US20140203260A1 - Display device - Google Patents

Display device Download PDF

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Publication number
US20140203260A1
US20140203260A1 US14/161,717 US201414161717A US2014203260A1 US 20140203260 A1 US20140203260 A1 US 20140203260A1 US 201414161717 A US201414161717 A US 201414161717A US 2014203260 A1 US2014203260 A1 US 2014203260A1
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US
United States
Prior art keywords
display device
display area
film
conductive film
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/161,717
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English (en)
Inventor
Takeshi Ookawara
Toshihiro Sato
Hiroshi Oooka
Kouhei Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Display Inc
Original Assignee
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Display Inc filed Critical Japan Display Inc
Assigned to JAPAN DISPLAY INC. reassignment JAPAN DISPLAY INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: TAKAHASHI, KOUHEI, OOKAWARA, TAKESHI, OOOKA, HIROSHI, SATO, TOSHIHIRO
Publication of US20140203260A1 publication Critical patent/US20140203260A1/en
Priority to US14/977,060 priority Critical patent/US9634080B2/en
Priority to US15/433,616 priority patent/US9871092B2/en
Abandoned legal-status Critical Current

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Classifications

    • H01L27/32
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • H01L51/5203
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/127Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
    • H10K59/1275Electrical connections of the two substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80524Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • the present invention relates to a display device, and more particularly to a thin display device having thin film transistors formed on an insulating substrate.
  • liquid crystal display device As display devices for information communication terminals such as a computer, or television receivers, flat display devices including a liquid crystal display device and an organic EL (electro-luminescent) display device have extensively been used.
  • the liquid crystal display device is designed to change an orientation of a liquid crystal composition sealed between two substrates according to a change in electric field, and control a transmission degree of light that passes through those two substrates and the liquid crystal composition to display an image.
  • the organic EL display device is designed to use a self-luminous body such as organic light emitting diodes.
  • the organic EL display device is not only excellent in visibility and response speed, but also requires no auxiliary lighting device such as a backlight because a self-luminous body is used. For that reason, the organic EL display device can be thinned more than the liquid crystal display device.
  • JP-A-2011-108459 discloses a structure in which an oxide conductive film is laminated on an aluminum based alloy film containing Ag in a reflection anode electrode of the organic EL display device.
  • the device is required to be further downsized and thinned, and a frame area formed around a display area is required to be more reduced.
  • the present invention has been made in view of the above circumstances, and aims at providing a display device that reduces the frame area.
  • a display device including: a display area in which pixels are arranged on a substrate; and a frame area that surrounds the display area, in which the display area includes: pixel circuits arranged for the respective pixels; an insulating film formed on the pixel circuits; pixel electrodes each connected to the pixel circuit through a through-hole formed in the insulating film; an organic layer arranged on the pixel electrodes, and including a light emitting layer; and a transparent conductive film arranged on the organic layer, in which the frame area includes: a conductive film; contact holes opened in the insulating film covering the conductive film, and continuously arranged from the display area to the frame area, and exposing the conductive film at bottom portions thereof; and a first metal film formed to cover the contact holes, and come in contact with the conductive film at the bottom portions, and in which the transparent conductive film is continuously arranged from the display area to the frame area, and formed on the first metal film.
  • the transparent conductive film may be formed of an electrode that covers the overall display area.
  • the first metal film may be formed only on the frame area, or cover the overall display area together with the transparent conductive film.
  • the display device may further include a second metal film formed on the transparent conductive film so as to cover the overall display area.
  • the contact holes may be discretely formed in a plurality of places outside of the display area, or formed outside of one of two pairs of opposed sides forming a rectangle of the display area.
  • the pixels formed in the display area may each have an organic light emitting layer that emits light by itself.
  • FIG. 1 is a diagram illustrating an organic EL display device according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram illustrating a circuit formed on a glass substrate configuring an organic EL panel of FIG. 1 ;
  • FIG. 3 is a cross-sectional view schematically illustrating the organic EL panel taken along a line III-III of FIG. 2 ;
  • FIG. 4 is a schematic diagram illustrating film formation in the vicinity of contact holes in FIG. 2 ;
  • FIG. 5 is a diagram illustrating a first modified example of a cathode electrode film in FIG. 4 ;
  • FIG. 6 is a diagram illustrating a second modified example of the cathode electrode film in FIG. 4 ;
  • FIG. 7 is a cross-sectional view schematically illustrating contact holes according to a comparative example 1.
  • FIG. 8 is a cross-sectional view schematically illustrating contact holes according to a comparative example 2.
  • FIG. 1 is a diagram illustrating an organic EL display device 100 which is a display device according to the embodiment of the present invention.
  • the organic EL display device 100 includes an upper frame 110 and a lower frame 120 which are fixed to sandwich an organic EL panel 200 therebetween, a circuit substrate 140 having a circuit element for generating information to be displayed, and a flexible substrate 130 that transmits display information generated in the circuit substrate 140 to the organic EL panel 200 .
  • FIG. 2 schematically illustrates a circuit formed on a glass substrate 201 configuring the organic EL panel 200 in FIG. 1 .
  • the glass substrate 201 includes a display area 300 in which pixels 310 each having an organic light emitting element are arranged in a matrix, data signal lines 222 that each transmit a data signal corresponding to a gray-scale value for display to an anode electrode of each pixel, a data signal driver circuit 221 that controls a voltage to be applied to the data signal lines 222 , a cathode electrode film 210 which is cathode electrodes for each pixel, and arranged to cover the display area 300 , and cathode voltage terminals 211 that each apply a cathode voltage to the cathode electrode film 210 through each of cathode electrode lines 212 and each of contact holes 213 .
  • the contact holes 213 are formed outside of one of two pair of opposed sides forming the rectangular display area 300 .
  • the contact holes 213 are not formed outside of the other pair of opposed sides, and a frame area outside of the display area 300 can be reduced.
  • the number of pixels 310 is omitted for preventing the figure from being complicated and the figure is simplified.
  • FIG. 3 schematically illustrates a cross-section of the organic EL panel 200 taken along a line III-III in FIG. 2 .
  • the organic EL panel 200 has a circuit formed on the glass substrate 201 , and is sealed by a sealing substrate 238 and a sealant 239 so as to prevent moisture from entering a periphery of the circuit.
  • the glass substrate 201 is formed with the display area in which the plurality of pixels is arranged, and the frame area surrounding the display area.
  • a pixel circuit 311 arranged for each of the pixels, a flattened film 232 formed on the pixel circuit 311 , a pixel electrode 235 connected to the pixel circuit 311 , an organic layer 236 arranged on the pixel electrode 235 , and a transparent conductive film 215 configuring the cathode electrode film 210 arranged on the organic layer 236 are arranged as a counter electrode.
  • the pixel electrode is an anode to which a current is supplied.
  • the flattened film 232 is a layer that separates a pixel electrode layer from a pixel circuit layer, and is formed of an insulating film.
  • the pixel electrode 235 is connected to the pixel circuit through a through-hole formed in the flattened film 232 .
  • the organic layer 236 is formed in a single layer or a multilayer. In the case of the multilayer, the organic layer 236 includes a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.
  • the counter electrode is a cathode electrode, formed of the transparent conductive film 215 , and allows a light emitted from the light emitting layer to penetrate at a panel front surface side.
  • An interlayer insulating film 231 is an insulating layer formed in the pixel circuit layer, and ensures insulation between the circuit and the wiring.
  • the cathode electrode line 212 that is a conductive film is formed in the frame area.
  • the interlayer insulating film 231 , the flattened film 232 , and an interpixel insulating film 233 are formed of insulating films continuously arranged from the display area to the frame area.
  • the insulating films are arranged to cover the conductive film in the frame area.
  • the contact hole 213 is a hole formed for bringing the cathode electrode film 210 into contact with the cathode electrode lines 212 .
  • the contact hole 213 is formed in films of the interlayer insulating film 231 , the flattened film 232 , and the interpixel insulating film 233 .
  • the pixel 310 is arranged so that the pixel electrode 235 connected to the data signal line 222 sandwiches the organic layer 236 in cooperation with the cathode electrode film 210 .
  • a current that flows due to a potential difference between the cathode electrode film 210 and the pixel electrode 235 causes the organic layer 236 to emit light.
  • the emitted light penetrates through the cathode electrode film 210 , and is displayed as an image for a user on the sealing substrate 238 side.
  • the cathode electrode film 210 is formed by forming a metal film 216 and the transparent conductive film 215 in sequence.
  • the sealant 239 is arranged further outside of the contact holes 213 .
  • the sealant 239 may be formed to partially or entirely cover the contact hole 213 .
  • FIG. 7 is a cross-sectional view schematically illustrating a contact hole 913 according to a comparative example 1 for describing this embodiment.
  • a cathode electrode film 910 formed to cover the display area is formed by laminating a transparent electrode 915 and a metal film 917 in the contact hole 913 in sequence.
  • the transparent electrode 915 is made of, for example, ITO (indium tin oxide) or InZnO, which is high in transparency, and also high in resistance value. Therefore, the metal film 917 that is, for example, a thin film made of Ag or Mg—Ag alloy which is low in the transparency and also low in the resistance value is formed on the transparent electrode 915 , for the purpose of the higher transparency and the lower resistance value.
  • the transparent electrode 915 is formed by sputtering.
  • coating may sometimes be insufficient due to a difference in a shape of a step of the contact hole, or a coated material.
  • a portion A in FIG. 7 represents a void which is a portion where the transparent electrode film does not sufficiently contact with the film of the contact hole 913 .
  • the void is present, but an area of the portion where the transparent electrode 915 does not contact with the cathode electrode line 212 is sufficiently smaller than an area of a contact portion. Therefore, it is conceivable that the void hardly affects the operation of the display device.
  • a rate of the area of the portion that does not contact with the cathode electrode line 212 becomes higher, and the higher resistance and also disconnection are conceivable. Also, even if the transparent electrode 915 contacts with the cathode electrode line 212 at the time of manufacturing, it is conceivable that the higher resistance or disconnection is issued due to use because the durability is low.
  • the metal film 216 and the transparent conductive film 215 are formed on the cathode electrode line 212 in the contact hole 213 in sequence.
  • the metal film 216 is formed through a vacuum deposition method having an oblique component such as rotational film formation or oblique deposition. With this process, even if the cathode electrode lines 212 is sufficiently coated by the metal film 216 , and an exposed area of the cathode electrode line 212 in the contact hole 213 is small, the cathode electrode line 212 is connected to the metal film 216 with a low resistance.
  • the metal film 216 does not cover the display area 300 , but covers only the periphery of the contact hole 213 , and only the transparent conductive film 215 formed on the metal film 216 covers the display area 300 .
  • the metal film 216 can be made of Ag or Mg—Ag alloy, but also opaque metal having a high melting point such as Al, Mg, or W.
  • the transparent conductive film 215 is made of, for example, ITO or InZnO by sputtering.
  • the line exposed in the bottom of the contact hole can be coated without the production of the void, and even if the area of the contact hole is reduced, the higher resistance and the disconnection can be prevented.
  • the area of the contact holes formed around the display area can be reduced, the frame area formed around the display area can be reduced. Also, because no void is generated, moisture and a chemical do not remain, and the degrading of a quality caused by diffusion of those remainders can be prevented, and the display device high in reliability can be provided.
  • the contact holes 213 are discretely formed in a plurality of places, even if a failure such as the disconnection occurs in any place, the contact holes 213 function in other places, to thereby enable the display device to operate.
  • the contact holes 213 are installed along one of two pairs of opposed sides, the frame area outside of the other pair of opposed sides can be reduced.
  • FIG. 5 illustrates a cathode electrode film 410 that is a first modified example of the cathode electrode film 210 in FIG. 4 .
  • a difference from the cathode electrode film 210 resides in that a metal film 417 is further formed on the transparent conductive film 215 .
  • the metal film 417 is formed to cover the display area 300 together with the transparent conductive film 215 .
  • the metal film 417 needs to have the transparency, it is desirable that the metal film 417 is formed of a thin film of Ag or Mg—Ag alloy. As a result, the resistance can be lowered particularly in the display area of the cathode electrode film 410 .
  • FIG. 6 illustrates a cathode electrode film 510 which is a second modified example of the cathode electrode film 210 .
  • Differences from the cathode electrode film 210 in FIG. 4 reside in that the metal film 417 is further formed on the transparent conductive film 215 as in FIG. 5 , and a metal film 516 formed below the transparent conductive film 215 covers the display area 300 .
  • the metal film 516 needs to have the transparency, it is desirable that the metal film 516 is formed of a thin film of Ag or Mg—Ag alloy.
  • the resistance can be further lowered in the display area of the cathode electrode film 510 .
  • only the metal film below the transparent conductive film 215 can be configured to cover the display area without formation of the metal film on the transparent conductive film 215 .
  • the electrode connected by the contact hole is the cathode electrode film, but may be anode electrode, or an electrode defined by another expression.
  • a top emission type organic EL display device is exemplified.
  • the present invention may be applied to a bottom emission type organic EL display device, another display device using self-emission display elements, or another display such as a liquid crystal display device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
US14/161,717 2013-01-23 2014-01-23 Display device Abandoned US20140203260A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US14/977,060 US9634080B2 (en) 2013-01-23 2015-12-21 Display device
US15/433,616 US9871092B2 (en) 2013-01-23 2017-02-15 Display device with reduced frame size

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013010224A JP6231281B2 (ja) 2013-01-23 2013-01-23 表示装置
JP2013-010224 2013-01-23

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US14/977,060 Active US9634080B2 (en) 2013-01-23 2015-12-21 Display device
US15/433,616 Active US9871092B2 (en) 2013-01-23 2017-02-15 Display device with reduced frame size

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US15/433,616 Active US9871092B2 (en) 2013-01-23 2017-02-15 Display device with reduced frame size

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US20210013296A1 (en) * 2018-03-29 2021-01-14 Sharp Kabushiki Kaisha Display device
US20210159289A1 (en) * 2019-05-22 2021-05-27 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Display substrate, method for manufacturing display substrate and display device
US20210343973A1 (en) * 2019-06-03 2021-11-04 Boe Technology Group Co., Ltd. Display substrate, display panel, manufacturing method of display panel and display device

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US9871092B2 (en) 2018-01-16
US20170162645A1 (en) 2017-06-08
KR20140095020A (ko) 2014-07-31
JP2014142456A (ja) 2014-08-07
US20160111486A1 (en) 2016-04-21
US9634080B2 (en) 2017-04-25
JP6231281B2 (ja) 2017-11-15

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