US20060088439A1 - Solders - Google Patents

Solders Download PDF

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Publication number
US20060088439A1
US20060088439A1 US11/046,417 US4641705A US2006088439A1 US 20060088439 A1 US20060088439 A1 US 20060088439A1 US 4641705 A US4641705 A US 4641705A US 2006088439 A1 US2006088439 A1 US 2006088439A1
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US
United States
Prior art keywords
around
solder
tin
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US11/046,417
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English (en)
Inventor
Kai Chew
Vincent Kho
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Quantum Chemical Technologies Singapore Pte Ltd
Singapore Asahi Chemical and Solder Industries Pte Ltd
Original Assignee
Quantum Chemical Technologies Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Quantum Chemical Technologies Singapore Pte Ltd filed Critical Quantum Chemical Technologies Singapore Pte Ltd
Assigned to QUANTUM CHEMICAL TECHNOLOGIES (SINGAPORE) PTE. LTD., SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE. LTD. reassignment QUANTUM CHEMICAL TECHNOLOGIES (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEW, KAI HWA, KHO, VINCENT YUE SERN
Publication of US20060088439A1 publication Critical patent/US20060088439A1/en
Priority to US11/674,075 priority Critical patent/US7472817B2/en
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Definitions

  • This invention relates to solders and, in particular to solders which are substantially lead-free.
  • solders contain lead as a major constituent thereof. Such solders often have desirable physical properties, and the use of lead-containing solders is widespread throughout several industries, including those concerned with the production of printed circuit boards.
  • tin-copper alloys One type of alloy that has been used as a replacement for the conventional tin-lead solders are tin-copper alloys, and an alloy consisting of 99.3% tin and 0.7% copper has become relatively widely used in certain industries.
  • the properties of such a tin-copper alloy are less desirable than those of the conventional tin-lead alloy, and in particular the tin-copper alloy exhibits a lower strength, a lower fatigue resistance and a higher eutectic temperature than the conventional tin-lead alloy.
  • one aspect of the present invention provides a substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
  • the solder further comprises from around 0.005% to around 0.01% phosphorous.
  • the solder comprises around 0.01% phosphorous.
  • the solder further comprises from around 0.005% to around 0.01% germanium.
  • the solder comprises around 0.01% germanium.
  • the solder comprises: around 0.7% copper; and around 0.02% silicon.
  • Another aspect of the present invention provides a method of preparing a substantially lead-free solder, comprising the step of mixing tin, copper and silicon such that: the proportion of tin in the solder is from around 96.8% to around 99.3%; the proportion of copper in the solder is from around 0.2% to around 3.0%; and the proportion of silicon in the solder is from around 0.02% to around 0.12%.
  • the method further comprises the step of including from around 0.005% to around 0.01% phosphorous in the solder mixture.
  • the method comprises the step of including around 0.01% phosphorous in the solder mixture.
  • the method further comprises the step of including from around 0.005% to around 0.01% germanium in the solder mixture.
  • the method comprises the step of including around 0.01% germanium in the solder mixture.
  • the method comprises the step of including around 0.7% copper and around 0.02% silicon in the solder mixture.
  • a further aspect of the present invention provides a method of soldering, comprising the step of using a substantially lead-free solder comprising: from around 96.8% to around 99.3% tin; from around 0.2% to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
  • the method comprises using a solder having from around 0.005% to around 0.01% phosphorous.
  • the method comprises using a solder having around 0.01% phosphorous.
  • the method comprises using a solder having from around 0.005% to around 0.01% germanium.
  • the method comprises using a solder having around 0.01% germanium.
  • the method comprises using a solder having around 0.7% copper and around 0.02% silicon.
  • FIG. 1 is a comparative table of mechanical properties of various alloys
  • FIG. 2 is a chart of mechanical properties of various alloys
  • FIG. 3 is a chart showing mechanical properties of various alloys after being subjected to an ageing process
  • FIG. 4 is a graph showing the tensile strength of various alloys after being subjected to ageing processes of varying lengths
  • FIG. 5 shows the yield strength of various alloys after being subjected to ageing processes of varying lengths
  • FIG. 6 is a graph showing strain values of various alloys after being subjected to ageing processes of varying lengths
  • FIG. 7 is a graph showing the quantity of energy required to produce yield in various alloys after being subjected to ageing processes of varying lengths
  • FIG. 8 is a graph showing the quantity of energy required to break various alloys after being subjected to ageing processes of varying lengths
  • FIG. 9 is a graph showing the toughnesses of various alloys after being subjected to ageing processes of varying lengths
  • FIGS. 10 and 11 are tables showing mechanical properties of various alloys
  • FIG. 12 is a differential scanning calorimeter curve of an alloy embodying the present invention.
  • FIG. 13 shows the wetting time of various alloys at various temperatures
  • FIG. 14 shows the wetting forces of various alloys at various temperatures.
  • FIG. 1 is a table showing various mechanical properties of certain solders, namely the conventional 63% tin/37% lead solder, a 99.3% tin/0.7% copper solder, a known tin/copper/nickel solder and six further solders comprising a base of tin, 0.7% copper and, respectively, 0.2% silicon, 0.4% silicon, 0.6% silicon, 0.8% silicon, O. 10% silicon and O. 12% silicon.
  • the physical properties exhibited by the tin/copper/silicon solders embodying the present invention are generally superior to those displayed by the 99.3% tin/0.7% copper solder, and also approximate more closely to the properties displayed by the conventional 63% tin/37% lead solder.
  • the tin/0.7% copper/0.02% silicon solder represents the closest approximation to the properties to the conventional 63% tin, 37% lead solder, and it is envisaged that this solder may be a strong candidate for direct, “drop-in” replacement for this conventional solder.
  • FIG. 2 is a graph showing selected quantities from the table of FIG. 1 , and in particular showing how these quantities vary with the quantity of silicon that is added to a tin/copper solder base to form a solder embodying the present invention. It can be seen that the majority of these properties are at their maximum when the proportion of silicon in the tin/copper solder base is about 0.02%.
  • the properties of the tin/copper/silicon alloys described above can be further strengthened or improved by the addition of a small quantity of germanium or phosphorous thereto.
  • the addition of around 0.005% to 0.01% of either of these elements leads to desirable results, including increased strength and the provision of an antioxidant effect.
  • FIG. 3 shows a graph of mechanical properties of alloys after undergoing an ageing process, in which the alloys are subjected to a temperature of 125° C. for 96 hours.
  • This test was conducted to discover how the properties of the alloy would change if an article manufactured using the alloy was to be subjected to such high temperatures for extended periods of time.
  • an alloy containing a tin base, 0.7% copper, 0.02% silicon and 0.01% germanium, as well as an alloy containing a tin base, 0.7% copper, 0.02% silicon and 0.01% phosphorous display a superior UTS (ultimate tensile strength) than the conventional tin/0.7% copper/0.02% silicon alloy.
  • UTS superior tensile strength
  • FIG. 4 shows the tensile strengths of various alloys after undergoing an ageing process, in which the alloys were subjected to a temperature of 125° C. for 24, 48 and 96 hours. It can be seen that alloys embodying the present invention display superior tensile strength after ageing, when compared to the conventional tin/lead alloy, as well as to the conventional tin/copper alloy.
  • FIG. 5 shows the yield strengths of various alloys after being subjected to the above-described ageing process, and again it will be seen that alloys embodying the present invention display superior yield strengths after ageing when compared to the conventional tin/lead and tin/copper alloys. Also, the alloys embodying the present invention containing small amounts of germanium or phosphorous display an improved yield strength after being subjected to significant ageing processes when compared to solders embodying the present invention which do not contain germanium or phosphorous.
  • FIG. 6 shows the strain percentages of various alloys after undergoing the ageing process described above, i.e. being subjected to a temperature of 125° C. for 24, 48 and 96 hours. It can be seen that alloys embodying the present invention display superior strain percentages when compared to the conventional tin/lead solder, and when compared to the conventional tin/copper alloy.
  • FIGS. 7 and 8 show the energies required, respectively, for various solders to yield and to break, after being subjected to the ageing process described above. It can again be seen that alloys embodying the present invention require greater quantities of energy to yield and to break when compared to the conventional tin/lead solder, and when compared to the conventional tin/copper solder. In particular, after 96 hours ageing at 125° C.; the tin/0.7% copper/0.02% silicon alloy requires 0.05 joules to yield and 20.735 joules to break, whereas the conventional tin/lead alloy requires 0.038 joules to yield and 5.647 joules to break.
  • the conventional tin/copper alloy requires 0.018 joules to yield and 5.364 joules to break.
  • this alloy embodying the present invention will be significantly more stable over extended periods of time than the conventional tin/lead and tin/copper alloys.
  • FIG. 9 shows the toughnesses of various alloys after being subjected to the ageing process described above, and once again it can be seen that alloys embodying the present invention display superior toughnesses after ageing when compared to the conventional tin/lead and tin/copper solders.
  • FIG. 10 shows the mechanical properties of the conventional tin/lead alloy, the conventional tin/copper alloy and the tin/0.7% copper/0.02% silicon alloy embodying the present invention when subjected to temperatures of 23° C., 75° C. and 125° C. While the UTS, YS (yield strength) strain percentages, energy to yield, energy to break and toughness of all of the alloys reduce under the influence of high temperature, the alloy embodying the present invention displays a lesser reduction in performance under these conditions.
  • the UTS of the conventional tin/lead alloy drops by around 71.2% when the temperature is increased from 23° C. to 125° C., but the UTS of the alloy embodying the present invention drops by only around 53.04% when the alloy is subjected to the same rise in temperature.
  • FIG. 11 shows a table of the UTS, YS, strain percentage, energy to yield, energy to break and toughness of the conventional tin/lead alloy, the conventional tin/copper alloy and the tin/0.7% copper/0.02% silicon alloy embodying the present invention when various cross-head speeds are used in a tensile testing apparatus. It can be seen from the table that the alloy embodying the present invention displays significantly more stable mechanical characteristics under the various cross-head speeds when compared to the conventional alloys.
  • this figure shows the different scanning calorimeter curve of the tin/0.7% copper/0.02% silicon alloy embodying the present invention, and it can be seen that the addition of silicon to this alloy has little or no effect on the melting temperature thereof.
  • This alloy embodying the present invention therefore maintains the desirable wettability properties of the 99.3% tin/0.7% copper alloy, such as the wetting time and wetting force thereof.
  • FIGS. 13 and 14 show the wetting times and wetting forces at certain temperatures of various alloys, and it can be seen that alloys embodying the present invention display very similar wetting characteristics to the conventional tin/copper alloy.
  • the present invention provides substantially lead-free alloys having significantly improved properties when compared to conventional lead-free solders. It is envisaged that alloys embodying the present invention may be used as direct “drop-in” replacements for conventional leaded solders, particularly for use in wave soldering applications.
  • substantially lead-free solders claimed may consist essentially of the listed components, in other words may comprise only these components, aside from unavoidable impurities. This need not, however, necessarily be the case.

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  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Silicates, Zeolites, And Molecular Sieves (AREA)
  • Fats And Perfumes (AREA)
  • Powder Metallurgy (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Detergent Compositions (AREA)
  • Silicon Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Glass Compositions (AREA)
US11/046,417 2004-10-27 2005-01-28 Solders Abandoned US20060088439A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/674,075 US7472817B2 (en) 2004-10-27 2007-02-12 Solders

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0423860.6 2004-10-27
GB0423860A GB2406101C (en) 2004-10-27 2004-10-27 Improvements in ro relating to solders

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/674,075 Continuation US7472817B2 (en) 2004-10-27 2007-02-12 Solders

Publications (1)

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US20060088439A1 true US20060088439A1 (en) 2006-04-27

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US11/046,417 Abandoned US20060088439A1 (en) 2004-10-27 2005-01-28 Solders
US11/674,075 Active 2025-07-18 US7472817B2 (en) 2004-10-27 2007-02-12 Solders

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US11/674,075 Active 2025-07-18 US7472817B2 (en) 2004-10-27 2007-02-12 Solders

Country Status (18)

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US (2) US20060088439A1 (da)
EP (1) EP1815034B1 (da)
JP (1) JP4048288B2 (da)
KR (1) KR100886768B1 (da)
CN (1) CN100497693C (da)
AT (1) ATE417941T1 (da)
AU (1) AU2005298466B2 (da)
BR (1) BRPI0517384B1 (da)
DE (1) DE602005011848D1 (da)
DK (1) DK1815034T3 (da)
GB (1) GB2406101C (da)
HK (1) HK1105668A1 (da)
IL (1) IL180932A (da)
MX (1) MX2007003369A (da)
MY (1) MY136213A (da)
NO (1) NO333370B1 (da)
RU (1) RU2356975C2 (da)
WO (1) WO2006045995A1 (da)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010133048A1 (zh) * 2009-05-19 2010-11-25 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8308053B2 (en) 2005-08-31 2012-11-13 Micron Technology, Inc. Microfeature workpieces having alloyed conductive structures, and associated methods
US7629249B2 (en) 2006-08-28 2009-12-08 Micron Technology, Inc. Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
WO2009028147A1 (ja) * 2007-08-24 2009-03-05 Kabushiki Kaisha Toshiba 接合用組成物
JP6008101B2 (ja) * 2012-08-11 2016-10-19 千住金属工業株式会社 電力用はんだ
RU2584357C1 (ru) * 2014-11-26 2016-05-20 Открытое акционерное общество "Композит" (ОАО "Композит") Припой для пайки алюминия и его сплавов
BE1025771B1 (nl) * 2017-12-14 2019-07-08 Metallo Belgium Verbeterde koperproductiewerkwijze

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858816A (en) * 1987-03-03 1989-08-22 Societe Electronique De La Region Pays De Loire Tin-soldering machine with automatic wave barrier for printed circuit boards
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
US5538686A (en) * 1993-04-30 1996-07-23 At&T Corp. Article comprising a PB-free solder having improved mechanical properties
US5733501A (en) * 1995-07-04 1998-03-31 Kabushiki Kaisha Toyota Chuo Kenkyusho Lead-free solder alloy
US5958333A (en) * 1996-08-29 1999-09-28 Mitsui Mining & Smelting Co., Ltd. Tin-silver-based soldering alloy
US6843862B2 (en) * 2001-07-09 2005-01-18 Quantum Chemical Technologies (Singapore) Pte Ltd Solders

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3107483B2 (ja) * 1993-07-13 2000-11-06 日本アルミット株式会社 無ないし低含鉛半田合金
US5410184A (en) * 1993-10-04 1995-04-25 Motorola Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
WO1997009455A1 (en) 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
JP3874031B2 (ja) 1995-11-29 2007-01-31 内橋エステック株式会社 無鉛はんだ合金
KR980006783A (ko) 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JPH10314980A (ja) 1997-05-14 1998-12-02 Sony Corp はんだ材料
JP3719624B2 (ja) * 1997-06-07 2005-11-24 内橋エステック株式会社 電子部品実装用はんだ及び電子部品の実装方法
JPH11221694A (ja) 1998-02-06 1999-08-17 Hitachi Ltd 鉛フリーはんだを用いた実装構造体およびそれを用いた実装方法
JP2000141078A (ja) 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
WO2000018536A1 (fr) 1998-09-30 2000-04-06 Matsushita Electric Industrial Co., Ltd. Materiau de brasage et dispositif electrique/electronique utilisant celui-ci
JP2000326088A (ja) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP3753168B2 (ja) 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
JP2001071173A (ja) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk 無鉛はんだ
JP2002248596A (ja) * 2001-02-27 2002-09-03 Toshiba Tungaloy Co Ltd 耐酸化性に優れる鉛レス半田ボール
JP2002373824A (ja) * 2001-04-11 2002-12-26 Miura Gokin Kogyosho:Kk 金属化プラスチックフィルムコンデンサの外部電極用無鉛合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
KR100366131B1 (ko) * 2001-11-21 2002-12-31 이재옥 드로스 발생이 적은 저융점 무연땜납
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
GB2431412B (en) * 2005-10-24 2009-10-07 Alpha Fry Ltd Lead-free solder alloy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4858816A (en) * 1987-03-03 1989-08-22 Societe Electronique De La Region Pays De Loire Tin-soldering machine with automatic wave barrier for printed circuit boards
US5538686A (en) * 1993-04-30 1996-07-23 At&T Corp. Article comprising a PB-free solder having improved mechanical properties
US5520752A (en) * 1994-06-20 1996-05-28 The United States Of America As Represented By The Secretary Of The Army Composite solders
US5733501A (en) * 1995-07-04 1998-03-31 Kabushiki Kaisha Toyota Chuo Kenkyusho Lead-free solder alloy
US5958333A (en) * 1996-08-29 1999-09-28 Mitsui Mining & Smelting Co., Ltd. Tin-silver-based soldering alloy
US6843862B2 (en) * 2001-07-09 2005-01-18 Quantum Chemical Technologies (Singapore) Pte Ltd Solders

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010133048A1 (zh) * 2009-05-19 2010-11-25 广州瀚源电子科技有限公司 一种无铅焊料的减渣方法
US10286497B2 (en) 2014-04-30 2019-05-14 Nihon Superior Co., Ltd. Lead-free solder alloy

Also Published As

Publication number Publication date
JP2006123001A (ja) 2006-05-18
GB2406101C (en) 2007-09-11
DK1815034T3 (da) 2009-04-06
CN101080505A (zh) 2007-11-28
CN100497693C (zh) 2009-06-10
JP4048288B2 (ja) 2008-02-20
EP1815034A1 (en) 2007-08-08
KR100886768B1 (ko) 2009-03-04
RU2356975C2 (ru) 2009-05-27
WO2006045995A1 (en) 2006-05-04
MX2007003369A (es) 2008-03-05
EP1815034B1 (en) 2008-12-17
AU2005298466B2 (en) 2008-11-20
DE602005011848D1 (de) 2009-01-29
NO20072097L (no) 2007-06-06
BRPI0517384B1 (pt) 2017-06-27
BRPI0517384A (pt) 2008-10-07
AU2005298466A1 (en) 2006-05-04
US20070125834A1 (en) 2007-06-07
GB2406101A8 (en) 2005-11-07
HK1105668A1 (en) 2008-02-22
RU2007116722A (ru) 2008-12-10
WO2006045995A8 (en) 2007-04-12
US7472817B2 (en) 2009-01-06
MY136213A (en) 2008-08-29
GB2406101A (en) 2005-03-23
KR20070049229A (ko) 2007-05-10
IL180932A (en) 2013-03-24
IL180932A0 (en) 2007-07-04
GB2406101B (en) 2006-08-02
ATE417941T1 (de) 2009-01-15
NO333370B1 (no) 2013-05-13
GB0423860D0 (en) 2004-12-01

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