US20010001978A1 - Electronic apparatus, manufacturing method therefor, and mold device - Google Patents

Electronic apparatus, manufacturing method therefor, and mold device Download PDF

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Publication number
US20010001978A1
US20010001978A1 US09/737,872 US73787200A US2001001978A1 US 20010001978 A1 US20010001978 A1 US 20010001978A1 US 73787200 A US73787200 A US 73787200A US 2001001978 A1 US2001001978 A1 US 2001001978A1
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US
United States
Prior art keywords
mold
electronic apparatus
frame
mold device
ejector pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/737,872
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English (en)
Inventor
Takashi Hosoi
Nobuyuki Takaki
Yasuo Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HOSOI, TAKASHI, ONO, YASUO, TAKAKI, NOBUYUKI
Publication of US20010001978A1 publication Critical patent/US20010001978A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • B22D17/20—Accessories: Details
    • B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
    • B22D17/2236—Equipment for loosening or ejecting castings from dies

Definitions

  • This invention relates to a manufacturing method for an electronic apparatus frame, and more particularly, to a case where a molded piece is taken out of a mold device.
  • magnesium alloys have been mainly used as the material of an electronic apparatus frame of a light metal. These alloys are molded by die-casting or thixotropy. In either of these molding methods, which use different equipment mechanisms, an alloy melted at 580° to 750° is injected into a mold device of about 100° to 350° and molded.
  • FIG. 1 shows a configuration of a conventional electronic apparatus frame.
  • a molten metal is introduced through a sprue 2 , a molten metal inlet portion of a mold device (which will be described with reference to that portion of this drawing which corresponds to the shape of the electronic apparatus frame just molded and the sectional view of FIG. 2 showing the mold device 10 ), and the molten metal is introduced into a desired mold through a runner 3 .
  • the introduced molten metal diffuses throughout a cavity 4 and finally reaches an air vent 5 .
  • a molten metal reservoir 6 is coupled to the air vent 5 .
  • the frame can be formed without containing any voids therein.
  • a molded piece is formed as the molten metal is thus introduced into the mold device 10 .
  • the molded piece is pushed out by means of ejector pins 7 .
  • the ejector pins 7 are provided in the mold device 10 , as shown in FIG. 2.
  • the electronic apparatus frame 1 is thinned in general. If a magnesium alloy is the material, the wall thickness of the frame ranges from about 0.7 to 1.0 mm. When the molded piece is pushed out of the mold device, therefore, those regions which are pushed in by means of the ejector pins 7 may be hollowed by the push force, possibly leaving push indentations 8 shown in FIG. 3.
  • the push force increases correspondingly. In some cases, therefore, the push indentations 8 may be formed more clearly in the pushed regions of the electronic apparatus frame 1 that is thinned, as mentioned before.
  • Such deformation that is attributable to the push force is not limited to the case of the light metal for use as the material, and is also caused in the case of a synthetic resin.
  • the deformation appears as a phenomenon such as blushing.
  • This invention has been contrived in consideration of these circumstances, and its object is to provide an electronic apparatus having a frame that cannot be deformed when it is pushed out of a mold device by means of ejector pins, a manufacturing method therefor, and the mold device.
  • an electronic apparatus of this invention comprises a frame and a raised portion provided on that region of the frame which engages an ejector pin projecting from inside a mold device and formed thicker than the peripheral portion of the engaging region at the least.
  • a mold device of this invention including a first mold and a second mold for forming a frame of a metallic material and having an ejector pin adapted to push out a molded piece from the first mold after the molded piece is formed, moreover, a depression is formed in that part of the first mold from which the ejector pin projects so that the part pushed out by means of the ejector pin forms a raised portion.
  • an electronic apparatus manufacturing method of this invention for molding an electronic apparatus including a frame of a metallic material by means of a mold device formed having a depression such that a part pushed out by means of an ejector pin forms a raised portion comprises a flowing process for diffusing a molten metal into the mold device, a solidifying process for solidifying the molten metal introduced into the mold device in the flowing process, thereby forming a frame, and an unloading process for pushing out a raised portion of a molded piece formed in the solidifying process, thereby taking out the molded piece from the mold device.
  • FIG. 1 is a perspective view showing the shape of a prior art electronic apparatus frame
  • FIG. 2 is a sectional view showing a configuration of a prior art mold device
  • FIG. 3 is a perspective view showing a state of push indentations in the prior art electronic apparatus frame
  • FIG. 4 is a perspective view showing the shape of a portable computer as an electronic apparatus according to one embodiment of this embodiment
  • FIG. 5 is a perspective view showing a configuration of an electronic apparatus frame of the electronic apparatus of the same embodiment
  • FIG. 6 is a plan view showing the shapes of raised portions and ribs of the electronic apparatus frame constituting the electronic apparatus of the same embodiment
  • FIG. 7 is a sectional view showing a configuration of a mold device of the same embodiment
  • FIGS. 8A and 8B are views showing a manufacturing method for the electronic apparatus having the electronic apparatus frame of the same embodiment, in which FIG. 8A is a view showing a state in which a first mold and a second mold of the mold device are disengaged, and FIG. 8B is a view showing a state in which a molded piece is pushed out of the first mold by means of ejector pins;
  • FIG. 9 shows a flowchart for the electronic apparatus manufacturing method of the same embodiment
  • FIG. 10 is a partial sectional view showing a state of an electronic apparatus frame of an electronic apparatus according to a modification of the present invention and illustrating the formation of a mound portion;
  • FIG. 11 is a partial sectional view showing a state of an electronic apparatus frame of an electronic apparatus according to a modification of the present invention and illustrating the formation of a thick-walled portion projecting into the electronic apparatus frame;
  • FIG. 12 is a partial sectional view showing a state of an electronic apparatus frame of an electronic apparatus according to a modification of the present invention and illustrating the formation of a thick-walled portion projecting outward from the electronic apparatus frame.
  • FIG. 4 is an external view showing the shape of a portable computer 10 such as a note-type personal computer.
  • the portable computer 10 comprises a computer body 11 and a display unit 12 that is rockably supported on the computer body 11 .
  • the computer body 11 is provided with a frame 13 , and this frame 13 is design so that a lower frame 14 and an upper frame 15 are suitably joined by means of, for example, screws or the like.
  • the lower frame 14 and the upper frame 15 may be joined by means of any other arrangement than this.
  • FIG. 5 shows the shape of the electronic apparatus frame 20 that cannot be deformed even if it is pushed out by means of ejector pins 39 according to the present invention.
  • raised portions 21 are formed protruding for a given height from the frame body of the electronic apparatus frame 20 , and moreover, ribs 22 that extend in gentle slopes from the top portion of each raised portion 21 toward the peripheral portion are arranged at intervals of, for example, about 90°.
  • FIG. 6 is a plan view of this state taken from the topside.
  • a mold device 30 arranged in the following manner is used to manufacture the electronic apparatus frame 20 having the aforementioned construction and prevent the push force of the ejector pins 39 from creating push indentations.
  • the mold device 30 shown in FIG. 7 is composed of a first mold 31 and a second mold 32 that are in engagement with each other, and has a cavity 35 formed therein as the first mold 31 and the second mold 32 engage each other.
  • a molten metal In introducing a molten metal into the cavity 35 , it is introduced through a sprue 33 , a molten metal inlet, and is diffused by means of a runner 34 so that a substantially parallel molten metal flow is introduced into the cavity 35 .
  • the molten metal diffused and introduced by means of the runner 34 , fills the cavity 35 , and is introduced into depressions 36 that are formed in the first mold 31 .
  • the depressions 36 are formed by depressing those regions of the first mold 31 for the ejector pins 39 to a given depth, and the raised portions 21 are provided on a molded piece 50 as the molten metal get into the depressions 36 and solidifies.
  • the wall thickness of the electronic apparatus frame 20 ranges from about 0.7 to 1.0 mm, for example, the height of projection of the raised portions 21 ranges from about 0.84 to 1.2 mm, which is about 20% greater than the wall thickness of the frame.
  • the depressions 36 are located individually on ejector projection regions 37 in the first mold 31 .
  • Through holes 38 are formed in the first mold 31 so as to be continuous with the ejector projection regions 37 , and the ejector pins 39 can get into and out of the through holes 38 , individually.
  • the ejector pins 39 are passed through the through holes 38 , individually.
  • the ejector pins 39 are movable along the through holes 38 . When they project downward, their respective lower end portions project from the inner wall surface of the cavity 35 of the first mold 31 .
  • a spring 40 for use as urging means is located on each ejector pin 39 .
  • the springs 40 serve to give urging force to the ejector pins 39 so that the pins 39 project from the inner wall surface of the cavity 35 of the first mold 31 .
  • the one-end side of each spring 40 is attached to a stationary mold 41 .
  • the stationary mold 41 which is located above the first mold 31 , can be driven in the vertical direction.
  • the stationary mold 41 is provided with recesses 42 having a given size.
  • the recesses 42 are designed to receive the respective upper ends of the springs 40 . If the stationary mold 42 is driven downward, therefore, corresponding urging force can be applied to the ejector pins 39 .
  • the raised portions 21 are formed on the molded piece 50 as the molten metal flows into the depressions 36 . In some cases, however, the raised portions 21 alone may fail to prevent general deformation, such as deflection, of the electronic apparatus frame 20 when those portions are pushed in by means of the ejector pins 39 . To avoid this, the molded piece 50 has the ribs 22 that are arranged at the given angular intervals around the raised portions 21 .
  • the ribs 22 are in the form of slopes with a sufficient length that gently decline from the outer peripheral edge portion of the top portion of each raised portion 21 . Since the ribs 22 gently decline from the depressions 36 , moreover, the molten metal in the depressions 36 can easily go around.
  • the ribs 22 have a length such that the molded piece 50 never undergoes deformation such as deflection when the raised portions 21 are pressed by means of the ejector pins 39 . Furthermore, the length of the ribs 22 is restricted in consideration of the attachment of any other electronic component or the like.
  • grooves 43 corresponding to the ribs 22 are formed around the depressions 36 of the mold device 30 .
  • the aforesaid ribs 22 can be formed in a manner such that the molten metal gets into the grooves 43 .
  • the molten metal that fills the inside of the cavity 35 reaches an air vent 44 on the other end side of the runner 34 with respect to the cavity 35 .
  • the air vent 44 serves to discharge air in the cavity 35 from the cavity 35 to the outside.
  • the molten metal introduced into the cavity 35 can prevent generation of voids therein as it reaches a molten metal reservoir 45 .
  • the molten metal is caused to flow into the cavity 35 and fill it (flowing process). Thereafter, the loaded molten metal is solidified by cooling (solidifying process). The molded piece 50 must be taken out of the cavity 35 when it is formed (unloading process).
  • the first mold 31 and the second mold 32 must be disengaged from each other, as shown in FIG. 8A, to allow the molded piece 50 to be taken out.
  • the molded piece 50 is left adhering to the first mold 31 on the molded piece 50 that is formed having a rib structure and bosses the electronic apparatus frame 20 usually has or irregularities such as the aforesaid depressions 36 and the ribs 22 .
  • the molded piece 50 in this state expected to be taken out of the first mold 31 is pushed out by means of the ejector pins 39 , as shown in FIG. 8B.
  • the raised portions 21 and the ribs 22 are formed on the molded piece 50 as the molten metal is introduced into the mold device 30 . Since the raised portions 21 and the ribs 22 are provided on the regions for the projection of the ejector pins 39 , however, the raised portions 52 receive the push force of the ejector pins 39 and are pushed out.
  • the molded piece 50 can be pushed out of the mold device 30 by means of the ejector pins 39 so that it is ready to be removed outward. Since those portions of the molded piece 50 which correspond to the sprue 33 and the runner 34 in the mold device 30 are not disengaged yet, however, they are cut off after the molded piece 50 is taken out. Thus, the electronic apparatus frame 20 is formed.
  • the engaging portions at which the molded piece 50 is pushed out by means of the ejector pins 39 are formed of the raised portions 21 . If the push force of the ejector pins 39 is received by means of the raised portions 21 , therefore, the electronic apparatus frame 20 cannot be subjected to any apparent deformation such as depressions if the electronic apparatus frame 20 is thinned.
  • the external appearance of the electronic apparatus frame 20 can be improved, and at the same time, occurrence of malformation that is attributable to deformation during the extrusion can be prevented.
  • the formation of the raised portions 21 improves the efficiency of mass production for the electronic apparatus frame 20 .
  • the ribs 22 are provided at the given angular intervals so that they extend like gentle slopes from the top portion of each raised portion 21 , moreover, malformation of the electronic apparatus frame 20 , such as depression or deflection, can be prevented more securely.
  • the thinned electronic apparatus frame 20 is reinforced by means of the ribs 22 , in particular, the general shape of the electronic apparatus frame 20 can be satisfactorily prevented from suffering deflection.
  • the mold device 30 is previously formed having the depressions 36 and the grooves 43 before the raised portions 21 and the ribs 22 are formed, moreover, the molded piece 50 having the raised portions 21 and the ribs 22 can be formed by only introducing the molten metal into the cavity 35 of the mold device 30 and allowing it to solidify. If the ejector pins 39 are received by means of the raised portions 21 , therefore, the molded piece 50 can be prevented from being deformed when the molded piece 50 is removed. Thus, the formation of the electronic apparatus frame 20 can be improved in efficiency, and therefore, its cost can be lowered.
  • the raised portions 21 are shaped so that their respective top portions are substantially circular, as shown in FIGS. 5 and 6.
  • the top portion of each raised portion 21 may have a square shape or any other shape.
  • the ribs 21 are not limited to the form of gentle slopes, and may be designed so that they extend for a given length without varying in height, for example.
  • the raised portions 21 may be replaced with any other structures such as protrusions that are formed by mounding those portions of the electronic apparatus frame 20 which engage the ejector pins 39 so that the ejector pins 39 can be caused to abut against their corresponding mound portions 23 , as shown in FIG. 10.
  • the mold device 30 is internally shaped corresponding to this arrangement so that the mound portions 23 can be e formed by only introducing the molten metal into the mold device 30 .
  • the mound portions 23 for use as the protrusions may be replaced with thick-walled portions 24 that are formed on the engaging portions for the ejector pins 39 so as to project into the electronic apparatus frame 20 , as shown in FIG. 11.
  • Each thick-walled portion 24 includes a top portion 24 a and a slanting portion 24 b that gently declines from the top portion 24 a toward the peripheral portion.
  • the slanting portion 24 b serves for reinforcement when each ejector pin 39 abuts against the top portion 24 a.
  • each thick-walled portion 24 is formed projecting into the electronic apparatus frame 20 .
  • a thick-walled portion 25 may be formed projecting outward from the electronic apparatus frame 20 , as shown in FIG. 11.
  • the thick-walled portion 25 has a top portion 25 a and a slanting portion 25 b . If a plurality of thick-walled portions 25 are formed on the bottom wall surface of the lower frame 14 of the portable computer 10 shown in FIG. 4, for example, the thick-walled portions 25 can be made to function as contact portions to engage a disk or the like.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Molds, Cores, And Manufacturing Methods Thereof (AREA)
US09/737,872 1998-06-19 2000-12-18 Electronic apparatus, manufacturing method therefor, and mold device Abandoned US20010001978A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10-173024 1998-06-19
JP10173024A JP2000005859A (ja) 1998-06-19 1998-06-19 電子機器とその製造方法及び金型装置
PCT/JP1999/001764 WO1999065632A1 (fr) 1998-06-19 1999-04-02 Appareil electronique, procede de fabrication de celui-ci et moule

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/001764 Continuation WO1999065632A1 (fr) 1998-06-19 1999-04-02 Appareil electronique, procede de fabrication de celui-ci et moule

Publications (1)

Publication Number Publication Date
US20010001978A1 true US20010001978A1 (en) 2001-05-31

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US09/737,872 Abandoned US20010001978A1 (en) 1998-06-19 2000-12-18 Electronic apparatus, manufacturing method therefor, and mold device

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US (1) US20010001978A1 (ja)
JP (1) JP2000005859A (ja)
CN (1) CN1306466A (ja)
TW (1) TW404162B (ja)
WO (1) WO1999065632A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050085654A1 (en) * 2001-06-25 2005-04-21 Canon Kabushiki Kaisha Metal coordination compound and electroluminescence device
US20060231230A1 (en) * 2005-04-15 2006-10-19 Kabushiki Kaisha Toshiba Method of forming a housing having a thin wall and the housing
US20090321034A1 (en) * 2008-06-30 2009-12-31 Kabushiki Kaisha Toshiba Die and method of manufacturing cast product
US20110128683A1 (en) * 2009-11-30 2011-06-02 Kabushiki Kaisha Toshiba Electronic device
US8899302B2 (en) * 2012-03-22 2014-12-02 Mahase Bhola Mold valve

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JP4686440B2 (ja) * 2006-12-26 2011-05-25 株式会社東芝 電子機器
JP5463709B2 (ja) * 2009-03-27 2014-04-09 富士電機株式会社 電力変換装置
JP5175944B2 (ja) * 2011-01-12 2013-04-03 株式会社東芝 電子機器
JP5726826B2 (ja) * 2012-08-30 2015-06-03 株式会社東芝 電子機器
CN102941332B (zh) * 2012-12-04 2015-05-20 宁波勋辉电器有限公司 一种压铸模的动模倒拉结构
WO2015035537A1 (zh) * 2013-09-16 2015-03-19 Zhang Xuli 薄型化之壳体结构及其制造方法
JP6420122B2 (ja) * 2014-11-05 2018-11-07 株式会社ケーヒン 電力変換装置
JP6406216B2 (ja) * 2015-11-09 2018-10-17 トヨタ自動車株式会社 金属製の筐体の製造方法
CN107457383A (zh) * 2017-08-08 2017-12-12 东莞市和镁五金有限公司 一种led显示屏模组底壳的压铸成型模具及压铸成型工艺
CN112935226B (zh) * 2021-01-30 2022-03-22 浙江新峰机械有限公司 一种轮毂毛坯脱模装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH074654B2 (ja) * 1986-12-08 1995-01-25 扶桑軽合金株式会社 ダイカスト鋳造における製品の取出し方法
JPH0811556B2 (ja) * 1987-06-19 1996-02-07 本田技研工業株式会社 自動２輪車用車体フレーム
JP3021296B2 (ja) * 1994-09-13 2000-03-15 株式会社デンソー 電子機器用箱体、その製造方法およびその使用方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050085654A1 (en) * 2001-06-25 2005-04-21 Canon Kabushiki Kaisha Metal coordination compound and electroluminescence device
US20060231230A1 (en) * 2005-04-15 2006-10-19 Kabushiki Kaisha Toshiba Method of forming a housing having a thin wall and the housing
US7458412B2 (en) * 2005-04-15 2008-12-02 Kabushiki Kaisha Toshiba Method of forming a housing having a thin wall and the housing
US20090052125A1 (en) * 2005-04-15 2009-02-26 Kabushiki Kaisha Toshiba Method of forming a housing having a thin wall and the housing
US20090321034A1 (en) * 2008-06-30 2009-12-31 Kabushiki Kaisha Toshiba Die and method of manufacturing cast product
US20110128683A1 (en) * 2009-11-30 2011-06-02 Kabushiki Kaisha Toshiba Electronic device
US8310820B2 (en) 2009-11-30 2012-11-13 Kabushiki Kaisha Toshiba Electronic device
US8899302B2 (en) * 2012-03-22 2014-12-02 Mahase Bhola Mold valve

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TW404162B (en) 2000-09-01
CN1306466A (zh) 2001-08-01
JP2000005859A (ja) 2000-01-11
WO1999065632A1 (fr) 1999-12-23

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AS Assignment

Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HOSOI, TAKASHI;TAKAKI, NOBUYUKI;ONO, YASUO;REEL/FRAME:011367/0637

Effective date: 20001211

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION