo Co Ltd 基板処理装置及び基板処理方法
US20120181239A1 (en) * 2011-01-18 2012-07-19 Tokyo Electron Limited Chemical liquid supply method and chemical liquid supply system

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9989855B2 (en) 2016-02-18 2018-06-05 Samsung Electronics Co., Ltd. Chemical supply unit capable of automatically replacing a canister and a substrate treatment apparatus having the same
CN111263973A (zh) * 2017-11-01 2020-06-09 东京毅力科创株式会社 处理液供给系统、处理液供给装置和承载器保管装置
US11521854B2 (en) * 2017-11-01 2022-12-06 Tokyo Electron Limited Processing liquid supply system, processing liquid supply apparatus, and carrier storage apparatus
US11199785B2 (en) * 2019-10-02 2021-12-14 Tokyo Electron Limited Coating and developing apparatus and coating and developing method
US11322346B2 (en) 2020-09-18 2022-05-03 Samsung Electronics Co., Ltd. Cleaning substrate method and method of processing substrate using the same
US20220206392A1 (en) * 2020-12-30 2022-06-30 Semes Co., Ltd. Nozzel standby port, apparatus for treating substrate including the same and method for cleaning nozzle using the same
US20220258198A1 (en) * 2021-02-15 2022-08-18 SCREEN Holdings Co., Ltd. Substrate processing apparatus and method of machining tubular guard
US11819872B2 (en) * 2021-02-15 2023-11-21 SCREEN Holdings Co., Ltd. Substrate processing apparatus and method of machining tubular guard
WO2022197475A3 (en) * 2021-03-16 2022-10-20 Anderson Group, Ltd Adjustable linear substrate infusion

Also Published As

Publication number Publication date
US20200064741A1 (en) 2020-02-27
US11630392B2 (en) 2023-04-18
KR20150041587A (ko) 2015-04-16
TWI584351B (zh) 2017-05-21
TW201529450A (zh) 2015-08-01
KR102245902B1 (ko) 2021-04-29

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Effective date: 20141006

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STPP Information on status: patent application and granting procedure in general

Free format text: FINAL REJECTION MAILED

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION