US20020089049A1 - Contactless electronic module for a card or label - Google Patents

Contactless electronic module for a card or label Download PDF

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Publication number
US20020089049A1
US20020089049A1 US09/101,049 US10104998A US2002089049A1 US 20020089049 A1 US20020089049 A1 US 20020089049A1 US 10104998 A US10104998 A US 10104998A US 2002089049 A1 US2002089049 A1 US 2002089049A1
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US
United States
Prior art keywords
module
antenna
electronic
microcircuit
accordance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/101,049
Other languages
English (en)
Inventor
Michel Leduc
Philippe Martin
Richard Kalinowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus SA filed Critical Gemplus SA
Priority to US10/254,736 priority Critical patent/US6794727B2/en
Assigned to GEMPLUS reassignment GEMPLUS ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KALINOWSKI, RICHARD, LEDUC, MICHEL, MARTIN, PHILIPPE
Publication of US20020089049A1 publication Critical patent/US20020089049A1/en
Abandoned legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
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    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
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    • G—PHYSICS
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    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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    • G06K19/07777—Antenna details the antenna being of the inductive type
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    • G—PHYSICS
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    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Definitions

  • the present invention relates to the field of portable objects such as, in particular, contactless electronic labels and chip cards provided with an electronic module comprising an integrated microcircuit.
  • the invention also relates to a process for manufacturing such modules and such portable objects.
  • Portable objects are already known in the form of contactless cards, of ISO format, which are intended to perform various operations such as, for example, payment operations for transport, telephone or other services. These operations are conducted by means of remote coupling between the card's electronic module and a receiver or reader unit. Coupling may be made in reading mode only or in reading/writing mode.
  • the invention does not only concern cards which operate exclusively without contact. It also relates to mixed or hybrid cards which are able to operate in both modes: without and with contact. These mixed cards are intended, for example, for operations of electronic cash dispensing type for which, after being charged with units of value (monetary units, payment units for various services) they are remote debited by a certain number of these units of value when they are passed in the proximity of a reading terminal: this type of debiting assumes contactless operation. If required, these cards can be re-charged in a purpose-designed dispenser.
  • contactless cards shall be construed as meaning both mixed cards and contactless cards.
  • portable items are known in the form of electronic labels, generally used for various identification or follow-up operations. They are made up firstly of an electronic module with a microcircuit, and secondly of a carrier for this module associated with a coiled antenna operating at relatively low frequency (150 Khz) and of relatively large size in relation to the size of the module.
  • contactless cards also have disadvantages. Such as they are currently produced, contactless cards are portable objects of normalized size.
  • a usual, but in no way restrictive, standard for the present invention is the so-called ISO 7810 standard which corresponds to a card of standard format 85 mm long, 54 mm wide and 0.76 mm thick.
  • each card comprises a card body made up of an assembly of plastic sheets and of an electronic module, embedded in this assembly, comprising an integrated circuit or microcircuit also called a ⁇ chip>> connected via two connection terminals to a coiled antenna of self-inductance type.
  • the chip has a memory and may, in some cases, comprise a microprocessor.
  • the size of the electronic module is substantially smaller than the size of the card, the module generally being positioned in one of the corners of the card, since the mechanical stresses exerted on the module through bending of the card are not as high in the corners as in the centre of the card.
  • a module 21 comprises a module carrier 28 on which is fixed an integrated circuit chip 29 .
  • a coil 30 surmounts chip 29 in such manner as to confer contactless identification capacity upon the module.
  • the antenna is in the form of a coiled air antenna inserted over the chip which gives rise to difficulties relating to production, cost, yield and lack of homogeneous performance.
  • the effective surface area of the antenna is small, which is detrimental to its range. Also, the card in accordance with this document cannot be produced in economic manner. It is known that the size of an elementary semiconductor pad is one of the main cost factors for mass produced integrated circuits. In this document, however, the minimum size of the integrated circuit incorporating the antenna is of about at least 24 mm 2 , whereas cheap contactless cards generally use microcircuits of very small size, of about 1 mm 2 .
  • a plurality of other processes for making contactless cards are also known, such as those described in French patent applications made by the same applicant and filed under numbers 95 400305.9, 95 400365.3 and 95 400790.2. These patent applications all describe a contactless card provided with an antenna whose size is substantially the same as that of the card and is connected to a micromodule carrying the chip.
  • Such antenna has the advantage of having a relatively high range for a given reading or writing magnetic field.
  • the equation which determines the electromotive force E appearing at the terminals of the receiver antenna when it breaks an electromagnetic field is of the following type:
  • K is a constant
  • S is the surface area of an average turn of antenna
  • N is the number of turns coiled to form the antenna
  • indices e and r represent the emitting and receiver sides respectively
  • D is the reading distance, i.e. the distance between the card antenna and the antenna of the outside reader.
  • voltage E To cause the circuits of the card chip to operate in order to initialize and conduct a reading operation, voltage E must be exceed a certain threshold, which is generally in the region of 3 Volts.
  • L is the coil inductance which increases with coil diameter and the number of turns
  • ⁇ 2 ⁇ f in which f is the reading frequency which is fixed for a given application
  • R is the electric resistance of the antenna coil, which is proportional to the length of wire of which it is formed.
  • the number N of turns is limited by the width of a turn and the space between two turns which depend upon the technology used for fabrication.
  • card and antenna assembly often remain complex and costly since the electronic module and antenna coil must be connected by means that are difficult to automate. Further, the assembly undergoes lamination which is a costly process requiring the addition of resin to sink the coil and module in the card in such manner that they do not appear on the surface of the card and do not deform the upper and lower sheets used for colamination.
  • the complexity of the process does not give yields comparable with those achieved for the manufacture of contact cards. This is especially so when integrating the restraints required for certain types of card printing and the possible existence of a magnetic stripe or embossing.
  • the latter must have virtually perfect planarity with defects of less than 6 ⁇ m.
  • embossing materials need to be chosen which are compatible with the card manufacturing process and the antenna must, in particular, leave free the area provided for embossing otherwise it would be damaged during embossing.
  • the purpose of the present invention is to make available non-expensive means which may be used for the manufacture of portable objects of chip card and/or electronic label type.
  • Another objective of the invention is to provide low-cost manufacturing processes for contactless cards and labels allowing reliable, quality manufacture using automated machines.
  • a further objective of the invention is to describe a manufacturing process which can be used to obtain perfectly planar contactless cards.
  • An additional objective of the invention is to make available a process for manufacturing contactless cards which is compatible with all subsequent stages of card body and antenna assembly, in particular with offset card printing, card embossing or the depositing of a magnetic stripe.
  • the invention sets forth an electronic module of a type that is suitable for producing contactless cards and/or contactless electronic labels, and comprising a carrier substrate to carry an electronic microcircuit, said electronic microcircuit being connectable to an antenna in such manner as to enable contactless operation of the module, characterized in that the antenna is wholly arranged on the module and in that it comprises turns made on the plane of the carrier substrate.
  • the invention therefore provides a basic part of small size which may be used virtually indifferently for the production of contactless cards of usual format or small-sized electronic labels, regardless of their shape.
  • the antenna is made up of a spiral whose outer size is in the region of 5 to 15 mm, preferably of about 12 mm, whose ends are connected to contacts of the electronic microcircuit,
  • the antenna is made up of a conductor spiral having between 6 and 50 turns, each turn having a width of approximately 50 to 300 ⁇ m, the space between two contiguous turns being of about 50 to 200 ⁇ m.
  • the spiral forming the antenna is, for example, of substantially circular outer shape, with an outer diameter of about 5 to 15 mm, preferably of about 12 mm.
  • said spiral is of substantially square outer shape, with an outer side measurement of approximately 5 to 15 mm, preferably approximately 12 mm, or of substantially oval outer shape having a larger measurement of approximately 15 mm and a smaller measurement of approximately 5 mm.
  • the microcircuit is placed in the centre of the antenna and on the same side of the module as the antenna, the connection terminals of the antenna being connected to respective corresponding contact pads of the module or microcircuit via conductor leads.
  • the microcircuit is placed on the same side as the antenna astride the latter's turns, the connection terminals of the antenna being connected to respective corresponding contact pads of the module and electronic microcircuit via conductor leads, and an insulator being placed between the microcircuit and at least the underlying area of the antenna.
  • the electronic microcircuit is placed on the side of the module which does not carry the antenna, the connection terminals of the antenna being connected to respective corresponding contact pads of the module or microcircuit via conductor leads crossing over pits made in the module carrier at said connection terminals of the antenna.
  • the electronic module on one face of the carrier substrate the electronic module comprises an antenna connected to the microcircuit, and on the other face of the carrier substrate it comprises visible contact pads that are also connected to the microcircuit in such manner as to obtain a hybrid card able to be read and written on via the contacts and/or the antenna.
  • a tuning capacitor is connected in parallel to the terminals of the antenna and of the electronic microcircuit, and its value is chosen so as to obtain a module operating frequency situated in a range of approximately 1 Mhz to 450 Mhz.
  • the value of the tuning capacitor is in the region of 12 to 180 picoFarad, and the operating frequency of the module is approximately 13.56 Mhz.
  • the value of the tuning capacitor is in the region of 30 to 500 picoFarad, and the operating frequency of the module is approximately 8.2 Mhz.
  • This tuning capacitor is obtaining by depositing oxidized silicon on the surface of the microcircuit previously coated with an insulator.
  • the invention also relates to a contactless card and an electronic label comprising a small-sized electronic module with an integrated antenna, in particular of the type described above, and to respective processes for the manufacture of a contactless card and an electronic label of this type.
  • the invention considers using the production lines of contactless cards for the manufacture of electronic labels.
  • an electronic module needs only to be cut out from a contactless module needs only to be cut out from a contactless card such as described above, in such manner as to leave around the electronic module some card body substance for the purposes of protecting the module.
  • This technique may be completed by cutting out another part of the same shape, for example from the same card, then fixing this part against the first in such manner as to surround and protect the module.
  • FIG. 1 shows a contactless card of the state of the art
  • FIG. 2 shows a contactless card of the invention
  • FIG. 3 shows a strip used for the continuous manufacture of electronic modules of the invention, intended for use in contactless cards or electronic labels of the invention, and a card intended to house the module;
  • FIGS. 4A to 4 G show several variants of embodiment of an electronic module of the invention, able or intended to be incorporated into the body of a contactless card or into an electronic label;
  • FIGS. 5 a to 5 D show a section view of several variants of embodiment of an electronic module provided with an antenna, according to the invention.
  • FIG. 6 shows a section view of a module for a contact and contactless hybrid card.
  • FIG. 7 shows the stages of a manufacturing process for a variant of electronic label using the electronic module of the inventions.
  • FIG. 1 showing a diagram and plan of a contactless card 1 having the type of those actually marketed.
  • antenna 2 in the form of a large-sized coil, slightly smaller than the size of the card, is integrated into the card body 3 , and two end of the coil of antenna 2 are connected to supply contacts 4 , 5 of an electronic module 6 carrying an integrated microcircuit 7 also called a chip.
  • the coil is shown to scale, except in respect of the number of turns, only four turns being shown.
  • To assemble such coil 2 with card body 3 it is required to conduct complex, costly lamination or injection operations with the above-mentioned disadvantages.
  • With this kind of antenna it is possible to read card information from a distance of 70 mm onwards at a frequency of a few Mhz.
  • the general underlying principle of the invention consists of no longer using the large-sized antennas currently used for contactless cards, in order to overcome the above-mentioned disadvantages.
  • the invention also sets out, in order to reach the desired objectives of reliability and low manufacturing cost, to use certain principles and the production lines used for the manufacture of contact cards, such manufacture being currently well circumscribed and allowing low manufacturing costs to be obtained.
  • a diagram of the solution put forward is shown by the card 1 in FIG. 2. It consists of using a particular module 6 of chip card combining on one same small-sized carrier the electronic functions of conventional chip modules, and the function of transmitting/receiving antenna for contactless transmission of information between the card and an outside reading/writing device (not shown).
  • module 6 is compatible with known manufacturing processes used to manufacture contact cards, in its thickness and plane, length and width.
  • the size of the antenna obtained must, contrary to the teaching of the state of the art, be compatible with the size of the module, while maintaining a number of turns able to assure electromagnetic transmission at sufficient distance, in the region of a few centimeters.
  • the antenna is made in the form of a spiral made up of a group of turns lying directly on the carrier substrate and substantially in the same plane, which excludes air coils as taught by some documents of the prior art mentioned above.
  • the antenna may have an outer turn of substantially square, rectangular, circular or oval shape or any other suitable shape.
  • the two ends of the antenna are connected to the supply terminals of an integrated circuit, in particular a memory and/or microprocessor, also positioned on the module as shown under reference 7 in the diagram in FIG. 2 but shown in more detail in FIGS. 4 to 6 .
  • FIG. 3 illustrating the separation of an electronic module of the invention from a strip 8 comprising a plurality of modules 6 placed for example in two rows.
  • the fabrication of conventional electronic modules on such strips is well known as such in the sphere of contact card production and will not therefore be further described.
  • a module 6 of the invention for example of the type comprising an integrated circuit 7 ⁇ astride>> the turns of an antenna 2 in square spiral shape, is detached from strip 8 by a cutting process, for example mechanical cutting.
  • the cut-out module is taken by automated means that are not shown but are known, and is brought preferably with the reverse side facing upwards (integrated circuit and antenna facing the bottom of the opening of the card body) opposite a blind opening 9 made in the card body 3 of a contactless chip card 1 . Attachment of module 6 in opening 9 provided is made by gluing, welding or any other appropriate means.
  • the result is a contactless card according to the invention provided with an antenna 2 positioned at electronic module level 6 and whose fabrication is chiefly limited to the stages which have just been described, followed, obviously, by any usual printing and personalisation stages.
  • FIGS. 4A to 4 G show in more detail several module variants intended to be integrated into cards for the production of contactless cards, or to be integrated into a support of a different form to the card, for example to manufacture electronic labels.
  • a module 6 is made up of a conventional carrier substrate 10 (in relatively flexible film, mylar, epoxy or capton) on which is added not a coil but an antenna pattern 2 which may be made in several manners as will be explained below.
  • Antenna 2 is, for example, made by stamping from a copper sheet followed by assembly of the stamped sheet with the carrier substrate.
  • Carrier substrate 10 and antenna 2 are possibly assembled in precise manner, using known substrate guiding and positioning means.
  • Antenna 2 may also be obtained by photochemical etching of the antenna pattern, or by depositing metallic matter on a flexible film forming substrate 10 .
  • a suitable carrier substrate 10 has consequences on the thickness of the module and is chiefly dependent upon the intended use of the module. This choice is fully within the scope of men of the art.
  • antenna 2 is made up of a copper stripe approximately 15 ⁇ m to 70 ⁇ m thick, made in spiral form, with spaces between the turns of the same size. Ends 11 , 12 of this spiral are preferably widened so as to form contact pads for connection with microcircuit 7 .
  • FIG. 4A shows connecting conductor leads 13 , 14 to connect a respective terminal of chip 7 to a corresponding respective end 11 , 12 of the antenna.
  • a lead 15 needs to be passed above the antenna lines.
  • an insulator 16 is previously deposited, in particular by screen processing between the corresponding stripe zone and connector lead 15 .
  • antenna 2 takes up the whole side of the module and has no free space in its centre.
  • the invention provides for gluing microcircuit 7 either onto the module face with no antenna or onto the same face as the antenna (FIG. 4D), after placing an insulator (dark part 16 ) between antenna 2 and microcircuit 7 .
  • FIG. 4E shows a variant of electronic module 6 , in which antenna 2 has a round spiral shape, microcircuit 7 being positioned over the plane of the turns with interpositioning of an insulator 16 . With this configuration it is possible to minimize the length of connection leads between the antenna and the microcircuit.
  • FIG. 4F illustrates an additional variant of module 6 of the invention, particularly adapted to cases in which an elongated or rectangular module is required.
  • the pattern of antenna 2 has a substantially oblong spiral shape
  • microcircuit is preferably located in the centre of the antenna and the connections between the terminals of the microcircuit and the coil pads are made as described for FIG. 4B.
  • connection between the chip pads and the contact terminals of the antenna may be made using a conventional connection technique for conductor leads, such as for example so-called ⁇ bonding>> consisting of conductor leads welded between a pad of the microcircuit and a respective terminal of the antenna, or using the so-called ⁇ flip-chip>> technique consisting of adding the microcircuit onto the module substrate 10 with the face carrying the antenna and microcircuit glued onto the substrate. Resin protection of the contacts is then achieved using conventional processes for producing contact chip cards.
  • ⁇ bonding>> consisting of conductor leads welded between a pad of the microcircuit and a respective terminal of the antenna
  • FIG. 4G gives a more detailed view of an electronic module 6 of the invention, on which a tuning capacitor 17 has been fabricated astride the antenna turns, by depositing on top of insulating layer 16 (shaded part).
  • a terminal 18 of capacitor 17 is connected to terminal 12 and pad 14
  • the other terminal 19 of capacitor 17 is connected to terminal 11 and pad 13 via intermediate pads 20 , 21 connected by an intermediate connection 22 located between intermediate pads 20 , 21 and made over insulating layer 16 in such manner as not to short-circuit the antenna turns.
  • tuning capacitor 17 can be integrated onto microcircuit 17 itself, at the design stage of the latter, which will reduce the number of manufacturing stages of module 6 .
  • the antenna pattern is determined so that it will allow operation at high frequency, in the Mhz region, the value of tuning capacitor 17 being chosen to obtain a determined operating frequency of antenna 2 within a high frequency range of approximately 1 Mhz to 450 Mhz.
  • the value of tuning capacitor 17 is in the region of 12 to 180 picoFarad.
  • the value of the tuning capacitor is in the region of 30 to 500 picoFarad.
  • FIGS. 5 and 6 show various embodiments of module 6 , shown in section view.
  • a metal grid has been used as an antenna that is cut out and then glued onto carrier substrate 10 .
  • Mechanical cutting of a spiral antenna is suitable for stripe widths that are not too fine, currently in the region of at least 300 ⁇ m.
  • microcircuit 7 and antenna 2 are situated on the two opposite faces of carrier substrate 10 , contact terminals 11 , 12 of antenna 2 being connected to pads of the microcircuit (not shown) via connection leads 15 brought through pits 23 made in carrier 10 .
  • microcircuit 7 is on the same side as antenna 2 and is deposited over its turns with interpositioning of an insulator 16 .
  • microcircuit 7 is placed in a cavity 25 made for this purpose in carrier 10 of the module, which allows the thickness of the module unit 6 to be reduced.
  • microcircuit 7 is simply glued in the centre of antenna 2 , as is also shown in FIGS. 4A, 4B. In all cases, the whole of the antenna is positioned on carrier substrate 10 forming part of the module, and the microcircuit is added onto this substrate and antenna structure.
  • antenna 2 instead of a cut-out metal grid, a grid that is etched in or deposited by metallisation or otherwise on a suitable carrier substrate 10 .
  • FIG. 6 which is a top section view of another embodiment of electronic module 6 , in order to obtain a hybrid contact and contactless module, particularly adapted to the manufacture of hybrid cards.
  • microcircuit 7 and the antenna are placed on a first face of carrier substrate 10 of the module, as already described in respect of FIG. 5.
  • contacts 26 identical to contacts for contact cards, are connected to corresponding pads of the microcircuit by conductor leads 27 .
  • the microcircuit can communicate with the outside using contacts 26 or antenna 2 depending upon the outside signal applied. All the effective components for the operation of the hybrid card, including antenna 2 , are therefore arranged on a hybrid module 6 of small size, able to be inserted, i.e. to be incorporated into a card body.
  • two modules 6 of the one of the above-described types may be made side by side in the width of a standard film 10 (i.e. 35 mm), but other arrangements of module 6 on a carrier strip 8 come within the limits of the invention.
  • Each module 6 may then be transferred onto a card body 3 of standard ISO format using conventional processes for transferring modules to card bodies, such as used for the production of contact cards.
  • modules 6 may be used for the production of electronic labels, of the type used for object identification. If necessary, after being cut from carrier strip 8 , modules 6 are protected by a protective resin coating or any other suitable material, allowing small-sized labels to be obtained at low cost. Obviously, the modules may also be integrated or fixed onto different or more voluminous supports (keys, packaging, etc.) in relation to the intended application.
  • FIG. 7( d ) using any appropriate technique, in particular by gluing or ultrasound welding. Finally, as shown in FIG. 7( e ) a part 29 , is cut out from the same card having the same size and at the same level as part 28 . In this way a symmetrical electronic label can be obtained at low cost, of which an enlarged diagram is given in FIG. 7( f ). Obviously parts 28 and 29 could be cut out separately and subsequently assembled.
  • Such label 30 incorporates a module 6 protected on both sides, and may be graphically personalized on both sides to produce labels that can be used in games or any other applications.
  • the module size is in the region of 12 mm ⁇ 12 mm, but it is possible to consider slightly larger, elongated formats to increase performance, or even optimising the reader antenna or even the chip antenna itself in respect of its consumption to improve performance and attain that of a larger antenna.
  • module 6 is used to manufacture cards, card integrity is maintained throughout the entire production process. Consequently, the card body may easily be used in conventional manner to house a magnetic stripe. Also, it may be printed using any existing processes with no particular restraints other than those that are known for the manufacture of a conventional card.
  • the choice of material for the card body is in no way restricted: it can be adapted to the needs of various applications given consideration.
  • the invention simultaneously solves all the above-described disadvantages connected with the production of contactless modules for contactless cards, in particular in respect of cost, space requirement, printing, compatibility with embossing or the insertion of a magnetic stripe.
  • the small size of the antenna brings comparable advantages for the production of electronic labels, that are not dependent upon the shape of a card body.
  • the economic advantage of the invention is undeniable; it enables the same production lines to be used for the production of electronic modules with integrated antennae, and of operational, contactless electronic labels and cards at a fraction of the current cost of processes used to produce contactless cards or labels, at every stage of their manufacture.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Wire Bonding (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Support Of Aerials (AREA)
US09/101,049 1996-01-17 1997-01-27 Contactless electronic module for a card or label Abandoned US20020089049A1 (en)

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FR9600889A FR2743649B1 (fr) 1996-01-17 1996-01-17 Module electronique sans contact, carte etiquette electronique l'incorporant, et leurs procedes de fabrication

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Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6642896B2 (en) * 2001-02-03 2003-11-04 Samsung Electronics Co., Ltd. Reader coil antenna, and non-contacting type card identification system using the same
US20040159932A1 (en) * 2003-02-18 2004-08-19 Hiroto Watanabe Semiconductor device
US20050194591A1 (en) * 1998-12-17 2005-09-08 Mitsuo Usami Semiconductor devices and manufacturing method therefor
US20050199734A1 (en) * 2004-03-10 2005-09-15 Infineon Technologies Ag Chip card
US20050258245A1 (en) * 2004-05-20 2005-11-24 Bates Peter K Radio frequency fobs and methods of using the same
US20060219797A1 (en) * 2005-03-29 2006-10-05 Aruze Corp. Game card
US20070159353A1 (en) * 2004-01-23 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US20070194130A1 (en) * 2004-03-25 2007-08-23 Pierre-Alain Bauer Method for making an electronic label and electronic label obtained by said method
US20070210364A1 (en) * 2004-04-28 2007-09-13 Semiconductor Energy Laboratory Co., Ltd Mos Capacitor And Semiconductor Device
US20070290207A1 (en) * 2006-06-01 2007-12-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
EP2178032A1 (de) 2008-10-17 2010-04-21 Oberthur Technologies Modul, Mikrochipkarte und entsprechendes Herstellungsverfahren
US20100113118A1 (en) * 2007-03-30 2010-05-06 Angel Playing Cards Co., Ltd. Rfid-incorporated game card and manufacturing method thereof
US7798415B1 (en) 2004-05-20 2010-09-21 American Express Travel Realted Services Company, Inc. Wireless transaction fobs and methods of using the same
US8100337B2 (en) 2005-08-30 2012-01-24 Smart Packaging Soultions (SPS) Double interface communication electronic module, in particular for a chip card
US20140138446A1 (en) * 2012-11-20 2014-05-22 Xerox Corporation Apparatuses and methods for printed radio frequency identification (rfid) tags
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
DE102013104567A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Chipanordnung, Chipkartenanordnung und Verfahren zum Herstellen einer Chipanordnung
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US9132044B2 (en) 2009-10-07 2015-09-15 Pampett Ab Method and system for detecting moisture at an absorbent article
US9218562B2 (en) 2012-07-02 2015-12-22 Inside Secure Method for producing a contactless microcircuit
US20180032854A1 (en) * 2016-08-01 2018-02-01 Infineon Technologies Ag Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card
CN110309897A (zh) * 2019-08-14 2019-10-08 莆田澳普睿智能科技有限公司 一种耐冲击电子标签及其制作方法
US10804594B2 (en) 2015-12-15 2020-10-13 Thales Dis France Sa Single-face antenna module comprising CMS device
US10820418B2 (en) 2014-01-06 2020-10-27 Thales Dis France Sa Electronic module, method for manufacturing same and electronic device comprising a module of said type
USD973664S1 (en) * 2019-09-06 2022-12-27 Murata Manufacturing Co., Ltd. IC-chip for RFID tag
RU2797652C1 (ru) * 2019-09-09 2023-06-07 Таль Дис Франс Сас Способ изготовления металлической смарт-карты с релейной мини-антенной

Families Citing this family (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10203066A (ja) * 1997-01-28 1998-08-04 Hitachi Ltd 非接触ｉｃカード
FR2765010B1 (fr) * 1997-06-20 1999-07-16 Inside Technologies Micromodule electronique, notamment pour carte a puce
DE19732644C1 (de) * 1997-07-29 1998-11-12 Siemens Ag Verfahren zur Herstellung einer Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Chipkarte
US5909050A (en) * 1997-09-15 1999-06-01 Microchip Technology Incorporated Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
FR2769390B1 (fr) * 1997-10-08 2003-02-14 Gemplus Card Int Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact
CN1179295C (zh) * 1997-11-14 2004-12-08 凸版印刷株式会社 复合ic模块及复合ic卡
IL122250A (en) 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
KR20000075883A (ko) * 1998-01-09 2000-12-26 씨. 필립 채프맨 집적 회로 칩과 코일을 동시 실장시킨 집적 회로 패키지 및 그 제조 방법
EP0977145A3 (de) * 1998-07-28 2002-11-06 Kabushiki Kaisha Toshiba Radio IC-Karte
JP3180086B2 (ja) * 1998-08-31 2001-06-25 株式会社シーメディア 携帯通信装置、情報伝達システム及び方法、携帯通信装置で利用可能な非接触ｉｃメディア
US6630370B2 (en) * 1998-10-02 2003-10-07 Shinko Electric Industries Co., Ltd. Process for manufacturing IC card
JP2002533914A (ja) 1998-12-18 2002-10-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 集積回路と伝送コイルを備えるデータキャリアモジュール
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
DE59900131D1 (de) † 1999-01-23 2001-07-26 Ident Gmbh X RFID-Transponder mit bedruckbarer Oberfläche
EP1031940A1 (de) * 1999-02-24 2000-08-30 Sihl GmbH Anordnung enthaltend eine Vielzahl elektronischer Schaltungen
FR2794264B1 (fr) * 1999-05-27 2001-11-02 Gemplus Card Int Adaptateur pour dispositif electronique portable a circuit integre, de type carte a puce, d'un format reduit par rapport au format standard d'une mini-carte
JP3928682B2 (ja) * 1999-06-22 2007-06-13 オムロン株式会社 配線基板同士の接合体、配線基板同士の接合方法、データキャリアの製造方法、及び電子部品モジュールの実装装置
FR2796208B1 (fr) * 1999-07-08 2002-10-25 Gemplus Card Int Antenne pour carte a puce sans contact, cartes hybrides et etiquettes electroniques
FR2796760B1 (fr) * 1999-07-23 2002-02-01 Gemplus Card Int Etiquette electronique et procede pour sa fabrication
JP2001256456A (ja) * 2000-03-10 2001-09-21 Shinko Electric Ind Co Ltd Ｉｃタグ及びその製造方法
US20020099473A1 (en) * 2000-11-08 2002-07-25 Paul Amadeo Integrated computer-aided design (CAD) and robotic systems for rapid prototyping and manufacture of smart cards
FR2820548A1 (fr) * 2001-02-02 2002-08-09 Schlumberger Systems & Service Objet portatif a puce et a antenne, module destine a former un objet portatif a puce et a antenne et leurs procedes de fabrication
JP4684433B2 (ja) * 2001-02-07 2011-05-18 大日本印刷株式会社 接触・非接触兼用型ｉｃモジュールとその製造方法
DE10120269C1 (de) * 2001-04-25 2002-07-25 Muehlbauer Ag Verfahren zum Verbinden von Mikrochips mit auf einem Trägerband angeordneten Antennen zum Herstellen eines Transponders
KR20010099429A (ko) * 2001-09-27 2001-11-09 김경현 신분증위조방지시스템
US6774470B2 (en) * 2001-12-28 2004-08-10 Dai Nippon Printing Co., Ltd. Non-contact data carrier and method of fabricating the same
JP4109039B2 (ja) * 2002-08-28 2008-06-25 株式会社ルネサステクノロジ 電子タグ用インレットおよびその製造方法
WO2004100063A1 (fr) * 2003-05-05 2004-11-18 Axalto Sa Procede de fabrication d'un inlet prelamine
US7243421B2 (en) * 2003-10-29 2007-07-17 Conductive Inkjet Technology Limited Electrical connection of components
US7612677B2 (en) 2005-01-28 2009-11-03 Smartrac Ip B.V. Method for producing a security layered construction and security layered construction and identification documents containing such a construction
US7196397B2 (en) * 2004-03-04 2007-03-27 International Rectifier Corporation Termination design with multiple spiral trench rings
FR2882174B1 (fr) * 2005-02-11 2007-09-07 Smart Packaging Solutions Sps Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
CN100361150C (zh) * 2005-06-24 2008-01-09 清华大学 带有硅基集成天线的射频识别标卡
DE102005038132B4 (de) 2005-08-11 2008-04-03 Infineon Technologies Ag Chipmodul und Chipkarte
JP4997779B2 (ja) * 2006-02-13 2012-08-08 大日本印刷株式会社 非接触データキャリア
KR100809028B1 (ko) * 2006-06-07 2008-03-03 (주)아이디밸리 교통카드용 알에프 모듈
FR2904723B1 (fr) * 2006-08-01 2008-12-19 Arjowiggins Security Soc Par A Structure de securite, notamment pour un document de securite et/ou de valeur
US8188926B2 (en) * 2008-10-31 2012-05-29 Silicon Laboratories, Inc. Folded antenna structures for portable devices
US8186603B2 (en) * 2009-09-22 2012-05-29 On Track Innovation Ltd. Contactless smart sticker
FR2963142B1 (fr) * 2010-07-20 2012-09-14 Oberthur Technologies Carte a microcircuit de type sans contact
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
US9272370B2 (en) 2010-08-12 2016-03-01 Féinics Amatech Teoranta Laser ablating structures for antenna modules for dual interface smartcards
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
DE102010036057A1 (de) * 2010-09-01 2012-03-01 Giesecke & Devrient Gmbh Chipmodul mit Kennzeichnung
EP2463809A1 (de) * 2010-12-07 2012-06-13 NagraID S.A. Elektronische Karte mit elektrischem Kontakt, die eine elektronische Einheit und/oder eine Antenne umfasst
JP5344000B2 (ja) * 2011-05-09 2013-11-13 大日本印刷株式会社 接触非接触両用ｉｃモジュール及びｉｃカード
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
DE102011056329A1 (de) * 2011-12-13 2013-06-13 Infineon Technologies Ag Chipkartenmodul
EP2669852A1 (de) 2012-05-31 2013-12-04 Gemalto SA Chip-Modul eines integrierten Schaltkreises mit Antenne
FR2994005B1 (fr) * 2012-07-25 2017-05-26 Microconnections Sas Module electronique pour carte a puce et circuit imprime pour la realisation d'un tel module
EP2736001A1 (de) * 2012-11-27 2014-05-28 Gemalto SA Elektronisches Modul mit dreidimensionaler Kommunikationsschnittstelle
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
JP6124119B2 (ja) * 2013-03-29 2017-05-10 パナソニックＩｐマネジメント株式会社 給電装置及び受電装置
CN106104290B (zh) * 2014-01-29 2019-06-04 北京嘉岳同乐极电子有限公司 高灵敏磁传感器及其制作方法
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
CN103984977A (zh) * 2014-05-27 2014-08-13 江苏远洋数据股份有限公司 一种双界面卡
US10438110B2 (en) 2015-07-08 2019-10-08 Assa Abloy Ab Multiple frequency transponder with a single antenna
EP3182336A1 (de) 2015-12-14 2017-06-21 Gemalto Sa Funkfrequenzvorrichtung mit anpassbarem lc-schaltkreis, der ein elektrisches und/oder elektronisches modul umfasst
FR3058545B1 (fr) * 2016-11-04 2018-10-26 Smart Packaging Solutions Procede de fabrication d'un module electronique pour carte a puce
US10826158B2 (en) * 2018-02-27 2020-11-03 Thin Film Electronics Asa Printed and/or thin film integrated circuit with integrated antenna, and methods of making and using the same
EP3663983A1 (de) 2018-12-06 2020-06-10 Thales Dis France SA Herstellungsverfahren einer metallischen oder nichtmetallischen chipkarte mit relaisantenne
EP3663984A1 (de) 2018-12-06 2020-06-10 Thales Dis France SA Herstellungsverfahren einer chipkarte mit verbindung von modulen
EP3671562A1 (de) 2018-12-21 2020-06-24 Thales Dis France SA Herstellungsverfahren einer metallischen funkfrequenz-chipkarte mit verbesserter leitfähigkeit und ausgedehnten perforationen
EP3671564A1 (de) 2018-12-21 2020-06-24 Thales Dis France SA Herstellungsverfahren eines einsatzes einer funkfrequenz-chipkarte, der eine metallplatte umfasst
EP3671563A1 (de) 2018-12-21 2020-06-24 Thales Dis France SA Herstellungsverfahren einer metallischen chipkarte, bevorzugt mit relaisantenne
EP3671561A1 (de) 2018-12-21 2020-06-24 Thales Dis France SA Herstellungsverfahren einer metallischen funkfrequenz-chipkarte mit verbesserter elektromagnetischer leitfähigkeit
EP3789919A1 (de) 2019-09-09 2021-03-10 Thales Dis France SA Herstellungsverfahren einer metallischen chipkarte mit minirelais-antenne
CN110632668B (zh) * 2019-10-14 2024-05-17 厦门顶尖电子有限公司 一种电子价签的定位方法、电子价签组件及系统
EP3832546A1 (de) 2019-12-02 2021-06-09 Thales Dis France Sa Herstellungsverfahren einer funkfrequenz-chipkarte, die eine metallplatte mit einem schlitz oder einem spiel in der platte umfasst
EP3832547A1 (de) 2019-12-02 2021-06-09 Thales Dis France Sa Die erfindung betrifft ein herstellungsverfahren einer funkfrequenz-chipkarte, die eine metallplatte mit einem schlitz in der platte umfasst
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
US11551050B2 (en) * 2020-11-12 2023-01-10 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology
EP4012612A1 (de) 2020-12-11 2022-06-15 Thales DIS France SA Verfahren zur herstellung einer chipkarte mit positionierung eines metalleinsatzes
CN112990416B (zh) * 2021-04-22 2021-11-19 四川谦泰仁投资管理有限公司 一种带有天线检测端口的高频rfid芯片及标签

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4857893A (en) * 1986-07-18 1989-08-15 Bi Inc. Single chip transponder device
WO1988008592A1 (en) * 1987-04-27 1988-11-03 Soundcraft, Inc. Method for the manufacture of and structure of a laminated proximity card
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
ATE124829T1 (de) * 1987-11-18 1995-07-15 Univ Western Australia Transponder.
FR2641102B1 (de) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
DE8909783U1 (de) * 1989-08-16 1990-09-13 Pepperl & Fuchs Gmbh, 6800 Mannheim, De
JPH04152191A (ja) * 1990-10-17 1992-05-26 Mitsubishi Electric Corp Ｔａｂ基板及びそれを用いた非接触ｉｃカード
FR2678753B1 (fr) * 1991-07-02 1996-12-20 Gemplus Card Int Fabrication de cartes a puce a module autodetachable.
DE4311493C2 (de) * 1993-04-07 2000-04-06 Amatech Advanced Micromechanic IC-Kartenmodul zur Herstellung einer IC-Karte
DE69323293T2 (de) * 1993-04-14 1999-09-09 Gustafson Elektronische Vorrichtung zur Kennzeichnung
JP3305843B2 (ja) * 1993-12-20 2002-07-24 株式会社東芝 半導体装置
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
DE10016715C1 (de) * 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten

Cited By (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050194591A1 (en) * 1998-12-17 2005-09-08 Mitsuo Usami Semiconductor devices and manufacturing method therefor
US7298029B2 (en) * 1998-12-17 2007-11-20 Hitachi, Ltd. Semiconductor devices and manufacturing method therefor
US20080054427A1 (en) * 1998-12-17 2008-03-06 Mitsuo Usami Semiconductor devices and manufacturing method therefor
US6642896B2 (en) * 2001-02-03 2003-11-04 Samsung Electronics Co., Ltd. Reader coil antenna, and non-contacting type card identification system using the same
US7312528B2 (en) * 2003-02-18 2007-12-25 Hitachi Maxell, Ltd. Semiconductor device having antenna connection electrodes
US20040159932A1 (en) * 2003-02-18 2004-08-19 Hiroto Watanabe Semiconductor device
US8305213B2 (en) 2004-01-23 2012-11-06 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US20070159353A1 (en) * 2004-01-23 2007-07-12 Semiconductor Energy Laboratory Co., Ltd. Film-like article and method for manufacturing the same
US20050199734A1 (en) * 2004-03-10 2005-09-15 Infineon Technologies Ag Chip card
US7240847B2 (en) * 2004-03-10 2007-07-10 Infineon Technologies Ag Chip card
US20070194130A1 (en) * 2004-03-25 2007-08-23 Pierre-Alain Bauer Method for making an electronic label and electronic label obtained by said method
US7815122B2 (en) * 2004-03-25 2010-10-19 Eric Bauer Method for making an electronic label and electronic label obtained by said method
US7825447B2 (en) * 2004-04-28 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. MOS capacitor and semiconductor device
US20070210364A1 (en) * 2004-04-28 2007-09-13 Semiconductor Energy Laboratory Co., Ltd Mos Capacitor And Semiconductor Device
US7604176B2 (en) 2004-05-20 2009-10-20 American Express Travel Related Services Company, Inc. Radio frequency fobs and methods of using the same
US20050258245A1 (en) * 2004-05-20 2005-11-24 Bates Peter K Radio frequency fobs and methods of using the same
US8157181B2 (en) 2004-05-20 2012-04-17 American Express Travel Related Services Company, Inc. Wireless transaction fobs and methods of using the same
US7798415B1 (en) 2004-05-20 2010-09-21 American Express Travel Realted Services Company, Inc. Wireless transaction fobs and methods of using the same
US20060219797A1 (en) * 2005-03-29 2006-10-05 Aruze Corp. Game card
US8100337B2 (en) 2005-08-30 2012-01-24 Smart Packaging Soultions (SPS) Double interface communication electronic module, in particular for a chip card
US20070290207A1 (en) * 2006-06-01 2007-12-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8558238B2 (en) 2006-06-01 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US8791461B2 (en) 2006-06-01 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
US20100113118A1 (en) * 2007-03-30 2010-05-06 Angel Playing Cards Co., Ltd. Rfid-incorporated game card and manufacturing method thereof
FR2937448A1 (fr) * 2008-10-17 2010-04-23 Oberthur Technologies Module, carte a microcircuit et procede de fabrication correspondant.
EP2178032A1 (de) 2008-10-17 2010-04-21 Oberthur Technologies Modul, Mikrochipkarte und entsprechendes Herstellungsverfahren
US9132044B2 (en) 2009-10-07 2015-09-15 Pampett Ab Method and system for detecting moisture at an absorbent article
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
US9218562B2 (en) 2012-07-02 2015-12-22 Inside Secure Method for producing a contactless microcircuit
US20140138446A1 (en) * 2012-11-20 2014-05-22 Xerox Corporation Apparatuses and methods for printed radio frequency identification (rfid) tags
US9286564B2 (en) * 2012-11-20 2016-03-15 Xerox Corporation Apparatuses and methods for printed radio frequency identification (RFID) tags
GB2509374B (en) * 2012-11-20 2020-04-29 Xerox Corp Apparatuses and methods for printed radio frequency identification (RFID) tags
DE102013104567A1 (de) * 2013-05-03 2014-11-06 Infineon Technologies Ag Chipanordnung, Chipkartenanordnung und Verfahren zum Herstellen einer Chipanordnung
US10820418B2 (en) 2014-01-06 2020-10-27 Thales Dis France Sa Electronic module, method for manufacturing same and electronic device comprising a module of said type
US10804594B2 (en) 2015-12-15 2020-10-13 Thales Dis France Sa Single-face antenna module comprising CMS device
US20180032854A1 (en) * 2016-08-01 2018-02-01 Infineon Technologies Ag Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card
CN110309897A (zh) * 2019-08-14 2019-10-08 莆田澳普睿智能科技有限公司 一种耐冲击电子标签及其制作方法
USD973664S1 (en) * 2019-09-06 2022-12-27 Murata Manufacturing Co., Ltd. IC-chip for RFID tag
RU2797652C1 (ru) * 2019-09-09 2023-06-07 Таль Дис Франс Сас Способ изготовления металлической смарт-карты с релейной мини-антенной

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FR2743649B1 (fr) 1998-04-03
CN1213449A (zh) 1999-04-07
EP1118960A2 (de) 2001-07-25
CN1165873C (zh) 2004-09-08
EP0875039B1 (de) 2001-08-22
RU2194306C2 (ru) 2002-12-10
EP0875039A1 (de) 1998-11-04
ATE204662T1 (de) 2001-09-15
US20030025186A1 (en) 2003-02-06
AU713433B2 (en) 1999-12-02
BR9709153A (pt) 1999-08-03
ES2163114T3 (es) 2002-01-16
WO1997026621A1 (fr) 1997-07-24
JPH11509024A (ja) 1999-08-03
JP3779328B2 (ja) 2006-05-24
DE69730362D1 (de) 2004-09-23
EP1118960B1 (de) 2004-08-18
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CA2243326A1 (fr) 1997-07-24
ES2226994T3 (es) 2005-04-01
ATE274214T1 (de) 2004-09-15
DE69730362T2 (de) 2005-09-08
EP1492048A2 (de) 2004-12-29
AU1447797A (en) 1997-08-11
DE69706280D1 (de) 2001-09-27
JP2002207987A (ja) 2002-07-26
US6794727B2 (en) 2004-09-21
FR2743649A1 (fr) 1997-07-18
DE69706280T2 (de) 2002-05-08
EP1492048A3 (de) 2005-12-14
EP1118960A3 (de) 2002-11-06
KR19990077335A (ko) 1999-10-25

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