WO2015035537A1 - 薄型化之壳体结构及其制造方法 - Google Patents

薄型化之壳体结构及其制造方法 Download PDF

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Publication number
WO2015035537A1
WO2015035537A1 PCT/CN2013/001097 CN2013001097W WO2015035537A1 WO 2015035537 A1 WO2015035537 A1 WO 2015035537A1 CN 2013001097 W CN2013001097 W CN 2013001097W WO 2015035537 A1 WO2015035537 A1 WO 2015035537A1
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WO
WIPO (PCT)
Prior art keywords
casing
stress
blank
thinned
stress block
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Application number
PCT/CN2013/001097
Other languages
English (en)
French (fr)
Inventor
张旭丽
Original Assignee
Zhang Xuli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhang Xuli filed Critical Zhang Xuli
Priority to PCT/CN2013/001097 priority Critical patent/WO2015035537A1/zh
Publication of WO2015035537A1 publication Critical patent/WO2015035537A1/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K1/00—Making machine elements
    • B21K1/26—Making machine elements housings or supporting parts, e.g. axle housings, engine mountings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories

Definitions

  • the invention relates to a thinned shell structure and a manufacturing method thereof, in particular to a shell blank disposed in a mold having a plurality of discharge holes at the bottom, which is formed by a high pressure compression type.
  • the shell blank flows out of the shell blank flow through the discharge hole, so that the region of the shell blank corresponding to the discharge hole position is not completely extruded to form a second stress block having a large density, and the shell
  • the area of the blank which is not corresponding to the position of the discharge hole is completely extruded to form a first stress block having a small density, and the integrally formed case has the first stress block with large stress and the small stress.
  • the staggered arrangement of the two stress blocks enables the shell to have both overall strength improvement and toughness, so that a shell structure with a thinner thickness can be produced.
  • a casing made of a metal alloy for example, a magnesium alloy
  • the casing is mostly made by die casting, and the magnesium alloy substrate is mainly placed in a mold for die casting, thereby forming the magnesium alloy substrate into a casing; however, since the die casting method is thicker for the thickness
  • the thin shell has a relatively high forming difficulty. The main factor is that when the thickness of a shell is reduced, the shell is prone to thermal cracking, oxidation, flow pattern, strength (stress) deficiency or deformation, etc.
  • the casing made of the metal alloy has a low yield; in addition, when the casing made of the metal alloy is inferior to the above-mentioned product, the repairing process of the defective casing must be manually performed, and so As a result, it will inevitably increase manpower hours and increase manufacturing costs.
  • the prior art also forms a metal casing by press molding; however, the pressure forming method is relatively difficult to form for a shell having a thinner thickness, and the main factor is when a metal substrate is used.
  • the high pressure bonding is performed in a closed mold, if the thinness of the metal substrate which is preset to be pressed is thinner, the pressure on the surface of the metal substrate is increased, and when the ductility of the metal substrate is exceeded, the metal shell is used. It is prone to cracks and even cracks, resulting in a low yield of the shell made of metal alloy. Summary of the invention
  • the present invention discloses a method for manufacturing a thinned casing structure, in which a casing blank is placed in a mold having a plurality of discharge holes at the bottom;
  • the press-compositing method presses the blank of the casing, so that the remainder of the shell blank flowing out through the discharge hole can form a blank billet flow, and the corresponding blank hole position of the shell blank
  • the region is not completely extruded to form a second stress block having a large density
  • the region of the shell blank which is not corresponding to the position of the discharge hole is completely extruded to form a first stress block having a small density.
  • the shell blank flow material formed by the blank of the shell is leveled to form Into a shell.
  • the stress ratio of the first stress block of the shell is greater than the staggered arrangement of the stress of the second stress block, so that the shell has both overall strength improvement and toughness, so that a thinner thickness can be produced. Housing structure.
  • the invention discloses a thinned casing structure, wherein the casing is integrally formed by at least one metal material in a high-pressure press-compression manner, the casing has a base portion, and a plurality of side walls are formed around the base portion, and the base portion is provided a plurality of first stress blocks and a plurality of second stress blocks, wherein the first stress blocks are interlaced with the second stress blocks, wherein a stress system of the first stress block is greater than a stress of the second stress block .
  • the stresses of the first stress blocks are relatively large to increase the strength of the whole casing, and the second stress blocks are less stressed and tough, so that the casing has a whole
  • the strength is increased and the sturdiness is achieved, and the thickness of the casing (i.e., the thickness of the base of the casing) can be made thinner and thinner, and the amount of material required for the casing can be reduced, thereby reducing the cost of the casing.
  • Second A schematic diagram of a first process embodiment of the housing structure of the present invention.
  • Fig. 3 is a schematic view showing a second process embodiment of the casing structure of the present invention.
  • Fig. 5 is a schematic view showing a fourth process embodiment of the casing structure of the present invention.
  • Fig. 6 is a partially enlarged schematic view showing the mark A in the fifth illustration of the present invention.
  • Figure 7 is a flow chart of the manufacture of the casing structure of the present invention.
  • the present invention discloses a thinned casing structure and a manufacturing method thereof. Please refer to the first figure, which is a partial cross-sectional view showing the appearance of a thinned casing structure according to the present invention.
  • the casing 1 may be made of at least one metal material. It is integrally formed in a high-pressure compression type, which can be combined with a preset electronic device.
  • the housing 1 has a base portion 1 1 and a plurality of side walls 1 2 are formed around the base portion 1 1 .
  • the base portion 1 1 and the side walls 1 2 form an accommodating space 10 , and the base portion 1 1 is provided.
  • the density of the block 1 1 1 is smaller than the density of the second stress block 112, such that the stress (strength) of the first stress block 112 is greater than the stress (strength) of the second stress block 112;
  • At least one groove 13 , at least one convex portion 14 and at least one joint portion 15 may be preliminarily provided on the base portion 1 1 of the casing 1 with respect to the accommodating space 10 .
  • the first stress block 1 1 1 formed by the casing 1 of the present invention is formed by the base portion 1 1 and has a relatively small density and a large stress, so that the overall strength of the casing 1 can be relatively increased;
  • the second stress blocks 1 1 2 formed by the base portion 1 1 have a higher density and a smaller stress, so that the second stress blocks 112 have toughness.
  • the casing 1 has both overall strength improvement and toughness, and reaches the thickness of the casing 1 (ie, The thickness of the base 11 of the housing 1 can be made thinner and thinner, and the amount of material required for the housing 1 can be reduced. Thereby reducing the cost of the housing 1.
  • the thinned casing 1 of the present invention can be formed by the following manufacturing method.
  • the steps of the thinned casing manufacturing method of the present invention include:
  • Step 1 0 0 a casing blank 2 is placed in a mold 3 (as shown in the second figure), and the mold 3 has a plurality of discharge holes 3 1 at the bottom thereof, and the discharge holes 3 1 are Interval setting.
  • the discharge holes 31 may be disposed at a longitudinal interval; and the discharge holes 31 may be disposed at a lateral interval; or the discharge holes 31 may be staggered and spaced apart in the longitudinal direction and the lateral direction.
  • Step 1 1 0 The shell blank 2 is pressed by the high pressure press synthesis method, and a part of the residual material of the shell blank 2 is discharged from the discharge holes 31 of the mold 3, and the shell is made.
  • the blank 2 can be formed with a casing blank flow 2 1 through the remainder of the discharge holes 31.
  • a predetermined pressure is applied to the casing blank 2 in the mold 3 by the nip 4 of a high-pressure pressing device 4, and the casing blank 2 is subjected to the high-pressure pressing device 4.
  • the pressing of the nip 4 1 causes a portion of the residual material of the casing blank 2 to flow out of the discharge holes 3 1 of the mold 3, and the casing blank 2 passes through the discharge holes 3 1
  • the remaining material flowing out may be formed with the casing rough billet 2 1, and then the shell blank 2 is taken out from the mold 3 (as shown in the third and fourth figures); wherein the shell blank 2 corresponds to
  • the area of the hole 3 1 i.e., the block of the casing blank flow material 2 1
  • the area of the discharge hole 31 i.e., the block of the non-housing blank flow material 2 1
  • the area of the discharge hole 31 i.e., the block of the non-housing blank flow material 2 1
  • Step 1 2 0 The casing blank flow material 2 formed by the casing blank 2 is leveled to form a casing 1.
  • the leveling operation can use the milling method to enlarge the shell blank 2
  • the formed shell blank stream 2 1 and other residual materials are removed to form the thinned casing 1 of the present invention (as shown in the fifth figure).
  • the method for manufacturing a thinned casing of the present invention utilizes a casing blank 2 to be placed in a mold 3 having a plurality of discharge holes 31 in a bottom portion, and the casing blank 2 is formed by a high pressure compression type. Pressing, the remainder of the shell blank 2 flowing out through the discharge hole 31 can be formed with the shell blank billet 2 1, that is, the shell blank 2 is used to correspond to the discharge hole 3 1 position.
  • the region is formed with a shell blank flow material 2 1 such that the region of the shell blank 2 corresponding to the discharge hole 3 1 is not completely pressed to form a second density portion 1 1 2 of dense density, followed by a shell
  • the region of the body blank 2 whose non-corresponding discharge hole 31 is located cannot flow out to form the casing blank flow material 2 1, so that the region of the casing blank 2 whose non-corresponding discharge hole 31 is completely pressed
  • a casing 1 can be formed.
  • the base 1 of the casing 1 may be formed with a first plurality of density blocks 1 1 1 having a lower density, and a second stress block 1 1 2 having a larger complex density formed by the base 1 1 .
  • the first stress block 11 1 has a small density and a large stress, and the relative strength of the casing 1 is relatively increased.
  • the second stress block 1 is formed by the base portion 1 1 . 1 2 is denser and has less stress, so that the second stress block 112 has an inert property, and the first stress block 1 1 1 and the second stress block 1 1 2 are utilized.
  • the housing 1 has both overall strength and toughness, and the thickness of the housing 1 (i.e., the thickness of the base 1 1 of the housing 1) can be pressed to make it lighter and thinner, and can be reduced. The amount of material required for the housing 1 is used to reduce the cost of the housing 1.
  • the outer surface of the base 1 1 of the casing 1 may be provided with a embossed road, or the casing 1
  • the outer surface of the base 1 1 may be painted with a color or an image; in addition, the casing blank 2 and its casing 1 are made of at least one metal material (for example, other metal alloys such as aluminum, magnesium or titanium).

Abstract

一种薄型化之壳体结构及其制造方法，是将一壳体粗胚设置于一底部设有多个出料孔的模具中，利用高压压合成型方法对粗胚进行压合，使得粗胚经由出料孔所流出的余料形成壳体粗胚流料，粗胚对应出料孔位置的区域非完全被挤压而形成一密度大的第二应力区块，粗胚非对应出料孔位置的区域由于完全被挤压而形成密度小的第一应力区块，再将壳体粗胚流料整平形成壳体，由此得到的壳体其第一应力区块的应力大于第二应力区块的应力，且两种应力区块交错设置，使得壳体整体强度和韧性都得到提升，能够制造更为轻薄的壳体。

Description

薄型化之壳体结构及其制造方法 技术领域
本发明系有关一种薄型化之壳体结构及其制造方法， 特别是指 系将一壳体粗坯设置于一具底部设有复数出料孔之模具之中， 利用高压 压合成型方式将壳体粗坯经由出料孔而流出壳体粗坯流料， 使得壳体粗 坯其对应出料孔位置之区域非完全被挤压而形成一密度大之第二应力区 块， 又壳体粗坯其非对应该出料孔位置之区域系完全被挤压而形成一密 度小之第一应力区块， 达到一体成形之壳体其具有应力大之第一应力区 块及应力小之第二应力区块的交错设置， 俾使壳体兼具整体强度的提升 及具有韧性， 达到可制作出一厚度更为轻薄之壳体结构。 背景技术
随着电子技术发展成熟， 现今电子装置已被广泛的应用， 而就 可携式之电子装置 （例如： 笔记型计算机、 平版计算机或智能型行动通 讯装置） 而言， 为了能让消费者得以方便携带， 皆以轻薄及坚固耐用为 主要诉求， 也因为如此现今电子装置已研发出以金属合金 （如： 铝、 镁 或钛等其它金属合金） 为材质之壳体结构， 其主要原因在于金属合金所 制成之壳体结构， 其具备有重量轻、 热传导良好及可防止电磁干扰 （E M I ) 之特性， 所以金属合金所制成之壳体结构也逐渐被电子装置之制 造商所采用。
发明内容
然而， 就金属合金所制成之壳体而言， 例如： 镁合金所制成之 壳体， 大多以压铸方式作为主要制成方法， 其主要系将镁合金基材置于 一模具内以进行压铸， 藉以将镁合金基材成形为一壳体； 惟， 由于压铸 方式对于厚度越薄之壳体， 其成形难度相对更高， 主要因素在于当一壳 体其压铸厚度越薄时， 壳体则容易产生热裂、 氧化、 流紋、 强度（应力） 不足或形变等问题， 造成金属合金所制成之壳体其良率低； 此外， 当金 属合金所制成之壳体发生上述产品不良情况时， 则又必须以人力方式对 不良之壳体进行补修等整修程序， 如此一来， 势必增加人力工时， 致使 制造成本增加。
再者， 习知技术亦有以加压成型方式形成一金属壳体； 惟， 加压成 型方式对于厚度越薄之壳体， 其成形难度也相对更高， 主要因素在于当 对一金属基材于一密闭模具内进行高压压合时， 若预设压合之金属基材 薄度越薄， 金属基材表面受到的压力越大， 一旦超过金属基材可承受之 延展性时， 金属壳体则容易产生裂痕、 甚至破裂， 造成金属合金所制成 之壳体其良率低。 发明内容
为了解决上述习知技术的问题与缺陷，本发明揭露一种薄型化之 壳体结构制造方法， 系将一壳体粗坯设置于一具底部设有复数出料孔之 模具之中；利用高压压合成型方式对壳体粗坯进行压合，使得壳体粗坯其 经由出料孔所流出之余料可形成有壳体粗坯流料， 俾使壳体粗坯其对应 出料孔位置之区域非完全被挤压而形成一密度大之第二应力区块， 另外 壳体粗坯其非对应该出料孔位置之区域系完全被挤压而形成一密度小之 第一应力区块； 再将壳体粗坯所形成之壳体粗坯流料进行整平作业以形 成一壳体。 藉此， 利用壳体其第一应力区块之应力系大于第二应力区块 之应力的交错设置， 使得壳体兼具整体强度的提升及具有韧性， 达到可 制作出一厚度更为轻薄之壳体结构。
本发明揭露一种薄型化之壳体结构，所述壳体由至少一金属材料 以高压压合成型方式一体成形，壳体具一基部，并于基部周围形成有复数 侧壁， 且基部设有复数第一应力区块及复数第二应力区块， 该等第一应 力区块与该等第二应力区块系交错设置， 其中第一应力区块之应力系大 于第二应力区块之应力。 藉此， 透过该等第一应力区块其应力较大而可 相对增加壳体整体之强度， 再透过该等第二应力区块其应力较小而具有 韧性， 使得壳体兼具整体强度的提升及具有轫性， 达到壳体之厚度 （即 壳体之基部厚度） 可被制作成更为轻薄， 同时可减少壳体所需之材料用 量， 藉以降低壳体所需之成本。
图式简单说明 第一图： 系本发明壳体结构一外观之局部剖面图。
第二图： 系本发明壳体结构第一制程实施例示意图。
第三图： 系本发明壳体结构第二制程实施例示意图。
第四图： 系本发明壳体结构第三制程实施例示意图。
第五图： 系本发明壳体结构第四制程实施例示意图。
第六图： 系本发明第五图示中标示 A局部放大示意图。
第七图： 系本发明壳体结构一制造流程图。
实施方式 为使 贵审査员方便简捷了解本发明之其它特征内容与优点及 其所达成之功效能够更为显现， 兹将本发明配合附图， 详细叙述本发明 之特征以及优点， 以下之各实施例系进一步详细说明本发明之观点， 但 非以任何观点限制本发明之范畴。
本发明系揭露一种薄型化之壳体结构及其制造方法，请先参阅第 一图所示， 为本发明薄型化之壳体结构一外观之局部剖面图， 壳体 1可 由至少一金属材料以高压压合成型方式一体成形，其系可与一预设之电子 装置相结合。 而壳体 1具一基部 1 1， 并于基部 1 1周围形成有复数侧 壁 1 2， 由基部 1 1及该等侧壁 1 2相对构成一容置空间 1 0， 且基部 1 1设有复数第一应力区块 1 1 1及复数第二应力区块 1 1 2， 该等第 一应力区块 1 1 1与该等第二应力区块 1 1 2系交错设置， 其中第一应 力区块 1 1 1之密度系小于第二应力区块 1 1 2之密度， 使得第一应力 区块 1 1 1之应力 （强度） 系大于第二应力区块 1 1 2之应力 （强度）； 又， 壳体 1之基部 1 1上相对于容置空间 1 0中可预设有至少一凹槽 1 3、 至少一凸部 1 4及至少一结合部 1 5。
本发明之壳体 1系透过基部 1 1所形成该等第一应力区块 1 1 1其密度较小而具有较大之应力， 俾可相对增加壳体 1整体之强度； 此 外， 再透过基部 1 1所形成该等第二应力区块 1 1 2其密度较大而具有 较小之应力， 使得该等第二应力区块 1 1 2具有韧性。 利用该等第一应 力区块 1 1 1与该等第二应力区块 1 1 2交错设置， 俾使壳体 1兼具整 体强度的提升及具有韧性双重功效， 达到壳体 1之厚度 （即壳体 1之基 部 1 1厚度）可被制作成更为轻薄， 同时可减少壳体 1所需之材料用量， 藉以降低壳体 1所需之成本。
请再配合参阅第二至七图所示，本发明所揭露薄型化之壳体 1可 藉由下述之制造方法而形成， 本发明薄型化之壳体制造方法其步骤包括 有：
步骤 1 0 0： 将一壳体粗坯 2设置于一模具 3之中 （如第二图所 示），而模具 3其底部设有复数出料孔 3 1，该等出料孔 3 1系间隔设置。 所述该等出料孔 3 1系可呈纵向间隔设置； 又该等出料孔 3 1系可呈横 向间隔设置； 或者该等出料孔 3 1系可呈纵向及横向交错并间隔设置。
步骤 1 1 0 : 利用高压压合成型方式对壳体粗坯 2进行压合， 让 壳体粗坯 2之部份余料系由模具 3之该等出料孔 3 1流出， 俾使壳体粗 坯 2其经由该等出料孔 3 1所流出之余料可形成有壳体粗坯流料 2 1 。 于髙压压合成型过程中，利用一高压压合装置 4之压合部 4 1对模具 3内 之壳体粗坯 2施以一预设压力， 壳体粗坯 2受高压压合装置 4之压合部 4 1的挤压， 使得壳体粗坯 2之部份余料系由模具 3之该等出料孔 3 1 流出， 而壳体粗坯 2其经由该等出料孔 3 1所流出之余料可形成有壳体 粗坯流料 2 1， 再将壳体粗坯 2从模具 3中取出 （如第三、 四图所示)； 其中， 壳体粗坯 2其对应出料孔 3 1位置之区域 （即壳体粗坯流料 2 1 之区块） 非完全被挤压而形成一密度大之第二应力区块 1 1 2， 另外壳 体粗坯 2其非对应出料孔 3 1位置之区域 （即非壳体粗坯流料 2 1之区 块） 系完全被挤压而形成一密度小之第一应力区块 1 1 1 。
步骤 1 2 0：将壳体粗坯 2所形成之壳体粗坯流料 2 1进行整平 作业以形成一壳体 1。 所述整平作业， 可利用铣平方式将壳体粗坯 2所 形成之壳体粗坯流料 2 1以及其它余料除去， 藉以成形本发明所揭露薄 型化之壳体 1 (如第五图所示)。
本发明薄型化之壳体制造方法，系利用将一壳体粗坯 2设置于一 底部具设有复数出料孔 3 1之模具 3之中，利用高压压合成型方式对壳体 粗坯 2进行压合， 让壳体粗坯 2其经由出料孔 3 1所流出之余料可形成 有壳体粗坯流料 2 1， 即利用壳体粗坯 2其对应出料孔 3 1位置之区域 形成有壳体粗坯流料 2 1， 使得壳体粗坯 2其对应出料孔 3 1位置之区 域没有完全被压合而形成一密度大之第二应力区块 1 1 2， 其次壳体粗 坯 2其非对应出料孔 3 1位置之区域无法流出形成壳体粗坯流料 2 1， 使得壳体粗坯 2其非对应出料孔 3 1位置之区域被完全被压合而形成一 密度小之第一应力区块 1 1 1， 再将壳体粗坯 2其壳体粗坯流料 2 1及 其它余料铣平后， 俾可成形一壳体 1。 其中， 壳体 1其基部 1 1可形成 有复数密度较小之第一应力区块 1 1 1、 以及形成有复数密度较大之第 二应力区块 1 1 2， 透过基部 1 1所形成该等第一应力区块 1 1 1其密 度较小而具有较大之应力， 俾可相对增加壳体 1整体之强度； 此外， 再 透过基部 1 1所形成该等第二应力区块 1 1 2其密度较大而具有较小之 应力， 使得该等第二应力区块 1 1 2具有轫性， 利用该等第一应力区块 1 1 1与该等第二应力区块 1 1 2交错设置， 俾使壳体 1兼具整体强度 的提升及具有韧性双重功效， 达到壳体 1之厚度 （即壳体 1之基部 1 1 厚度） 可被压合制作成更为轻薄， 同时可减少壳体 1所需之材料用量， 藉以降低壳体 1所需之成本。
所述壳体 1其基部 1 1外部表面可设有压花紋路，或者壳体 1其 基部 1 1外部表面可喷涂有颜色或图像； 另外， 所述壳体粗坯 2及其壳 体 1系为至少一种金属材质 （例如： 铝、 镁或钛等其它金属合金)。
惟， 上列详细说明系针对本发明之一可行实施例之具体说明， 该 实施例并非用以限制本发明， 而凡未脱离本发明技艺精神所为之等效实 施或变更， 均应包含于本案之专利范围中。

Claims

权 利 要 求 书
、 一种薄型化之壳体制造方法， 该方法包括以下步骤：
将一壳体粗坯设置于一模具之中， 该模具其底部设有复数出料孔， 该等 出料孔系间隔设置；
利用高压压合成型方式对该壳体粗坯进行压合， 于高压压合成型过程 中， 该壳体粗坯之部份余料系由该模具之该等出料孔流出， 而该壳体粗 坯其经由该等出料孔所流出之余料可形成有壳体粗坯流料，俾使该壳体 粗坯其对应该出料孔位置之区域形成一密度大之第二应力区块，以及该 壳体粗坯其非对应该出料孔位置之区域形成一密度小之第一应力区块； 将该壳体粗坯所形成之该壳体粗坯流料进行整平作业以形成一壳体，该 壳体其第一应力区块之应力系大于第二应力区块之应力。
、 如请求项 1所述之薄型化之壳体制造方法， 其中该整平作业可利用铣 平方式将该壳体粗坯所形成之壳体粗坯流料除去。
、 如请求项 1所述之薄型化之壳体制造方法， 其中该壳体粗坯系为至少 一种金属材质。
、 如请求项 3所述之薄型化之壳体制造方法， 其中该金属材质可为铝、 镁或钛等其它金属合金。
、 一种薄型化之壳体结构， 该壳体具一基部， 于该基部周围形成有复数 侧壁， 由该基部及该等侧壁相对构成一容置空间， 且该基部设有复数 第一应力区块及复数第二应力区块， 该等第一应力区块与该等第二应 力区块系交错设置， 其中该第一应力区块之密度系小于该第二应力区 块之密度， 令该第一应力区块之应力系大于该第二应力区块之应力。 、 如请求项 5所述之薄型化之壳体结构， 其中该壳体之基部相对于容置 空间中可设有至少一凹槽。
、 如请求项 5所述之薄型化之壳体结构， 其中该壳体之基部相对于容置 空间中可设有至少一凸部。
、 如请求项 5所述之薄型化之壳体结构， 其中该壳体之基部相对于容置 空间中可设有至少一结合部。
、 如请求项 5所述之薄型化之壳体结构， 其中该壳体之基部外部表面可 设有压花紋路。
0、 如请求项 5所述之薄型化之壳体结构， 其中该壳体之基部外部表面 可喷涂设有颜色或图像
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