US20060096868A1 - Nickel electroplating bath designed to replace monovalent copper strike solutions - Google Patents
Nickel electroplating bath designed to replace monovalent copper strike solutions Download PDFInfo
- Publication number
- US20060096868A1 US20060096868A1 US10/985,134 US98513404A US2006096868A1 US 20060096868 A1 US20060096868 A1 US 20060096868A1 US 98513404 A US98513404 A US 98513404A US 2006096868 A1 US2006096868 A1 US 2006096868A1
- Authority
- US
- United States
- Prior art keywords
- acid
- nickel
- concentration
- zinc
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
Definitions
- This invention details a process, which can be used to electroplate a nickel deposit directly onto zinc or zinc alloy die-castings, thereby eliminating the need to use traditional cyanide based plating baths.
- Zinc parts are often produced as zinc based die-castings. It is common for these to be plated with other metals to improve cosmetic appearance and improve corrosion resistance.
- This coating generally consists of one or more of the following: copper, nickel, chromium, tin and brass. Traditionally these articles are base plated with a thin layer of monovalent copper from a copper cyanide bath. Because of the toxicity of cyanide and it's impact on the environment and hence, expense of treatment and disposal—it is desirable that an alternative plating solution be found.
- Nickel electrolytes can be used to plate a layer directly onto a zinc or zinc alloy substrate, however this is not practised commercially as these solutions exhibit poor coverage in areas of low current density. Also, nickel baths are generally run at low pH which is an unsuitable medium for plating zinc based die-castings since the acidic nature of the electrolyte destroys the article before it can be plated, leading to blistering and poor adhesion of subsequent plated layers. However, the inventors have formulated an additive system which overcomes these difficulties. When added to the nickel salt plating bath, this additive system allows complete coverage plating over a full range of current densities. The additive system is applied to a near neutral pH bath which is suitable for the application of a plated nickel surface directly onto zinc and zinc alloys.
- This invention describes the use of a nickel plating bath and method which provide for plating an adherent base layer on zinc and in particular zinc based die-castings. This method comprises the following steps:
- This invention describes a method of treating zinc articles to produce an adherent base coating suitable for the plating of subsequent metallic layers.
- the process of the invention generally includes the steps of:
- the cleaning and activating step is preferred to provide a surface of the article that is suitable for plating. Defects such as lack of adhesion, porosity, roughness, dark spots and non-uniform coatings are likely to occur on poorly prepared parts.
- the surface preparation process also serves to activate the surface of the part so that it is optimally receptive to the deposition of the metal coating.
- the zinc die-cast articles are first cleaned in a standard alkaline cleaning solution.
- the articles are then activated by a short immersion dip in an acid solution. Thorough rinsing is required between cleaning stages and prior to plating on the surface of the zinc article.
- the main source of nickel in the present invention are nickel salts. Of particular interest are nickel chloride and nickel sulphate.
- concentration of nickel salt in the aqueous solution is generally between about 150 and about 300 grams per liter.
- the chloride present in the solution may come from nickel salt or alkali metal salt.
- concentration of chloride salt in aqueous solution should be sufficient to cause effective dissolution of the nickel anodes in the bath.
- the solution contains a quantity of buffer material in the form of one or more of the following: boric acid, mono-, di- and tri-carboxylic acids such as, but not limited to, acetic acid, malic acid, succinic acid, citric acid or suitable salts thereof. These are present in the aqueous solution at a concentration of about 5 to about 70 grams per liter.
- the nickel plating solution is optimally maintained at a temperature between room temperature and about 65 degrees Celsius.
- the articles are generally immersed in the solution for a minimum time of one minute, at a current density of 1.5 to 8.0 amps per square decimeter.
- an additive system is added.
- the additive system is comprised of one or more of the following: a quantity of sulphonic acid or alkali metal salt of a sulphonic acid preferably at a level between about 0.2 and 2 grams per liter; a sulfonated alkoxylate to act as a brightener, preferably added at a level of about 0.1 to about 1.5 grams per liter; a glycerol compound preferably added at a level of about 0.4 grams to about 4 grams per liter, and a quantity of organic acid of one or more of the following: tolylacetic acid, salicylic acid, hydroxybenzoic acid and/or benzyloxyacetone, preferably added at a level of 0 to about 25 grams per liter.
- the additive system also preferably comprises an ionic surfactant.
- the sulphonic acid or sulphonic acid salt are preferably naphthalene sulphonic acids or salts thereof, such as 4-acetomido-5-hydroxy-2,7-naphthalene-disulphonic acid-disodium salt.
- the sulphonated alkoxylate is preferably selected from the group consisting of alkoxylated bis-phenols, and sulphonated alkoxylates, such as 2-ethylhexanol ethoxylated sulfopropylate.
- the glycerol or glycerol derivative is preferably selected from the group consisting of alkoxylated glycols, polyols and polyoxy alkoxylated glycols such as Macol® ETG 3590, available from the Chemax Company, and is a polyoxyethylated glycerol deriviative.
- the aromatic carboxylic acid is preferably selected from the group consisting of tolylacetic acid, salicylic acid, benzoic acid, hydroxy benzoic acid, and benzyloxyacetone.
- the articles are again rinsed.
- the resulting nickel coating is sufficiently noble and continuous as to allow subsequent plating of further metallic layers as required.
- the bath runs at a pH of between 5 and 6. This is sufficiently alkaline as to prevent the corrosion and dissolution of the zinc on contact with the invention.
- the pH is maintained using nickel hydroxy carbonate paste and sulphuric acid.
- the bath requires filtration after the addition of the nickel hydroxy carbonate paste, which also serves as a secondary nickel source in the bath.
- the nickel electroplated coating on the zinc article is carried out by standard electroplating techniques and also applicable for use in barrel plating techniques. Barrel plating is suitable for plating many small articles at one time. Parts are tumbled in a cascading motion inside a rotating vessel in the plating bath.
- the process of the present invention forms a firmly adherent and uniform coating of nickel onto zinc articles, allowing subsequent metal layers to be plated onto it.
- the bath provides full coverage of the electroplated article and hence eliminates the need to use cyanide based copper electrolytes to base cover zinc based die cast parts.
- a zinc-plated steel panel was plated in a hull cell containing 267 ml of nickel plating solution, prepared as stated.
- the panel was plated at 1 Amp for ten minutes.
- the thickness of the deposit was measured by x-ray fluorescence spectroscopy.
- Adherence was checked by heating the plated article to a temperature of 160° C. for one hour and then plunging it into cold water at a temperature of approximately 10° C. Lack of adhesion was evident when blistering, cracking and peeling of the deposit was observed on contact with the cold water.
- Nickel sulfate hexahydrate 60 g/L Sodium acetate anhydrous 3.5 g/L Boric acid 11.5 g/L Sodium chloride 10 g/L Sodium sulfate anhydrous 23.5 g/L Ammonium sulfate 14.6 g/L Citric acid 1.87 g/L Measurement Test Results 4 Asd 2 Asd 0.5 Asd 3.96 ⁇ m Patchy plating. No plating Appearance and Adhesion Small area of bright nickel plating (3-4.5 ⁇ m). Burning in high current density areas and no plating in areas below 2 amps per square decimeter.
- Nickel sulfate hexahydrate 150 g/L Sodium chloride 20 g/L Boric acid 20 g/L Sodium sulfate anhydrous 15 g/L 4-acetomido-5-hydroxy-2,7-napthalene- 0.5 g/L disulphonic acid-disodium salt 4-hydroxy-methoxyphenolglycol sulphate 0.6 g/L potassium salt 4,4′-sulphonyldiphenol 0.4 g/L Tolylacetic acid 0.6 g/L Measurement Test Results 4 Asd 2 Asd 0.5 Asd 7.68 ⁇ m 4.56 ⁇ m 1.79 ⁇ m Appearance and Adhesion Even matte coverage of nickel deposit between 0.75 Asd and 6 Asd. Good adhesion over current density range.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/985,134 US20060096868A1 (en) | 2004-11-10 | 2004-11-10 | Nickel electroplating bath designed to replace monovalent copper strike solutions |
PCT/US2005/028628 WO2006052310A2 (fr) | 2004-11-10 | 2005-08-10 | Bain galvanoplastique de nickel conçu pour remplacer les solutions de precuivrage leger comprenant du cuivre monovalent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/985,134 US20060096868A1 (en) | 2004-11-10 | 2004-11-10 | Nickel electroplating bath designed to replace monovalent copper strike solutions |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060096868A1 true US20060096868A1 (en) | 2006-05-11 |
Family
ID=36315195
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/985,134 Abandoned US20060096868A1 (en) | 2004-11-10 | 2004-11-10 | Nickel electroplating bath designed to replace monovalent copper strike solutions |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060096868A1 (fr) |
WO (1) | WO2006052310A2 (fr) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010039323A1 (fr) * | 2008-10-02 | 2010-04-08 | Macdermid, Incorporated | Nouveau procédé d'électroplacage sans cyanure pour composants coulés sous pression en zinc et alliage de zinc |
US20100155108A1 (en) * | 2008-12-23 | 2010-06-24 | Samsung Electro-Mechanics Co., Ltd. | Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof |
US20110233065A1 (en) * | 2008-07-08 | 2011-09-29 | Enthone Inc. | Electrolyte and method for deposition of matte metal layer |
CN102965697A (zh) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | 柔性镍的电镀工艺 |
EP2706132A1 (fr) * | 2012-09-10 | 2014-03-12 | Dr. Hesse GmbH & Cie KG | Electrolyte zinc-nickel sans acide borique |
EP2878711A1 (fr) * | 2013-11-27 | 2015-06-03 | RIAG Oberflächentechnik AG | Procédé de séparation galvanique de nickel et de l'électrolyte correspondant |
DE102014118614A1 (de) * | 2014-12-15 | 2016-06-16 | Harting Kgaa | Borsäurefreies Nickel-Bad |
EP2683853B1 (fr) | 2011-03-09 | 2017-10-11 | MacDermid Acumen, Inc. | Bain de placage de nickel semi-brillant et procédé d'utilisation de ce dernier |
WO2018234229A1 (fr) * | 2017-06-23 | 2018-12-27 | Atotech Deutschland Gmbh | Bain d'électroplacage de nickel pour le dépôt d'un revêtement de nickel décoratif sur un substrat |
US20190093252A1 (en) * | 2017-09-22 | 2019-03-28 | Ming Chi University Of Technology | Electroplating apparatus |
EP3054035B1 (fr) * | 2013-10-03 | 2019-05-08 | Toyota Jidosha Kabushiki Kaisha | Procédé de formation de film de nickel |
KR20200020152A (ko) * | 2018-08-16 | 2020-02-26 | 현대자동차주식회사 | 원 스텝 전기증착을 이용한 전기촉매의 제조방법 및 이로부터 제조된 전기촉매 |
CN112522685A (zh) * | 2020-12-03 | 2021-03-19 | 江苏思瑞奕精密科技有限公司 | 锌合金表面处理方法 |
CN113073364A (zh) * | 2021-03-26 | 2021-07-06 | 深圳市崇辉表面技术开发有限公司 | 一种led支架电镀溶液及其制备方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753872A (en) * | 1971-01-11 | 1973-08-21 | Langbein Pfanhauser Werke Ag | Method of and bath for producing microcrack chromium coatings |
US4462872A (en) * | 1981-08-21 | 1984-07-31 | Westinghouse Electric Corp. | Method of operating a gas analyzer and solid electrolyte gas sensing apparatus |
US4469569A (en) * | 1983-01-03 | 1984-09-04 | Omi International Corporation | Cyanide-free copper plating process |
US4521282A (en) * | 1984-07-11 | 1985-06-04 | Omi International Corporation | Cyanide-free copper electrolyte and process |
US4904354A (en) * | 1987-04-08 | 1990-02-27 | Learonal Inc. | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof |
US5006262A (en) * | 1989-11-21 | 1991-04-09 | Met. Rev. Inc. | Process for recovering copper from copper ion containing aqueous solutions |
US5266212A (en) * | 1992-10-13 | 1993-11-30 | Enthone-Omi, Inc. | Purification of cyanide-free copper plating baths |
US6054037A (en) * | 1998-11-11 | 2000-04-25 | Enthone-Omi, Inc. | Halogen additives for alkaline copper use for plating zinc die castings |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10222962A1 (de) * | 2002-05-23 | 2003-12-11 | Atotech Deutschland Gmbh | Saurer galvanischer Badelektrolyt und Verfahren zur elektrolytischen Abscheidung satinglänzender Nickelniederschläge |
-
2004
- 2004-11-10 US US10/985,134 patent/US20060096868A1/en not_active Abandoned
-
2005
- 2005-08-10 WO PCT/US2005/028628 patent/WO2006052310A2/fr active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753872A (en) * | 1971-01-11 | 1973-08-21 | Langbein Pfanhauser Werke Ag | Method of and bath for producing microcrack chromium coatings |
US4462872A (en) * | 1981-08-21 | 1984-07-31 | Westinghouse Electric Corp. | Method of operating a gas analyzer and solid electrolyte gas sensing apparatus |
US4469569A (en) * | 1983-01-03 | 1984-09-04 | Omi International Corporation | Cyanide-free copper plating process |
US4521282A (en) * | 1984-07-11 | 1985-06-04 | Omi International Corporation | Cyanide-free copper electrolyte and process |
US4904354A (en) * | 1987-04-08 | 1990-02-27 | Learonal Inc. | Akaline cyanide-free Cu-Zu strike baths and electrodepositing processes for the use thereof |
US5006262A (en) * | 1989-11-21 | 1991-04-09 | Met. Rev. Inc. | Process for recovering copper from copper ion containing aqueous solutions |
US5266212A (en) * | 1992-10-13 | 1993-11-30 | Enthone-Omi, Inc. | Purification of cyanide-free copper plating baths |
US6054037A (en) * | 1998-11-11 | 2000-04-25 | Enthone-Omi, Inc. | Halogen additives for alkaline copper use for plating zinc die castings |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110233065A1 (en) * | 2008-07-08 | 2011-09-29 | Enthone Inc. | Electrolyte and method for deposition of matte metal layer |
US20100084278A1 (en) * | 2008-10-02 | 2010-04-08 | Rowan Anthony J | Novel Cyanide-Free Electroplating Process for Zinc and Zinc Alloy Die-Cast Components |
JP2012504704A (ja) * | 2008-10-02 | 2012-02-23 | マクダーミッド インコーポレーテッド | 亜鉛及び亜鉛合金ダイカスト部品のための新規シアン化物非含有電気めっき方法 |
WO2010039323A1 (fr) * | 2008-10-02 | 2010-04-08 | Macdermid, Incorporated | Nouveau procédé d'électroplacage sans cyanure pour composants coulés sous pression en zinc et alliage de zinc |
TWI448590B (zh) * | 2008-10-02 | 2014-08-11 | Macdermid Inc | 用於鋅與鋅合金鑄模構件之新穎無氰化物電鍍方法 |
US20100155108A1 (en) * | 2008-12-23 | 2010-06-24 | Samsung Electro-Mechanics Co., Ltd. | Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof |
EP2683853B1 (fr) | 2011-03-09 | 2017-10-11 | MacDermid Acumen, Inc. | Bain de placage de nickel semi-brillant et procédé d'utilisation de ce dernier |
EP2706132A1 (fr) * | 2012-09-10 | 2014-03-12 | Dr. Hesse GmbH & Cie KG | Electrolyte zinc-nickel sans acide borique |
CN102965697A (zh) * | 2012-12-18 | 2013-03-13 | 南通广联实业有限公司 | 柔性镍的电镀工艺 |
EP3054035B1 (fr) * | 2013-10-03 | 2019-05-08 | Toyota Jidosha Kabushiki Kaisha | Procédé de formation de film de nickel |
US10358734B2 (en) | 2013-10-03 | 2019-07-23 | Toyota Jidosha Kabushiki Kaisha | Nickel solution for forming film and film-forming method using same |
EP2878711A1 (fr) * | 2013-11-27 | 2015-06-03 | RIAG Oberflächentechnik AG | Procédé de séparation galvanique de nickel et de l'électrolyte correspondant |
DE102014118614A1 (de) * | 2014-12-15 | 2016-06-16 | Harting Kgaa | Borsäurefreies Nickel-Bad |
EP3933072A1 (fr) * | 2017-06-23 | 2022-01-05 | ATOTECH Deutschland GmbH | Bain galvanoplastique de nickel conçu pour déposer un revêtement de nickel décoratif sur un substrat |
WO2018234229A1 (fr) * | 2017-06-23 | 2018-12-27 | Atotech Deutschland Gmbh | Bain d'électroplacage de nickel pour le dépôt d'un revêtement de nickel décoratif sur un substrat |
CN110785516A (zh) * | 2017-06-23 | 2020-02-11 | 德国艾托特克公司 | 用于在衬底上沉积装饰用镍涂层的镍电镀浴 |
TWI762661B (zh) * | 2017-06-23 | 2022-05-01 | 德商德國艾托特克公司 | 用於在基板上沉積裝飾用鎳塗層之鎳電鍍浴 |
JP2020524746A (ja) * | 2017-06-23 | 2020-08-20 | アトテック ドイチェランド ゲーエムベーハー | 基材上に装飾ニッケルコーティングを堆積させるためのニッケル電気メッキ浴 |
US20190093252A1 (en) * | 2017-09-22 | 2019-03-28 | Ming Chi University Of Technology | Electroplating apparatus |
KR20200020152A (ko) * | 2018-08-16 | 2020-02-26 | 현대자동차주식회사 | 원 스텝 전기증착을 이용한 전기촉매의 제조방법 및 이로부터 제조된 전기촉매 |
KR102589924B1 (ko) * | 2018-08-16 | 2023-10-17 | 현대자동차주식회사 | 원 스텝 전기증착을 이용한 전기촉매의 제조방법 및 이로부터 제조된 전기촉매 |
CN112522685A (zh) * | 2020-12-03 | 2021-03-19 | 江苏思瑞奕精密科技有限公司 | 锌合金表面处理方法 |
CN113073364A (zh) * | 2021-03-26 | 2021-07-06 | 深圳市崇辉表面技术开发有限公司 | 一种led支架电镀溶液及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2006052310A2 (fr) | 2006-05-18 |
WO2006052310A3 (fr) | 2006-12-21 |
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AS | Assignment |
Owner name: MACDERMID, INCORPORATED, CONNECTICUT Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BUNCE, SIONA;LONG, ERNEST;ROWAN, ANTHONY;REEL/FRAME:015853/0673;SIGNING DATES FROM 20041209 TO 20041210 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |