US20040159900A1 - Phosphor based light sources having front illumination - Google Patents

Phosphor based light sources having front illumination Download PDF

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Publication number
US20040159900A1
US20040159900A1 US10/762,678 US76267804A US2004159900A1 US 20040159900 A1 US20040159900 A1 US 20040159900A1 US 76267804 A US76267804 A US 76267804A US 2004159900 A1 US2004159900 A1 US 2004159900A1
Authority
US
United States
Prior art keywords
light
phosphor
led
layer
phosphor material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/762,678
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English (en)
Inventor
Andrew Ouderkirk
Michael Weber
John Wheatley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Priority to US10/762,678 priority Critical patent/US20040159900A1/en
Assigned to 3M INNOVATIVE PROPERTIES COMPANY reassignment 3M INNOVATIVE PROPERTIES COMPANY ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OUDERKIRK, ANDREW J., WEBER, MICHAEL F., WHEATLEY, JOHN A.
Publication of US20040159900A1 publication Critical patent/US20040159900A1/en
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode
US10/762,678 2003-01-27 2004-01-20 Phosphor based light sources having front illumination Abandoned US20040159900A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/762,678 US20040159900A1 (en) 2003-01-27 2004-01-20 Phosphor based light sources having front illumination

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US44323503P 2003-01-27 2003-01-27
US44323203P 2003-01-27 2003-01-27
US44327403P 2003-01-27 2003-01-27
US10/762,678 US20040159900A1 (en) 2003-01-27 2004-01-20 Phosphor based light sources having front illumination

Publications (1)

Publication Number Publication Date
US20040159900A1 true US20040159900A1 (en) 2004-08-19

Family

ID=32830867

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/762,678 Abandoned US20040159900A1 (en) 2003-01-27 2004-01-20 Phosphor based light sources having front illumination
US10/762,724 Active 2025-06-22 US7157839B2 (en) 2003-01-27 2004-01-20 Phosphor based light sources utilizing total internal reflection

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/762,724 Active 2025-06-22 US7157839B2 (en) 2003-01-27 2004-01-20 Phosphor based light sources utilizing total internal reflection

Country Status (6)

Country Link
US (2) US20040159900A1 (fr)
EP (3) EP1588433B1 (fr)
JP (3) JP2006515962A (fr)
KR (3) KR20050103208A (fr)
TW (5) TW200428677A (fr)
WO (3) WO2004068598A2 (fr)

Cited By (28)

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US20040116033A1 (en) * 2003-01-27 2004-06-17 3M Innovative Properties Company Methods of making phosphor based light sources having an interference reflector
US20040145913A1 (en) * 2003-01-27 2004-07-29 3M Innovative Properties Company Phosphor based light sources having a polymeric long pass reflector
US20040145289A1 (en) * 2003-01-27 2004-07-29 3M Innovative Properties Company Phosphor based light sources having a non-planar short pass reflector and method of making
US20040145312A1 (en) * 2003-01-27 2004-07-29 3M Innovative Properties Company Phosphor based light source having a flexible short pass reflector
US20050117366A1 (en) * 2003-12-02 2005-06-02 Simbal John J. Reflective light coupler
US20050116635A1 (en) * 2003-12-02 2005-06-02 Walson James E. Multiple LED source and method for assembling same
US20050134527A1 (en) * 2003-12-18 2005-06-23 3M Innovative Properties Company Display including a solid state light device and method using same
US7091661B2 (en) 2003-01-27 2006-08-15 3M Innovative Properties Company Phosphor based light sources having a reflective polarizer
US7091653B2 (en) 2003-01-27 2006-08-15 3M Innovative Properties Company Phosphor based light sources having a non-planar long pass reflector
US20060214175A1 (en) * 2005-03-25 2006-09-28 Sarnoff Corporation Metal silicate-silica-based polymorphous phosphors and lighting devices
US7157839B2 (en) 2003-01-27 2007-01-02 3M Innovative Properties Company Phosphor based light sources utilizing total internal reflection
US20070103925A1 (en) * 2002-12-02 2007-05-10 3M Innovative Properties Company Illumination system using a plurality of light sources
US20070125984A1 (en) * 2005-12-01 2007-06-07 Sarnoff Corporation Phosphors protected against moisture and LED lighting devices
US20070125982A1 (en) * 2005-12-02 2007-06-07 Sarnoff Corporation Metal silicate halide phosphors and LED lighting devices using the same
US20070182299A1 (en) * 2003-01-27 2007-08-09 3M Innovative Properties Company Phosphor based light source component
WO2007144809A1 (fr) 2006-06-14 2007-12-21 Philips Intellectual Property & Standards Gmbh Dispositif d'éclairage
US7312560B2 (en) 2003-01-27 2007-12-25 3M Innovative Properties Phosphor based light sources having a non-planar long pass reflector and method of making
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
US7368179B2 (en) 2003-04-21 2008-05-06 Sarnoff Corporation Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors
US7427366B2 (en) 2004-07-06 2008-09-23 Sarnoff Corporation Efficient, green-emitting phosphors, and combinations with red-emitting phosphors
US20090001399A1 (en) * 2007-06-27 2009-01-01 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
US20090218582A1 (en) * 2008-02-28 2009-09-03 Kang Wei-Hung Optical device and method of fabricating the same
US7713442B2 (en) 2006-10-03 2010-05-11 Lightscape Materials, Inc. Metal silicate halide phosphors and LED lighting devices using the same
EP2215504A1 (fr) * 2007-11-23 2010-08-11 Oerlikon Textile GmbH & Co. KG Dispositif de détection optique d'impuretés dans du fil déplacé longitudinalement
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US20130235557A1 (en) * 2010-10-22 2013-09-12 Osram Gmbh Led light source and associated structural unit

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KR20050103281A (ko) 2005-10-28
WO2004068602A3 (fr) 2004-11-18
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WO2004068598A2 (fr) 2004-08-12
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WO2004068597A3 (fr) 2004-10-28
JP5192148B2 (ja) 2013-05-08

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