US20080156351A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method Download PDF

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Publication number
US20080156351A1
US20080156351A1 US11/958,891 US95889107A US2008156351A1 US 20080156351 A1 US20080156351 A1 US 20080156351A1 US 95889107 A US95889107 A US 95889107A US 2008156351 A1 US2008156351 A1 US 2008156351A1
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United States
Prior art keywords
substrate
holding member
processing
reversing
reverse holding
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Abandoned
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US11/958,891
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English (en)
Inventor
Ichiro Mitsuyoshi
Jun Shibukawa
Shinji Kiyokawa
Tomohiro Kurebayashi
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Dainippon Screen Manufacturing Co Ltd
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Individual
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Assigned to DAINIPPON SCREEN MFG. CO., LTD. reassignment DAINIPPON SCREEN MFG. CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIYOKAWA, SHINJI, KUREBAYASHI, TOMOHIRO, SHIBUKAWA, JUN, MITSUYOSHI, ICHIRO
Publication of US20080156351A1 publication Critical patent/US20080156351A1/en
Priority to US14/223,391 priority Critical patent/US10040102B2/en
Priority to US14/223,226 priority patent/US8919358B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

Definitions

  • the present invention relates to a substrate processing apparatus and a substrate processing method for subjecting a substrate to processing.
  • Substrate processing apparatuses have been conventionally used to perform various types of processes on substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for optical disks or the like.
  • the substrate processing apparatus including a reversing unit that reverses a top surface and a back surface of the substrate is described in JP 2004-146708 A.
  • a center robot transport unit that transports the substrate is arranged in substantially the center of a processing section having a rectangular shape.
  • a plurality of (four, for example) back surface cleaning units that perform cleaning processes on the back surfaces of the substrates, respectively, are arranged so as to surround the center robot.
  • the reversing unit is arranged in a position where the center robot can access in the processing section.
  • An indexer section including a plurality of storing containers that store the substrates is provided on one end of the processing section.
  • a substrate transport robot that takes the substrate before processing out of the above-mentioned storing container or stores the substrate after the processing in the above-mentioned storing container is provided in this indexer section.
  • the substrate transport robot takes the substrate before the processing out of any of the storing containers and transfers it to the center robot while receiving the substrate after the processing from the center robot and storing it in the storing container.
  • the center robot receives the substrate before the processing from the substrate transport robot and subsequently transfers the received substrate to the reversing unit.
  • the reversing unit reverses the substrate received from the center robot so that the top surface thereof is directed downward. Then, the center robot receives the substrate reversed by the reversing unit and carries the substrate to any of the back surface cleaning units.
  • the center robot carries the substrate out of the back surface cleaning unit and again transfers it to the reversing unit.
  • the reversing unit reverses the substrate that has been subjected to the processing in the back surface cleaning unit so that the top surface thereof is directed upward.
  • the center robot subsequently receives the substrate reversed by the reversing unit and transfers it to the substrate transport robot.
  • the substrate transport robot receives the substrate after the processing from the center robot and stores it in the storing container.
  • the substrate before the processing stored in the storing container is reversed by the reversing unit and subjected to the processing (processing to the back surface of the substrate) in the back surface cleaning unit, and subsequently reversed again by the reversing unit and stored in the storing container as the substrate after the processing.
  • the center robot is required to perform four transporting processes for the single substrate, that is, a transporting process from the substrate transport robot to the reversing unit, a transporting process from the reversing unit to the back surface cleaning unit, a transporting process from the back surface cleaning unit to the reversing unit and a transporting process from the reversing unit to the substrate transport robot.
  • a plurality of top surface cleaning units are arranged in the processing section instead of part of the back surface cleaning units.
  • the center robot is required to perform five transporting processes for the single substrate, that is, the transporting process from the substrate transport robot to the reversing unit, the transporting process from the reversing unit to the back surface cleaning unit, the transporting process from the back surface cleaning unit to the reversing unit, a transporting process from the reversing unit to the top surface cleaning unit and a transporting process from the top surface cleaning unit to the substrate transport robot.
  • a substrate processing apparatus that performs processing on a substrate having a top surface and a back surface includes a processing region for processing the substrate, a carrying in and out region for carrying the substrate into and out of the processing region and first and second reversing devices that are provided between the processing region and the carrying in and out region and reverse the top surface and the back surface of the substrate, wherein the carrying in and out region includes a container platform where a storing container that stores the substrate is placed and a first transport device that transports the substrate between the storing container placed on the container platform and any of the first and second reversing devices, the processing region includes a processing unit that performs processing on the substrate and a second transport device that transports the substrate between any of the first and second reversing devices and the processing unit, the first reversing device is used in transfer of the substrate from the first transport device to the second transport device and the second reversing device is used in transfer of the substrate from the second transport device to the first transport device.
  • the substrate is stored in the storing container placed on the container platform in the carrying in and out region.
  • the first and second reversing devices that reverse the top surface and the back surface of the substrate are provided between the processing region and the carrying in and out region.
  • the substrate is transported by the first transport device in the carrying in and out region between the above-mentioned storing container and any of the first and second reversing devices.
  • the substrate is transported by the second transport device in the processing region between any of the first and second reversing devices and the processing unit.
  • the substrate is processed in the processing region.
  • the above-mentioned first reversing device is used in transfer of the substrate from the first transport device to the second transport device
  • the second reversing device is used in transfer of the substrate from the second transport device to the first transport device.
  • the first and second reversing devices are provided between the processing region and the carrying in and out region, so that the transporting process by the second transport device between the first transport device and the first and second reversing devices can be eliminated.
  • the number of the transporting processes for the single substrate by the second transport device is reduced. This improves the throughput of the substrate processing.
  • the first reversing device is used in transfer of the substrate from the first transport device to the second transport device, that is, in transfer of the substrate before the processing
  • the second reversing device is used in transfer of the substrate from the second transport device to the first transport device, that is, in transfer of the substrate after the processing
  • the substrate after the processing is prevented from being contaminated by the substrate before the processing when being received and transferred between the first transport device and the second transport device.
  • the first and second reversing devices are provided between the processing region and the carrying in and out region, so that the configuration of the existing substrate processing apparatus (a configuration of a so-called platform) is not required to be changed.
  • an increase in production cost of the substrate processing apparatus can be suppressed.
  • providing the first and second reversing devices does not increase the footprint of the substrate processing apparatus or prevent the substrate processing apparatus from being reduced in size.
  • first and second reversing devices function as interfaces, so that the production cost of the substrate processing apparatus can be further reduced.
  • Each of the first and second reversing devices may reverse the substrate around a rotation axis that crosses a line connecting a position of the first transport device in receiving and transferring the substrate and a position of the second transport device in receiving and transferring the substrate.
  • the first and second reversing devices can transfer and receive the substrate to and from the first and second transport devices without changing their directions.
  • the configurations of the first and second reversing devices are simplified while the cost can be reduced.
  • the directions of the first and second reversing devices are not required to be changed, so that the throughput of the substrate processing is improved.
  • Each of the first and second reversing devices may include a first holding mechanism that holds the substrate vertically to a first axis, a second holding mechanism that holds the substrate vertically to the first axis, a support member that supports the first and second holding mechanisms so that the first and second holding mechanisms overlap with each other in a direction of the first axis and a rotating device that integrally rotates the support member together with the first and second holding mechanisms around a second axis that is substantially vertical to the first axis.
  • the substrate is held vertically to the first axis by at least one of the first and second holding mechanisms.
  • the first and second holding mechanisms are integrally rotated around the second axis that is substantially vertical to the first axis by the rotating device. Accordingly, the substrate held by the first holding mechanism or the second holding mechanism is reversed.
  • the substrate after the reversing can be carried out of one of the first and second holding mechanisms by one of the two transport holders and the substrate before the reversing can be carried into the other of the first and second holding mechanisms by the other of the two transport holders.
  • the first and second holding mechanisms are supported so as to overlap with each other in the direction of the first axis. Therefore, the two transport holders are arranged so as to overlap with each other in the direction parallel to the first axis, so that the substrate can be carried into and out of the first and second holding mechanisms by hardly moving the two transport holders in the direction parallel to the first axis. This allows the substrate to be quickly carried into and out of the first and second reversing devices.
  • the two transport holders are arranged so as to overlap with each other in the direction parallel to the first axis, so that the two substrates can be simultaneously carried into the first and second holding mechanisms by the two transport holders while the two substrates can be simultaneously carried out of the first and second holding mechanisms by the two transport holders. Accordingly, the substrate can be quickly carried into and out of the first and second reversing devices while the plurality of substrates can be efficiently reversed.
  • the first and second holding mechanisms may include a common reverse holding member having one surface and the other surface that are vertical to the first axis
  • the first holding mechanism may include a plurality of first supporters that are provided on the one surface of the common reverse holding member and support a periphery of the substrate, a first reverse holding member provided so as to face the one surface of the common reverse holding member, a plurality of second supporters that are provided on a surface, which faces the common reverse holding member, of the first reverse holding member and support the periphery of the substrate and a first driving mechanism that moves at least one of the first reverse holding member and the common reverse holding member so that the first reverse holding member and the common reverse holding member are selectively shifted between a state where the first reverse holding member and the common reverse holding member are spaced apart from each other in the direction of the first axis and a state where the first reverse holding member and the common reverse holding member are close to each other and the second holding mechanism may include a plurality of third supporters that are provided on the other surface of the common reverse holding member and support the
  • the substrate is inserted into a space between the plurality of first supporters provided on the one surface of the common reverse holding member and the plurality of second supporters provided on the surface, which faces the common reverse holding member, of the first reverse holding member in the state where the first reverse holding member and the common reverse holding member are spaced apart from each other.
  • at least one of the first reverse holding member and the common reverse holding member is moved by the first driving mechanism so that the first reverse holding member and the common reverse holding member are close to each other.
  • the periphery of the substrate is held by the plurality of first and second supporters.
  • the first reverse holding member, the second reverse holding member and the common reverse holding member are integrally rotated around the second axis by the rotating device. Accordingly, the substrate held by the first reverse holding member and the common reverse holding member is reversed.
  • the substrate is inserted into a space between the plurality of third supporters provided on the other surface of the common reverse holding member and the plurality of fourth supporters provided on the surface, which faces the common reverse holding member, of the second reverse holding member in the state where the second reverse holding member and the common reverse holding member are spaced apart from each other.
  • at least one of the second reverse holding member and the common reverse holding member is moved by the second driving mechanism so that the second reverse holding member and the common reverse holding member come close to each other.
  • the periphery of the substrate is held by the plurality of third and fourth supporters.
  • the first reverse holding member, the second reverse holding member and the common reverse holding member are integrally rotated around the second axis by the rotating device. Accordingly, the substrate held by the second reverse holding member and the common reverse holding member is reversed.
  • the common reverse holding member may be secured to the support member
  • the first driving mechanism may move the first reverse holding member relative to the common reverse holding member so that the first reverse holding member is selectively shifted between the state where the first reverse holding member and the common reverse holding member are spaced apart from each other and the state where the first reverse holding member and the common reverse holding member are close to each other
  • the second driving mechanism may move the second reverse holding member relative to the common reverse holding member so that the second reverse holding member is selectively shifted between the state where the second reverse holding member and the common reverse holding member are spaced apart from each other and the state where the second reverse holding member and the common reverse holding member are close to each other.
  • the first reverse holding member is moved by the first driving mechanism so as to come close to the common reverse holding member, so that the substrate is held by the plurality of first and second supporters.
  • the second reverse holding member is moved by the second driving mechanism so as to come close to the common reverse holding member, so that the substrate is held by the plurality of third and fourth supporters. This allows the substrate to be reversed in the simple configuration.
  • the second transport device may have first and second transport holders and a distance between a holding position of the substrate by the first holding mechanism and a holding position of the substrate by the second holding mechanism may be substantially equal to a distance between a holding position of the substrate by the first transport holder of the second transport device and a holding position of the substrate by the second transport holder.
  • the substrate after the reversing can be carried out of one of the first and second holding mechanisms by one of the first and second transport holders and the substrate before the reversing can be carried into the other of the first and second holding mechanisms by the other of the first and second transport holders by hardly moving the first and second transport holders of the second transport device in the direction parallel to the first axis.
  • This allows the substrate to be carried into and out of the first and second reversing devices more quickly.
  • the two substrates can be simultaneously carried into the first and second holding mechanisms by the first and second transport holders while the two substrates can be simultaneously carried out of the first and second holding mechanisms by the first and second transport holders. Accordingly, the substrates can be quickly carried into and out of the first and second reversing devices while the plurality of substrates can be reversed efficiently.
  • the processing unit may include a first cleaning processing unit that cleans the back surface of the substrate and the second transport device may transport the substrate among the first reversing device, the second reversing device and the first cleaning processing unit.
  • the substrate reversed by the first reversing device with the back surface thereof directed upward is transported to the first cleaning processing unit by the second transport device.
  • the back surface of the substrate that is directed upward is cleaned in the first cleaning processing unit.
  • the first cleaning processing unit may include a plurality of first cleaning units arranged in a plurality of stages.
  • the plurality of first cleaning units are arranged in the plurality of stages, so that the footprint can be reduced and the throughput of the back surface processing of the substrate can be improved. This can improve the throughput of the substrate processing of the whole substrate processing apparatus.
  • the first reversing device may be used for reversing the substrate before the processing by the first cleaning processing unit.
  • the substrate before the processing by the first cleaning processing unit is reversed by the first reversing device. This prevents the substrate that is carried into the second reversing device after the processing from being contaminated by the substrate before the processing.
  • the processing unit may further include a second cleaning processing unit that cleans the top surface of the substrate and the second transport device may transport the substrate among the first reversing device, the second reversing device, the first cleaning processing unit and the second cleaning processing unit.
  • the substrate with the top surface thereof directed upward is transported to the second cleaning processing unit by the second transport device.
  • the top surface of the substrate that is directed upward is cleaned in the second cleaning processing unit.
  • the second cleaning processing unit may include a plurality of second cleaning units arranged in a plurality of stages.
  • the plurality of second cleaning units are arranged in the plurality of stages, so that the footprint can be reduced while the throughput of the top surface processing of the substrate can be improved. This can improve the throughput of the substrate processing of the whole substrate processing apparatus.
  • the first reversing device may be used for reversing the substrate after the processing by the first cleaning processing unit.
  • the substrate after the processing by the first cleaning processing unit is reversed by the first reversing device.
  • the substrate after the processing by the second cleaning processing unit can be transferred to the first transport device through the second reversing device. Accordingly, the substrate that is carried into the second reversing device after the processing is prevented from being contaminated by the substrate before the processing.
  • a substrate processing method that subjects a substrate to processing by a substrate processing apparatus including a carrying in and out region that includes a container platform and a first transport device, a processing region that includes a plurality of processing units and a second transport device, and first and second reversing devices provided between the processing region and the carrying in and out region includes the steps of taking the substrate before the processing out of a storing container placed on the container platform and transferring the taken out substrate before the processing to the first reversing device by the first transport device, reversing the substrate before the processing in the first reversing device, receiving the substrate before the processing from the first reversing device and carrying the received substrate into any of the plurality of processing units by the second transport device, carrying the substrate having been processed in any of the plurality of processing units out of the processing unit and transferring the carried out substrate after the processing to the second reversing device by the second transport device, and receiving the substrate after the processing from the second reversing device and storing the received substrate after
  • the substrate before the processing is taken out of the storing container placed on the container platform by the first transport device.
  • the taken out substrate before the processing is transferred to the first reversing device by the first transport device.
  • the substrate before the processing is received from the first reversing device to the second transport device, and the received substrate before the processing is carried into any of the plurality of processing units by the second transport device.
  • the substrate having been processed in any of the plurality of processing units is carried out of the processing unit by the second transport device and the carried out substrate after the processing is transferred to the second reversing device by the second transport device.
  • the substrate after the processing is subsequently received from the second reversing device by the first transport device, and the received substrate after the processing is stored in the storing container by the first transport device.
  • the first and second reversing devices are provided between the processing region and the carrying in and out region, so that the transporting process between the first transport device and the first and second reversing devices by the second transport device can be eliminated. Accordingly, the number of the transporting processes by the second transport device for the single substrate is reduced. This improves throughput of the substrate processing.
  • the first reversing device is used in transfer of the substrate from the first transport device to the second transport device, that is, in transfer of the substrate before the processing
  • the second reversing device is used in transfer of the substrate from the second transport device to the first transport device, that is, in transfer of the substrate after the processing
  • the substrate after the processing is prevented from being contaminated by the substrate before the processing when the substrate is received and transferred between the first transport device and the second transport device.
  • the first and second reversing devices are provided between the processing region and the carrying in and out region, so that the configuration of the existing substrate processing apparatus (the configurations of the so-called platforms) is not required to be changed.
  • the increase in the production cost of the substrate processing apparatus can be suppressed.
  • providing the first and second reversing devices does not increase the footprint of the substrate processing apparatus or prevent the substrate processing apparatus from being reduced in size.
  • first and second reversing devices function as the interfaces, so that the production cost of the substrate processing apparatus can be further reduced.
  • the throughput of the substrate processing can be improved.
  • the substrate after the processing can be prevented from being contaminated by the substrate before the processing when the substrate is received and transferred between the first transport device and the second transport device.
  • the increase in the production cost of the substrate processing apparatus can be suppressed.
  • the footprint of the substrate processing apparatus is not increased and the substrate processing apparatus is not prevented from being reduced in size.
  • FIG. 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment
  • FIG. 2 is a schematic view showing a cross section of FIG. 1( a ) taken along the line A-A;
  • FIG. 3 is a schematic view showing a detailed configuration of a main robot
  • FIG. 4 is a schematic view showing a configuration of a reversing unit
  • FIG. 5 is an explanatory view showing how a substrate is carried into and out of the reversing unit by each of an indexer robot and the main robot;
  • FIG. 6 is an explanatory view showing a first pattern of carrying the substrate into and out of the reversing unit by the main robot;
  • FIG. 7 is an explanatory view showing the first pattern of carrying the substrate into and out of the reversing unit by the main robot;
  • FIG. 8 is an explanatory view showing a second pattern of carrying the substrate into and out of the reversing unit by the main robot;
  • FIG. 9 is a schematic view showing a configuration of a top surface cleaning unit
  • FIG. 10 is a schematic view showing a configuration of a back surface cleaning unit.
  • FIG. 11 is a schematic view showing a configuration of a substrate processing apparatus according to a second embodiment.
  • a substrate refers to a semiconductor wafer, a glass substrate for a liquid crystal display, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask and a substrate for an optical disk or the like.
  • a surface of the substrate on which a variety of patterns such as a circuit pattern or the like are to be formed is referred to as a top surface and the opposite surface thereof is referred to as a back surface.
  • a surface of the substrate directed downward is referred to as a lower surface and a surface of the substrate directed upward is referred to as an upper surface.
  • FIG. 1 is a schematic view showing a configuration of a substrate processing apparatus according to a first embodiment.
  • FIG. 1( a ) is a plan view of the substrate processing apparatus and
  • FIG. 1( b ) is a side view in which the substrate processing apparatus of FIG. 1( a ) is seen from the direction of the arrow X.
  • FIG. 2 is a schematic view showing a cross section of FIG. 1( a ) taken along the line A-A.
  • the substrate processing apparatus 100 includes an indexer block 10 and a processing block 11 .
  • the indexer block 10 and the processing block 11 are provided in parallel to each other.
  • the indexer block 10 is provided with a plurality of carrier platforms 40 , an indexer robot IR and a controller 4 .
  • Carriers C that store a plurality of substrates W in multiple stages are placed on the carrier platforms 40 , respectively.
  • the indexer robot IR is constructed so that it can move in the direction of the arrow U ( FIG. 1( a )), rotate around a vertical axis and move up and down.
  • the indexer robot IR has hands IRH 1 , IRH 2 provided one above the other for receiving and transferring the substrate W.
  • the hands IRH 1 , IRH 2 hold a peripheral portion of the lower surface of the substrate Wand an outer circumference of the substrate W.
  • the controller 4 is composed of a computer or the like including a CPU (central processing unit), and controls each unit in the substrate processing apparatus 100 .
  • a plurality of (four in FIG. 1( b )) top surface cleaning units SS, a plurality of (four in FIG. 1( b )) back surface cleaning units SSR and a main robot MR are provided in the processing block 11 .
  • One side of the processing block 11 has a vertical stack of the plurality of top surface cleaning units SS, and the other side of the processing block 11 has a vertical stack of the plurality of back surface cleaning units SSR.
  • the main robot MR is provided between the plurality of top surface cleaning units SS and the plurality of back surface cleaning units SSR.
  • the main robot MR is constructed so that it can rotate around a vertical axis and move up and down.
  • the main robot MR has hands MRH 1 , MRH 2 provided one above the other for receiving and transferring the substrate W.
  • the hands MRH 1 , MRH 2 hold the peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W. Details of the main robot MR will be described later.
  • reversing units RT 1 , RT 2 for reversing the substrate W are provided one above the other at a predetermined spacing between the indexer block 10 and the processing block 11 . Details of the reversing units RT 1 , RT 2 will be described later.
  • the indexer robot IR takes out the unprocessed substrate W from one of the carriers C placed on the carrier platforms 40 by using the lower hand IRH 2 . At this point, the top surface of the substrate W is directed upward.
  • the hand IRH 2 of the indexer robot IR holds the peripheral portion of the back surface of the substrate W and the outer circumference of the substrate W.
  • the indexer robot IR turns around the vertical axis while moving in the direction of the arrow U, and transfers the unprocessed substrate W to a reversing unit RT 1 .
  • the unprocessed substrate W with the top surface thereof directed upward is reversed so that the back surface thereof is directed upward.
  • the substrate W after reversing is carried out of the reversing unit RT 1 by the main robot MR, and subsequently carried into the back surface cleaning unit SSR.
  • back surface cleaning unit SSR cleaning processing is performed on the back surface of the substrate W.
  • the cleaning processing of the back surface of the substrate W is referred to as the back surface cleaning processing. Note that details of the back surface cleaning processing by the back surface cleaning unit SSR will be described later.
  • the substrate W after the back surface cleaning processing is carried out of the back surface cleaning unit SSR by the main robot MR, and subsequently carried into the reversing unit RT 1 .
  • the substrate W with the back surface thereof directed upward is reversed so that the top surface thereof is directed upward.
  • the substrate W after the reversing is carried out of the reversing unit RT 1 by the main robot MR, and subsequently carried into the top surface cleaning unit SS.
  • top surface cleaning unit SS cleaning processing is performed on the top surface of the substrate W.
  • the cleaning processing of the top surface of the substrate W is referred to as the top surface cleaning processing. Note that details of the top surface cleaning processing by the top surface cleaning unit SS will be described later.
  • the substrate W after the top surface cleaning processing is carried out of the top surface cleaning unit SS by the main robot MR, and carried into the reversing unit RT 2 .
  • the carried in substrate W is held in the reversing unit RT 2 without being reversed, and subsequently received by the indexer robot IR and stored in the carrier C.
  • FIG. 3( a ) is a side view of the main robot MR
  • FIG. 3( b ) is a plan view of the main robot MR.
  • the main robot MR includes a base 21 , to which a moving portion 22 is attached so as to be able to vertically move and turn with respect to the base 21 .
  • the hands MRH 1 and MRH 2 are connected to the moving portion 22 by multi-joint type arms AM 1 and AM 2 , respectively.
  • the moving portion 22 is moved up and down by a lifting mechanism 25 provided in the base 21 while being turned around a vertical axis by a turning driving mechanism 26 provided in the base 21 .
  • the multi-joint type arms AM 1 , AM 2 are independently driven by driving mechanisms that are not shown, respectively, and horizontally move the respective hands MRH 1 , MRH 2 forward and backward while keeping them in fixed postures.
  • Each of the hands MRH 1 , MRH 2 is arranged to have a certain height with respective to the moving portion 22 , and the hand MRH 1 is positioned above the hand MRH 2 .
  • a difference M 1 ( FIG. 3( a )) in height between the hands MRH 1 and MRH 2 is maintained constant.
  • the hands MRH 1 , MRH 2 have the same shape and are formed to be approximately U-shaped, respectively.
  • the hand MRH 1 has two claw portions H 11 extending substantially in parallel to each other and the hand MRH 2 has two claw portions H 12 extending substantially in parallel to each other.
  • a plurality of support pins 23 are attached on the hands MRH 1 , MRH 2 , respectively.
  • the four support pins 23 are attached on the upper surfaces of the hands MRH 1 , MRH 2 , respectively, at substantially equal distances from each other along the outer circumference of the substrate W placed thereon. The peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W are held by the four support pins 23 .
  • FIG. 4( a ) is a side view of the reversing unit RT 1 , RT 2
  • FIG. 4( b ) is a perspective view of the reversing unit RT 1 , RT 2 .
  • the reversing unit RT 1 , RT 2 includes a support plate 31 , a fixed plate 32 , a pair of linear guides 33 a , 33 b , a pair of support members 35 a , 35 b , a pair of cylinders 37 a , 37 b , a first movable plate 36 a , a second movable plate 36 b and a rotary actuator 38 .
  • the support plate 31 is provided so as to vertically extend and the fixed plate 32 is attached to the support plate 31 so as to extend horizontally from the center of one surface of the support plate 31 .
  • the linear guide 33 a extending in a vertical direction to the fixed plate 32 is provided in a region of the support plate 31 on one surface side of the fixed plate 32 .
  • the linear guide 33 b extending in the vertical direction to the fixed plate 32 is provided in the region of the support plate 31 on the other surface side of the fixed plate 32 .
  • the linear guides 33 a , 33 b are provided symmetrically with respect to the fixed plate 32 .
  • the support member 35 a is provided so as to extend in a parallel direction to the fixed plate 32 on the one surface side of the fixed plate 32 .
  • the support member 35 a is slidably attached to the linear guide 33 a by a coupling member 34 a .
  • the support member 35 a is connected to the cylinder 37 a , which moves the support member 35 a up and down along the linear guide 33 a . In this case, the support member 35 a moves in the vertical direction to the fixed plate 32 while being maintained in a fixed posture.
  • the first movable plate 36 a is attached to the support member 35 a so as to face the one surface of the fixed plate 32 .
  • the support member 35 b is provided so as to extend in the parallel direction to the fixed plate 32 .
  • the support member 35 b is slidably attached to the linear guide 33 b by a coupling member 34 b .
  • the support member 35 b is connected to the cylinder 37 b , which moves the support member 35 b up and down along the linear guide 33 b .
  • the support member 35 b moves in the vertical direction to the fixed plate 32 while being maintained in a fixed posture.
  • the second movable plate 36 b is attached to the support member 35 b so as to face the other surface of the fixed plate 32 .
  • a distance M 2 between the first movable plate 36 a and the fixed plate 32 and a distance M 3 between the second movable plate 36 b and the fixed plate 32 are set to be substantially equal to the difference M 1 in height between the hand MRH 1 and the hand MRH 2 of the main robot MR shown in FIG. 3 in the present embodiment.
  • the rotary actuator 38 rotates the support plate 31 around the horizontal axis HA parallel to the direction of the arrow U ( FIG. 1 ). Accordingly, the first movable plate 36 a , the second movable plate 36 b and the fixed plate 32 that are coupled to the support plate 31 rotate around the horizontal axis HA (in the direction of ⁇ ).
  • each of the first movable plate 36 a , the fixed plate 32 and the second movable plate 36 b is formed in the shape of a flat plate.
  • a plurality of support pins 39 a are provided on the one surface, which faces the first movable plate 36 a , of the fixed plate 32
  • a plurality of support pins 39 b are provided on the other surface of the fixed plate 32 as shown in FIG. 4( a ).
  • a plurality of support pins 39 c are provided on one surface, which faces the fixed plate 32 , of the first movable plate 36 a
  • a plurality of support pins 39 d are provided on one surface, which faces the fixed plate 32 , of the second movable plate 36 b.
  • respective six pieces of the support pins 39 a , 39 b , 39 c , 39 d are provided. These support pins 39 a , 39 b , 39 c , 39 d are arranged along the outer circumference of the substrate W that is carried into the reversing unit RT 1 , RT 2 . Moreover, the support pins 39 a , 39 b , 39 c , 39 d have the same length.
  • a distance between the tips of the support pins 39 a and the tips of the support pins 39 d and a distance between the tips of the support pins 39 b and the tips of the support pins 39 c are substantially equal to the difference M 1 in height between the hand MRH 1 and the hand MRH 2 of the main robot MR shown in FIG. 3 .
  • the distance M 2 between the first movable plate 36 a and the fixed plate 32 and the distance M 3 between the second movable plate 36 b and the fixed plate 32 may be suitably changed.
  • the distance between the tips of the support pins 39 c and the tips of the support pins 39 d is set to be larger than the difference M 1 in height between the hand MRH 1 and the hand MRH 2 .
  • the main robot MR receives the unprocessed substrate W with the back surface thereof directed upward from the reversing unit RT 1 by the hand MRH 2 .
  • the main robot MR carries the substrate W after the back surface cleaning processing out of any of the back surface cleaning units SSR by the hand MRH 1 and carries the above-mentioned unprocessed substrate W held by the hand MRH 2 into the back surface cleaning unit SSR.
  • the main robot MR carries the substrate W with the top surface thereof directed upward out of the reversing unit RT 1 by the hand MRH 2 , and carries the substrate W after the above-mentioned back surface cleaning processing held by the hand MRH 1 into the reversing unit RT 1 .
  • the main robot MR subsequently carries the substrate W after the top surface cleaning processing out of any of the top surface cleaning units SS by the hand MRH 1 , and carries the above-mentioned substrate W with the top surface thereof directed upward held by the hand MRH 2 into the top surface cleaning unit SS.
  • the main robot MR carries the unprocessed substrate W with the back surface thereof directed upward out of the reversing unit RT 1 by the hand MRH 2 , and carries the above-mentioned substrate W after the top surface cleaning processing held by the hand MRH 1 into the reversing unit RT 2 .
  • the main robot MR successively performs a series of such operations.
  • FIG. 5( a ) is an explanatory view showing how the substrate W is carried into and out of the reversing unit RT 1 , RT 2 by the indexer robot IR
  • FIG. 5( b ) is an explanatory view showing how the substrate W is carried into and out of the reversing unit RT 1 , RT 2 by the main robot MR.
  • the reversing unit RT 1 , RT 2 is arranged so that the length direction of the support member 35 a is in parallel to the direction of the arrow U. That is, the above-mentioned direction of the arrow U is perpendicular to the direction of forward and backward movements of the hands IRH 1 , IRH 2 (shown in FIG. 1 , not shown in FIG. 5) of the indexer robot IR at the time of carrying in and out the substrate W and the direction of forward and backward movements of the hand MRH 1 , MRH 2 (shown in FIG. 1 , not shown in FIG. 5 ) of the main robot MR at the time of carrying in and out the substrate W.
  • a plurality of support pins 53 are attached on the hands IRH 1 , IRH 2 , respectively.
  • the four support pins 53 are attached on the upper surface of the hands IRH 1 , IRH 2 , respectively, at substantially equal distances from each other along the outer circumference of the substrate W placed thereon. The peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W are held by the four support pins 53 .
  • the respective support pins 39 a , 39 b , 39 c , 39 d of the reversing units RT 1 , RT 2 are provided in positions with which either of the hands IRH 1 , IRH 2 or the hands MRH 1 , MRH 2 does not come into contact when the substrate W is carried in and out as shown in FIG. 5( a ), ( b ).
  • FIG. 6 and FIG. 7 are explanatory views showing the first pattern of carrying the substrate into and out of the reversing unit RT 1 by the main robot MR. Note that since the operation of the respective processes of the reversing units RT 1 , RT 2 are the same, the case where the substrates W after the back surface cleaning processing by the back surface cleaning unit SSR are carried into the reversing unit RT 1 by the hands MRH 1 , MRH 2 and the substrates W after the back surface cleaning processing are reversed by the reversing unit RT 1 is explained as an example in FIG. 6 and FIG. 7 .
  • the hands MRH 1 , MRH 2 holding the substrates W simultaneously advance between the first movable plate 36 a and the fixed plate 32 and between the second movable plate 36 b and the fixed plate 32 .
  • the hands MRH 1 , MRH 2 are simultaneously lowered and withdraw as shown in FIG. 6( b ).
  • the substrates W are placed on the support pins 39 a , 39 d .
  • the substrates W with their back surfaces directed upward are placed on the support pins 39 a , 39 d in the reversing unit RT 1 .
  • the support member 35 a is lowered by the cylinder 37 a ( FIG. 4( a )) while the support member 35 b is lifted by the cylinder 37 b ( FIG. 4( a )) as shown in FIG. 6( c ).
  • the one substrate W is held by the support pins 39 c of the first movable plate 36 a and the support pins 39 a of the fixed plate 32
  • the other substrate W is held by the support pins 39 d of the second movable plate 36 b and the support pins 39 b of the fixed plate 32 .
  • the first movable plate 36 a , the fixed plate 32 and the second movable plate 36 b are integrally rotated by the rotary actuator 38 by 180 degrees in the direction of ⁇ (around the horizontal axis HA) as shown in FIG. 6( d ). Accordingly, the substrate W held by the support pins 39 a , 39 c and the substrate W held by the support pins 39 b , 39 d are reversed. In this case, the top surfaces of the substrates W are directed upward in the reversing unit RT 1 .
  • the support member 35 a is lowered by the cylinder 37 a while the support member 35 b is lifted by the cylinder 37 b as shown in FIG. 7( e ). Accordingly, the first movable plate 36 a is lowered while the second movable plate 36 b is lifted. Therefore, the one substrate W is supported by the support pins 39 c of the first movable plate 36 a , and the other substrate W is supported by the support pins 39 b of the fixed plate 32 .
  • the hands MRH 1 , MRH 2 advance below the substrate W supported by the support pins 39 b and below the substrate W supported by the support pins 39 c , respectively, and are lifted as shown in FIG. 7( f ).
  • the substrate W supported by the support pins 39 b is received by the hand MRH 1
  • the substrate W supported by the support pins 39 c is received by the hand MRH 2 .
  • the hands MRH 1 , MRH 2 simultaneously withdraw, so that the two substrates W are carried out of the reversing unit RT 1 as shown in FIG. 7( g ).
  • the hands IRH 1 , IRH 2 of the indexer robot IR may simultaneously carry the substrates W taken out of the carriers C into the reversing unit RT 1 and may simultaneously carry the substrates W out of the reversing unit RT 2 and store them in the carriers C, similarly to the case of the hands MRH 1 , MRH 2 of the main robot MR described above.
  • FIG. 8 is an explanatory view showing the second pattern of carrying the substrate into and out of the reversing unit RT 1 by the main robot MR.
  • the main robot MR carries the substrate W after the reversing out of the reversing unit RT 1 by the hand MRH 2 , and subsequently carries the substrate W before the reversing into the reversing unit RT 1 by the hand MRH 1 .
  • the hand MRH 1 of the main robot MR holds the substrate W before the reversing and the hand MRH 2 does not hold the substrate W immediately before the substrate W is carried out of the reversing unit RT 1 as shown in FIG. 8( a ).
  • the hand MRH 2 advances and is lifted, so that the substrate W on the support pins 39 c is received by the hand MRH 2 as shown in FIG. 8( b ).
  • the hand MRH 1 is lifted in accordance with the upward movement of the hand MRH 2 .
  • the hand MRH 2 withdraws while the hand MRH 1 advances with the heights of the hands MRH 1 , MRH 2 maintained as shown in FIG. 8( c ).
  • the distance M 2 between the first movable plate 36 a and the fixed plate 32 ( FIG. 4 ) and the distance M 3 between the second movable plate 36 b and the fixed plate 32 ( FIG. 4 ) are set to be substantially equal to the difference M 1 in height between the hand MRH 1 and the hand MRH 2 .
  • the hand MRH 1 advances to move to a position in between the second movable plate 36 b and the fixed plate 32 .
  • the hand MRH 1 is subsequently lowered and withdraws as shown in FIG. 8( d ). Accordingly, the substrate W is placed on the support pins 39 b .
  • the hand MRH 2 is lowered in accordance with the downward movement of the hand MRH 1 .
  • the substrate W is carried into and out of the reversing unit RT 1 by the main robot MR. Thereafter, the reversing unit RT 1 reverses the substrate W subsequently carried therein. That is, the substrate W is carried into the reversing unit RT 1 alternately in the state where the first movable plate 36 a is positioned above the fixed plate 32 and the state where the second movable plate 36 b is positioned above the fixed plate 32 .
  • FIG. 9 is a schematic view showing the configuration of the top surface cleaning unit SS
  • FIG. 10 is a schematic view showing the configuration of the back surface cleaning unit SSR.
  • the cleaning processing of the substrate W by using a brush (hereinafter referred to as the scrub cleaning processing) is performed.
  • the top surface cleaning unit SS includes a spin chuck 61 for rotating the substrate W around a vertical axis passing through the center of the substrate W while holding the substrate W horizontally.
  • the spin chuck 61 is secured to the upper end of a rotation shaft 63 that is rotated by a chuck rotation driving mechanism 62 .
  • the substrate W with the top surface thereof directed upward is carried into the top surface cleaning unit SS.
  • the scrub cleaning processing and rinsing processing are performed, the back surface of the substrate W is held by suction on the spin chuck 61 .
  • a motor 64 is provided outside the spin chuck 61 .
  • a rotation shaft 65 is connected to the motor 64 .
  • An arm 66 is coupled to the rotation shaft 65 so as to extend in a horizontal direction, and a substantially cylindrical brush cleaner 70 is provided on the tip of the arm 66 .
  • a liquid discharge nozzle 71 is provided above the spin chuck 61 for supplying a cleaning liquid or a rinse liquid (pure water) onto the top surface of the substrate W held by the spin chuck 61 .
  • the liquid discharge nozzle 71 is connected to a supply pipe 72 , and the cleaning liquid and the rinse liquid are selectively supplied to the liquid discharge nozzle 71 through this supply pipe 72 .
  • the motor 64 rotates the rotation shaft 65 .
  • the arm 66 turns within a horizontal plane, and the brush cleaner 70 moves between a position outside the substrate W and a position above the center of the substrate W, centered around the rotation shaft 65 .
  • a lifting mechanism (not shown) is provided in the motor 64 . The lifting mechanism lifts and lowers the brush cleaner 70 in the position outside the substrate W and the position above the center of the substrate W by lifting and lowering the rotation shaft 65 .
  • the substrate W with the top surface thereof directed upward is rotated by the spin chuck 61 .
  • the cleaning liquid or the rinse liquid is supplied to the liquid discharge nozzle 71 through the supply pipe 72 .
  • the cleaning liquid or the rinse liquid is supplied onto the top surface of the substrate W that rotates.
  • the brush cleaner 70 is swung and moved up and down by the rotation shaft 65 and the arm 66 . Accordingly, the scrub cleaning processing is performed on the top surface of the substrate W.
  • the suction-type spin chuck 61 is used in the top surface cleaning unit SS, the peripheral portion and the outer circumference of the substrate W can be simultaneously cleaned.
  • the back surface cleaning unit SSR includes a mechanical type spin chuck 81 that holds the outer circumference of the substrate W instead of the suction-type spin chuck 61 that holds the lower surface of the substrate W by vacuum suction.
  • the substrate W is rotated while being maintained in a horizontal posture with the peripheral portion of the lower surface of the substrate W and the outer circumference of the substrate W held by the spin holding pins 82 on the spin chuck 61 .
  • the substrate W with the back surface thereof directed upward is carried into the back surface cleaning unit SSR. Therefore, the substrate W is held by the spin chuck 81 with the back surface thereof directed upward. Then, a scrub cleaning processing that is similar to the above-described scrub cleaning processing is performed on the back surface of the substrate W.
  • the reversing units RT 1 , RT 2 are provided in an intermediate position between the indexer robot IR and the main robot MR in the present embodiment.
  • the main robot MR performs four transporting processes for the single substrate W, that is, a transporting process from the reversing unit RT 1 to the back surface cleaning unit SSR, a transporting process from the back surface cleaning unit SSR to the reversing unit RT 1 , a transporting process from the reversing unit RT 1 to the top surface cleaning unit SS and a transporting process from the top surface cleaning unit SS to the reversing unit RT 2 .
  • the main robot MR performs two transporting processes for the single substrate W, that is, a transporting process from the reversing unit RT 1 or RT 2 to the back surface cleaning unit SSR and a transporting process from the back surface cleaning unit SSR to the reversing unit RT 1 or RT 2 .
  • the number of the transporting processes of the main robot MR is reduced, so that the throughput of the substrate processing can be improved.
  • the reversing unit RT 1 is used in transfer of the substrate W before the back surface cleaning processing from the indexer robot IR to the main robot MR
  • the reversing unit RT 2 is used in transfer of the substrate W after the top surface cleaning processing from the main robot MR to the indexer robot IR in the present embodiment. This prevents the substrate W after the cleaning processing from being contaminated by the substrate W before the cleaning.
  • the reversing unit RT 2 is used as an interface for the substrate W after the top surface cleaning processing for the indexer robot IR, a new interface is not required to be provided in the substrate processing apparatus 100 in the present embodiment. This reduces the production cost of the substrate processing apparatus 100 .
  • the reversing units RT 1 , RT 2 are provided in the intermediate position between the indexer robot IR and the main robot MR while the plurality of back surface cleaning units SSR and the plurality of top surface cleaning units SS are arranged in multiple stages, respectively, with the main robot MR provided therebetween in the processing block 11 of the substrate processing apparatus 100 .
  • This can significantly reduce the substrate processing apparatus 100 in size and space compared to the case where the plurality of cleaning units are arranged in two dimensions and the reversing units are arranged on the side opposite to the indexer robot IR with the main robot MR positioned therebetween.
  • providing the plurality of top surface cleaning units SS and the plurality of back surface cleaning units SSR so as to be stacked in respective multiple stages in the height direction allows the configuration of the substrate processing apparatus 100 (a configuration of a so-called platform) to be reduced in size while disposing the top surface cleaning units SS and the back surface cleaning units SSR in the above-mentioned height direction allows the respective required numbers of top surface cleaning units SS and back surface cleaning units SSR to be easily provided.
  • the reversing unit RT 1 , RT 2 reverses the substrate W around the horizontal axis HA that is perpendicular to the line connecting a transfer position of the substrate W by the indexer robot IR and a transfer position of the substrate W by the main robot MR in the present embodiment.
  • This allows the substrate W to be received and transferred between the indexer robot IR and the reversing unit RT 1 , RT 2 , and allows the substrate W to be received and transferred between the main robot MR and the reversing unit RT 1 , RT 2 without moving the reversing unit RT 1 , RT 2 .
  • the configurations of the reversing units RT 1 , RT 2 are simplified while the reversing units RT 1 , RT 2 are reduced in size.
  • the two substrates W are simultaneously carried into the reversing units RT 1 , RT 2 by the hands IRH 1 , IRH 2 of the indexer robot IR or the hands MRH 1 , MRH 2 of the main robot MR, and simultaneously reversed by the reversing units RT 1 , RT 2 in the present embodiment.
  • the two substrates W are simultaneously carried out of the reversing units RT 1 , RT 2 by the hands IRH 1 , IRH 2 of the indexer robot IR or the hands MRH 1 , MRH 2 of the main robot MR.
  • the substrates W can be carried into and out of the reversing units RT 1 , RT 2 quickly while the plurality of substrates W can be reversed efficiently. This allows the throughput of the substrate processing to be improved.
  • the hand MRH 2 of the main robot MR is withdrawn to carry the substrate W after the reversing out of the reversing unit RT 1
  • the hand MRH 1 of the main robot MR is advanced at the constant level without being vertically moved, so that the substrate W before the reversing can be carried into the reversing unit RT 1 in the present embodiment.
  • the substrate W can be carried into and out of the reversing unit RT 1 quickly. Accordingly, the throughput of the substrate processing can be improved.
  • FIG. 11 is a schematic view showing a configuration of a substrate processing apparatus according to a second embodiment.
  • FIG. 11( a ) is a plan view of the substrate processing apparatus
  • FIG. 11( b ) is a side view in which the substrate processing apparatus of FIG. 11( a ) is seen from the direction of the arrow X.
  • the configuration of the substrate processing apparatus 100 a according to the present embodiment is different from the configuration of the substrate processing apparatus 100 according to the first embodiment in that the back surface cleaning units SSR are provided in the region where the top surface cleaning units SS are supposed to be provided ( FIG. 1) in the processing block 11 . That is, twice as many the back surface cleaning units SSR (eight units) as those of the substrate processing apparatus 100 are provided in the substrate processing apparatus 10 a.
  • the plurality of back surface cleaning units SSR are provided in the processing block 11 , so that the throughput of the back surface cleaning processing of the substrate W can be remarkably improved in addition to each of the effects described in the above first embodiment. Specifically, this allows the main robot MR to perform the two transporting processes for the single substrate W, that is, the transporting process from the reversing unit RT 1 or RT 2 to the back surface cleaning unit SSR and the transporting process from the back surface cleaning unit SSR to the reversing unit RT 1 or RT 2 . Thus, the throughput of the substrate processing in the substrate processing apparatus 100 a can be improved.
  • the present invention is not limited to this and the back surface cleaning processing of the substrate W may be performed after the top surface cleaning processing of the substrate W.
  • the substrate W is not reversed by the reversing unit RT 1 before being subjected to the top surface cleaning processing, and reversed by the reversing unit RT 2 after the back surface cleaning processing so that the top surface thereof is directed upward.
  • top surface and the back surface of the substrate W are cleaned by using the brush in the top surface cleaning unit SS and the back surface cleaning unit SSR in the above-described embodiments, the present invention is not limited to this and the top surface and the back surface of the substrate W may be cleaned by using a chemical liquid.
  • the present invention is not limited to this and the reversing unit RT 2 may reverse the substrate W before the back surface cleaning processing and may reverse the substrate W after the back surface cleaning processing.
  • the substrate W is carried into the reversing unit RT 1 after being subjected to the back surface cleaning processing and subsequently to the top surface cleaning processing.
  • control operation in the substrate processing apparatus can be suitably set so that the reversing operations of the substrate W after and before each of the processes can be performed by one of the reversing unit RT 1 and the reversing unit RT 2 or both of them.
  • the present invention is not limited to this and the substrate W may be carried into the reversing unit RT 1 by the hand MRH 2 and the substrate W may be carried out of the reversing unit RT 1 by the hand MRH 1 .
  • the main robot MR carries the substrate W after the reversing out of the reversing unit RT 1 and subsequently carries the substrate W before the reversing into the reversing unit RT 1 in the above-described embodiments, the present invention is not limited to this and the main robot MR may carry the substrate W before the reversing into the reversing unit RT 1 and subsequently carry the substrate W after the reversing out of the reversing unit RT 1 .
  • the length of each of the support pins 39 a , 39 b , 39 c , 39 d can be arbitrarily set within a range where the distance between the tips of the support pins 39 c and the tips of the support pins 39 d is larger than the difference M 1 in height between the hand MRH 1 and the hand MRH 2 and a distance between the tips of the support pins 39 a and the tips of the support pins 39 b is smaller than the difference M 1 in height between the hand MRH 1 and the hand MRH 2 with the first movable plate 36 a and the second movable plate 36 b being farthest away from the fixed plate 32 .
  • multi-joint type transport robots that linearly move their hands forward and backward by moving their joints are used as the indexer robot IR and the main robot MR in the above-described embodiments
  • the present invention is not limited to this and linear-type transport robots that move their hands forward and backward by linearly sliding them with respect to the substrate W may be used.
  • one or plurality of substrate platforms for temporarily placing the substrate W may be provided between the reversing unit RT 1 and the reversing unit RT 2 .
  • the main robot MR does not carry the substrate W after the top surface cleaning processing into the reversing unit RT 2 , and places it on the above-mentioned substrate platform.
  • Such a configuration allows the new substrate W to be carried into the reversing unit RT 2 from the carrier C by the indexer robot IR instead of carrying the substrate W after the top surface cleaning processing into the reversing unit RT 2 .
  • the order of the operations of the indexer robot IR and the main robot MR may be suitably changed depending on the processing speeds of the reversing units RT 1 , RT 2 , the top surface cleaning unit SS and the back surface cleaning unit SSR.
  • the respective numbers of the reversing units RT 1 , RT 2 , the top surface cleaning unit SS and the back surface cleaning unit SSR may be suitably changed depending on their processing speeds.
  • the indexer block 10 is an example of a carrying in and out region
  • the processing block 11 is an example of a processing region
  • the carrier C is an example of a storing container
  • the carrier platform 40 is an example of a container platform
  • the indexer robot IR is an example of a first transport device
  • the main robot MR is an example of a second transport device
  • the back surface cleaning unit SSR is an example of a first cleaning processing unit and a first cleaning unit
  • the top surface cleaning unit SS is an example of a second cleaning processing unit and a second cleaning unit
  • the horizontal axis HA is an example of a rotation axis.
  • the reversing units RT 1 , RT 2 are examples of first and second reversing devices, respectively, the fixed plate 32 , the first movable plate 36 a , the support pins 39 a , 39 c and the cylinder 37 a are examples of a first holding mechanism, the fixed plate 32 , the second movable plate 36 b , the support pins 39 b , 39 d and the cylinder 37 b are examples of a second holding mechanism, the support plate 31 is an example of a support member and the rotary actuator 38 is an example of a rotating device in the above-described embodiments.
  • the fixed plate 32 is an example of a common reverse holding member
  • the first movable plate 36 a is an example of a first reverse holding member
  • the second movable plate 36 b is an example of a second reverse holding member
  • the support pin 39 a is an example of a first supporter
  • the support pin 39 c is an example of a second supporter
  • the support pin 39 b is an example of a third supporter
  • the support pin 39 d is an example of a fourth supporter
  • the cylinder 37 a is an example of a first driving mechanism
  • the cylinder 37 b is an example of a second driving mechanism
  • a hand MRH 1 is an example of a first transport holder
  • the hand MRH 2 is an example of a second transport holder in the above-described embodiments.

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KR20080061289A (ko) 2008-07-02
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CN101211757A (zh) 2008-07-02
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US20140202501A1 (en) 2014-07-24
KR100927301B1 (ko) 2009-11-18
JP4744426B2 (ja) 2011-08-10
US8919358B2 (en) 2014-12-30
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US10040102B2 (en) 2018-08-07
TW200901357A (en) 2009-01-01

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