US20130143405A1 - Silicon wafer processing solution and silicon wafer processing method - Google Patents
Silicon wafer processing solution and silicon wafer processing method Download PDFInfo
- Publication number
- US20130143405A1 US20130143405A1 US13/816,938 US201113816938A US2013143405A1 US 20130143405 A1 US20130143405 A1 US 20130143405A1 US 201113816938 A US201113816938 A US 201113816938A US 2013143405 A1 US2013143405 A1 US 2013143405A1
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- US
- United States
- Prior art keywords
- silicon
- processing fluid
- wafer processing
- nitrogen
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 36
- 239000010703 silicon Substances 0.000 title claims abstract description 36
- 238000003672 processing method Methods 0.000 title claims description 12
- 239000012530 fluid Substances 0.000 claims abstract description 100
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000006061 abrasive grain Substances 0.000 claims abstract description 21
- 239000003607 modifier Substances 0.000 claims abstract description 17
- 150000002391 heterocyclic compounds Chemical class 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 14
- 239000012964 benzotriazole Substances 0.000 claims description 9
- HJBLUNHMOKFZQX-UHFFFAOYSA-N 3-hydroxy-1,2,3-benzotriazin-4-one Chemical compound C1=CC=C2C(=O)N(O)N=NC2=C1 HJBLUNHMOKFZQX-UHFFFAOYSA-N 0.000 claims description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 6
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- BAXOFTOLAUCFNW-UHFFFAOYSA-N 1H-indazole Chemical compound C1=CC=C2C=NNC2=C1 BAXOFTOLAUCFNW-UHFFFAOYSA-N 0.000 claims description 3
- -1 nitrogen-containing compound Chemical class 0.000 abstract description 28
- 239000001257 hydrogen Substances 0.000 abstract description 12
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 15
- 238000011156 evaluation Methods 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 230000000452 restraining effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 230000000844 anti-bacterial effect Effects 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 239000003899 bactericide agent Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 150000002431 hydrogen Chemical class 0.000 description 3
- 239000003002 pH adjusting agent Substances 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- 230000002335 preservative effect Effects 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 239000002562 thickening agent Substances 0.000 description 3
- 229920003169 water-soluble polymer Polymers 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- PGRHXDWITVMQBC-UHFFFAOYSA-N dehydroacetic acid Chemical compound CC(=O)C1C(=O)OC(C)=CC1=O PGRHXDWITVMQBC-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000006078 metal deactivator Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000008399 tap water Substances 0.000 description 2
- 235000020679 tap water Nutrition 0.000 description 2
- HHPDFYDITNAMAM-UHFFFAOYSA-N 2-[cyclohexyl(2-hydroxyethyl)amino]ethanol Chemical compound OCCN(CCO)C1CCCCC1 HHPDFYDITNAMAM-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- XQIOBBHIEUGFCI-UHFFFAOYSA-N 3,4-dihydropyrido[1,2-a]pyrimidin-2-one Chemical compound C1=CC=CC2=NC(=O)CCN21 XQIOBBHIEUGFCI-UHFFFAOYSA-N 0.000 description 1
- XZOYHFBNQHPJRQ-UHFFFAOYSA-N 7-methyloctanoic acid Chemical compound CC(C)CCCCCC(O)=O XZOYHFBNQHPJRQ-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 239000004287 Dehydroacetic acid Substances 0.000 description 1
- 229920006309 Invista Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 229960004365 benzoic acid Drugs 0.000 description 1
- 150000001558 benzoic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 235000019258 dehydroacetic acid Nutrition 0.000 description 1
- 229940061632 dehydroacetic acid Drugs 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- BEFDCLMNVWHSGT-UHFFFAOYSA-N ethenylcyclopentane Chemical compound C=CC1CCCC1 BEFDCLMNVWHSGT-UHFFFAOYSA-N 0.000 description 1
- 229940093476 ethylene glycol Drugs 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000005489 p-toluenesulfonic acid group Chemical class 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- VTGOHKSTWXHQJK-UHFFFAOYSA-N pyrimidin-2-ol Chemical compound OC1=NC=CC=N1 VTGOHKSTWXHQJK-UHFFFAOYSA-N 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 235000010199 sorbic acid Nutrition 0.000 description 1
- 239000004334 sorbic acid Substances 0.000 description 1
- 229940075582 sorbic acid Drugs 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- 150000004670 unsaturated fatty acids Chemical class 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M133/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen
- C10M133/02—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen having a carbon chain of less than 30 atoms
- C10M133/38—Heterocyclic nitrogen compounds
- C10M133/44—Five-membered ring containing nitrogen and carbon only
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
- B23D61/185—Saw wires; Saw cables; Twisted saw strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M133/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen
- C10M133/02—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen having a carbon chain of less than 30 atoms
- C10M133/22—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen having a carbon chain of less than 30 atoms containing a carbon-to-nitrogen double bond, e.g. guanidines, hydrazones, semicarbazones
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M133/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen
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- C10M133/38—Heterocyclic nitrogen compounds
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
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- C10M133/42—Triazines
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M133/00—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen
- C10M133/02—Lubricating compositions characterised by the additive being an organic non-macromolecular compound containing nitrogen having a carbon chain of less than 30 atoms
- C10M133/38—Heterocyclic nitrogen compounds
- C10M133/44—Five-membered ring containing nitrogen and carbon only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
- G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/22—Heterocyclic nitrogen compounds
- C10M2215/221—Six-membered rings containing nitrogen and carbon only
- C10M2215/222—Triazines
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/22—Heterocyclic nitrogen compounds
- C10M2215/223—Five-membered rings containing nitrogen and carbon only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2215/00—Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
- C10M2215/22—Heterocyclic nitrogen compounds
- C10M2215/223—Five-membered rings containing nitrogen and carbon only
- C10M2215/224—Imidazoles
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2040/00—Specified use or application for which the lubricating composition is intended
Definitions
- the present invention relates to a silicon wafer processing fluid and silicon wafer processing method.
- processes including slicing a silicon ingot and polishing the silicon wafers are performed. For instance, a silicon ingot is sliced while supplying processing fluid to a wire. A silicon ingot is sliced according to either a loose abrasive method in which the silicon ingot is sliced while dispersing abrasive grains in the processing fluid or a fixed grain method in which the silicon ingot is sliced with the abrasive grains being rigidly attached on a surface of a wire.
- the processing fluid used for the loose abrasive method includes an aqueous processing fluid containing, for instance, a friction coefficient reducer, an auxiliary corrosion-resistance agent and the like.
- the friction-coefficient reducer contained in the processing fluid is an unsaturated fatty acid.
- the auxiliary corrosion-resistance agent is benzotriazole (see Patent Literature 1).
- the processing fluid used for the fixed grain method includes an aqueous processing fluid containing, for instance, glycols, carboxylic acids, alcanolamines and the like (see Patent Literature 2).
- An object of the invention is to provide a silicon wafer processing fluid and a silicon wafer processing method capable of restraining abrasion of abrasive grains and generation of hydrogen.
- the invention provides a silicon wafer processing fluid and silicon wafer processing method as follows.
- a silicon-wafer processing fluid according to an aspect of the invention containing: a friction modifier comprising a nitrogen-containing compound, in which a pH of the nitrogen-containing compound is in a range from 2 to 8 when a mass ratio with water represented by the nitrogen-containing compound/the water is 1/99.
- the silicon-wafer processing fluid according to the above aspect of the invention in which the nitrogen-containing compound is a heterocyclic compound.
- the heterocyclic compound is selected from the group consisting of benzotriazole, 3,4-dihydro-3-hydroxy-4-oxo-1,2,3-benzotriazine, indazole, benzimidazole and derivatives thereof.
- the silicon-wafer processing fluid according to the above aspect of the invention in which a pH of the silicon-wafer processing fluid is in a range from 3 to 9.
- a content of the nitrogen-containing compound is in a range from 0.05 mass % to 10 mass % based on a total amount of the processing fluid.
- the silicon-wafer processing fluid contains water in a range from 50 mass % to 99.95 mass % based on a total amount of the processing fluid.
- a silicon-wafer processing fluid according to the above aspect of the invention in which the silicon-wafer processing fluid is used for processing a silicon wafer with a wire on which abrasive grains are rigidly attached.
- a silicon-wafer processing method according to another aspect of the invention including: using a silicon-wafer processing fluid containing a friction modifier comprising a nitrogen-containing compound; and processing the silicon wafer with a wire on which abrasive grains are rigidly attached, in which a pH of the nitrogen-containing compound is in a range from 2 to 8 when a mass ratio with water represented by the nitrogen-containing compound/the water is 1/99.
- a silicon wafer processing fluid and a silicon wafer processing method capable of restraining abrasion of abrasive grains and generation of hydrogen can be provided.
- a silicon-wafer processing fluid of the invention (sometimes referred to as “processing fluid” hereinafter) is used for processing a silicon wafer with a wire.
- the processing fluid of the invention is used for slicing a silicon ingot according to the fixed grain method.
- the processing fluid of the invention may be used in the loose abrasive method.
- the processing fluid of the invention contains a friction modifier.
- the friction modifier contains a nitrogen-containing compound, pH of the nitrogen-containing compound being in a range from 2 to 8 when a mass ratio with water (i.e. nitrogen-containing compound/water) is 1/99.
- pH is in a range from 3 to 7, more preferably in a range from 4 to 6.
- the nitrogen-containing compound having pH of the above specific range is, for instance, a heterocyclic compound, which specifically is benzotriazole, 3,4-dihydro-3-hydroxy-4-oxo-1,2,3-benzotriazine, indazole, benzimidazole and derivatives thereof.
- benzotriazole and 3,4-dihydro-3-hydroxy-4-oxo-1,2,3-benzotriazine are preferably used.
- the lubricity of the wire is enhanced, so that abrasion of the abrasive grains rigidly attached on the wire can be restrained and the abrasive grains can be kept from being fallen off from the wire. Accordingly, breakage of the wire can be prevented and the processing efficiency and slicing accuracy can be enhanced, thereby improving the yield rate. Further, the nitrogen-containing compound restrains the generation of hydrogen due to the reaction between the chips of a silicon ingot and water. As a result, the processing fluid is kept from spilling over the processing fluid tank.
- pH of the processing fluid of the invention is in a range from 3 to 9, more preferably in a range from 5 to 7. Since the pH of the processing fluid is in a range from medium acidity to mild alkalinity, the generation of hydrogen can be further restrained. In addition, the corrosion of wire and silicon can be prevented.
- the content of the nitrogen-containing compound in the invention is in a range from 0.05 to 10 mass % based on a total amount of the processing fluid, more preferably in a range from 0.1 to 5 mass %. Since the content is at least 0.05 mass %, the abrasion of abrasive grains and generation of hydrogen can be further restrained and corrosion of wire and silicon can be prevented. On the other hand, since the content is at most 10 mass %, the production cost can be restrained.
- the processing fluid of the invention contains water.
- the water may be of any kind of water including tap water and purified water.
- the content of water is preferably in a range from 50 to 99.95 mass %, more preferably in a range from 60 to 95 mass %.
- environmental burden can be reduced as compared to ethyleneglycol that is conventionally used as a main component. Further, since water is the main component, inflammability can be lowered.
- the silicon-wafer processing method of the invention is, for instance, a fixed grain method, where abrasive grains are rigidly attached on a wire in advance.
- a silicon ingot is introduced into a processing chamber of a wire saw in which the wire is stretched around.
- the silicon ingot is sliced while supplying the processing fluid of the invention to the wire.
- the processing fluid of the invention contains the nitrogen-containing compound having pH of a specific range, abrasion of the abrasive grains can be prevented. Further, though the chips of the silicon ingot are generated, the nitrogen-containing compound of the invention restrains the reaction between the chips and water.
- processing fluid of the invention may be added with known additive(s) including friction modifier, antifoaming agent, metal deactivator, bactericide (preservative), viscosity modifier, pH modifier, thickener, dispersant and the like, as long as the addition of the additive(s) is not inconsistent with an object of the invention.
- additive(s) including friction modifier, antifoaming agent, metal deactivator, bactericide (preservative), viscosity modifier, pH modifier, thickener, dispersant and the like, as long as the addition of the additive(s) is not inconsistent with an object of the invention.
- the friction modifier is used for restraining the abrasion of the abrasive grains.
- Various surfactants and water-soluble polymer compounds are usable as the friction modifier.
- the surfactant include non-ionic surfactant such as glycols.
- the water-soluble polymer compound include carboxylic acid polymer compounds such as polyacrylic acid and alkyleneglycol polymer compounds such as polyethylene glycol.
- the antifoaming agent is used for keeping the processing fluid from spilling out of the processing fluid tank provided inside the processing chamber.
- examples of the antifoaming agent include silicone oil, fluorosilicone oil and fluoroalkylether.
- metal deactivator examples include imidazoline, pyrimidine derivative, thiadiazole and benzotriazole.
- the bactericide is used for preventing corrosion of the wire and the like.
- examples of the bactericide (preservative) include paraoxy benzoic acid esters (parabens), benzoic acid, salicylic acid, sorbic acid, dehydroacetic acid, p-toluenesulfonic acids and salts thereof, and phenoxyethanol.
- the pH modifier is used for adjusting the pH of the processing fluid of the invention in a range from 3 to 9.
- the pH modifier is classified into an acidic modifier and a basic modifier.
- the acidic modifier include acidic compounds such as polyacrylic acid and isononanoic acid.
- the basic modifier include basic compounds such as N-methyldiethanolamine and cyclohexyl diethanolamine.
- the thickener is used for increasing the viscosity of the processing fluid of the invention to improve adherability to the wire.
- the abrasion of the abrasive grains can be restrained.
- the thickener include carboxylic acid polymer compounds and alkyleneglycol polymer compounds similar to the friction modifier.
- the dispersant is used for restraining the chips from depositing on the wire saw.
- examples of the dispersant include various surfactants and water-soluble polymers similar to the friction modifier.
- the content of the additives may be determined in accordance with the intended use of the processing fluid. However, the total content of the additives is usually in a range approximately from 0.01 mass % to 30 mass % based on the total amount of the processing fluid.
- the processing fluid of the invention is used for slicing a silicon ingot in the above description, the processing fluid of the invention may be used for polishing a silicon wafer.
- the manufacturing method of the processing fluid of the invention is not specifically limited.
- the processing fluid may be prepared in a condensed state in which less amount of water is contained, and water may be added before use to adjust the concentration.
- glycols may alternatively be used as the main component.
- a processing fluid of a composition shown in Table 1 was prepared and was subjected to various tests for evaluation. The components contained in the processing fluid and the test items are shown below. Evaluation results and pH of the processing fluid are also shown in Table 1.
- Nitrogen-containing compound benzotriazole (SEETEC BT manufactured by SHIPRO KASEI KAISHA, LTD) (4) Nitrogen-containing compound: 3,4-dihydro-3-hydroxy-4-oxo-1,2,3-benzotriazine (5) Nitrogen-containing compound: imidazole (6) nitrogen-containing compound: 3,4-dihydro-2H-pyrido(1,2-a)pyrimidin-2-one.
- Nitrogen-containing compound N-methyl diethanolamine (aminoalcohol MDA manufactured by Nippon Nyukazai Co, Ltd.) (8) Dodecanedioic acid (registered trademark “Corfree M1”, manufactured by INVISTA (Japan) K.K)
- the friction coefficient was measured for evaluation under the following test conditions.
- Tester F-2100 manufactured by ORIENTEC Co., Ltd.
- Ball 3/16 inch ball made of SUJ2
- Test plate polycrystalline silicon
- Used amount of wire 30 m (repeatedly used by reciprocatory movement)
- Amount of processing fluid left still 100 g
- the processing fluid was evaluated according to the content of water contained in the processing fluid based on the following evaluation criteria.
- the processing fluid of the invention reduces the friction coefficient due to the presence of a predetermined nitrogen-containing compound.
- the processing fluid restrains the abrasion of the abrasive grains and keeps the abrasive grains from being fallen off.
- the processing fluid of the invention reduces the amount of generated hydrogen, so that the processing fluid is kept from spilling out of a processing fluid tank.
- the main component of the processing fluid of the invention is water, the processing fluid imposes less environmental burden and exhibits excellent source-saving performance.
- Comparatives 1 to 5 do not contain the nitrogen-containing compound of a predetermined pH as a friction modifier as required by the invention, increase in both the friction coefficient and generated hydrogen cannot be restrained. Further, since the main component of the processing fluid of Comparative 4 is propylene glycol, the processing fluid imposes larger environmental burden and exhibits poor source-saving performance.
- the silicon-wafer processing fluid and silicon-wafer processing method of the invention are suitably used for slicing a silicon ingot with a wire on which abrasive grains are rigidly attached.
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JP2010186782A JP5588786B2 (ja) | 2010-08-24 | 2010-08-24 | シリコンウェハ加工液およびシリコンウェハ加工方法 |
JP2010-186782 | 2010-08-24 | ||
PCT/JP2011/068899 WO2012026437A1 (ja) | 2010-08-24 | 2011-08-23 | シリコンウェハ加工液およびシリコンウェハ加工方法 |
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EP (1) | EP2610896A4 (ja) |
JP (1) | JP5588786B2 (ja) |
KR (1) | KR101809778B1 (ja) |
CN (1) | CN103053010B (ja) |
MY (1) | MY158440A (ja) |
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JP6039935B2 (ja) * | 2012-06-29 | 2016-12-07 | 出光興産株式会社 | 水性加工液 |
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US20070254485A1 (en) * | 2006-04-28 | 2007-11-01 | Daxin Mao | Abrasive composition for electrochemical mechanical polishing |
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US5693596A (en) * | 1994-10-25 | 1997-12-02 | Shin-Etsu Handotai Co., Ltd. | Cutting fluid, method for production thereof, and method for cutting ingot |
JPH1053789A (ja) * | 1996-08-12 | 1998-02-24 | Nippei Toyama Corp | ワイヤー切断加工機用水性加工液組成物 |
JP2000237952A (ja) * | 1999-02-19 | 2000-09-05 | Hitachi Ltd | 研磨装置および半導体装置の製造方法 |
JP4497767B2 (ja) | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | 固定砥粒ワイヤソー用水溶性加工液組成物 |
JP4057803B2 (ja) * | 2001-09-11 | 2008-03-05 | 株式会社東芝 | 半導体装置の製造方法 |
WO2003033207A1 (fr) * | 2001-10-17 | 2003-04-24 | Neomax Co., Ltd. | Procede de decoupe au moyen d'un fil helicoidal, dispositif de decoupe a fil helicoidal, et procede de fabrication d'un aimant permanent a base de terres rares |
JP3770879B2 (ja) * | 2002-03-01 | 2006-04-26 | 株式会社Neomax | 希土類合金の切断方法 |
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WO2007039934A1 (ja) * | 2005-12-27 | 2007-04-12 | Japan Fine Steel Co., Ltd. | 固定砥粒ワイヤ |
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CN103053010B (zh) | 2016-08-03 |
SG187749A1 (en) | 2013-03-28 |
TWI550077B (zh) | 2016-09-21 |
JP2012049155A (ja) | 2012-03-08 |
US9441179B2 (en) | 2016-09-13 |
EP2610896A1 (en) | 2013-07-03 |
WO2012026437A1 (ja) | 2012-03-01 |
KR20130093097A (ko) | 2013-08-21 |
CN103053010A (zh) | 2013-04-17 |
EP2610896A4 (en) | 2016-03-30 |
JP5588786B2 (ja) | 2014-09-10 |
KR101809778B1 (ko) | 2017-12-15 |
US20150045264A1 (en) | 2015-02-12 |
MY158440A (en) | 2016-10-14 |
TW201217505A (en) | 2012-05-01 |
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