US20070227632A1 - Metal Strip Electroplating - Google Patents
Metal Strip Electroplating Download PDFInfo
- Publication number
- US20070227632A1 US20070227632A1 US10/584,068 US58406804A US2007227632A1 US 20070227632 A1 US20070227632 A1 US 20070227632A1 US 58406804 A US58406804 A US 58406804A US 2007227632 A1 US2007227632 A1 US 2007227632A1
- Authority
- US
- United States
- Prior art keywords
- anode
- strip
- tin
- anodes
- pellets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
Definitions
- the invention relates to a process for high-speed metal strip electrotinning wherein the strip is plated by anodically dissolving tin anodes facing the strip into an electroplating solution.
- anode bars When the anode bars are spent to an agreed minimum thickness, they are removed from the plating section and recycled in a remelting process for new cast anodes.
- the anode positions must be adjusted regularly.
- Adjustments can e.g. be suitably made by controlled masking out part of the anode.
- masking out is held to mean positioning an object between anode and cathode so as to impede plating “in the shadow of the object” if the anode is seen as a light source.
- anode substance viz. tin is supplied in pellet form and fed to baskets
- tin bars as described above are no longer used and so there is no need to adjust them anymore.
- the need to supply heavy anode bars is eliminated.
- anode substance is supplied in the form of easily handled anode pellets.
- the invention also avoids removal of spent anode material since the pellets may be completely consumed.
- pellets shall mean rounds, ovoids, briquets, granules and the like.
- part of the anode is masked out according to claim 2 .
- the masking means have the features of claim 3 .
- the pellets are electrically contacted via a current collector made of a material with a low electrical resistance allowing for good electrical contact with the tin pellets and being electrochemically inert in the electrolyte.
- Suitable materials for the current collector include Ti and Zr.
- an automated supply system is provided to add tin pellets to the anode basket.
- FIG. 1 shows a cross section of a conventional tinning cell and various elements used in such a cell
- FIG. 2 shows an example of a screen shot of process control apparatus displaying coating thicknesses at different positions over the strip width in a conventional tinning line;
- FIG. 3 shows a top view of an anode bridge forming part of a conventional tinning cell
- FIG. 4 schematically indicates the movement of the anode bars along the anode bridge in a conventional tinning process
- FIG. 5 schematically indicates removing or adding anode bars in a conventional tinning process
- FIG. 6 schematically indicates placement and appearance of an anode basket for use in the process according to the invention
- FIG. 7 schematically indicates an anode basket for use in the process according to the invention in more detail
- FIG. 8 a graph generally indicating i/i avg as a function of D ES
- FIG. 9 schematically indicates a shutter placed as a mask in front of an anode basket for use in a process according to the invention.
- FIG. 1 A typical soluble anode system is illustrated in FIG. 1 .
- tin is supplied by tin anode 1 which has an anode gap 2 and an anode notch 3 .
- Each of a series of tin anodes 1 is supported by an anode bridge 4 at a top portion near its anode notch 3 and at a bottom portion in anode box 5 .
- Isolated plate 6 separates two tinning sections in one plating cell. Electrical power is supplied to the strip via conductor roll 7 . Near the bottom of the plating cell the strip is guided by sink roll 8 . Also hold-down roll 9 is shown.
- Anode bridge 4 comprises an insulated parking space 10 for a fresh tin anode 1 .
- the tin anodes 1 are connected to the anode bridge 4 via contact strip 14 .
- the anodes During tinplating the anodes have to be properly positioned to obtain a uniform tin coating thickness over the strip width.
- FIG. 2 an example is given of values of the tin coating thickness over the strip width in a situation in which the anodes were not properly positioned.
- anodes have to be positioned as can be seen in FIG. 3 , which gives a top view of anode bridge.
- the optimal anode positions are given by parameters A-G.
- the optimal parameters are given for a line speed of 400 m min ⁇ 1 , a strip width of 732 mm and a tin coating thickness of 2.8 gm ⁇ 2 on each side of the strip.
- A 95 mm (at height anode bridge) and 85 mm (at height anode box)
- B 60 mm (at height anode bridge) and 50 mm (at height anode box)
- parameter A and B are smaller at the bottom of the anode than at the top.
- anode spacing is a regularly recurring operation after replacement of spent anodes (see procedure 2), after a change of strip width, and after a change to differential coating (see procedure 3). Anodes are manually spaced by placing an insulated hook into the anode gap.
- a first disadvantage is the occurrence of variations of tin coating thickness over the strip width, e.g. in the form of tin edges; the outer anodes may be positioned too close to the strip edge (parameter C), or the anodes may be a non-equidistanced (parameter D), or not evenly consumed over the length of the strip caused by improper anode positioning.
- a second disadvantage is the labour intensiveness of adjustment, and a third disadvantage is that adjustment is hazardous in view of exposure to electrolyte, fumes and the presence of electrically charged installation parts.
- the thickness of the worn anodes is regularly checked with a thickness gauge.
- the anode thickness in the optimal anode arrangement previously described becomes less than 15 mm
- the anode is detached from the anode bridge and placed on the nearest insulated parking space, see FIG. 4 where the arrows indicate how the anodes “move” along the anode bridge.
- a new anode is placed on the insulated parking space and transferred to the anode bridge. After each replacement, anodes need to be repositioned again (see procedure 1).
- a fresh tin anode is designated with N and a worn one with W.
- the disadvantages of the soluble anode system due to anode replacement are mainly related to anode spacing (see procedure 1).
- An additional disadvantage is that the anodes are not constantly positioned according to the optimal anode arrangement during anode replacement. This causes variations in the tin coating thickness over the strip width.
- parameter C in FIG. 3 no longer has the optimal value. Furthermore after changing to differential coating, i.e. a lower coating weight on one side of the strip, tin edge build-up becomes more severe on the low coating weight side. In practice both situations are compensated by removing (or adding) and/or repositioning the anodes on the anode bridge.
- FIG. 5 indicating removing or adding anodes after changing to another strip width or to differential coatings.
- the disadvantages of the soluble anode system due to changing to another strip width or to differential coating are mainly related to anode spacing (see procedure 1).
- An additional disadvantage is that the anodes are not positioned according to the optimal anode arrangement (see procedure 1) during removal or adding of anodes. This causes variations in the tin coating thickness over the strip width.
- DSA dimension stable anodes
- tin stock can be lower and compared to the DSA system no separate dissolution reactor is needed. Also less personnel is needed for anode handling. Also, by using as the anode tin in the form of pellets held in an anode basket according to the invention, the cell voltage can be lowered. Probably this is due to the increase of anodic surface. It will be clear that this also opens up routes to increased production speeds and thus potentially higher yield for the electrotinning production line in question.
- anode baskets 12 were mounted on the anode bar 4 via contact strip 14 .
- the contact strips 14 made of copper in the experiments according to this example, may be coated on their surface contacting the anode basket 12 with a noble metal like Au or Pt. In the embodiment of the invention the contact strips 14 were coated with Pt, which worked well.
- the anode baskets 12 in FIG. 6 were filled with tin pellets (2-20 mm preferably between 5-9 mm in diameter). In order to replenish anodic substance, tin pellets are supplied regularly, which can be done while the plating line is fully operational.
- the anode baskets 12 in the experiments according to this example made of titanium, are designed and positioned in such a way that the anode is closer to the strip at the bottom to compensate for holmic losses in the anode and strip, which would otherwise cause unwanted differences in current density over the height of the strip.
- the anode basket was covered with an anode bag to prevent small tin fines entering the electrolyte.
- edge mask 13 By providing the DSSA system with an edge mask 13 , see FIG. 7 , even the build-up of tin (dogbone effect) can be reduced.
- the construction of these edge masks and the system to move them are designed in such a way that they can be operated from a safe distance from the plating line excluding labour intensive and possibly dangerous work.
- a normalised current density defined as i avg , wherein i stands for the local current density and i avg for the average current density (e.g. in A/m 2 ), and therefore the amount of tin build-up at the edge of the strip reaches an unacceptable level, see upper curve in FIG. 8 .
- the horizontal axis shows D ES representing the distance in mm from the edge of the strip
- the lower curve shows the relation i/i avg versus D ES for a strip and anode width of 1020 mm
- the upper curve shows i/i avg after the strip width has changed to 940 leaving the anode configuration configured for a strip width of 1020 mm.
- FIG. 9 a schematic representation of this situation is given.
- the vertical axis (the Y-axis) represents a plane through the centre of the strip perpendicular to the surface of the strip.
- the horizontal axis (the X-axis) represents the distance from the centre of the strip, D CS.
- the upper curve corresponds to an overlap of 0 mm, the next lower curve to 30 mm, the next lower curve to 45 mm and the lower curve to 60 mm.
- an optimum tin layer thickness distribution may be found at an overlap of mask and anode of about 45 mm.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03078988.7 | 2003-12-23 | ||
EP03078988 | 2003-12-23 | ||
PCT/EP2004/014894 WO2005064043A2 (en) | 2003-12-23 | 2004-12-23 | Improved metal strip electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
US20070227632A1 true US20070227632A1 (en) | 2007-10-04 |
Family
ID=34717202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/584,068 Abandoned US20070227632A1 (en) | 2003-12-23 | 2004-12-23 | Metal Strip Electroplating |
Country Status (15)
Country | Link |
---|---|
US (1) | US20070227632A1 (es) |
EP (1) | EP1699949B1 (es) |
JP (1) | JP2007515557A (es) |
KR (1) | KR20060127076A (es) |
CN (1) | CN1918328A (es) |
AT (1) | ATE435933T1 (es) |
AU (1) | AU2004309087B2 (es) |
BR (1) | BRPI0418111A (es) |
CA (1) | CA2551273A1 (es) |
DE (1) | DE602004021961D1 (es) |
ES (1) | ES2327239T3 (es) |
MX (1) | MXPA06007170A (es) |
PT (1) | PT1699949E (es) |
RU (1) | RU2374363C2 (es) |
WO (1) | WO2005064043A2 (es) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140332393A1 (en) * | 2013-05-09 | 2014-11-13 | Ebara Corporation | Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD |
US20180030612A1 (en) * | 2015-03-04 | 2018-02-01 | Jfe Steel Corporation | Method for continuous electrolytic etching of grain oriented electrical steel strip and apparatus for continuous electrolytic etching of grain oriented electrical steel strip |
CN116516445A (zh) * | 2022-11-28 | 2023-08-01 | 粤海中粤(中山)马口铁工业有限公司 | 可溶性阳极的边部屏蔽装置及方法 |
EP4141149A4 (en) * | 2021-03-25 | 2023-12-27 | Contemporary Amperex Technology Co., Limited | FILTRATION MECHANISM AND DEVICE FOR PRODUCING CONDUCTIVE MATERIAL |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4902346B2 (ja) * | 2006-12-28 | 2012-03-21 | Jfeスチール株式会社 | Snメッキ用電極支持体及びその使用方法 |
FR2918674B1 (fr) * | 2007-07-12 | 2010-10-01 | Siemens Vai Metals Tech Sas | Installation et procede pour l'etamage electrolytique de bandes d'acier mettant en oeuvre une anode soluble |
JP5884169B2 (ja) * | 2012-03-01 | 2016-03-15 | Jfeスチール株式会社 | 電気めっき鋼板の製造ラインの自溶性電極の消費量自動監視システム及び方法 |
JP5900213B2 (ja) * | 2012-07-18 | 2016-04-06 | Jfeスチール株式会社 | 電気めっき鋼板の製造装置 |
WO2015011130A1 (en) * | 2013-07-26 | 2015-01-29 | Tata Steel Ijmuiden B.V. | Anode system for use in an electroplating cell for the coating of a moving metal strip and a method using said anode system |
CN105696059B (zh) * | 2016-02-02 | 2018-03-06 | 上海大学 | 磁场下高强高导铜‑纳米碳管复合材料的制备方法及装置 |
CN107740173B (zh) * | 2017-09-15 | 2020-12-15 | 首钢京唐钢铁联合有限责任公司 | 一种高锡量镀锡板的边部质量控制方法 |
EP3540098A3 (en) | 2018-03-16 | 2019-11-06 | Airbus Defence and Space GmbH | Apparatus and method for the continuous metallization of an object |
EP3763850A1 (en) | 2019-07-10 | 2021-01-13 | Tata Steel IJmuiden B.V. | Anode and method for electrolytically depositing a metal layer onto a metal substrate |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
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US1991817A (en) * | 1930-02-04 | 1935-02-19 | John S Nachtman | Method of plating steel |
US2690424A (en) * | 1950-11-20 | 1954-09-28 | Nat Steel Corp | Apparatus for reduction of heavy edge coating in electroplating |
US2719820A (en) * | 1951-01-26 | 1955-10-04 | United States Steel Corp | Method for coating steel strip |
US3300396A (en) * | 1965-11-24 | 1967-01-24 | Charles T Walker | Electroplating techniques and anode assemblies therefor |
US4164454A (en) * | 1977-11-01 | 1979-08-14 | Borg-Warner Corporation | Continuous line for plating on metal strip material |
US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
US4900406A (en) * | 1988-06-14 | 1990-02-13 | Hoogovens Groep B.V. | Method of electrolytic metal coating of a strip-shape metal substrate and apparatus for carrying out the method |
US5454929A (en) * | 1994-06-16 | 1995-10-03 | National Semiconductor Corporation | Process for preparing solderable integrated circuit lead frames by plating with tin and palladium |
US5582708A (en) * | 1994-09-29 | 1996-12-10 | Sollac | Cell and process for continuously electroplating metal alloys |
US5776327A (en) * | 1996-10-16 | 1998-07-07 | Mitsubishi Semiconuctor Americe, Inc. | Method and apparatus using an anode basket for electroplating a workpiece |
US5798925A (en) * | 1995-05-16 | 1998-08-25 | L-S Electro-Galvanizing Company | Method and apparatus for monitoring a moving strip |
US5804053A (en) * | 1995-12-07 | 1998-09-08 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
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JPS62151593A (ja) * | 1985-12-25 | 1987-07-06 | Nippon Kokan Kk <Nkk> | 金属ストリツプの連続電気メツキ装置 |
JPH01159400A (ja) * | 1987-12-16 | 1989-06-22 | Kawasaki Steel Corp | 電気錫めっき装置 |
JPH0459997A (ja) * | 1990-06-27 | 1992-02-26 | Kawasaki Steel Corp | 金属ストリップの電解処理装置および電解処理方法 |
JPH0971894A (ja) * | 1995-09-01 | 1997-03-18 | Kawasaki Steel Corp | 鋼帯の電気メッキ方法 |
JP3103753B2 (ja) * | 1995-10-13 | 2000-10-30 | 株式会社イデヤ | 帯状部材のめっき装置 |
JP3528453B2 (ja) * | 1996-08-23 | 2004-05-17 | Jfeスチール株式会社 | 金属ストリップの片面連続電気めっき装置 |
-
2004
- 2004-12-23 RU RU2006126703/02A patent/RU2374363C2/ru not_active IP Right Cessation
- 2004-12-23 US US10/584,068 patent/US20070227632A1/en not_active Abandoned
- 2004-12-23 MX MXPA06007170A patent/MXPA06007170A/es active IP Right Grant
- 2004-12-23 WO PCT/EP2004/014894 patent/WO2005064043A2/en active Application Filing
- 2004-12-23 CA CA002551273A patent/CA2551273A1/en not_active Abandoned
- 2004-12-23 EP EP04804475A patent/EP1699949B1/en not_active Not-in-force
- 2004-12-23 DE DE602004021961T patent/DE602004021961D1/de active Active
- 2004-12-23 AU AU2004309087A patent/AU2004309087B2/en not_active Ceased
- 2004-12-23 AT AT04804475T patent/ATE435933T1/de not_active IP Right Cessation
- 2004-12-23 BR BRPI0418111-5A patent/BRPI0418111A/pt not_active Application Discontinuation
- 2004-12-23 CN CNA2004800417531A patent/CN1918328A/zh active Pending
- 2004-12-23 KR KR1020067014840A patent/KR20060127076A/ko not_active Application Discontinuation
- 2004-12-23 ES ES04804475T patent/ES2327239T3/es active Active
- 2004-12-23 PT PT04804475T patent/PT1699949E/pt unknown
- 2004-12-23 JP JP2006546130A patent/JP2007515557A/ja active Pending
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1991817A (en) * | 1930-02-04 | 1935-02-19 | John S Nachtman | Method of plating steel |
US2690424A (en) * | 1950-11-20 | 1954-09-28 | Nat Steel Corp | Apparatus for reduction of heavy edge coating in electroplating |
US2719820A (en) * | 1951-01-26 | 1955-10-04 | United States Steel Corp | Method for coating steel strip |
US3300396A (en) * | 1965-11-24 | 1967-01-24 | Charles T Walker | Electroplating techniques and anode assemblies therefor |
US4164454A (en) * | 1977-11-01 | 1979-08-14 | Borg-Warner Corporation | Continuous line for plating on metal strip material |
US4367125A (en) * | 1979-03-21 | 1983-01-04 | Republic Steel Corporation | Apparatus and method for plating metallic strip |
US4900406A (en) * | 1988-06-14 | 1990-02-13 | Hoogovens Groep B.V. | Method of electrolytic metal coating of a strip-shape metal substrate and apparatus for carrying out the method |
US5454929A (en) * | 1994-06-16 | 1995-10-03 | National Semiconductor Corporation | Process for preparing solderable integrated circuit lead frames by plating with tin and palladium |
US5582708A (en) * | 1994-09-29 | 1996-12-10 | Sollac | Cell and process for continuously electroplating metal alloys |
US5798925A (en) * | 1995-05-16 | 1998-08-25 | L-S Electro-Galvanizing Company | Method and apparatus for monitoring a moving strip |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
US5804053A (en) * | 1995-12-07 | 1998-09-08 | Eltech Systems Corporation | Continuously electroplated foam of improved weight distribution |
US5776327A (en) * | 1996-10-16 | 1998-07-07 | Mitsubishi Semiconuctor Americe, Inc. | Method and apparatus using an anode basket for electroplating a workpiece |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140332393A1 (en) * | 2013-05-09 | 2014-11-13 | Ebara Corporation | Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD |
US9816197B2 (en) * | 2013-05-09 | 2017-11-14 | Ebara Corporation | Sn alloy plating apparatus and Sn alloy plating method |
US20180030612A1 (en) * | 2015-03-04 | 2018-02-01 | Jfe Steel Corporation | Method for continuous electrolytic etching of grain oriented electrical steel strip and apparatus for continuous electrolytic etching of grain oriented electrical steel strip |
US10533263B2 (en) | 2015-03-04 | 2020-01-14 | Jfe Steel Corporation | Method for continuous electrolytic etching of grain oriented electrical steel strip and apparatus for continuous electrolytic etching of grain oriented electrical steel strip |
EP4141149A4 (en) * | 2021-03-25 | 2023-12-27 | Contemporary Amperex Technology Co., Limited | FILTRATION MECHANISM AND DEVICE FOR PRODUCING CONDUCTIVE MATERIAL |
US12104267B2 (en) | 2021-03-25 | 2024-10-01 | Contemporary Amperex Technology Co., Limited | Filtering mechanism and device for producing conductive material |
CN116516445A (zh) * | 2022-11-28 | 2023-08-01 | 粤海中粤(中山)马口铁工业有限公司 | 可溶性阳极的边部屏蔽装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20060127076A (ko) | 2006-12-11 |
AU2004309087A1 (en) | 2005-07-14 |
WO2005064043A3 (en) | 2005-09-09 |
ATE435933T1 (de) | 2009-07-15 |
DE602004021961D1 (de) | 2009-08-20 |
MXPA06007170A (es) | 2006-09-04 |
RU2374363C2 (ru) | 2009-11-27 |
WO2005064043A2 (en) | 2005-07-14 |
CA2551273A1 (en) | 2005-07-14 |
RU2006126703A (ru) | 2008-01-27 |
CN1918328A (zh) | 2007-02-21 |
ES2327239T3 (es) | 2009-10-27 |
BRPI0418111A (pt) | 2007-04-17 |
JP2007515557A (ja) | 2007-06-14 |
EP1699949A2 (en) | 2006-09-13 |
PT1699949E (pt) | 2009-08-03 |
EP1699949B1 (en) | 2009-07-08 |
AU2004309087B2 (en) | 2009-10-22 |
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Owner name: CORUS STAAL BV, NETHERLANDS Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHNETZ, KOKKIE, MR.;DE VREUGD, DANIEL ADRIAAN, MR.;WIJNBEEK, ERIC BOB, MR.;AND OTHERS;REEL/FRAME:019079/0235;SIGNING DATES FROM 20070226 TO 20070305 |
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