US20020173876A1 - Board align image acquisition device with improved interface - Google Patents

Board align image acquisition device with improved interface Download PDF

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Publication number
US20020173876A1
US20020173876A1 US10/017,501 US1750101A US2002173876A1 US 20020173876 A1 US20020173876 A1 US 20020173876A1 US 1750101 A US1750101 A US 1750101A US 2002173876 A1 US2002173876 A1 US 2002173876A1
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US10/017,501
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English (en)
Inventor
Lance Fisher
John Gaida
Todd Liberty
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Cyberoptics Corp
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Individual
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Priority to US10/017,501 priority Critical patent/US20020173876A1/en
Assigned to CYBEROPTICS CORPORATION reassignment CYBEROPTICS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FISHER, LANCE K., GAIDA, JOHN D., LIBERTY, TODD D.
Publication of US20020173876A1 publication Critical patent/US20020173876A1/en
Priority to US10/745,860 priority patent/US6954681B2/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
US10/017,501 2000-12-15 2001-12-14 Board align image acquisition device with improved interface Abandoned US20020173876A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/017,501 US20020173876A1 (en) 2000-12-15 2001-12-14 Board align image acquisition device with improved interface
US10/745,860 US6954681B2 (en) 2000-12-15 2003-12-24 Board align image acquisition device with improved interface

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25592500P 2000-12-15 2000-12-15
US10/017,501 US20020173876A1 (en) 2000-12-15 2001-12-14 Board align image acquisition device with improved interface

Related Child Applications (1)

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US10/745,860 Continuation US6954681B2 (en) 2000-12-15 2003-12-24 Board align image acquisition device with improved interface

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US20020173876A1 true US20020173876A1 (en) 2002-11-21

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US10/017,501 Abandoned US20020173876A1 (en) 2000-12-15 2001-12-14 Board align image acquisition device with improved interface
US10/745,860 Expired - Fee Related US6954681B2 (en) 2000-12-15 2003-12-24 Board align image acquisition device with improved interface

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US10/745,860 Expired - Fee Related US6954681B2 (en) 2000-12-15 2003-12-24 Board align image acquisition device with improved interface

Country Status (4)

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US (2) US20020173876A1 (de)
JP (1) JP2004531048A (de)
DE (1) DE10197041T1 (de)
WO (1) WO2002049410A2 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040254681A1 (en) * 2000-12-15 2004-12-16 Fisher Lance K. Board align image acquisition device with improved interface
EP2134149A1 (de) * 2007-03-30 2009-12-16 Yamaha Motor Co., Ltd. Anbringvorrichtung und anbringverfahren und in der anbringvorrichtung verwendetes substratbildgebungsmitteltransferverfahren

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT1321839E (pt) * 2001-12-10 2007-04-30 Lacent Technologies Inc Sistema para cortar padrões pré-ajustados numa corrente contínua de material em folha
US9014850B2 (en) 2012-01-13 2015-04-21 Toyota Motor Engineering & Manufacturing North America, Inc. Methods and computer-program products for evaluating grasp patterns, and robots incorporating the same
US9014857B2 (en) 2012-01-13 2015-04-21 Toyota Motor Engineering & Manufacturing North America, Inc. Methods and computer-program products for generating grasp patterns for use by a robot
US8843235B2 (en) 2012-01-13 2014-09-23 Toyota Motor Engineering & Manufacturing North America, Inc. Robots, computer program products, and methods for trajectory plan optimization
US8934999B2 (en) * 2012-02-13 2015-01-13 Tesla Motors, Inc. Robotic processing system and method
JP6430986B2 (ja) * 2016-03-25 2018-11-28 ファナック株式会社 ロボットを用いた位置決め装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques

Family Cites Families (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4146924A (en) * 1975-09-22 1979-03-27 Board Of Regents For Education Of The State Of Rhode Island System for visually determining position in space and/or orientation in space and apparatus employing same
US5148591A (en) * 1981-05-11 1992-09-22 Sensor Adaptive Machines, Inc. Vision target based assembly
US4628464A (en) * 1983-10-07 1986-12-09 Westinghouse Electric Corp. Robotic system for mounting electrical components
JPS6228710A (ja) 1985-07-31 1987-02-06 Nec Home Electronics Ltd 画像表示装置
DE3689406T2 (de) 1985-10-11 1994-06-16 Hitachi Ltd Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu.
US4731923A (en) * 1986-03-15 1988-03-22 Tdk Corporation Apparatus and method for mounting circuit element on printed circuit board
JPH079721B2 (ja) 1986-06-25 1995-02-01 松下電器産業株式会社 ピンチロ−ラ圧着装置
JPS6315704A (ja) 1986-07-08 1988-01-22 株式会社クボタ 厚型瓦の製造法
US4831549A (en) * 1987-07-28 1989-05-16 Brigham Young University Device and method for correction of robot inaccuracy
US4810154A (en) 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
JPH02165699A (ja) 1988-12-20 1990-06-26 Matsushita Electric Ind Co Ltd 産業用ロボットによるフラットパッケージ型ｉｃの装着方法
US4970365A (en) 1989-09-28 1990-11-13 International Business Machines Corporation Method and apparatus for bonding components leads to pads located on a non-rigid substrate
US5140730A (en) * 1989-10-20 1992-08-25 Blakell Systems Limited Printed circuit board assembly apparatus
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5075079A (en) * 1990-05-21 1991-12-24 Technicon Instruments Corporation Slide analysis system
JP2841733B2 (ja) 1990-06-08 1998-12-24 松下電器産業株式会社 半導体素子の位置合わせ方法
JPH0494600A (ja) 1990-08-11 1992-03-26 Tdk Corp 電子部品装着方法及び装置
JPH04106939A (ja) 1990-08-27 1992-04-08 Toshiba Corp ダイボンディング装置
JP3201619B2 (ja) 1991-04-05 2001-08-27 東京エレクトロン株式会社 半導体検査方法
DE4119401C2 (de) 1991-06-10 1998-07-23 Finetech Ges Fuer Elektronik T Vorrichtung zum Bestücken eines Schaltungsträgers mit elektronischen Bauelementen
US5577130A (en) * 1991-08-05 1996-11-19 Philips Electronics North America Method and apparatus for determining the distance between an image and an object
US5297238A (en) * 1991-08-30 1994-03-22 Cimetrix Incorporated Robot end-effector terminal control frame (TCF) calibration method and device
US5247844A (en) * 1991-10-25 1993-09-28 Micron Technology, Inc. Semiconductor pick-and-place machine calibration apparatus
JPH05138466A (ja) 1991-11-19 1993-06-01 Nec Corp 配膳装置
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
DE4209524A1 (de) * 1992-03-24 1993-09-30 Siemens Ag Verfahren zur Lageerkennung und/oder Teilungsprüfung und/oder Koplanaritätsprüfung der Anschlüsse von Bauelementen und Bestückkopf für die automatische Bestückung von Bauelementen
JP2876962B2 (ja) 1993-01-07 1999-03-31 松下電器産業株式会社 基板外観検査装置
US5387969A (en) * 1993-06-22 1995-02-07 Optima Industries, Inc. Machine tool position measurement employing multiple laser distance measurements
US5396331A (en) * 1993-08-10 1995-03-07 Sanyo Machine Works, Ltd. Method for executing three-dimensional measurement utilizing correctively computing the absolute positions of CCD cameras when image data vary
US5781447A (en) * 1993-08-13 1998-07-14 Micron Eletronics, Inc. System for recreating a printed circuit board from disjointly formatted data
JP2941617B2 (ja) 1993-10-21 1999-08-25 株式会社テンリュウテクニックス 電子部品の部品データ記録装置およびそれを用いた電子部品の搬送組み付け装置
JPH07243810A (ja) 1994-03-04 1995-09-19 Toshiba Corp 電子部品の位置認識方法および位置認識装置
US5526050A (en) * 1994-03-31 1996-06-11 Cognex Corporation Methods and apparatus for concurrently acquiring video data from multiple video data sources
JP2989744B2 (ja) * 1994-06-13 1999-12-13 株式会社東芝 測定面抽出装置及びその方法
KR100367272B1 (ko) * 1994-08-11 2003-03-15 사이버옵틱스 코포레이션 부품정렬센서및부품검출시스템
SE508423C2 (sv) 1994-10-12 1998-10-05 Mydata Automation Ab Metod jämte anordning för avbildning av en rad komponenter varvid bilden förstoras mer i en riktning tvärs komponentraden och användning därav i en komponentmonteringsmaskin
SE515418C2 (sv) 1994-10-12 2001-07-30 Mydata Automation Ab Metod och anordning att avbilda i en rad fasthållna komponenter för automatisk utvärdering av komponenternas lägen samt användning av en sådan anordning
US5537204A (en) * 1994-11-07 1996-07-16 Micron Electronics, Inc. Automatic optical pick and place calibration and capability analysis system for assembly of components onto printed circuit boards
US5732150A (en) * 1995-09-19 1998-03-24 Ihc Health Services, Inc. Method and system for multiple wavelength microscopy image analysis
DE29515738U1 (de) 1995-10-04 1995-11-30 Vosseler Hans Guenther Meßvorrichtung zur kontaktlosen Meßanalyse von Körpern oder Oberflächen
BE1009814A5 (nl) 1995-11-06 1997-08-05 Framatome Connectors Belgium Werkwijze en inrichting voor het aanbrengen van elektronische onderdelen in een plaat met gedrukte schakelingen.
JP3461643B2 (ja) * 1995-11-29 2003-10-27 松下電器産業株式会社 電子部品実装装置及び電子部品実装方法
JP4035189B2 (ja) * 1995-12-28 2008-01-16 キヤノン株式会社 撮像装置
JPH09210618A (ja) 1996-01-30 1997-08-12 Matsushita Electric Ind Co Ltd 認識カメラのスケール比と回転角測定方法
JPH09266212A (ja) * 1996-03-28 1997-10-07 Shin Etsu Handotai Co Ltd シリコンウエーハおよびその製造方法
WO1997039416A2 (en) * 1996-04-02 1997-10-23 Cognex Corporation Image formation apparatus for viewing indicia on a planar specular substrate
DE69712481T2 (de) * 1996-06-28 2002-12-19 T Eric Hopkins Bilderfassungssystem und verfahren
US5905850A (en) * 1996-06-28 1999-05-18 Lam Research Corporation Method and apparatus for positioning substrates
JPH1065392A (ja) 1996-08-19 1998-03-06 Matsushita Electric Ind Co Ltd 電子部品供給装置及び電子部品実装方法
US6144366A (en) * 1996-10-18 2000-11-07 Kabushiki Kaisha Toshiba Method and apparatus for generating information input using reflected light image of target object
US5991434A (en) * 1996-11-12 1999-11-23 St. Onge; James W. IC lead inspection system configurable for different camera positions
EP0920791B1 (de) 1996-11-26 2006-05-24 Assembléon N.V. Methode zum anordnen von bauteilen auf einem träger mit kalibrierungsverfahren und vorrichtung dafür
CN1133359C (zh) 1997-01-16 2003-12-31 松下电器产业株式会社 元件供给方法、元件放置数据的建立方法和使用此方法的电子元件安装设备
US6022124A (en) * 1997-08-19 2000-02-08 Ppt Vision, Inc. Machine-vision ring-reflector illumination system and method
US6079098A (en) * 1998-09-08 2000-06-27 Siemens Aktiengesellschaft Method and apparatus for processing substrates
IL131284A (en) * 1999-08-05 2003-05-29 Orbotech Ltd Illumination for inspecting surfaces of articles
US6392688B1 (en) * 1999-10-04 2002-05-21 Point Grey Research Inc. High accuracy stereo vision camera system
US20020062170A1 (en) * 2000-06-28 2002-05-23 Skunes Timothy A. Automated opto-electronic assembly machine and method
US6681151B1 (en) * 2000-12-15 2004-01-20 Cognex Technology And Investment Corporation System and method for servoing robots based upon workpieces with fiducial marks using machine vision
DE10197041T1 (de) * 2000-12-15 2003-12-11 Cyberoptics Corp Leiterplattenausrichtungsbildaufnahmevorrichtung mit verbesserter Schnittstelle
US6430474B1 (en) * 2001-04-03 2002-08-06 Xerox Corporation Tooling adapter for allowing selected manipulation of a workpiece
US6606540B1 (en) * 2001-04-26 2003-08-12 Idealab Pressure sensor systems and methods for use in robotic devices
DE10128476C2 (de) 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
DE10139163B4 (de) * 2001-08-09 2014-11-13 Trützschler GmbH & Co Kommanditgesellschaft Vorrichtung an einer Karde, bei der der Garnitur der Trommel gegenüberliegend Abdeckelemente vorhanden sind
US6704619B1 (en) * 2003-05-24 2004-03-09 American Gnc Corporation Method and system for universal guidance and control of automated machines

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040254681A1 (en) * 2000-12-15 2004-12-16 Fisher Lance K. Board align image acquisition device with improved interface
US6954681B2 (en) * 2000-12-15 2005-10-11 Cyberoptics Corporation Board align image acquisition device with improved interface
EP2134149A1 (de) * 2007-03-30 2009-12-16 Yamaha Motor Co., Ltd. Anbringvorrichtung und anbringverfahren und in der anbringvorrichtung verwendetes substratbildgebungsmitteltransferverfahren
US20100101082A1 (en) * 2007-03-30 2010-04-29 Yamaha Hatsudoki Kabushiki Kaisha Mounting apparatus, mounting method and board imaging device transfer method employed in the mounting apparatus
EP2134149A4 (de) * 2007-03-30 2012-02-15 Yamaha Motor Co Ltd Anbringvorrichtung und anbringverfahren und in der anbringvorrichtung verwendetes substratbildgebungsmitteltransferverfahren
US8438725B2 (en) 2007-03-30 2013-05-14 Yamaha Hatsudoki Kabushiki Kaisha Method of moving a board imaging device and a mounting apparatus

Also Published As

Publication number Publication date
JP2004531048A (ja) 2004-10-07
US20040254681A1 (en) 2004-12-16
US6954681B2 (en) 2005-10-11
WO2002049410A3 (en) 2003-01-23
DE10197041T1 (de) 2003-12-11
WO2002049410A2 (en) 2002-06-20

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Legal Events

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AS Assignment

Owner name: CYBEROPTICS CORPORATION, MINNESOTA

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FISHER, LANCE K.;GAIDA, JOHN D.;LIBERTY, TODD D.;REEL/FRAME:012669/0997;SIGNING DATES FROM 20020124 TO 20020125

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE