US20130222972A1 - Laminated ceramic electronic component - Google Patents

Laminated ceramic electronic component Download PDF

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Publication number
US20130222972A1
US20130222972A1 US13/856,475 US201313856475A US2013222972A1 US 20130222972 A1 US20130222972 A1 US 20130222972A1 US 201313856475 A US201313856475 A US 201313856475A US 2013222972 A1 US2013222972 A1 US 2013222972A1
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United States
Prior art keywords
internal electrodes
laminated ceramic
less
electronic component
ceramic electronic
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Abandoned
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US13/856,475
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English (en)
Inventor
Yoshito Saito
Yosuke Hirata
Takashi Hiramatsu
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Assigned to MURATA MANUFACTURING CO., LTD. reassignment MURATA MANUFACTURING CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HIRAMATSU, TAKASHI, HIRATA, YOSUKE, SAITO, YOSHITO
Publication of US20130222972A1 publication Critical patent/US20130222972A1/en
Priority to US15/172,199 priority Critical patent/US9972438B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/258—Temperature compensation means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Definitions

  • This invention relates to a laminated ceramic electronic component, and more particularly, relates to an improvement for enhancing the thermal shock resistance of a laminated ceramic electronic component.
  • JP 2005-136132 A discloses a technique for promoting the resistance of a laminated ceramic capacitor to thermal stress.
  • Patent Document 1 discloses a laminated ceramic capacitor including, as a main body section, a laminated body formed by arranging dielectric layers each between a plurality of internal electrodes to be stacked in the stacking direction, and placing a dielectric around the plurality of internal electrodes, characterized in that a pair of upper and lower margin sections (outer layer sections) without any internal electrodes present is each placed between end surfaces (principal surfaces) located in the stacking direction of the laminated body and the internal electrodes closest to the end surfaces (principal surfaces) located in the stacking direction, a pair of right and left margin sections (width-direction gap sections) without any internal electrodes present is each placed between end surfaces (side surfaces) located in a crossing direction with respect to the stacking direction of the laminated body and the ends of the internal electrodes, the upper and lower margin sections (outer layer sections) and the right and left margin sections (width-direction gap sections) each have a dimension of 50 to 200 ⁇ m, and the difference in dimension between the upper and lower margin sections
  • Patent Document 1 reports that a laminated ceramic capacitor which has high resistance to thermal stress is supposed to be achieved even when a large number of internal electrodes are stacked. While thermal shocks are applied to laminated ceramic capacitors in, for example, solder reflow mounting, a thermal stress test at 280° C. is carried out in an example described in Patent Document 1, and thus, the ability to bear this thermal stress test means the ability to withstand thermal shocks in solder reflow mounting.
  • laminated ceramic capacitors have been described above, laminated ceramic electronic components other than laminated ceramic capacitors can encounter the same problem.
  • Patent Document 1 JP 2005-136132 A
  • an object of this invention is to provide a laminated ceramic electronic component which can achieve a higher level of thermal shock resistance.
  • This invention is directed to a laminated ceramic electronic component comprising a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes located between the ceramic layers, the laminated body having a pair of mutually opposed principal surfaces extending in a direction in which the ceramic layers extend, as well as a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces, the side surfaces and the end surfaces respectively extending in directions orthogonal to the principal surfaces, the internal electrodes extracted to either one of the pair of end surfaces, and distributed in an area located with a width-direction gap interposed with respect to each of the pair of side surfaces and located with an outer layer thickness interposed with respect to each of the pair of principal surfaces.
  • a first aspect of this invention is characterized by meeting a first condition that the internal electrode is 0.4 ⁇ m or less in thickness and a second condition that the width-direction gap is 30 ⁇ m or less or the outer layer thickness is 35 ⁇ m or less, in order to solve the technical problem mentioned previously.
  • the first condition that the internal electrode is 0.4 ⁇ m or less in thickness is the same as in the case of the first aspect, while the second condition is both the width-direction gap of 30 ⁇ m or less and the outer layer thickness of 35 ⁇ m or less.
  • This invention is, in a third aspect thereof, adapted to further meet a third condition that a coverage for the internal electrodes is 75% or more, in addition to the first and second conditions in the first or second aspect.
  • the laminated ceramic electronic component according to this invention can adequately withstand, for example, cases such as the laminated ceramic electronic component used near an automobile engine room, or a substrate with the laminated ceramic electronic component thereon, which is further joined with some sort of substrate by welding or the like.
  • the laminated ceramic electronic component can be adapted to withstand a thermal shock of a higher load in the case of meeting the conditions according to the second aspect, as compared with the case of meeting the conditions according to the first aspect, and furthermore, can be adapted to withstand a thermal shock of a higher load in the case of meeting the conditions according to the third aspect, as compared with the case of meeting the conditions according to the second aspect.
  • Patent Document 1 has the idea that, briefly speaking, the upper and lower margin sections (outer layer sections) and the right and left margin sections (width-direction gap sections) are further increased in dimension to 50 ⁇ m or more, to keep cracks caused by thermal stress, if any, from reaching a capacitance forming section.
  • the internal electrodes are reduced in thickness to 0.4 ⁇ m or less to suppress the generation of stress due to the difference in coefficient of thermal expansion, while the width-direction gap and/or the outer layer thickness are reduced in contrast to the case of Patent Document 1 to suppress the generation of structural defects such as cracks due to thermal shocks. More specifically, the concept is that stress itself caused by thermal stress is reduced to suppress the generation of cracks as much as possible.
  • FIG. 1 is a cross-sectional view illustrating a laminated ceramic capacitor as an example of a laminated ceramic electronic component according to an embodiment of this invention.
  • FIG. 2 is an enlarged cross-sectional view along the line II-II of FIG. 1 .
  • FIG. 3 is a diagram showing distributions of a width-direction gap and an outer layer thickness for samples with an internal electrode of 0.4 ⁇ m in thickness among samples prepared in Experimental Example 1, and together showing evaluation results of defect generation for each sample with symbols of • and ⁇ .
  • FIG. 4 is a diagram showing distributions of a width-direction gap and an outer layer thickness for samples with an internal electrode of 0.2 ⁇ m in thickness among samples prepared in Experimental Example 1, and together showing evaluation results of defect generation for each sample with symbols of • and ⁇ .
  • the laminated ceramic capacitor 1 includes a laminated body 2 as a component main body.
  • the laminated body 2 includes a plurality of stacked ceramic layers 3 and a plurality of internal electrodes 4 and 5 located between the ceramic layers 3 .
  • the internal electrodes 4 and the internal electrodes 5 are arranged alternately in the stacking direction.
  • the laminated body 2 forms a cuboidal shape or a substantially cuboidal shape which has a pair of mutually opposed principal surfaces 6 and 7 extending in the direction in which the ceramic layers 3 extend, as well as a pair of mutually opposed side surfaces 8 and 9 and a pair of mutually opposed end surfaces 10 and 11 which respectively extend in directions orthogonal to the principal surfaces 6 and 7 .
  • the end surfaces 10 and 11 of the laminated body 2 respectively have the plurality of internal electrodes 4 and 5 extracted thereto, and the respective ends exposed thereto, and external electrodes 12 and 13 are formed respectively so as to electrically connect the respective ends of the internal electrodes 4 to each other and the respective ends of the internal electrodes 5 to each other.
  • the internal electrodes 4 and 5 are, as shown in FIG. 2 , distributed in an area located with a predetermined width-direction gap A interposed with respect to each of the pair of side surfaces 8 and 9 , and located with a predetermined outer-layer thickness B interposed with respect to each of the pair of principal surfaces 6 and 7 .
  • This laminated ceramic capacitor 1 meets the first condition that the internal electrodes 4 and 5 each have a thickness C of 0.4 ⁇ m or less, and the second condition that the width-direction gap A is 30 ⁇ m or less or the outer-layer thickness B is 35 ⁇ m or less.
  • the capacitor is adapted to meet both the width-direction gap A of 30 ⁇ m or less and the outer-layer thickness B of 35 ⁇ m or less.
  • the capacitor is adapted to meet the third condition that the coverage for the internal electrodes 4 and 5 is 75% or more.
  • the thickness C for each of the internal electrodes 4 and 5 has a lower limit on the order of 0.05 ⁇ m
  • the outer-layer thickness B has a lower limit on the order of 5 ⁇ m
  • the width-direction gap A has a lower limit on the order of 5 ⁇ m.
  • this laminated ceramic capacitor 1 For manufacturing this laminated ceramic capacitor 1 , ceramic green sheets to serve as the ceramic layers 3 are first prepared, and conductive paste films to serve as the internal electrodes 4 and 5 are formed by printing onto the ceramic green sheets. Next, the multiple ceramic green sheets are stacked to prepare an unfired laminated body to serve as the laminated body 2 , which includes a plurality of unfired ceramic layers and the conductive paste films located between the unfired ceramic layers.
  • a firing step is carried out for making the unfired laminated body sintered.
  • the external electrodes 12 and 13 are respectively formed on the end surfaces 10 and 11 of the sintered laminated body 2 , thereby completing the laminated ceramic capacitor 1 .
  • the thickness C for the internal electrodes 4 and 5 is reduced to 0.4 ⁇ m or less in order to meet the first condition mentioned above, it is not easy to meet the third condition that the coverage is kept at 75% or more.
  • the firing temperature is lowered, it is easy to keep the coverage at 75% or more, whereas the ceramic is somewhat insufficiently sintered.
  • a heat treatment step in which a temperature profile is applied at an average rate of temperature increase of 40° C./second or more, preferably 100° C./second or more up to a maximum temperature, and further desirably to carry out cooling without keeping the maximum temperature after reaching the temperature in order to reduce the heat quantity.
  • the firing step is carried out under this condition, the coverage for the internal electrodes 4 and 5 can be kept high while making the ceramic sufficiently sintered.
  • the unfired laminated body is preferably subjected to a degreasing treatment before the heat treatment step described above in the firing step.
  • the heat treatment step may be carried out in an atmosphere supplied with an atmosphere gas which is oxidative with respect to the equilibrium oxygen partial pressure of the base metal.
  • the ceramic layers 3 are composed of dielectric ceramic.
  • this invention may be applied to not only laminated ceramic capacitors, but also inductors, thermistors, piezoelectric components, etc. Therefore, depending on the function of the laminated ceramic electronic component, the ceramic layers may be composed of, in addition to dielectric ceramic, magnetic ceramic, semiconductor ceramic, piezoelectric ceramic, etc.
  • laminated ceramic capacitor 1 shown in FIG. 1 is a two-terminal capacitor including two external terminals 12 and 13
  • this invention can be also applied to multi-terminal laminated ceramic electronic components.
  • Ceramic green sheets including: ceramic powder containing barium titanate as its main constituent; and an organic binder were formed on base films so as to be 1 ⁇ m in thickness after firing. Then, conductive paste films to serve as internal electrodes were formed by screen printing onto the ceramic green sheets, so as to achieve the thickness shown in the column “Thickness of Internal Electrode” in Tables 1 and 2 after the firing. In this case, the dimensions of the printing pattern for the conductive paste films were adjusted so that internal electrodes were distributed in a region located with a width-direction gap interposed as shown in the column “Width-Direction Gap” in Tables 1 and 2, in laminated bodies obtained through subsequent cutting step and firing step.
  • the green sheets with the conductive paste films formed thereon were stacked a predetermined number of times so as to alternate the sides to which the conductive paste films were extracted, and further so as to sandwich these sheets, green sheets for an outer layer section without any conductive paste films formed were stacked a predetermined number of times, and heated and pressed to prepare laminated body blocks.
  • the number of stacked green sheets for an outer layer section was adjusted so as to achieve the “Outer Layer Thickness” in Tables 1 and 2 after the firing.
  • the laminated body blocks were cut with a dicing saw to obtain unfired laminated bodies.
  • the unfired laminated bodies obtained were subjected, for degreasing, to a heat treatment with a maximum temperature of 240° C. in N 2 stream.
  • the laminated bodies were subjected to firing with a maximum temperature of 1180° C. under an atmosphere with an oxygen partial pressure of 10 ⁇ 9.5 MPa in N 2 —H 2 O—H 2 stream.
  • Laminated ceramic capacitors according to each sample were obtained in the way described above.
  • the obtained laminated ceramic capacitors including the external electrodes achieved the external dimensions as shown in the “Length-Direction Dimension”, “Width-Direction Dimension”, and “Thickness-Direction Dimension” of Tables 1 and 2.
  • the laminated ceramic capacitors obtained achieved the values in the “Thickness of Internal Electrode”, “Outer Layer Thickness”, and “Width-Direction Gap” as shown in Tables 1 and 2.
  • Three laminated ceramic capacitors were prepared for each sample. These laminated ceramic capacitors were encased in a resin so as to barely present the end surfaces, and the end surfaces were polished in the length directions of the laminated ceramic capacitors to obtain polished cross sections at 1 ⁇ 2 in the length directions. Next, these polished cross sections were subjected to ion milling to remove drops produced by the polishing. In this way, cross sections for observation were obtained.
  • the group of internal electrodes was divided into three equal parts with respect to the thickness direction of the sample, which were classified in three regions of: an upper area; a middle area; and a lower area.
  • a perpendicular line was drawn which was orthogonal to the internal electrodes and divided the internal electrodes into two equal parts in the width direction. Then, twenty-five layers of internal electrodes were selected from each of the central parts of the three regions, and the thicknesses of these internal electrodes were measured on the perpendicular line.
  • the thickness of the internal electrode was measured at 75 points for one sample, and the thickness of the internal electrode was obtained at 225 points in total for the three samples in total to figure out the average value of these thicknesses. However, the points with the defective internal electrodes were not counted.
  • the cross sections for observation obtained in the section (2), were used for figuring out the outer layer thickness.
  • Seven perpendicular lines were drawn which were orthogonal to the internal electrodes and divided the internal electrodes into six equal parts in the width direction.
  • the outer layer thickness was measured at 10 points in total on both the upper side and lower side. Then, the outer layer thickness was first obtained at 30 points in total for the three samples in total.
  • three laminated ceramic capacitors were further prepared for each sample. These laminated ceramic capacitors were encased in a resin so as to barely present the side surfaces, and the side surfaces were polished in the width directions of the laminated ceramic capacitors to obtain polished cross sections at 1 ⁇ 2 in the width directions. Next, these polished cross sections were subjected to ion milling to remove drops produced by the polishing. In this way, second cross sections for observation were obtained.
  • the coverage for the internal electrodes was about 80% for all of samples 1 to 74 shown in Tables 1 and 2.
  • the laminated body was subjected to peeling, and then, the surface near the center of the internal electrode pattern at the peeled surface was observed under an optical microscope to figure out the ratio of the area with the internal electrode present therein, and regard this ratio as the coverage.
  • the laminated ceramic capacitors according to each sample were subjected to a thermal shock test as follows.
  • the thermal shock test was carried out in which the laminated ceramic capacitors according to each sample were immersed for 2 seconds in a solder bath at a temperature of 500° C., and the presence or absence of structural defect generation was evaluated by optical microscopic observation. This evaluation was performed for hundred samples to figure out the ratio of the number of samples with structural defects generated. The results are shown in the column “Defect Generation Ratio” of Tables 1 and 2.
  • FIGS. 3 and 4 show distributions of the width-direction gap and outer layer thickness for specific samples, and together show the evaluation results of defect generation with symbols of • and ⁇ .
  • FIG. 3 herein shows samples 37 to 55 of 0.4 ⁇ m in the thickness of the internal electrode as shown in Table 2.
  • FIG. 4 shows samples 56 to 65 of 0.2 ⁇ m in the thickness of the internal electrode as shown in Table 2.
  • the defect generation ratio higher than 0% (particularly in FIG. 3 , the defect generation ratio of 100%) is expressed by the symbol •, whereas the defect generation ratio of 0% is expressed by the symbol ⁇ .
  • the case of 0.4 ⁇ m in the thickness of the internal electrode also has the same tendency as in the case of 0.2 ⁇ m in the thickness of the internal electrode.
  • the defect generation ratio of 0% can be achieved as long as the condition of 0.4 ⁇ m or less in the thickness of the internal electrode is met, and the condition of 35 ⁇ m or less in outer layer thickness or 30 ⁇ m or less in width direction gap is met.
  • laminated ceramic capacitors according to each sample were obtained which had the external dimensions shown in “Length Direction Dimension”, “Width Direction Dimension” and “Thickness Direction Dimension” of Table 3.
  • the laminated ceramic capacitors according to each sample were all adjusted to 0.4 ⁇ m in the thickness of the internal electrode, 30 ⁇ m in width direction gap, and 35 ⁇ m in outer layer thickness.
  • the coverage for the internal electrodes was varied as shown in the column “Coverage” of Table 3, by controlling the maximum temperature in the firing step between 1100° C. and 1300° C.
  • the “Defect Generation Ratio” when attention is paid to the “Coverage” for the samples with the “Defect Generation Ratio” of 0%, the “Defect Generation Ratio” is 0% with the “Coverage” of 75% or more in the case of the “Solder Bath Temperature” of 400° C. From the foregoing, it is first determined that the “Coverage” is preferably 75% or more at least against the thermal shock of 400° C.
  • the “Coverage” is preferably higher against thermal shocks of higher temperatures, and more specifically, the “Defect Generation Ratio” is 0% with the “Coverage” of 76% or more in the case of the “Solder Bath Temperature” of 450° C., whereas the “Defect Generation Ratio” is 0% with the “Coverage” of 79% or more in the case of the “Solder Bath Temperature” of 500° C.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
US13/856,475 2010-12-06 2013-04-04 Laminated ceramic electronic component Abandoned US20130222972A1 (en)

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PCT/JP2011/077887 WO2012077585A1 (ja) 2010-12-06 2011-12-02 積層セラミック電子部品

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Cited By (12)

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US20150008024A1 (en) * 2013-07-05 2015-01-08 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and mounting board therefor
US20160049256A1 (en) * 2014-08-13 2016-02-18 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor, multilayer ceramic capacitor series including the same, and multilayer ceramic capacitor mount body including the same
US9355780B2 (en) 2013-01-29 2016-05-31 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor, and circuit board having multilayer ceramic capacitor embedded therein
US20170103853A1 (en) * 2015-10-09 2017-04-13 Murata Manufacturing Co., Ltd. Electronic component
US20190080848A1 (en) * 2015-03-24 2019-03-14 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor
US20190180940A1 (en) * 2017-12-07 2019-06-13 Taiyo Yuden Co., Ltd. Multi-Layer Ceramic Capacitor
US11004607B2 (en) 2015-03-30 2021-05-11 Taiyo Yuden Co., Ltd. Method for manufacturing multilayer ceramic capacitor
US11217394B2 (en) 2018-08-29 2022-01-04 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
US11276526B2 (en) 2018-08-29 2022-03-15 Samsung Electro-Mechanics Co., Ltd. Multilayer capacitor
US11342120B2 (en) * 2018-05-17 2022-05-24 Taiyo Yuden Co., Ltd. Multilayer ceramic capacitor and manufacturing method of multilayer ceramic capacitor
US20220189695A1 (en) * 2020-12-14 2022-06-16 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same mounted thereon
US11469045B2 (en) * 2020-02-28 2022-10-11 Taiyo Yuden Co., Ltd. Ceramic electronic component and method of manufacturing the same

Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
KR101771728B1 (ko) * 2012-07-20 2017-08-25 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR101922867B1 (ko) * 2012-10-12 2018-11-28 삼성전기 주식회사 적층 세라믹 전자부품 및 이의 제조방법
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CN103250217A (zh) 2013-08-14
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KR101541505B1 (ko) 2015-08-03
TW201232576A (en) 2012-08-01
CN103250217B (zh) 2017-07-18
US9972438B2 (en) 2018-05-15
US20160284474A1 (en) 2016-09-29
JPWO2012077585A1 (ja) 2014-05-19
KR20150027244A (ko) 2015-03-11
TWI528392B (zh) 2016-04-01
KR101589567B1 (ko) 2016-01-29

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