US20040187659A1 - Glass cutting method - Google Patents

Glass cutting method Download PDF

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Publication number
US20040187659A1
US20040187659A1 US10/794,295 US79429504A US2004187659A1 US 20040187659 A1 US20040187659 A1 US 20040187659A1 US 79429504 A US79429504 A US 79429504A US 2004187659 A1 US2004187659 A1 US 2004187659A1
Authority
US
United States
Prior art keywords
scribe line
cutting
glass
glass surface
chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/794,295
Other languages
English (en)
Inventor
Tomohiro Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nishiyama Stainless Chemical Co Ltd
Original Assignee
Nishiyama Stainless Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nishiyama Stainless Chemical Co Ltd filed Critical Nishiyama Stainless Chemical Co Ltd
Assigned to NISHIYAMA STAINLESS CHEMICAL CO., LTD. reassignment NISHIYAMA STAINLESS CHEMICAL CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NISHIYAMA, TOMOHIRO
Publication of US20040187659A1 publication Critical patent/US20040187659A1/en
Priority to US12/068,612 priority Critical patent/US7836727B2/en
Abandoned legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00—Printed matter of special format or style not otherwise provided for
    • B42D15/0073—Printed matter of special format or style not otherwise provided for characterised by shape or material of the sheets
    • B42D15/0093—Sheet materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/14—Printing or colouring
    • B32B38/145—Printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D15/00—Printed matter of special format or style not otherwise provided for
    • B42D15/02—Postcards; Greeting, menu, business or like cards; Letter cards or letter-sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42P—INDEXING SCHEME RELATING TO BOOKS, FILING APPLIANCES OR THE LIKE
    • B42P2261/00—Manufacturing; Forming
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/31—Pre-treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

Definitions

  • FIG. 4 is a schematic view obtained when a surface contour of a glass substrate obtained by cutting without performing a chemical treatment after formation of a scribe line is observed with a microscope of a magnification of ⁇ 50;
  • a scribe line can be formed by means of the same method as that adopted by a cutting apparatus from ACCUDYNE Co. having been employed a conventional technique. That is, (1) a physical damage is formed at an edge of a mother material with a metal foil or the like, (2) the physical damage is illuminated with a linear laser beam and (3) immediately thereafter, a mixed gas of helium and water is blown to the mother material to rapidly cool it. With the three steps applied, a scribe line can be formed on a surface of a mother material.
  • a time for which a mother material is in contact with a chemical treatment solution and a chemical treatment solution temperature are properly altered according to a composition of a mother glass and a thickness thereof.
  • a mother glass substrate is lowered into the chemical treatment solution in a direction normal to a surface of the solution.
  • a mother glass plate is immersed in the chemical treatment solution in parallel to the surface thereof.
  • the mother material may be immersed in the chemical treatment solution obliquely relative to the surface of the solution.
  • a pressure tool brought into contact with glass may be a flat plate. A thinner plate is preferably used.
  • a glass cutting face 9 is smooth.
  • a glass cutting face 11 is not smooth, but has cracks 13 thereon.
  • a scribe line 10 on a glass surface is linear.
  • depressed recesses are shown in black. That is, a scribe line 12 takes an irregular shape with exaggerated depressions and projections. This exaggeration in depression and projections show that glass cracking and breakage occurred in cutting of the glass substrate. Therefore, it has been confirmed that by performing a chemical treatment, glass cracks generated in formation of a scribe line is removed.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Surface Treatment Of Glass (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
US10/794,295 2003-03-24 2004-03-04 Glass cutting method Abandoned US20040187659A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/068,612 US7836727B2 (en) 2003-03-24 2008-02-08 Glass cutting method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003079675 2003-03-24
JP2003-079675 2003-03-24
JP2003329865A JP3577492B1 (ja) 2003-03-24 2003-09-22 ガラスの切断分離方法、フラットパネルディスプレイ用ガラス基板及びフラットパネルディスプレイ
JP2003-329865 2003-09-22

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/068,612 Continuation US7836727B2 (en) 2003-03-24 2008-02-08 Glass cutting method

Publications (1)

Publication Number Publication Date
US20040187659A1 true US20040187659A1 (en) 2004-09-30

Family

ID=32993012

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/794,295 Abandoned US20040187659A1 (en) 2003-03-24 2004-03-04 Glass cutting method
US12/068,612 Expired - Fee Related US7836727B2 (en) 2003-03-24 2008-02-08 Glass cutting method

Family Applications After (1)

Application Number Title Priority Date Filing Date
US12/068,612 Expired - Fee Related US7836727B2 (en) 2003-03-24 2008-02-08 Glass cutting method

Country Status (6)

Country Link
US (2) US20040187659A1 (zh)
JP (1) JP3577492B1 (zh)
KR (2) KR101119145B1 (zh)
CN (1) CN100471806C (zh)
HK (1) HK1068325A1 (zh)
TW (1) TWI336316B (zh)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080171209A1 (en) * 2006-09-27 2008-07-17 Nishiyama Stainless Chemical Co., Ltd. Method for cutting glass laminate
EP2048119A1 (en) * 2007-10-11 2009-04-15 Nishiyama Stainless Chemical Co., Ltd. Method for cutting glass laminate and flat panel display
US20090197088A1 (en) * 2007-08-03 2009-08-06 Nippon Electric Glass Co., Ltd. Tempered glass substrate and method of producing the same
US20100171920A1 (en) * 2007-06-22 2010-07-08 Tomohiro Nishiyama Display device and method for producing the same
CN101857377A (zh) * 2009-04-03 2010-10-13 西山不锈化学股份有限公司 电子装置用玻璃衬底以及电子装置的制造方法
US20110226832A1 (en) * 2010-03-19 2011-09-22 John Frederick Bayne Mechanical scoring and separation of strengthened glass
US8844782B2 (en) 2010-07-16 2014-09-30 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US9416041B2 (en) 2013-06-26 2016-08-16 Beijing Boe Display Technology Co., Ltd. Method for cutting substrate of irregular pattern and display device
US10351460B2 (en) 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
WO2024000332A1 (zh) * 2022-06-29 2024-01-04 超能高新材料股份有限公司 可对板件同步截断及检测强度的板件截断机及截断方法

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4865351B2 (ja) * 2003-03-24 2012-02-01 株式会社Ｎｓｃ 液晶ディスプレイ
US8737920B2 (en) 2004-11-10 2014-05-27 Interdigital Technology Corporation Method and apparatus for managing wireless communication network radio resources
JP4650095B2 (ja) * 2005-05-18 2011-03-16 ソニー株式会社 薄膜デバイスの製造方法
JP4513647B2 (ja) * 2005-05-20 2010-07-28 株式会社島津製作所 光学素子の製造方法
KR100745148B1 (ko) * 2006-07-21 2007-08-01 한국과학기술원 정전하를 이용한 유리 절단 방법 및 그의 유리 절단 장치
JP4682346B2 (ja) * 2006-08-02 2011-05-11 株式会社 日立ディスプレイズ 液晶表示装置及び液晶表示装置の製造方法
JP2008292919A (ja) * 2007-05-28 2008-12-04 Nishiyama Stainless Chem Kk 表示装置
KR101045272B1 (ko) 2008-04-24 2011-06-29 미쓰보시 다이야몬도 고교 가부시키가이샤 접합 유리 기판의 가공 방법
JP5449904B2 (ja) * 2008-11-06 2014-03-19 株式会社Ｎｓｃ ガラス基板を有する電子装置の製造方法
JP4775829B2 (ja) * 2009-04-03 2011-09-21 株式会社Ｎｓｃ 電子装置用ガラス基板及び電子装置の製造方法
JP2009230147A (ja) * 2009-04-27 2009-10-08 Nishiyama Stainless Chemical Kk フラットパネルディスプレイの製造方法。
KR20110005499A (ko) 2009-07-10 2011-01-18 삼성모바일디스플레이주식회사 유기전계 발광 표시장치 및 그 제조방법
JP2011046581A (ja) 2009-08-28 2011-03-10 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
CN102442764A (zh) * 2010-10-08 2012-05-09 东莞万士达液晶显示器有限公司 强化玻璃切割方法及强化玻璃切割预置结构
JP5166573B2 (ja) * 2011-06-30 2013-03-21 株式会社Ｎｓｃ ガラス基板の製造方法
US9938186B2 (en) 2012-04-13 2018-04-10 Corning Incorporated Strengthened glass articles having etched features and methods of forming the same
EP2925482A1 (en) 2012-11-29 2015-10-07 Corning Incorporated Sacrificial cover layers for laser drilling substrates and methods thereof
WO2014085663A1 (en) 2012-11-29 2014-06-05 Corning Incorporated Methods of fabricating glass articles by laser damage and etching
CN103713409B (zh) * 2013-12-27 2016-03-30 合肥京东方光电科技有限公司 一种液晶面板切割装置及切割方法
KR101580287B1 (ko) * 2014-05-02 2015-12-24 삼성전기주식회사 인쇄회로기판, 인쇄회로기판 스트립 및 그 제조방법
CN104556656B (zh) * 2014-12-30 2017-07-11 湖北优尼科光电技术股份有限公司 玻璃基板化学切割装置及化学切割方法
KR101819608B1 (ko) * 2015-07-31 2018-01-17 코닝정밀소재 주식회사 유리 접합체 커팅 방법 및 커팅 장치
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
CN108227270A (zh) * 2018-02-11 2018-06-29 武汉华星光电半导体显示技术有限公司 面板切割装置
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN114394757A (zh) * 2021-11-28 2022-04-26 凯盛科技股份有限公司蚌埠华益分公司 单面蚀刻制造超薄玻璃的方法及超薄玻璃

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US6423930B1 (en) * 1999-06-18 2002-07-23 Mitsuboshi Diamond Industrial Co., Ltd. Scribing with laser

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JPH03232731A (ja) * 1990-02-08 1991-10-16 Hitachi Chem Co Ltd 化学切削性感光性ガラス製品の分割法
JPH04118190A (ja) * 1990-09-07 1992-04-20 Nagasaki Pref Gov ウェハの割断方法
KR100368637B1 (ko) * 2000-05-15 2003-01-24 (주)해라시스템 미소기전소자를 이용한 평판표시장치

Patent Citations (2)

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US6423930B1 (en) * 1999-06-18 2002-07-23 Mitsuboshi Diamond Industrial Co., Ltd. Scribing with laser
US20020041946A1 (en) * 2000-08-18 2002-04-11 Nippon Sheet Glass Co., Ltd. Process for cutting a glass sheet and a glass disk for a recording medium

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101455383B1 (ko) 2006-09-27 2014-10-27 가부시키가이샤 엔에스씨 접합 유리판의 절단 분리 방법, 플랫 패널 디스플레이 패널의 제조 방법, 플랫 패널 디스플레이의 제조 방법, 및 플랫 패널 디스플레이
US20080171209A1 (en) * 2006-09-27 2008-07-17 Nishiyama Stainless Chemical Co., Ltd. Method for cutting glass laminate
US20100171920A1 (en) * 2007-06-22 2010-07-08 Tomohiro Nishiyama Display device and method for producing the same
US20090197088A1 (en) * 2007-08-03 2009-08-06 Nippon Electric Glass Co., Ltd. Tempered glass substrate and method of producing the same
US9299869B2 (en) 2007-08-03 2016-03-29 Nippon Electric Glass Co., Ltd. Tempered glass substrate and method of producing the same
US8679631B2 (en) 2007-08-03 2014-03-25 Nippon Electric Glass Co., Ltd. Tempered glass substrate and method of producing the same
US9054250B2 (en) 2007-08-03 2015-06-09 Nippon Electric Glass Co., Ltd Tempered glass substrate and method of producing the same
US9034469B2 (en) 2007-08-03 2015-05-19 Nippon Electric Glass Co., Ltd. Tempered glass substrate and method of producing the same
EP2048119A1 (en) * 2007-10-11 2009-04-15 Nishiyama Stainless Chemical Co., Ltd. Method for cutting glass laminate and flat panel display
CN101857377A (zh) * 2009-04-03 2010-10-13 西山不锈化学股份有限公司 电子装置用玻璃衬底以及电子装置的制造方法
US20110226832A1 (en) * 2010-03-19 2011-09-22 John Frederick Bayne Mechanical scoring and separation of strengthened glass
US8875967B2 (en) 2010-03-19 2014-11-04 Corning Incorporated Mechanical scoring and separation of strengthened glass
WO2011116165A1 (en) * 2010-03-19 2011-09-22 Corning Incorporated Mechanical scoring and separation of strengthened glass
US9802854B2 (en) 2010-03-19 2017-10-31 Corning Incorporated Mechanical scoring and separation of strengthened glass
US8864005B2 (en) 2010-07-16 2014-10-21 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US8844782B2 (en) 2010-07-16 2014-09-30 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US9611167B2 (en) 2010-07-16 2017-04-04 Corning Incorporated Methods for scribing and separating strengthened glass substrates
US10351460B2 (en) 2012-05-22 2019-07-16 Corning Incorporated Methods of separating strengthened glass sheets by mechanical scribing
US9416041B2 (en) 2013-06-26 2016-08-16 Beijing Boe Display Technology Co., Ltd. Method for cutting substrate of irregular pattern and display device
US10414683B2 (en) 2013-06-26 2019-09-17 Boe Technology Group Co., Ltd. Method for cutting substrate of irregular pattern and display device
WO2024000332A1 (zh) * 2022-06-29 2024-01-04 超能高新材料股份有限公司 可对板件同步截断及检测强度的板件截断机及截断方法

Also Published As

Publication number Publication date
HK1068325A1 (en) 2005-04-29
TW200418737A (en) 2004-10-01
JP3577492B1 (ja) 2004-10-13
JP2004307318A (ja) 2004-11-04
KR101206343B1 (ko) 2012-11-30
KR20110055498A (ko) 2011-05-25
KR20040086518A (ko) 2004-10-11
CN1532158A (zh) 2004-09-29
TWI336316B (en) 2011-01-21
CN100471806C (zh) 2009-03-25
US20080202298A1 (en) 2008-08-28
US7836727B2 (en) 2010-11-23
KR101119145B1 (ko) 2012-02-21

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