WO2024000332A1 - 可对板件同步截断及检测强度的板件截断机及截断方法 - Google Patents

可对板件同步截断及检测强度的板件截断机及截断方法 Download PDF

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Publication number
WO2024000332A1
WO2024000332A1 PCT/CN2022/102554 CN2022102554W WO2024000332A1 WO 2024000332 A1 WO2024000332 A1 WO 2024000332A1 CN 2022102554 W CN2022102554 W CN 2022102554W WO 2024000332 A1 WO2024000332 A1 WO 2024000332A1
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WIPO (PCT)
Prior art keywords
plate
cut
cutting
blocks
line
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PCT/CN2022/102554
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English (en)
French (fr)
Inventor
魏汝超
陈东林
廖启凯
江竣纶
陈奕胜
Original Assignee
超能高新材料股份有限公司
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Application filed by 超能高新材料股份有限公司 filed Critical 超能高新材料股份有限公司
Priority to PCT/CN2022/102554 priority Critical patent/WO2024000332A1/zh
Priority to KR1020247043197A priority patent/KR20250048189A/ko
Priority to EP22948446.4A priority patent/EP4549407A1/en
Publication of WO2024000332A1 publication Critical patent/WO2024000332A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
    • G01M5/005—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress by means of external apparatus, e.g. test benches or portable test systems
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations

Definitions

  • the present invention relates to a cutting machine that mainly cuts off plates such as ceramic substrates, and in particular, to a plate cutting machine and a plate cutting method that can simultaneously cut off plates and detect their strength.
  • Ceramic substrate is a kind of circuit board. It is made of refined high-purity inorganic materials as raw materials. The composition and uniformity are precisely controlled by chemical or physical methods, and then formed by dry pressing, slurry casting, or injection molding. , after sintering steps, and then processed into finished products, unlike traditional FR-4 or aluminum substrates, it has a thermal expansion coefficient close to that of semiconductors and high heat resistance, as well as being hard, wear-resistant, pressure-resistant, and high-heat resistant , acid-resistant, alkali-resistant, etc., suitable for products with high calorific value (such as high-brightness LED carrier boards, LED car lights, LED street lights, solar inverters, etc.).
  • high calorific value such as high-brightness LED carrier boards, LED car lights, LED street lights, solar inverters, etc.
  • the substrate needs to be cut (cut) into a suitable size before use.
  • preprocessing to form a cut line is required before cutting, and then pressure is applied along the edge of the cut line during subsequent processing to make the board Separate along the cutting line; the cutting line can be formed by scoring with a scoring wheel (forming a scoring line), laser ablation, etc.
  • the main purpose of the present invention is to provide a cutting machine and a cutting method that can detect the strength of plates such as ceramic substrates while cutting them.
  • the invention provides a plate cutting machine that can synchronously detect the strength of the plate, including: a fixed platform for fixing the plate; a lifting base arranged above the fixed platform, and a plurality of lifting bases are arranged around the lower part of the lifting base.
  • the fixed platform can be fixedly arranged, and the driving mechanism is used to drive the lifting base to rise or fall relative to the fixed platform.
  • the lifting base can be fixedly arranged, and the driving mechanism is used to drive the fixed platform to rise or fall relative to the lifting base.
  • each of the cutting blocks are at the same height as each other.
  • the cutting blocks simultaneously move the cutting line of the panel. Vertical pressure is exerted on each edge, so that the peripheral portion of the cutting line of the panel is cut and separated.
  • each of the truncated blocks can be placed at different heights from each other.
  • the truncated blocks will move from the one with the lowest lower end to the highest lower end.
  • the user sequentially applies vertical pressure to the plate along each edge of the rectangular cut-off line, so that the peripheral portion of the cut-off line of the plate is cut and separated.
  • the fixed platform is provided with a plurality of air holes, and the air holes are connected to a vacuum pump.
  • the vacuum pump When the vacuum pump is running, the air holes form a negative pressure to adsorb the plate placed on the fixed platform. .
  • the panel can be quickly fixed on the fixed platform through vacuum adsorption force, or the panel can be quickly removed from the fixed platform when the vacuum is released.
  • the lifting base may include: a lower pressure platform, which is provided with four slots arranged on the four sides to form a rectangle and penetrate up and down; and a connecting seat connected to one side of the downward pressure platform,
  • the connecting base is connected to the driving mechanism, wherein the stress sensors are arranged above the pressing platform, and the cutting blocks are arranged below the pressing platform.
  • the stress sensors and the cutting blocks pass through the connecting blocks respectively. connected, and the connecting blocks are respectively accommodated in the slots. Therefore, while cutting off the plate, the lower cutting block can conduct the relevant stress to the upper stress sensor through the connecting seat to prevent the stress sensor from being damaged by external forces.
  • a lower pressure plate can be provided within the range surrounded by the truncated blocks below the lower pressure platform, and the lower surface of the lower pressure plate is located lower than the lowest lower end surface of the truncated blocks. height position. According to the structure, before the cutting block descends to contact the plate, the lower pressing plate first presses the plate, and then the cutting block contacts the plate and cuts the plate.
  • the invention provides a plate cutting method that can simultaneously detect the strength of the plate, including: forming a cutting line on the upper surface of the plate; and using the plate cutting machine according to any one of claims 1 to 8 to cut the plate.
  • the piece exerts vertical downward pressure along the edge of the rectangular cut-off line, so that the peripheral part of the cut-off line of the plate is cut and separated. While the peripheral part of the cut-off line of the plate is cut and separated, the plate is The stress experienced when the piece is cut is transmitted to a stress sensor, converted into electronic values and sent to a computer unit.
  • Figure 1 is a schematic perspective view showing the appearance structure of the panel cutting machine of the present invention
  • Figure 2 is a schematic front view showing the appearance structure of the panel cutting machine of the present invention.
  • Figure 3 is a schematic side view showing the appearance structure of the panel cutting machine of the present invention.
  • Figure 4 is a schematic top view showing the appearance structure of the panel cutting machine of the present invention.
  • Figure 5 is a perspective view showing the driving mechanism of the panel cutting machine of the present invention.
  • Figure 6 is a three-dimensional exploded schematic diagram showing the lifting seat structure of the panel cutting machine of the present invention.
  • Figure 7 is a schematic plan view showing the overall structure of the panel cutting machine of the present invention, and showing that the panel is fixed but the lifting base has not yet been lowered to cut the panel;
  • FIG. 8 is a schematic plan view showing that the lifting base shown in FIG. 7 is lowered to cut off the plate.
  • connection block First connection block (connection block)
  • connection block Second connection block (connection block)
  • connection block 15C The third connection block (connection block)
  • connection block 15D The fourth connection block (connection block)
  • the present invention provides a plate cutting machine 1 that can simultaneously cut off plates and detect their strength.
  • An embodiment of the invention may include a fixed platform 11 and a driving mechanism 12 on a base 10, and The driving mechanism 12 is connected to a lifting base 14.
  • the lifting base 14 corresponds to the top of the fixed platform 11.
  • the driving mechanism 12 is used to drive the lifting base 14 to rise or fall in the vertical direction.
  • the fixed platform 11 is provided with a plurality of air holes, and these air holes are connected to a vacuum pump (not shown in the figure).
  • the driving mechanism 12 is arranged between the base 10 and the vertical plate 120 fixed vertically on the base 10.
  • the driving mechanism 12 includes a motor 121 provided on one side of the vertical plate 120.
  • the screw rod 123 provided on the other side of the vertical plate 120, the two ends of the screw rod 123 are matched to the bearing seats 1232 fixed above and below the vertical plate 120 and are arranged vertically, and a driven pulley 1231 is provided at the upper end of the screw rod 123,
  • the driven pulley 1231 is connected with the driving pulley 1211 provided on the main shaft of the motor 121 by a belt 122 to form a linkage relationship; the screw 123 is also provided with a moving block 1233 in a spiral fit.
  • the driving pulley 1211 is driven to rotate.
  • the belt 122 drives the driven pulley 1231 and the screw 123 to rotate.
  • the moving block 1233 is driven to move along the screw 123. That is, when the screw 123 is driven to rotate forward or reverse, the moving block 1233 is driven up or down.
  • two rails 13 arranged symmetrically and vertically are provided on one side of the vertical plate 120 on which the screw 123 is arranged. Each rail 13 is matched with a slider 143 in a sliding fit.
  • the lifting base 14 is connected to the driving mechanism 12 and is arranged above the fixed platform 11 .
  • the lifting base 14 includes a pressing platform 141 and a connecting seat 142 .
  • the pressing platform 141 is arranged horizontally, and the connecting seat 142 is fixed. It is arranged on one side of the lower pressure platform 141 and is basically perpendicular to the lower pressure platform 141.
  • the lower pressure platform 141 is provided with four slots 1411 to 1414 arranged on the four sides to form a rectangular shape and penetrating up and down, respectively.
  • a slot 1411, a second slot 1412, a third slot 1413 and a fourth slot 1414; four stress sensors 16A ⁇ 16D are provided above the pressing platform 141, which are the first stress sensor 16A and the second stress sensor respectively.
  • the stress sensors 16A-16D are electrically connected to a computer unit (not shown in the figure).
  • the first connecting block 15A is accommodated in the first slot 1411, the first stress sensor 16A located above the pressing platform 141 is locked on the first connector 15A through fixing elements such as screws, and the A cut-off block 18A is locked to the bottom of the first connector 15A through fixing elements such as screws, so that the first stress sensor 16A and the first cut-off block 18A are respectively fixed above and below the pressing platform 141;
  • the second connecting block 15B is accommodated in the second slot 1412, the second stress sensor 16B located above the pressing platform 141 is locked on the second connector 15B through fixing elements such as screws, and the second truncated block 18B is fixed through such as screws.
  • the component is locked to the bottom of the second connector 15B, so that the second stress sensor 16B and the second cutting block 18B are fixed above and below the pressing platform 141 respectively; the third connecting block 15C is accommodated in the third slot 1413 , the third stress sensor 16C located above the pressing platform 141 is locked on the third connector 15C through fixing elements such as screws, and the third truncating block 18C is locked to the third connector 15C through fixing elements such as screws.
  • the fourth stress sensor 16D is locked on the upper side of the fourth connector 15D through fixing elements such as screws, and the fourth truncating block 18D is locked on the lower side of the fourth connector 15D through fixing elements such as screws, thus causing the fourth stress
  • the sensor 16D and the fourth cutting block 18D are fixed above and below the pressing platform 141 respectively.
  • a lower pressure plate 19 within the range surrounded by the cut-off blocks 18A-18D below the down-pressure platform 141, and the lower surface of the lower pressure plate 19 is located lower than the cut-off blocks 18A-18D.
  • the height position of the lowest lower end surface in 18D, that is, compared with the lower end surfaces of the cutoff blocks 18A to 18D, the lower end surface of the lower pressure plate 19 is the lowest.
  • the lifting base 14 is connected to the driving mechanism 12 by fixing the connecting base 142 to the moving block 1233 and the two sliding blocks 142 of the driving mechanism 12. Therefore, the screw 123 is driven to rotate forward or reverse to drive the moving block 1233 up or down. When, the lift base 14 will be driven up or down at the same time.
  • the lower ends of the four rectangular-shaped truncated blocks 18A to 18D can be positioned at the same height. Or, the lower ends of at least two opposite truncated blocks 18A to 18D surrounding the rectangle are at the same height position as each other, but the lower ends of the remaining two opposite truncated blocks are at different height positions from each other and are different from the lower ends of the two aforementioned truncated blocks.
  • the lower ends of the first truncated block 18A and the third truncated block 18C are located at the same height position, and the lower ends of the second truncated block 18B and the fourth truncated block 18D are located at different height positions from each other and are also at different height positions from the first.
  • the height positions of the lower ends of the truncated block 18A and the third truncated block 18C are different; the height positions of the lower ends of the four truncated blocks 18A to 18D can be implemented by making the truncated blocks 18A to 18D have the same or different thicknesses. .
  • the lower ends of the truncated blocks 18A to 18D can also be arranged to be at different heights from each other; for example, the lower end of the first truncated block 18A is the lowest, the lower end of the second truncated block 18B is the second lowest, and the lower end of the third truncated block 18C is the second. Three low, the lower end of the fourth truncated block 18D is the highest; the lower ends of the truncated blocks 18A to 18D are at different heights from each other, which can be implemented by setting each of the truncated blocks to have different thicknesses.
  • the plate cutting machine 1 of the present invention is mainly used to cut brittle and hard plates 2 such as ceramic substrates. As shown in Figure 5, Figure 7 and Figure 8, before the plate 2 is cut off, the range to be broken needs to be marked on the plate.
  • a laser device can be used to apply laser to the plate 2. Cut a rectangular cut-off line 21 of appropriate depth. This cut-off line 21 serves as the reference line for plate breakage. It can also be called a "break line" or "crack".
  • the inner dimensions of the rectangle enclosed by the cut-off line 21 are Corresponding to the peripheral dimensions of the fixed platform 11; the plate 2 after cutting the rectangular cutoff line 21 with a laser is placed on the fixed platform 11, and the vacuum pump is started to continuously extract the air in the air holes on the fixed platform 11. By using Negative pressure is generated in the air holes 11 to adsorb and fix the plate 2 on the fixed platform 11 (as shown in Figure 7).
  • the motor 121 of the driving mechanism 12 is started, and the lifting base 14 is lowered through the aforementioned driving method until the lower pressing plate 19 further presses and fixes the plate 2, and then the cutting blocks 18A to 18D continue to descend along the Apply pressure against the edge of the cutting line 21 on the panel 2 to cut and separate the panel 2 other than the cutting line 21 (as shown in Figure 8).
  • the descending cutting blocks 18A to 18D will simultaneously apply vertical pressure along the edges of the cutting lines to cut off the plate. .
  • the lifting base 14 descends until the lower pressure plate 19 further presses and fixes the plate 2, and then the first and third cutting blocks 18A and 18C that continue to descend first move along the plate.
  • the second and fourth cutoff blocks 18B and 18D that continue to descend exert pressure along the edges of the cutoff lines 21 on the other opposite sides of the plate 2 to thereby
  • the panels 2 other than the cutting line 21 are cut and separated.
  • the lifting base 14 descends until the lower pressure plate 19 further presses and fixes the plate 2, and then continues to descend.
  • the first to fourth cutting blocks 18A, 18B, 18C, and 18D sequentially exert pressure along each edge of the cutting line 21 on the panel 2 to cut and separate the panel 2 other than the cutting line 21.
  • each stress sensor 16A-16D detects the maximum stress, and converts the obtained stress value into an electronic value and transmits it to the computer unit, so that each plate 2 can be cut off and inspected 100% without omission. Effect.
  • the aforementioned cut-off lines formed on the plate are not limited to rectangles. They can be formed into circles, polygons or other geometric shapes according to the actual needs of the product. In this case, the configuration of the plurality of cut-off blocks must also be based on the shape of the cut-off lines. Configure the shape so that the truncation block applies vertical pressure to the edge of the truncation line to truncate.
  • the lifting base can be set to be fixed, and the driving mechanism can be connected to the fixed platform to drive the fixed platform up or down. It can also be used when the lifting base and the fixed platform are close to each other.
  • the truncation block has the effect of truncating the plate.
  • the invention provides a plate cutting method that can simultaneously detect the strength of the plate, including: forming a cutting line on the upper surface of a plate; and using the plate cutting machine to cut the plate. Vertical pressure is applied along the edge of the cut-off line, so that the peripheral portion of the cut-off line of the plate is cut and separated.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

提供一种可对板件（2）同步截断及检测强度的板件截断机（1）及板件（2）截断方法，包括固定平台（11）、升降座（14）、应力传感器（16A、16B、16C、16D）以及驱动机构（12）；固定平台（11）用以将预先形成有矩形截断线的板件（2）固定；升降座（14）围绕地配置有多个截断块（18A、18B、18C、18D），多个截断块（18A、18B、18C、18D）分别连接多个应力传感器（16A、16B、16C、16D），当经由驱动机构（12）驱动以使升降座（14）与固定平台（11）相对接近时，使截断块（18A、18B、18C、18D）对板件（2）上沿着截断线（21）的各边缘施加垂直压力，使板件（2）的截断线（21）外围的部分被截断分离的同时，将板件（2）被截断当时所受的应力传导至应力传感器（16A、16B、16C、16D），并且转换为电子数值后传送至电脑单元。

Description

可对板件同步截断及检测强度的板件截断机及截断方法 技术领域
本发明涉及主要对陶瓷基板等板件进行截断的截断机，尤其涉及可对板件同步截断及检测强度的板件截断机及板件截断方法。
背景技术
陶瓷基板为电路板的一种，是一种以精制的高纯度无机材料为原料，经化学或物理方法精确控制组成及均匀度，再以干式压制、铸浆、或射出成形等方法成形后，经过烧结步骤，再经过加工制成成品，与传统FR-4或铝基板不同的是，其具有与半导体接近的热膨胀系数及高耐热能力，以及具有坚硬、耐磨、耐压、耐高热、耐酸、耐碱等的特性，适用于具备高发热量的产品(例如：高亮度LED载板、LED车灯、LED路灯、太阳能逆变器等)。
基板在使用之前需要裁切(截断)成适合的尺寸，尤其针对脆硬的陶瓷基板进行截断之前需要进行形成截断线的预处理，然后在后续加工时沿着截断线边缘施加压力，使得板件沿着截断线分离；所述截断线可以利用刻划轮进行刻划(形成刻划线)、激光烧蚀、…等方式来形成。
此外，为了了解基板的强度是否符合规定，现有上需要对基板进行破坏性测试，然而由于受检板件进行破坏性测试后即成为废板而须报废，造成成本浪费，因此破坏性测试仅能实施取样检验，无法做到百分之百检验；又，由于用来检验强度的机台是与截断机台分开设置，也因此占用了更多空间。
发明内容
基于前述，本发明的主要目的在于提供在截断陶瓷基板等板件的同时能够对板件的强度进行检测的截断机及截断方法。
本发明提供的可同步检测板件强度的板件截断机，包括：固定平台，用以固定板件；升降座，配置在该固定平台的上方，并且该升降座的下方围绕地配置有多个截断块；多个应力传感器，分别连接至该等截断块，并且该等应力传感器电连接至电脑单元；以及驱动机构，用以驱动该升降座或该固定 座在垂直方向上彼此相对地上升或下降；其中，该板件的上表面预先形成有截断线，该升降座或该固定平台被驱动彼此接近时，该等截断块对该板件上的该截断线的边缘施加垂直压力，使该板件的该截断线外围的部分被截断分离的同时，将该板件被截断当时所受的应力传导至该等应力传感器，并且转换为电子数值后传送至该电脑单元。通过此截断机，由于板件被截断的同时立即被检测强度，并且将相关数据输送到电脑单元进行处理分析，从而可以即时淘汰不良品，大幅提高生产效率，节省检测设备占用厂房的空间。
在本发明的另一实施例，该固定平台可以被固定地设置，该驱动机构用以驱动该升降座相对于该固定平台上升或下降。
在本发明的另一实施例，该升降座可以被固定地设置，该驱动机构用以驱动该固定平台相对于该升降座上升或下降。
在本发明的一实施例，该等截断块的每一个的下端彼此处于相同高度，该升降座或该固定平台被驱动彼此接近时，该等截断块同时间对该板件的该截断线的各边缘施加垂直压力，使该板件的该截断线外围的部分被截断分离。
在本发明的另一实施例，可以将该等截断块的每一个的下端彼此处于不同高度，该升降座或该固定平台被驱动彼此接近时，该等截断块由其下端最低者至下端最高者对该板件依序沿着该矩形截断线的各边缘施加垂直压力，使该板件的该截断线外围的部分被截断分离。
在本发明的较佳实施例，该固定平台上设有复数气孔，该等气孔连通至一真空泵，通过该真空泵运转时将该气孔形成负压，以吸附放置在该固定平台上的该板件。通过此结构，可以通过真空吸附力快速地将板件固定在固定平台上，或是在解除真空时快速地将板件从固定平台卸下。
在本发明的较佳实施例，该升降座可以包含：下压平台，设有配置在四边以构成矩形并且上下贯通的四个槽孔；以及连接座，连接在该下压平台的一侧，该连接座连接至该驱动机构，其中，该等应力传感器配置在该下压平台的上方，该等截断块配置在该下压平台的下方，该等应力传感器与该等截断块分别通过连接块连接，并且该等连接块分别容纳在该槽孔内。因此，下方的截断块在对板件进行截断的同时可以将相关应力经由连接座传导至上方的应力传感器，避免应力传感器受到外力作用损坏。
在本发明的一实施例，可以在该下压平台下方的该等截断块所包围的范围内设置下压板，该下压板的下表面所处的位置低于该等截断块的最低下端面的高度位置。因此结构，当截断块下降接触板件之前，先由该下压板压掣板件，然后再由截断块接触板件并将板件截断。
本发明提供一种可同步检测板件强度的板件截断方法，包括：在板件的上表面形成截断线；以及以权利要求1至8中任一项所述的板件截断机对该板件沿着该矩形截断线的边缘施加垂直往下的压力，使该板件的该截断线外围的部分被截断分离，该板件的该截断线外围的部分被截断分离的同时，将该板件被截断当时所受的应力传导至一应力传感器，并且转换为电子数值后传送至一电脑单元。
根据本发明的截断方法的另一实施例，可以使该板件截断机对该板件的各边缘同时施加垂直压力，使该板件的该截断线外围的部分被截断分离；或者可以使该板件截断机对该板件依序沿着该截断线的各边缘施加垂直往下的压力，使该板件的该截断线外围的部分被截断分离。
附图说明
图1为显示本发明的板件截断机外观结构的立体示意图；
图2为显示本发明的板件截断机外观结构的前视示意图；
图3为显示本发明的板件截断机外观结构的侧视示意图；
图4为显示本发明的板件截断机外观结构的俯视示意图；
图5为显示本发明的板件截断机的驱动机构的立体示意图；
图6为显示本发明的板件截断机的升降座结构的立体分解示意图；
图7为显示本发明的板件截断机的整体结构，同时显示板件被固定，但升降座尚未下降对板件截断的平面剖视示意图；以及
图8为显示图7所示的升降座下降以对板件截断的平面剖视示意图。
附图标记说明
1:板件截断机
10:基座
11:固定平台
12:驱动机构
120:竖板
121:马达
1211:主动皮带轮
122:皮带
123:螺杆
1231:从动皮带轮
1232:轴承座
1233:移动块
13:轨道
14:升降座
141:下压平台
1411:第一槽孔(槽孔)
1412:第二槽孔(槽孔)
1413:第三槽孔(槽孔)
1414:第四槽孔(槽孔)
142:连接座
143:滑块
15A:第一连接块(连接块)
15B:第二连接块(连接块)
15C:第三连接块(连接块)
15D:第四连接块(连接块)
16A:第一应力传感器(应力传感器)
16B:第二应力传感器(应力传感器)
16C:第三应力传感器(应力传感器)
16D:第四应力传感器(应力传感器)
17:固定板
18A:第一截断块(截断块)
18B:第二截断块(截断块)
18C:第三截断块(截断块)
18D:第四截断块(截断块)
19:下压板
2:板件
21:截断线
具体实施方式
以下配合附图及元件符号对本发明的实施方式做更详细的说明，使本领域技术人员在研读本说明书后能据以实施。
如图1至图7所示，本发明提供可对板件同步截断及检测强度的板件截断机1，其实施例可以是在基座10上设有固定平台11与驱动机构12，并且在驱动机构12连接有升降座14，升降座14对应至固定平台11的上方，驱动机构12用以驱动升降座14在垂直方向上升或下降。其中，固定平台11上设有复数气孔，该等气孔连通至真空泵(图中未显示)，通过真空泵运转时将气孔中的空气抽出以形成负压，从而在固定平台11的上方形成吸力，使得固定平台11适于将板件2吸附固定在固定平台11上(如图5所示)。
如图5及图7所示，所述驱动机构12配置在基座10与垂直地固定在基座10上的竖板120，该驱动机构12包括有设置在竖板120一侧的马达121，以及设置在竖板120另一侧的螺杆123，螺杆123两端配合至固定在竖板120之上、下方位置的轴承座1232而垂直地配置，并且在螺杆123的上端设置从动皮带轮1231，该从动皮带轮1231与设在马达121的主轴的主动皮带轮1211以皮带122连接而形成连动关系；螺杆123还螺旋配合地设置有移动块1233，因此，当马达121运转而驱动主动皮带轮1211旋转时经由皮带122带动从动皮带轮1231与螺杆123旋转，螺杆123旋转时则带动移动块1233沿着螺杆123移动，亦即，螺杆123被驱动正向或反向旋转时带动移动块1233上升或下降。此外，在配置螺杆123的竖板120的一侧面上设置有对称地且竖向地配置的二支轨道13，每一支轨道13分别滑动配合地匹配一个滑块143。
所述升降座14连接至驱动机构12并且配置在固定平台11的上方，其中，该升降座14包含有下压平台141与连接座142，下压平台141呈水平地配置，连接座142固定地设置在下压平台141上面的偏一侧并且与下压平台141基本上保持相互垂直，其中下压平台141设有配置在四边以构成矩形并且上下贯通的四个槽孔1411～1414，分别为第一槽孔1411、第二槽孔1412、第三槽孔1413 与第四槽孔1414；下压平台141的上方设置四个应力传感器16A～16D，分别为第一应力传感器16A、第二应力传感器16B、第三应力传感器16C与第四应力传感器16D；下压平台141的下方设置四个截断块18A～18D，分别为第一截断块18A、第二截断块18B、第三截断块18C与第四截断块18D，该等应力传感器16A～16D与该等截断块18A～18D分别通过连接块15A～15D连接。该等应力传感器16A～16D则电连接至一电脑单元(图中未显示)。
更明确地说，第一连接块15A容纳在第一槽孔1411内，位于下压平台141上方的第一应力传感器16A通过诸如螺丝等固定元件锁固于第一连接器15A的上面，并且第一截断块18A通过诸如螺丝等固定元件锁固于第一连接器15A的下面，因此使得第一应力传感器16A与第一截断块18A分别被固定在下压平台141的上、下方；第二连接块15B容纳在第二槽孔1412内，位于下压平台141上方的第二应力传感器16B通过诸如螺丝等固定元件锁固于第二连接器15B的上面，并且第二截断块18B通过诸如螺丝等固定元件锁固于第二连接器15B的下面，因此使得第二应力传感器16B与第二截断块18B分别被固定在下压平台141的上、下方；第三连接块15C容纳在第三槽孔1413内，位于下压平台141上方的第三应力传感器16C通过诸如螺丝等固定元件锁固于第三连接器15C的上面，并且第三截断块18C通过诸如螺丝等固定元件锁固于第三连接器15C的下面，因此使得第三应力传感器16C与第三截断块18C分别被固定在下压平台141的上、下方；以及第四连接块15D容纳在第四槽孔1414内，位于下压平台141上方的第四应力传感器16D通过诸如螺丝等固定元件锁固于第四连接器15D的上面，并且第四截断块18D通过诸如螺丝等固定元件锁固于第四连接器15D的下面，因此使得第四应力传感器16D与第四截断块18D分别被固定在下压平台141的上、下方。当该等应力传感器16A～16D设置于下压平台141上后则以固定板17予以覆盖固定，以对该等应力传感器16A～16D产生保护作用。再者，较佳地在下压平台141下方的该等截断块18A～18D所包围的范围内设有下压板19，并且该下压板19的下表面所处的位置低于该等截断块18A～18D中的最低下端面的高度位置，亦即，该下压板19与该等截断块18A～18D的下端面相较，该下压板19的下端面为最低。
升降座14通过将连接座142固定至驱动机构12的移动块1233与二个滑块142而连接至驱动机构12，因此，螺杆123被驱动正向或反向旋转而带动移动块1233上升或下降时，将同时带动升降座14上升或下降。
本发明的实施例是可以使围绕成矩形的四个截断块18A～18D的下端彼此均处于相同高度位置。或者使围绕成矩形的四个截断块18A～18D中的至少相对二个的下端彼此处于相同高度位置，但剩余的相对二个截断块下端彼此处于不同高度位置且和前述二个截断块的下端也处于不同高度位置；例如第一截断块18A与第三截断块18C的下端位于相同的高度位置，第二截断块18B与第四截断块18D的下端彼此位于不同的高度位置并且也和第一截断块18A与第三截断块18C的下端的高度位置不同；所述四个截断块18A～18D的下端所处的高度位置可以通过使该等截断块18A～18D具有相同或不同的厚度来实施。或者，也可以设置成该等截断块18A～18D的下端彼此处于不同高度位置；例如，第一截断块18A的下端最低、第二截断块18B的下端次低，第三截断块18C的下端第三低，第四截断块18D的下端最高；所述该等截断块18A～18D的下端彼此处于不同高度位置可以通过将该等截断块的每一个设为具有不同的厚度来实施。
本发明的板件截断机1主要用来对诸如陶瓷基板等脆、硬的板件2进行截断。如图5、图7及图8所示，板件2要被截断之前需要先在板面上划设出需要折断的范围，对于陶瓷基板，例如可以利用激光设备对板件2施以激光以切割出适当深度的矩形截断线21，该截断线21作为板件断裂的基准线，也可以称为“断裂线”或“裂纹”，一般而言，该截断线21所围的矩形内围尺寸对应于固定平台11的外围尺寸；预先以激光切割出矩形截断线21后的板件2被放置于固定平台11上，并且启动真空泵以持续抽取该固定平台11上的气孔内的空气，通过使气孔11内产生负压而将板件2吸附固定在固定平台11上面(如图7所示)。
接下来启动驱动机构12的马达121，通过前述的驱动方式使升降座14下降，直到该下压板19先将板件2进一步压住固定后，接着由持续下降的该等截断块18A～18D沿着板件2上的截断线21边缘施加压力而将截断线21以外的板件2截断分离(如图8所示)。具体而言，如前所述，当各个截断块18A～18D的下端均处于相同高度位置时，下降的各截断块18A～18D会沿着各截断线的边 缘同时施加垂直压以将板件截断。当第一截断块18A与第三截断块18C的下端彼此处于相同且较低的高度位置，但第二截断块18B与第四截断块18D下端彼此处于不同高度位置且高于第一与第三截断块18A、18C的下端高度位置时，升降座14下降直到下压板19先将板件2进一步压住固定后，接着由持续下降的第一与第三截断块18A、18C先沿着板件2上的相对两侧的截断线21边缘施加压力，然后由持续下降的第二与第四截断块18B、18D再沿着板件2上的另外相对两侧的截断线21边缘施加压力而将截断线21以外的板件2截断分离。或者，当第一截断块18A至第四截断块18D的下端高度位置呈依序由最低至最高时，升降座14下降直到下压板19先将板件2进一步压住固定后，接着由持续下降的第一至与第四截断块18A、18B、18C、18D依序沿着板件2上截断线21各边边缘施加压力，以将截断线21以外的板件2截断分离。板件2被施加压力的过程中，在截断线21各边所承受的应力分别经由各截断块18A～18D及各连接块15A～15D传导至各应力传感器16A～16D，直到板件2被截断时由各应力传感器16A～16D侦测到最大值的应力，并且将所获取的应力值转换为电子数值后传送至电脑单元，因此达到百分之百对每一个板件2进行截断同时进行检验而不遗漏的效果。
前述形成在板件上的截断线并不限定为矩形，可以依据产品的实际需要形成为圆形、多边形或其他几何形状，在此情况下，所述复数截断块的配置也须因应截断线的形状配置，使截断块可以对截断线的边缘施加垂直压力以截断。
本发明的另一实施例(图中未显示)可以将升降座设置为固定，并将驱动机构连接至固定平台以驱动固定平台上升或下降，同样可以达到通过升降座与固定平台相互接近时利用截断块将板件截断的效果。
利用前述的板件截断机，本发明提供的可同步检测板件强度的板件截断方法，包括：在一板件的上表面形成截断线；以及以所述的板件截断机对该板件沿着该截断线的边缘施加垂直压力，使该板件的该截断线外围的部分被截断分离。
以上所述者仅为用以解释本发明的较佳实施例，并非企图据以对本发明做任何形式上的限制，是以，凡有在相同的发明精神下所作有关本发明的任何修饰或变更，皆仍应包括在本发明意图保护的范畴。

Claims (11)

  1. 一种可对板件同步截断及检测强度的板件截断机，包括：
    固定平台，用以固定板件；
    升降座，配置在所述固定平台的上方，并且所述升降座的下方围绕地配置有多个截断块；
    多个应力传感器，分别连接至所述多个截断块，并且所述多个应力传感器电连接至电脑单元；以及
    驱动机构，用以驱动所述升降座或所述固定平台在垂直方向上彼此相对地上升或下降；
    其中，所述板件的上表面预先形成有截断线，所述升降座或所述固定平台被驱动彼此接近时，所述多个截断块对所述板件上的所述截断线的边缘施加垂直压力，使所述板件的所述截断线外围的部分被截断分离的同时，将所述板件被截断当时所受的应力传导至所述多个应力传感器，并且转换为电子数值后传送至所述电脑单元。
  2. 根据权利要求1所述的可对板件同步截断及检测强度的板件截断机，其中，所述固定平台被固定地设置，所述驱动机构用以驱动所述升降座相对于所述固定平台上升或下降。
  3. 根据权利要求1所述的可对板件同步截断及检测强度的板件截断机，其中，所述升降座被固定地设置，所述驱动机构用以驱动所述固定平台相对于所述升降座上升或下降。
  4. 根据权利要求1所述的可对板件同步截断及检测强度的板件截断机，其中，所述多个截断块的每一个的下端彼此处于相同高度，所述升降座或所述固定平台被驱动彼此接近时，所述多个截断块同时间对所述板件的所述截断线的各边缘施加垂直压力，使所述板件的所述截断线外围的部分被截断分离。
  5. 根据权利要求1所述的可对板件同步截断及检测强度的板件截断机，其中，所述多个截断块的每一个的下端彼此处于不同高度，所述升降座或所述固定平台被驱动彼此接近时，所述多个截断块由其下端最低者至下端最高者对所述板件依序沿着所述截断线的各边缘施加垂直压力，使所述板件的所述截断线外围的部分被截断分离。
  6. 根据权利要求1至5项中任一项所述的可对板件同步截断及检测强度的板件截断机，其中，所述固定平台上设有复数气孔，所述多个气孔连通至真空泵,通过所述真空泵运转时将所述气孔形成负压，以吸附放置在所述固定平台上的所述板件。
  7. 根据权利要求1至5项中任一项所述的可对板件同步截断及检测强度的板件截断机，其中，所述升降座包含：
    下压平台，设有配置在四边以构成矩形并且上下贯通的四个槽孔；以及
    连接座，连接在所述下压平台的一侧,所述连接座连接至所述驱动机构，
    其中，所述多个应力传感器配置在所述下压平台的上方，所述多个截断块配置在所述下压平台的下方，所述多个应力传感器与所述多个截断块分别通过连接块连接，并且所述多个连接块分别容纳在所述槽孔内。
  8. 根据权利要求7所述的可对板件同步截断及检测强度的板件截断机，其中，所述下压平台下方的所述多个截断块所包围的范围内设有下压板，所述下压板的下表面所处的位置低于所述多个截断块的最低下端面的高度位置。
  9. 一种可对板件同步截断及检测强度的方法，包括：
    在板件的上表面形成截断线；以及
    以权利要求1至8中任一项所述的板件截断机对所述板件沿着所述截断线的边缘施加垂直往下的压力，使所述板件的所述截断线外围的部分被截断分离，所述板件的所述截断线外围的部分被截断分离的同时，将所述板件被截断当时所受的应力传导至应力传感器，并且转换为电子数值后传送至电脑单元。
  10. 根据权利要求9所述的可对板件同步截断及检测强度的方法，其中，所述板件截断机对所述板件的各边缘同时施加垂直压力，使所述板件的所述截断线外围的部分被截断分离。
  11. 根据权利要求9所述的可对板件同步截断及检测强度的方法，其中，所述板件截断机对所述板件依序沿着所述截断线的各边缘施加垂直往下的压力，使所述板件的所述截断线外围的部分被截断分离。
PCT/CN2022/102554 2022-06-29 2022-06-29 可对板件同步截断及检测强度的板件截断机及截断方法 WO2024000332A1 (zh)

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KR1020247043197A KR20250048189A (ko) 2022-06-29 2022-06-29 판재에 대해 절단과 강도 검사를 동시에 진행할 수 있는 판재절단기 및 절단방법
EP22948446.4A EP4549407A1 (en) 2022-06-29 2022-06-29 Plate cut-off machine capable of synchronously cutting off and detecting strength of plate, and cut-off method

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US20040187659A1 (en) * 2003-03-24 2004-09-30 Tomohiro Nishiyama Glass cutting method
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
CN101695854A (zh) * 2005-07-20 2010-04-21 Sfa工程股份有限公司 划线设备和方法
JP2010237197A (ja) * 2009-03-10 2010-10-21 Murata Mfg Co Ltd 破壊強度測定装置及び破壊強度測定方法
US20200391498A1 (en) * 2019-06-17 2020-12-17 Samsung Display Co., Ltd. Manufacturing apparatus of display device and manufacturing method of display device

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Publication number Priority date Publication date Assignee Title
US20040182903A1 (en) * 2000-10-18 2004-09-23 Marek Henry S. Method for glass separation for flat panel displays
US20040187659A1 (en) * 2003-03-24 2004-09-30 Tomohiro Nishiyama Glass cutting method
CN101695854A (zh) * 2005-07-20 2010-04-21 Sfa工程股份有限公司 划线设备和方法
JP2008201629A (ja) * 2007-02-21 2008-09-04 Epson Imaging Devices Corp 電気光学装置の製造方法、基板の分断方法、及び、基板分断装置
JP2010237197A (ja) * 2009-03-10 2010-10-21 Murata Mfg Co Ltd 破壊強度測定装置及び破壊強度測定方法
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