US20110256002A1 - Electric Compressor Having Drive Circuit Integrated Thereinto - Google Patents

Electric Compressor Having Drive Circuit Integrated Thereinto Download PDF

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Publication number
US20110256002A1
US20110256002A1 US13/141,072 US200913141072A US2011256002A1 US 20110256002 A1 US20110256002 A1 US 20110256002A1 US 200913141072 A US200913141072 A US 200913141072A US 2011256002 A1 US2011256002 A1 US 2011256002A1
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United States
Prior art keywords
drive circuit
electric compressor
semiconductor element
power semiconductor
refrigerant gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US13/141,072
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English (en)
Inventor
Hideo Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanden Corp
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Individual
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Publication of US20110256002A1 publication Critical patent/US20110256002A1/en
Assigned to SANDEN CORPORATION reassignment SANDEN CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: IKEDA, HIDEO
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00—Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04—Heating; Cooling; Heat insulation
    • F04C29/047—Cooling of electronic devices installed inside the pump housing, e.g. inverters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/06—Cooling; Heating; Prevention of freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/008—Hermetic pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/02—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents
    • F04C18/0207—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents both members having co-operating elements in spiral form
    • F04C18/0215—Rotary-piston pumps specially adapted for elastic fluids of arcuate-engagement type, i.e. with circular translatory movement of co-operating members, each member having the same number of teeth or tooth-equivalents both members having co-operating elements in spiral form where only one member is moving
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2210/00—Fluid
    • F04C2210/26—Refrigerants with particular properties, e.g. HFC-134a
    • F04C2210/261—Carbon dioxide (CO2)
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2210/00—Fluid
    • F04C2210/26—Refrigerants with particular properties, e.g. HFC-134a
    • F04C2210/263—HFO1234YF
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00—Components
    • F04C2240/80—Other components
    • F04C2240/808—Electronic circuits (e.g. inverters) installed inside the machine

Definitions

  • This invention relates to a drive circuit-integrated electric compressor which has a built-in motor and into which a motor drive circuit for driving the motor is incorporated integrally, and specifically, relates to a drive circuit-integrated electric compressor which is adapted to cool a power semiconductor element mounted on the motor drive circuit efficiently.
  • Patent Document 1 disclosed is a scroll-type electric compressor which has a built-in motor for driving a compression mechanism part and into which a motor drive circuit for driving the motor is incorporated integrally.
  • a motor drive circuit particularly into its inverter, a power semiconductor element is assembled, and because the power semiconductor element generates heat, it is generally preferred to cool the element in order to secure the normal operation.
  • Semiconductors currently used, including power semiconductor elements usually consist of silicon (Si). Because the upper limit of the operating temperature of such a conventional power semiconductor element is about 150° C., it is preferred to cool the element so as not to exceed the upper limit. In Patent Document 1, utilizing refrigerant being sucked into a compressor, this cooling is carried out.
  • Patent document 1 JP-A-2000-291557
  • the object of the present invention is to provide a drive circuit-integrated electric compressor which can efficiently cool the power semiconductor element in the motor drive circuit, basically without elevating the temperature of sucked refrigerant gas and while suppressing the increase of pressure loss in the path for cooling.
  • a drive circuit-integrated electric compressor is an electric compressor into which a motor drive circuit having a power semiconductor element is incorporated integrally, characterized in that the electric compressor is configured so that the power semiconductor element of the drive circuit is cooled by refrigerant gas to be discharged. Namely, it is not configured so as to be cooled by sucked refrigerant gas as in the conventional technology, but it is configured so as to cool the power semiconductor element utilizing refrigerant gas to be discharged after having passed through a compression mechanism part of the compressor.
  • the refrigerant gas to be discharged is used for cooling the power semiconductor element, the problems caused in case of using sucked refrigerant gas, that is, a decrease in compression efficiency caused by a temperature elevation of the sucked refrigerant gas, a decrease in life of the compressor caused by a temperature elevation of a compressed gas, an increase in pressure loss caused by passing of the sucked refrigerant gas through a heat exchange route for cooling and a decrease in compression efficiency accompanied with the pressure loss, do not occur basically.
  • the magnet may be demagnetized because of the elevation of the temperature.
  • the power semiconductor element is cooled by sucked refrigerant gas
  • there has been a fear that the magnet may be demagnetized because the gas passes through the motor after the temperature of sucked refrigerant gas has been elevated by heat exchange whereas in the present invention, such a problem can be solved because cooling is performed by refrigerant gas to be discharged which has passed through the motor.
  • the power semiconductor element may be cooled to a higher temperature relative to that of the conventional structure. Therefore, it is necessary to use a semiconductor element having a higher thermal resistance, that is, a higher operating temperature limit, as the power semiconductor element.
  • a wide band gap semiconductor element can be used as the above-described power semiconductor element.
  • all the semiconductors currently used, including power semiconductors, consist of silicon (Si).
  • a wide band gap (WBG) power semiconductor is being developed as a semiconductor material to be replaced from silicon. Because the upper limit of the operating temperature of the WBG semiconductor is 200° C. or higher whereas that of the conventional Si power semiconductor is about 150° C., it becomes possible to cool it sufficiently down to a desired temperature even by the refrigerant gas to be discharged with a temperature which is generally in a range of 100-150° C.
  • any type of wide band gap power semiconductor element can be used as long as it has such a high upper limit of the operating temperature as described above.
  • the wide band gap semiconductor element has a high heatproof temperature, it is not necessary to create an extra low temperature as a cooling source, and therefore, the total efficiency determined as the whole of the refrigeration circuit system is also improved.
  • the drive circuit-integrated electric compressor it may be configured so that the power semiconductor element of motor drive circuit is cooled by refrigerant gas to be discharged, and various types of configurations can be employed as concrete cooling structures.
  • a structure may be employed wherein the above-described power semiconductor element is mounted on a high heat-conduction circuit board and a back surface of the circuit board is configured to be cooled by the refrigerant gas to be discharged through a wall of the compressor (a wall inside the compressor).
  • a circuit board comprising a high heat-conduction material, for example, a material made of a high heat-conduction ceramic, etc., the power semiconductor element is cooled through the circuit board with a high efficiency.
  • a structure may be employed wherein the above-described power semiconductor element is coated with a low heat-conduction resin. Furthermore, a structure may be employed wherein a low heat-conduction heat shielding member is provided at a position between the above-described power semiconductor element and other electronic parts. Because heat radiation to other electronic parts can be prevented by being shielded by such a low heat-conduction resin or a low heat-conduction member, the temperature elevation of the other electronic parts can be suppressed, and the reliability as the whole of the motor drive circuit, and further, as the whole of the compressor, is improved.
  • the kind of refrigerant used in the drive circuit-integrated electric compressor according to the present invention is not particularly limited. Not only conventional refrigerants used generally, but also CO 2 and HFC1234yf can be used as the refrigerant. In the case of CO 2 refrigerant, although the refrigerant is used under a higher-temperature and higher-pressure condition, it is sufficiently applicable for cooling the above-described wide band gap semiconductor element. Further, HFC1234yf, which is a new refrigerant announced recently, is also sufficiently applicable for cooling the power semiconductor element.
  • the refrigerant gas to be discharged for cooling the above-described power semiconductor element in the drive circuit for example, it is possible to use any of refrigerant gas to be discharged which has passed through a built-in motor and a compression part (a compression mechanism part) in this order, refrigerant gas to be discharged which has passed through a compression part and a built-in motor in this order and refrigerant gas to be discharged which passes through a built-in motor part after having passed through a compression part (for example, as shown in the embodiment described later, refrigerant gas to be discharged which passes through a discharged gas path formed at a position between a stator of a built-in motor and a drive circuit housing after having passed a compression part).
  • the drive circuit-integrated electric compressor according to the present invention is suitable, for example, for a scroll-type compressor in particular. That is, in the case of a scroll-type compressor, because a motor drive circuit can be easily disposed at a position near a path for refrigerant gas to be discharged, it is possible to cool the power semiconductor element of the motor drive circuit efficiently.
  • the drive circuit-integrated electric compressor according to the present invention is particularly suitable as a compressor mounted on a vehicle.
  • a structure for efficiently cooling the power semiconductor can be realized by a simple configuration substantially without a gain of weight.
  • this electric compressor is suitable particularly for a compressor installed in a refrigeration circuit of an air conditioning systems for vehicles.
  • the drive circuit-integrated electric compressor because refrigerant gas to be discharged is utilized for cooling the power semiconductor element, an elevation of the gas temperature before the compression and discharge of sucked refrigerant gas as in the conventional method may not be caused, a high compression efficiency can be achieved and the coefficient of performance (COP) of the compressor can be improved.
  • the power semiconductor element can be efficiently cooled by utilizing refrigerant gas to be discharged.
  • the gas temperature is not elevated until sucked refrigerant gas is compressed and discharged, it is possible to improve the durability and life of the compressor. Furthermore, because sucked refrigerant gas does not have to pass through a heat exchange route for cooling as in a conventional structure, it is also possible to reduce the pressure loss.
  • FIG. 1 is a schematic vertical sectional view of a drive circuit-integrated electric compressor according to a first embodiment of the present invention.
  • FIG. 2 is a circuit diagram of a motor drive circuit and a control circuit in the compressor depicted in FIG. 1 .
  • FIG. 3 is a schematic vertical sectional view of a drive circuit-integrated electric compressor according to a second embodiment of the present invention.
  • FIG. 4 is a schematic vertical sectional view of a drive circuit-integrated electric compressor according to a third embodiment of the present invention.
  • FIG. 1 shows a drive circuit-integrated electric compressor 100 according to a first embodiment of the present invention.
  • symbol 1 indicates a drive circuit housing
  • symbol 2 indicates a compressor housing
  • symbol 3 indicates a suction housing.
  • a motor 13 constituted by a stator 4 , a rotor 5 and a motor coil 6 is incorporated into suction housing 3 .
  • a drive shaft 7 supported by a bearing 23 at a condition free to rotate is rotationally driven and a compression part 8 (a compression mechanism part) is operated.
  • Compression part 8 is configured, for example, as a scroll type.
  • compressor 100 a refrigerant path depicted by arrows is formed.
  • the refrigerant gas is sucked at a suction port 9 formed in suction housing 3 , passes through a motor part, is compressed at compression part 8 , and then is discharged from a discharge port 10 formed in drive circuit housing 1 to an external circuit.
  • Symbol 11 indicates a sealed terminal A and symbol 12 indicates a sealed terminal B, and they supply power from a motor drive circuit 30 to motor 13 , together with a lead wire 24 .
  • Motor drive circuit 30 has a power semiconductor element 15 , which is installed on a power circuit board 14 .
  • a wide band gap power semiconductor element is used as this power semiconductor element 15 .
  • Power circuit board 14 is fixed to a wall 26 in drive circuit housing 1 , which is located at a position where refrigerant gas to be discharged passes, via insulation material 16 , and by utilizing refrigerant gas to be discharged which passes through a discharge chamber 25 , power semiconductor element 15 mounted on power circuit board 14 is cooled.
  • insulation material 16 are made of a high heat-conduction ceramic, etc.
  • Symbol 17 indicates a board of control circuit for controlling motor drive circuit 30 , and a micro controller 18 constituting the control circuit is installed on this control circuit board 17 .
  • Electric power is supplied from an external power source through a connector 22 , and therefrom, the power is supplied to motor drive circuit 30 through a noise filter 20 and a smoothing capacitor 19 .
  • These circuit parts are covered with a lid 21 , and shielded from the outside.
  • a low heat-conduction insulation resin 27 is provided on power circuit board 14 , and power semiconductor element 15 is covered with this resin 27 so that heat radiation from power semiconductor element 15 to other electronic parts is prevented.
  • symbol 28 in FIG. 1 shows a bolt connecting the respective housings to each other.
  • Motor drive circuit 30 and its control circuit are configured, for example, as shown in FIG. 2 .
  • motor drive circuit 30 is provided in electric compressor 100 as described above, and by supplying an output from motor drive circuit 30 to each of motor coils 6 of a built-in motor 13 through sealed terminal 11 , motor 13 is rotationally driven and the compression by compression part 8 is carried out.
  • Electric power from an external power source 42 (for example, a battery) is supplied to this motor drive circuit 30 , then is supplied to an inverter 41 through noise filter 20 containing a coil and a capacitor and through smoothing capacitor 19 , and is supplied to motor 13 after the direct current from power source 42 is converted into a pseudo three-phase alternate current by inverter 41 .
  • Signals controlling the compressor are supplied to motor control circuit 45 from, for example, an air conditioning unit for vehicles 44 through a connector for control signal 43 .
  • the above-described inverter 41 is provided with three sets of power semiconductor elements 15 , 6 elements in total, each consisting of a Schottky barrier diode SiC-SBD 47 and a SiC-MOSFET 46 as wide band gap semiconductor. Similar motor drive circuit and control circuit can be used in the drive circuit-integrated electric compressors according to second and third embodiments described later.
  • power semiconductor element 15 is cooled efficiently as follows.
  • the upper limit of the operating temperature of a wide band gap power semiconductor is 200° C. or more whereas the upper limit of the operating temperature of a conventional Si power semiconductor is approximately 150° C.
  • the wide band gap power semiconductor can be cooled sufficiently even by a temperature of refrigerant gas to be discharged which is generally in a temperature range of 100-150° C. Therefore, an elevation of the temperature of the sucked refrigerant gas in the conventional cooling method can be prevented and the compression efficiency can be improved. Further, by suppressing the elevation of the temperature of the sucked refrigerant gas, the life of respective portions in the compressor can be improved. Furthermore, because it is not necessary to specially form a gas path for cooling a power semiconductor element by a sucked refrigerant gas, the reduction of the pressure loss can also be achieved.
  • control circuit board 17 by covering power semiconductor element 15 with low heat-conduction resin 27 , for example, the heat radiation to electronic parts, smoothing capacitor 19 and noise filter 20 which are mounted on control circuit board 17 can be eliminated so that the elevation of temperature can be prevented, and proper operation of these electronic parts can be ensured.
  • smoothing capacitor 19 and noise filter 20 which are mounted on control circuit board 17 can be eliminated so that the elevation of temperature can be prevented, and proper operation of these electronic parts can be ensured.
  • the wide band gap semiconductor element has a high heatproof temperature and it is not necessary to create an extra low temperature as a cooling source, the total efficiency of the refrigeration circuit system is improved. Furthermore, in case where motor 13 has a rotor using a neodymium magnet, the magnet would be demagnetized to some extent by the temperature elevation. In the conventional case where the power semiconductor element is cooled by the sucked refrigerant gas, because the sucked refrigerant gas passes through a motor after the gas temperature has elevated due to the heat exchange, there has been a fear that the magnet may be demagnetized to some extent, but in the case of this embodiment, this problem is to be solved.
  • FIG. 3 depicts a drive circuit-integrated electric compressor 200 according to a second embodiment of the present invention.
  • the refrigerant gas sucked from suction port 9 is introduced directly into compression part 8 through suction gas chamber 31 , passes through motor 13 , cools power semiconductor element 15 and then is discharged from discharge port 10 .
  • a magnet of motor 13 is exposed to refrigerant gas to be discharged, it is preferred to use not a neodymium magnet having a demagnetization characteristic at high temperature, but a ferrite magnet, etc. having a demagnetization characteristic at low temperature.
  • a motor which has no fear of demagnetization an induction motor, a switched reluctance motor, etc.
  • the other configurations of this embodiment are in accordance with those of the aforementioned first embodiment.
  • the sucked refrigerant gas is not heated because the gas enters directly into compression part 8 before passing through motor 13 . Therefore, it is possible to further improve the compression efficiency. Further, because the sucked refrigerant gas enters directly into compression part 8 without passing through motor 13 , the pressure loss therebetween does not substantially occur.
  • FIG. 4 depicts a drive circuit-integrated electric compressor according to a third embodiment of the present invention.
  • a drive circuit is mounted in the radial direction of motor 13 .
  • the sucked refrigerant gas coming out of compression part 8 passes through discharge gas path 33 formed between stator 4 of motor 13 and drive circuit housing 32 , and cools power semiconductor element 15 of the motor drive circuit.
  • a drive circuit is incorporated into drive circuit housing 32
  • motor 13 is incorporated into drive circuit housing 32 .
  • Compression part 8 is incorporated into suction housing 3 .
  • the sucked refrigerant gas enters into suction gas chamber 31 and then is sent to compression part 8 .
  • the other configurations of this embodiment are in accordance with those of the aforementioned first embodiment.
  • FIG. 1 , FIG. 3 and FIG. 4 show configurations that power semiconductor element is mounted on a high heat-conduction circuit board. However, though it is not depicted in figures, it goes without saying that the same effect can be achieved when a discrete-type wide band gap power semiconductor element is mounted directly on a wall of a compressor.
  • the structure of the drive circuit-integrated electric compressor according to the present invention can be applied to any type electric compressor assembled with a power semiconductor element, and specifically, is suitable for a compressor mounted on a vehicle, and in particular, is suitable for a compressor for air conditioning system for vehicles.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressor (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Rotary Pumps (AREA)
US13/141,072 2008-12-18 2009-12-18 Electric Compressor Having Drive Circuit Integrated Thereinto Abandoned US20110256002A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-322254 2008-12-18
JP2008322254A JP5531186B2 (ja) 2008-12-18 2008-12-18 駆動回路一体型電動圧縮機
PCT/JP2009/007027 WO2010070927A1 (ja) 2008-12-18 2009-12-18 駆動回路一体型電動圧縮機

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US20110256002A1 true US20110256002A1 (en) 2011-10-20

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US13/141,072 Abandoned US20110256002A1 (en) 2008-12-18 2009-12-18 Electric Compressor Having Drive Circuit Integrated Thereinto

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US (1) US20110256002A1 (ja)
EP (1) EP2378120B1 (ja)
JP (1) JP5531186B2 (ja)
CN (1) CN102245899A (ja)
WO (1) WO2010070927A1 (ja)

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US20130108486A1 (en) * 2011-10-31 2013-05-02 Kabushiki Kaisha Toyota Jidoshokki Motor-driven compressor
CN103089634A (zh) * 2011-10-31 2013-05-08 株式会社丰田自动织机 马达驱动型压缩机
US8939739B2 (en) 2010-12-02 2015-01-27 Kabushiki Kaisha Toyota Jidoshokki Electric compressor
US20150176877A1 (en) * 2013-12-25 2015-06-25 Kabushiki Kaisha Toyota Jidoshokki Motor-driven compressor
US9068563B2 (en) 2011-03-31 2015-06-30 Kabushiki Kaisha Toyota Jidoshokki Electric connector for cooling a compressor drive circuit
US20150326089A1 (en) * 2012-12-14 2015-11-12 Continental Automotive Gmbh Actuator
US9810219B2 (en) 2013-03-26 2017-11-07 Kabushiki Kaisha Toyota Jidoshokki Motor-driven compressor including a coupling structure having a protrusion and insertion portion
US10508842B2 (en) * 2015-07-03 2019-12-17 Mitsubishi Electric Corporation Heat pump device with separately spaced components
US10907636B2 (en) * 2016-05-09 2021-02-02 Hitachi Industrial Equipment Systems Co., Ltd. Package-type compressor

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JP2013164048A (ja) * 2012-02-13 2013-08-22 Panasonic Corp 電動コンプレッサ
JP6134127B2 (ja) * 2012-11-21 2017-05-24 三菱重工業株式会社 ヒートシンクを有する機器
JP6132567B2 (ja) * 2013-01-31 2017-05-24 ジョンソンコントロールズ ヒタチ エア コンディショニング テクノロジー（ホンコン）リミテッド スクロール圧縮機
JP2015126648A (ja) * 2013-12-27 2015-07-06 株式会社日立産機システム 電力変換装置および電力変換装置の制御方法
FR3019406B1 (fr) * 2014-03-31 2017-09-01 Valeo Systemes De Controle Moteur Convertisseur de tension pour une machine electrique embarquee dans un vehicule
CA3053733C (en) 2017-02-22 2023-01-10 Stackpole International Engineered Products, Ltd. Pump assembly having a controller including a circuit board and 3d rotary sensor for detecting rotation of its pump
CN107476951B (zh) * 2017-08-08 2019-03-22 中山大洋电机股份有限公司 一体化电动空气压缩机及应用其的燃料电池空气进气系统
CN108334687B (zh) * 2018-01-29 2021-06-25 扬州大学 一种大中型电机运行温升可靠度的预测方法
CN108916050A (zh) * 2018-08-30 2018-11-30 苏州中成新能源科技股份有限公司 一种控制器侧装式电动压缩机及压缩机用控制器盖
IT201900014913A1 (it) * 2019-08-22 2021-02-22 Vhit Spa Pompa

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EP2378120B1 (en) 2015-02-11
EP2378120A1 (en) 2011-10-19
EP2378120A4 (en) 2012-12-26
JP2010144607A (ja) 2010-07-01
WO2010070927A1 (ja) 2010-06-24
CN102245899A (zh) 2011-11-16

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