US20080206072A1 - Vacuum Apparatus - Google Patents

Vacuum Apparatus Download PDF

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Publication number
US20080206072A1
US20080206072A1 US10/589,748 US58974805A US2008206072A1 US 20080206072 A1 US20080206072 A1 US 20080206072A1 US 58974805 A US58974805 A US 58974805A US 2008206072 A1 US2008206072 A1 US 2008206072A1
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United States
Prior art keywords
vacuum
vacuum pump
pump
gas
stage
Prior art date
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Abandoned
Application number
US10/589,748
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English (en)
Inventor
Tadahiro Ohmi
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Foundation for Advancement of International Science
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Foundation for Advancement of International Science
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Assigned to FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE reassignment FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OHMI, TADAHIRO
Publication of US20080206072A1 publication Critical patent/US20080206072A1/en
Abandoned legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F04C23/003—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle having complementary function
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
    • F04B37/10—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use
    • F04B37/14—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for special use to obtain high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/001—Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids of similar working principle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C25/00—Adaptations of pumps for special use of pumps for elastic fluids
    • F04C25/02—Adaptations of pumps for special use of pumps for elastic fluids for producing high vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C18/00—Rotary-piston pumps specially adapted for elastic fluids
    • F04C18/08—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing
    • F04C18/12—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type
    • F04C18/14—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons
    • F04C18/16—Rotary-piston pumps specially adapted for elastic fluids of intermeshing-engagement type, i.e. with engagement of co-operating members similar to that of toothed gearing of other than internal-axis type with toothed rotary pistons with helical teeth, e.g. chevron-shaped, screw type
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/10—Vacuum
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04C—ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2220/00—Application
    • F04C2220/30—Use in a chemical vapor deposition [CVD] process or in a similar process

Definitions

  • This invention relates to a vacuum apparatus and, in particular, relates to a vacuum apparatus for use in the field of manufacturing semiconductor devices, flat panel display devices, or the like.
  • vacuum apparatus have been used in the semiconductor manufacturing field and many other industrial fields.
  • the vacuum apparatus generally comprises a vacuum container and vacuum pumps for keeping the inside of the vacuum container in a vacuum or depressurized state.
  • the vacuum apparatus is disposed in a clean room and is configured to perform predetermined processing while introducing and exhausting a predetermined process gas into and from the vacuum container.
  • a vacuum apparatus of this type having vacuum pumps of a plurality of stages for use in the manufacturing field of a semiconductor device manufacturing apparatus is disclosed, for example, in Patent Document 1.
  • a high vacuum pump as a first vacuum pump is connected to a reaction chamber in order to bring the inside of the reaction chamber into a depressurized or vacuum state, and a booster pump as a second vacuum pump and a back pump as a third vacuum pump are respectively arranged at a subsequent stage of the high vacuum pump.
  • the high vacuum pump of a high vacuum pump that operates in a molecular flow region of ultimate pressure (10 ⁇ 7 Torr or less).
  • a turbomolecular pump or a thread groove pump is generally used as the high vacuum pump.
  • the turbomolecular pump and the thread groove pump each generally have a low allowable back pressure of 1 Torr or less (specifically 0.5 Torr or less) while the pumping speed is high even with a small size. Therefore, there is/are provided, at the subsequent stage of the high vacuum pump, an intermediate/low vacuum pump or intermediate/low vacuum pumps in one or two stages which each operate at a relatively low back pressure while the ultimate pressure is relatively low.
  • a booster pump or the like is provided subsequent to the high vacuum pump as an intermediate vacuum pump and, further, a back pump (Roots-type back pump or the like) is provided subsequent to the booster pump as a low vacuum pump that operates at a relatively low back pressure while the ultimate pressure is low.
  • a gas exhausted from the reaction chamber is discarded.
  • a noble gas such as krypton or xenon
  • the expensive noble gas is normally recovered.
  • the discharge side of the back pump is connected to a compressor of a recovery apparatus.
  • the compressor of the conventional recovery apparatus merely accumulates an input gas, increases its pressure, and discharges it.
  • vacuum apparatus for use in the manufacture of a semiconductor device manufacturing apparatus
  • These vacuum pumps often have mutually different structures as described above, but are all driven by electric motors. Accordingly, in the vacuum apparatus of this type where the number of vacuum pumps used is large, the power consumption increases. Since the power consumption of the vacuum apparatus resultantly affects the manufacturing cost of the semiconductor device manufacturing apparatus, it is desired to reduce the power consumption.
  • the last-stage low vacuum pump (back pump) among the multistage vacuum pumps is required to have a large capacity, the power consumption thereof is also large. Therefore, it is effective and desirable to suppress the power consumption of the back pump for a reduction in power consumption of the entire vacuum apparatus and thus a reduction in manufacturing cost of the semiconductor device manufacturing apparatus.
  • the reasons of the large power consumption of the back pump are firstly that since its discharge side is the atmosphere (the atmospheric pressure is 760 Torr), the exhaust operation should always be carried out (even when the reaction chamber is not operated) in order to prevent back diffusion to the inlet side from the atmospheric side and secondly that although a depressurized gas enters from the inlet side, the gas does not go out into the atmosphere unless its pressure is increased to the atmospheric pressure or more.
  • Patent Document 1
  • JP-A Japanese Unexamined Patent Application Publication No. 2002-39061
  • a vacuum apparatus characterized by comprising a vacuum container having a gas inlet and a gas outlet, a vacuum pump of at least one stage connected to the gas outlet of the vacuum container for depressurizing the inside of the vacuum container or maintaining the inside of the vacuum container in a depressurized state, and a compressor connected to a discharge port of the last-stage vacuum pump of the at least one-stage vacuum pump and having capability of depressurizing an input side of the compressor.
  • the number of vacuum pump stages is set to one stage or a plurality of stages depending on a gas amount introduced into the vacuum container or the capability of the vacuum pump.
  • a gas recovery apparatus for recovering a gas discharged from the last-stage vacuum pump for re-use of said gas be provided and the compressor be a gas recovery compressor in the gas recovery apparatus.
  • a vacuum apparatus comprising a container to be depressurized having a gas inlet and a gas outlet, mechanical vacuum pumps of a plurality of stages connected to the container for depressurizing the inside of the container and maintaining the inside of the container in a depressurized state, and a gas recovery apparatus for recovering a gas discharged from the last-stage vacuum pump for re-use of said gas, the vacuum apparatus characterized by comprising a gas recovery compressor connected to a discharge port of the last-stage vacuum pump and having depressurization capability for assisting a depressurization operation of the last-stage vacuum pump and suppressing back diffusion from the discharge port.
  • the last-stage vacuum pump is omitted, a gas discharged from the vacuum pump at the stage prior to the last stage is recovered and reused by the gas recovery apparatus, and the gas recovery compressor is connected to a discharge port of the vacuum pump at the stage prior to the last stage.
  • the vacuum pumps in the plurality of stages may comprise a first vacuum pump, a second vacuum pump connected at a subsequent stage of the first vacuum pump, and a third vacuum pump connected at a subsequent stage of the second vacuum pump and, in this case, it is preferable that the first vacuum pump be a turbomolecular pump or a thread groove pump, the second vacuum pump be a booster pump, and the third vacuum pump be a dry pump.
  • the third vacuum pump is omitted and the compressor having the depressurization capability is connected to the second vacuum pump.
  • the compressor additionally attached to the discharge port of the last-stage pump, particularly the discharge port exposed to the atmospheric side, has the function of a vacuum pump.
  • the compressor assists the depressurization operation of the last-stage vacuum pump (i.e. since the compressor having the depressurization capability reduces the pressure at the discharge port of the last-stage vacuum pump, the last-stage vacuum pump is not required to increase the pressure of the sucked gas to the atmospheric pressure or more) and suppresses back diffusion from the discharge port of the last-stage vacuum pump and, hence, it is possible to suppress the power consumption of the last-stage vacuum pump as compared with conventional and, as a result, it is possible to reduce the manufacturing cost of a semiconductor device manufacturing apparatus or the like.
  • FIG. 1 is a schematic diagram showing a semiconductor manufacturing vacuum apparatus according to an embodiment of this invention.
  • FIG. 2 ], ( a ) and ( b ) are sectional views showing a screw pump as a last-stage vacuum pump of the vacuum apparatus according to the embodiment of this invention.
  • FIG. 3 is a diagram showing the relationship between the inlet pressure and the power consumption of the pump along with that of a comparative example for explaining the operation and effect of this invention.
  • this vacuum apparatus comprises a plurality of reaction chambers 10 , 11 , and 12 , high vacuum pumps 1 , 2 , and 3 as first vacuum pumps one or a plurality of which are arranged for each of the reaction chambers 10 , 11 , and 12 in order to bring the inside thereof into a depressurized or vacuum state, and booster pumps 4 a , 5 a , and 6 a as second vacuum pumps and back pumps 4 b , 5 b , and 6 b as third vacuum pumps that are arranged at subsequent stages of the high vacuum pumps, respectively.
  • valves 22 , 23 , and 24 are provided between the high vacuum pumps 1 , 2 , and 3 and the booster pumps 4 a , 5 a , and 6 a , respectively.
  • load lock chambers 13 and 14 for transferring processing objects such as wafers to the reaction chambers 10 , 11 , and 12 and a transfer chamber 15 provided therein with a robot (transfer apparatus) that transfers the processing objects, brought into the load lock chamber 13 , into the reaction chambers 10 , 11 , and 12 and transfers them from the reaction chambers 10 , 11 , and 12 into the load lock chamber 14 .
  • a robot transfer apparatus
  • a booster pump 8 a , a back pump 8 b , and a compressor 8 c are connected to the load lock chamber 13 , a booster pump 7 a , a back pump 7 b , and a compressor 7 c are connected to the load lock chamber 14 , and a booster pump 9 a and a back pump 9 b are connected to the transfer chamber 15 , thereby being capable of bringing those chambers into depressurized or vacuum states, respectively.
  • reaction chambers 10 , 11 , and 12 are each provided with a gas inlet and heating means such as a heater to thereby carry out predetermined processing such as film formation while introducing a predetermined gas under heating.
  • symbols A 1 denote pipes between the high vacuum pumps 1 , 2 , and 3 and the booster pumps 4 a , 5 a , and 6 a , respectively
  • symbols A 2 denote pipes between the reaction chambers 10 , 11 , and 12 and the high vacuum pumps 1 , 2 , and 3 , respectively.
  • symbol R denotes a clean room.
  • a cassette with a plurality of processing objects such as wafers placed therein is brought into the load lock chamber 13 from the atmosphere outside the system and the load lock chamber 13 is evacuated.
  • a gate valve (not illustrated) between the load lock chamber 13 and the transfer chamber 15 is opened and the processing object transfer robot uses its transfer arm to pick up one of the processing objects from the cassette and transfer it into the transfer chamber 15 .
  • a gate valve (not illustrated) between the reaction chamber 10 and the transfer chamber 15 is opened and the processing object is placed on a stage in the reaction chamber 10 by the use of the transfer arm.
  • the processed object is transferred into the other reaction chamber 11 or 12 or the load lock chamber 14 by the use of the transfer arm.
  • the processed object is finally transferred to the exterior from the load lock chamber 14 .
  • the high vacuum pump of a high vacuum pump that operates in a molecular flow region of ultimate pressure (10 ⁇ 7 Torr or less).
  • a turbomolecular pump or a thread groove pump is used as the high vacuum pump.
  • the turbomolecular pump and the thread groove pump each generally have a low allowable back pressure of 1 Torr or less (specifically 0.5 Torr or less) while the pumping speed is high even with a small size. Therefore, there is/are provided, at the subsequent stage of the high vacuum pump, an intermediate/low vacuum pump or intermediate/low vacuum pumps in one or two stages which each operate at a relatively low back pressure while the ultimate pressure is relatively low.
  • a booster pump or the like is provided subsequent to the high vacuum pump as an intermediate vacuum pump and, further, a back pump (Roots-type back pump or the like) is provided subsequent to the booster pump as a low vacuum pump that operates at a relatively low back pressure while the ultimate pressure is low.
  • the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b serving as the vacuum pumps at the last stage in FIG. 1 are respectively provided with gas recovery apparatuses B incorporated with compressors 4 c , 5 c , and 6 c each having a vacuum pump function that can assist the depressurization operation by the back pump or suppress back diffusion from a discharge port of the back pump and compressors 7 c , 8 c , and 9 c each having the vacuum pump function.
  • the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b in FIG. 1 have screw pumps, respectively.
  • a male rotor 25 and a female rotor 26 of the screw pump are received in a main casing 42 and rotatably supported by bearings 35 and 36 attached to an end plate 43 sealing the main casing 42 on its one end side and bearings 37 and 38 attached to an auxiliary casing 46 , respectively.
  • Timing gears 31 and 32 accommodated in the auxiliary casing 46 are mounted on rotation shafts 27 and 28 of the male and female rotors 25 and 26 , respectively, and a gap between the male rotor 25 and the female rotor 26 is adjusted so that both rotors do not contact each other. Further, a motor M is attached to the rotation shaft of the male rotor 25 through a coupling or speed change gear. It is configured that the rotation of the motor M is transmitted to the male rotor 25 and rotates the female rotor 26 through the timing gears 31 and 32 .
  • An auxiliary casing 55 provided with an inlet port 56 is attached to the main casing 42 on its one end side. Further, the end plate 43 of the main casing 42 is formed with a discharge port 57 for discharging a gas compressed by the male rotor 25 and the female rotor 26 .
  • a cooling jacket 33 is formed on the outside of the main casing 42 .
  • a coolant such as water is circulated in the cooling jacket 33 to thereby cool the main casing 42 , the compressed gas, and so on.
  • this vacuum apparatus is provided with the gas recovery apparatuses B incorporated with the compressors 4 c , 5 c , and 6 c and the compressors 7 c , 8 c , and 9 c having the vacuum pump function and connected to the discharge ports 57 of the screw pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b for suppressing the back diffusion through the discharge ports 57 from the exterior near the atmospheric pressure to thereby reduce the power consumption.
  • the back diffusion through the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b is largely reduced, thereby enabling a large reduction in power consumption.
  • the ultimate pressure of the compressor ( 4 c , 5 c , 6 c , 7 c , 8 c , or 9 c ) having the vacuum pump function can be reduced to approximately 300 Torr.
  • FIG. 3 shows the results of examining the relationship between the pressure at the inlet port 56 of the screw pump and the power consumption of the screw pump when the screw pumps were used as the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b in the vacuum apparatus shown in FIG. 1 .
  • the measurement was carried out in the case where the exhaust was performed with the compressors 4 c , 5 c , 6 c , 7 c , 8 c , and 9 c , having the vacuum pump function, connected to the discharge ports of the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b and in the case where no compressor having the vacuum pump function was connected to any of the back pumps 4 b , 5 b , 6 b , 7 b , 8 b , and 9 b .
  • the power consumption is low overall regardless of the inlet pressure as compared with the screw pump having no compressor with the vacuum pump function.
  • the screw pump having the compressor with the vacuum pump function is reduced in power consumption by approximately 50% as compared with the screw pump having no compressor with the vacuum pump function.
  • the number of stages of the vacuum pumps in the vacuum apparatus is not limited to the multistage structure but may be two stages or one stage. That is, a vacuum pump (last-stage vacuum pump) to be connected with a compressor is not limited to a back pump in a multistage structure but may be a second-stage vacuum pump in a two-stage structure or a first-stage vacuum pump in a single-stage structure as long as the back pressure thereof is within a pressure range over which the effect of the compressor appears. Further, this vacuum pump may be one of various types of vacuum pumps such as the Roots type.
  • the predetermined amount of the gas supply in this case is determined based on various conditions, particularly the process pressure, the performance (back pressure, pumping speed, etc.) of the booster pump 4 a , and the performance (pressure, pumping speed, etc.) of the compressor 4 c .
  • the booster pump 4 a has the performance with the back pressure being 200 Torr and the pumping speed being 2000 L/min
  • the compressor 4 c has the performance with the pressure being 200 Torr and the pumping speed being 50 L/min
  • the last-stage back pump 4 b can be omitted and further the high vacuum pump 1 can also be omitted, wherein the reaction chamber 10 can be evacuated by the booster pump (second vacuum pump) 4 a and the compressor 4 c.
  • the use of the vacuum apparatus of this invention is not limited to a semiconductor device manufacturing apparatus but it can be used in every industrial field that requires depressurization.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
  • Applications Or Details Of Rotary Compressors (AREA)
  • Non-Positive Displacement Air Blowers (AREA)
US10/589,748 2004-02-17 2005-02-14 Vacuum Apparatus Abandoned US20080206072A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004-39597 2004-02-17
JP2004039597A JP4633370B2 (ja) 2004-02-17 2004-02-17 真空装置
PCT/JP2005/002151 WO2005078281A1 (fr) 2004-02-17 2005-02-14 Appareil à vide

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US20080206072A1 true US20080206072A1 (en) 2008-08-28

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US10/589,748 Abandoned US20080206072A1 (en) 2004-02-17 2005-02-14 Vacuum Apparatus

Country Status (4)

Country Link
US (1) US20080206072A1 (fr)
JP (1) JP4633370B2 (fr)
TW (1) TW200537025A (fr)
WO (1) WO2005078281A1 (fr)

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CN103635688A (zh) * 2011-11-16 2014-03-12 新东工业株式会社 真空装置以及真空装置的真空容器内的压力控制方法
US20150028039A1 (en) * 2012-03-26 2015-01-29 Bayerische Motoren Werke Aktiengesellschaft Vehicle Tank System for Storing a Fuel in an Extremely Cold State
US20170183112A1 (en) * 2015-12-28 2017-06-29 William Terence Birch Apparatus for Vacuum Sealing Products
JP2018071210A (ja) * 2016-10-31 2018-05-10 範多機械株式会社 汚泥吸引車
US20180328410A1 (en) * 2017-05-10 2018-11-15 Edwards Limited Lubrication of gears in twin-shaft pumps

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US10978315B2 (en) 2014-05-30 2021-04-13 Ebara Corporation Vacuum evacuation system

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