A7 404162 五、發明說明（1) 【發明之所屬技術領域】 (請先閱讀背面之注意事項再填寫本頁) 本發明係有關電子機器用筐體的製造方法，特別是有 關於從模具裝置內部取出模具成形品的情形。 【先前之技術】 有關輕金屬製電子機器用筐體，最近大多採用以鎂合 金爲主要素材的合金，利用壓鑄法或觸變法來使這些合金 成形。這些成形法，雖然在裝置構造上各有不同，但是其 條件都是必須將溶解於5 8 0度至7 5 0度的合金射出於 大約1 0 0度至3 5 0度的模具裝置的內部使其成形。 經濟部智慧財^局員工消費合作社印製 在此，藉圖1顯示以往之電子機器用筐體的構造。在 此電子機器用筐體1，係從模具裝置之溶液導入部的車轍 2導入溶液（在此圖，係拿對應剛剛成形後之電子機器用 筐體的形狀的部分，及圖2之模具裝置1 0的斷面圖來說 明），使經由直線3導入所要的模具內部。被導入的溶液 ，會遍佈整個模槽4然後到達通氣口 5，另外此通氣口 5 連接有溶液槽6。因此，當溶液從車轍2被導入時，會經 由此通氣口 5流出去，就可以使筐體內部成真空狀態地成 形。 雖然，如此藉由將溶液導入模具裝置1 0的內部可以 製成模具成形品，但是要將此模具從模槽4內部取出，必 須使用噴射銷7向外擠壓取出此模具成形品。 爲了要如上述利用噴射銷7向外擠壓取出此模具成形 品，所以在模具裝置1 0的內部，設有如圖2所示的噴射 -4- 本纸張尺度適用中國國家標準（CNS)A4規格<2】0 X 297公釐） 經濟部智慧財-J-局員工消費合作社印製 404162 A7 B7 五、發明說明（2) 銷7結構。 然而，在電子機器用筐體1的材質主要是採用輕金屬 的情況下，一般係可以達到電子機器用筐體1薄型化的效 果，如果使用鎂合金爲材質的話，則其厚度大約爲0 . 7 〜1 . Omm。因此，要將模具成形品從模具裝置內部擠 壓取出的話，透過該擠壓動作，會因噴射銷7使被擠壓的 部位產生凹陷留下如圖3所示的擠壓痕跡8。 類似這樣的擠壓痕跡8，如果在電子機器用筐體1設 多處凸起或支撐的話，會隨之使此擠壓力增大，則隨著上 述電子機器用筐體1的薄型化，此被擠壓的部位就會更明 顯。 並且，透過這樣的擠壓力所造成的變形並不只限於輕 金屬的材質，合成樹脂的情形也會發生，只是合成樹脂的 情形多半以白化現象而被接受。 當類似這樣的擠壓痕跡8的凹陷變形產生時，則會影 響外觀上的美觀，以致缺乏量產性。 並且，利用噴射銷7擠壓時，透過該擠壓力，不單只 有擠壓部位，整個模具成形品都可能會有歪曲等變形的情 形發生，一旦發生如此變形的情形時，就無法用來製成電 子機器用筐體1，而且還會因變形導致形狀不良的原因。 【發明之手段】 本發明係針對上述問題點，其目的在提供一種從模具 裝置內部藉由噴射銷擠壓時，不會產生變形的電子機器及 -5- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------------I -----I--訂---—--I--線 <請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 404162 五、發明說明（3 ) 其製造方法與模具裝置。 在一適用的實施例裡，本發明之電子機器，其特徵爲 ’係由筐體，及設在上述筐體之模具裝置內部的噴射銷的 連接部位，至少比上述連接部位的周圍還厚的增厚部所構 成。 另外’本發明之模具裝置，係具有形成由金屬材料所 構成之筐體的第1型及第2型，及在模具成形品形成後， 將此模具成形品從第1型擠壓取出的噴射銷，其特徵爲， 在上述第1型之噴射銷的突出部位，形成有因噴射銷的擠 壓所形成之增厚部的凹部。 還有，有關本發明之電子機器的製造方法，係爲利用 具有由金屬材料所構成之筐體的電子機器，藉由噴射銷的 擠壓使擠壓部分形成有增厚部之凹部的模具裝置，來製成 電子機器的製造方法，其特徵爲，係由將溶液導入上述模 具裝置內部的流動過程，及使在上述流動過程中被導入模 具裝置內部之溶液硬化形成筐體的硬化過程，及利用噴射 銷擠壓在上述.硬化過程中所形成之模具成形品的增厚部， 來將模具成形品從模具裝置內部取出的取出過程所構成。 【圖面之簡單說明】 圖1係顯示以往之實施例之電子機器的筐體形狀的斜 視圖。 圖2係顯示以往之模具裝置的構造斷面圖。 圖3係顯示形成在以往之電子機器用筐體之擠壓痕跡 -6- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） — -------t--------訂---------峻 (請先閲讀背面之注意事項再填寫本頁) 404162 A7 經濟部智慧財產局員工消費合作社印*1私 _____B7__五、發明說明（4 ) 的斜視圖。 圖4係顯示本發明之實施形態之一的電子機器，可攜 帶型電腦的形狀的斜視圖。 圖5係顯示相同之電子機器的電子機器用筐體的構造 斜視圖。 圖6係顯示構成相同之電子機器之電子機器用筐體的 增厚部及支撐的形狀平面圖。 圖7係顯示相同之模具裝置的構造斷面圖。 圖8係顯示具有相同之電子機器用筐體的電子機器的 製造方法圖，8 A係爲解除模具裝置之第1型及第2型的 結合的狀態圖，8 B係爲在此第1型藉由噴射銷擠壓模具 成形品的狀態圖。 圖9係顯示具有相同之電子機器的製造方法的流程圖。 圖10係顯示本發明之變形實施例的電子機器的電子 機器用筐體的狀態的部分斷面圖，係顯示形成突出部的狀 態圖。 圖11係顯示本發明之變形實施例的電子機器的電子 機器用筐體的狀態的部分斷面圖，係顯示在電子機器用筐 體內部突出形成增厚部的狀態圖。 圖12係顯示本發明之變形實施例的電子機器的電子 機器用筐體的狀態的部分斷分圖，係顯示在電子機器用筐 體外部突出形成增厚部的狀態圖。 主要元件對照表 ％ 1 電子機器用筐體 2 車轍 (請先閱讀背面之注意事項再填寫本頁) 二一 二 三 - I---II ^ 11111111 1 · 二 三 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 404162 A7 經濟部智慧財產局員工消費合作社印製 _B7五、發明說明（5) 3 直線 4 模槽 5 通氣口 6 凹槽 7 噴射銷 8 擠壓痕跡 10 模具裝置 11 電腦本體 12 顯示器 13 筐體 14 下筐體 15 上筐體 2 0 電子機器用筐體 2 1 增厚部 2 2 支撐 2 4 增厚部 24a 頂上部 24b 傾斜部 2 5 增厚部 25a 頂上部 25b 傾斜部 30 模具裝置 3 1 第1型 3 2 第2型 (請先閱讀背面之注意事項再填寫本頁) — — — — — —— — — — — ι,ν· --------------訂---------繞 -8- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 404162 B7 五、發明說明（6 ) 3 3 車 轍 3 4 直 線 3 5 模 槽 3 6 凹 部 3 7 突 出部位 3 8 插 通孔 3 9 噴 射銷 4 0 彈 簧 4 1 固 定型 4 2 凹 部 4 3 溝 部 4 4 通 氣口 4 5 凹 槽 5 0 模 具成形品 — —卜 I I . U — I I I I — I I I I I I _ — — — — — — — · (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 【本發明之實施形態】 以下，將針對本發明之一實施形態，參照圖4至圖8 加以說明。 圖4，係顯示筆記型電腦等可攜帶型電腦1 0的外觀 形狀圖。在此圖當中，可攜帶型電腦1 0，係具有電腦本 體1 1，及可以自由轉動地被支撐在此電腦本體1 1的顯 示器12。另外，此電腦本體11具有筐體13，此筐體 1 3，係藉由螺絲等將下筐體1 4及上筐體1 5結合構造 而成。但是雖然如此，下筐體1 4及上筐體1 5結合構造 -9- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 經濟部智慧財產局員工消費合作社印製 404162 a? __B7 _ 五、發明說明（7 ) 並不局限於此，也可以利用其他結合構造來構成。 在此，在以下的說明當中，將針對適用於可攜帶型電 腦1 0等之電子機器的筐體的電子機器用筐體2 0，進行 說明。 圖5係顯示利用本發明之噴射銷3 9進行擠壓時，並 不會產生變形之電子機器用筐體2 0的形狀。在此圖當中 ，突出形成有比電子機器用筐體2 0的筐體本體還高出一 定高度的增厚部2 1，並且，從此增厚部2 1的頂端部緩 緩傾斜朝周邊部，大約9 0度間隔地設有支撐2 2。而圖 6即顯示從上鳥瞰此狀態的平面圖。 要製造具備此構造的電子機器用筐體20，使透過噴 射銷3 9的擠壓力不會產生擠壓痕跡，係使用下述之模具 裝置3 0。 圖7所顯示的模具裝置3 0，係藉由結合第1型3 1 及第2型32所搆成，透過此第1型31及第2型32的 結合，使在其內部形成模槽3 5的構造。要將溶液導入此 模槽3 5，係從溶液導入口之車轍3 3將溶液導入，使溶 液擴散於直線3 4而幾乎成平行狀態地流入模槽3 5內部 〇 擴散於直線3 4而被導入之溶液，在塡充此模槽3 5 的同時，會被導入形成在第1型3 1的凹部3 6。凹部 3 6，係在設有第1型3 1之噴射銷3 9的部位凹設一定 深度所構成，將溶液導入此凹部36使其硬化的話，即在 模具成形品5 0構成了增厚部2 1。 -10 · 本紙張尺i適用中國國家標準（CNS)A4規格（210 X 297公釐） ---K---------^----------I I I I I 1 (請先閱讀背面之注意事項再填寫本頁) 404162 A7 B7 五、發明說明（8) 另外，此增厚部2 1的突出高度，如果電子機器用筐 體20的厚度係介於〇.7〜1.Omm的範圍裡的話， 則筐體厚度係大約突出20%，介於0.84〜1.2 m m之間。 此凹部3 6，係設在第1型3 1內部之噴射銷突出部 位3 7。爲使連接此噴射銷突出部位3 7，在第1型3 1 內部形成有插通孔3 8，構成噴射銷3 9可以出入自在地 安裝在此插通孔3 8的構造。 然後，將噴射銷3 9插通於此插通孔3 8。此噴射銷 3 9，係形成沿著上述插通孔3 8，可以自由移動的構造 ，朝下方突出之該下端部係形成從第1型3 1之模槽3 5 內壁面突出的構造。 另外，在噴射銷3 9的上端，設有付勢手段的彈簧 40。此彈簧40，係成對噴射銷39付予從第1型31 之模槽3 5內壁面突出之付勢力的構造。要構成此構造， 在上述彈簧4 0的一端設有固定模具4 1。此固定模具 4 1，係位於第1型3 1上方，係爲可以往上下驅動的配 置。 在固定模具4 1，設有具有一定大小的凹部42。在 此凹部4 2，係構成承接上述彈簧4 0之上端的構造。因 此，只要驅動使固定模具4 1往下，而對應其作用即可付 予噴射銷3 9付勢力。 雖然藉由將溶液導入上述凹部3 6的動作，可以於模 具成形品50形成上述增厚部21，但是只有增厚部21 -11 - 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) i I I I I !訂·！ ί ί 線 經濟部智慧財產局員工消費合作社印製 A7 404162 B7 五、發明說明（9) 的話，當利用噴射銷3 9擠壓此部分時，可能無法完全避 免電子機器用筐體2 0產生歪曲等變形的情形發生。因此 ’爲了防止變形的情形發生，在模具成形品5 0的增厚部 2 1的周圍，於指定之間隔的角度設有支撐2 2。 此支撐2 2，係成從增厚部2 1的頂端部的外周緣部 緩緩傾斜的傾斜狀，具有相當的長度，並且，由於係從凹 部3 6緩緩傾斜，所以可以使溶液很順暢地流入此凹部 3 6 〇 還有，此支撐2 2的長度，具有當利用噴射銷3 9擠 壓增厚部2 1時，不會使模具成形品5 0產生歪曲等變形 情形發生的長度，並且考慮到安裝其他電子零件等的因素 ，有限制此支撐2 2的長度。 爲了在模具成形品5 0形成類似這樣的支撐2 2，在 模裝置3 0的凹部3 6的周圍，形成有對應支撐2 2的溝 部4 3。藉由將溶液導入此溝部4 3，來形成上述之支撐 2 2。 塡充模槽3 5內部之溶液’會到達對應此模槽3 5之 直線3 4的另一端的通氣口 4 4。此通氣口 4 4，係用來 使存在於模槽3 5內部的空氣向外流出，使被導入模槽 3 5內部的溶液，可以在該內部保持真空狀態地到達凹槽 4 5。 有關使用具有上述構造之模具裝置3 0來製造電子機 器用筐體2 0的方法，係如下述。另外，此製造方法係如 圖9所示。 •12· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝·! I訂·！ II -線 經濟部智慧財產局員工消費合作社印製 A7 B7 404162 五、發明說明（1G) 首先，先將溶液流入模槽3 5內部使塡充〔流動過程 〕，之後，利用冷卻使塡充之溶液硬化〔硬化過程〕。然 後，當模具成形品5 0形成之後，必須將該模具成形品 50從模槽35取出〔取出過程〕。 因此，雖然如圖8 ( a )所顯示的，必須解除第1型 3 1和第2型3 2的咬合，將模具成形品5 0取出，但在 解除第1型3 1和第2型3 2的咬合的開放狀態下，設在 具有一般電子機器用筐體2 0所具有之支撐構造及凸起， 或上述凹部3 6及支撐2 2等凹凸形狀的模具成形品5 0 的第1型3 1，會形成附著有模具成形品5 0的狀態。 這個時候，必須將模具成形品5 0從第1型3 1取出 ，要進行這樣的取出作業，必須進行如圖8 ( b )所顯示 之藉由噴射銷3 9對模具成形品5 0進行擠壓動作。 這個時候，雖然藉由將溶液導入模具裝置3 0，可以 在模具成形品5 0形成增厚部2 1及支撐2 2，但是由於 此增厚部2 1及支撐2 2，係被設在噴射銷3 9的突出部 位，所以在增厚部2 1會承受噴射銷3 9的擠壓作用力而 被向外壓出。 雖然藉由此噴射銷3 9，可以將模具成形品5 0從模 具裝置3 0的內部向外壓出，但是這時的模具成形品5 0 ，還連著模具裝置3 0內部的車轍3 3及直線3 4，所以 在取出此模具成形品5 0之後，必須將這些部位切斷。如 此一來，就形成了電子機器用筐體20。 由於透過上述構成之電子機器用筐體2 0及其製造方 -13- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝--------訂-------1線 經濟部智慧財產局員工消費合作社印製 A7 404162 B7_ 五、發明說明（11) (請先閱讀背面之注意事項再填寫本頁) 法與模具裝置3 0，在利用噴射銷3 9取出模具成形品 5 0的部分構成有增厚部2 1，藉由此增厚部2 1來承受 噴射銷3 9的擠壓作用力的話，就可以製造薄型化的電子 機器用筐體2 0，防止凹陷等變形情況的發生影響到電子 機器用筐體2 0的外觀。 因此，不但可以製造良好外觀之電子機器用筐體2 0 ，還可以防止因擠壓造成之變形所導致之不良成形的產生 。所以，藉由增厚部2 1的形成，可以改善電子機器用筐 體2 0的量產性。 另外，由於從此增厚部2 1的頂端部緩緩傾斜好像形 成一個斜面，在間隔一定角度處設有支撐2 2，所以可以 更加防止此電子機器用筐體2 0有凹陷變形，或彎曲變形 等不良成形的情形發生。 特別是，利用支撐2 2來強化製成薄型化的電子機器 用筐體2 0，可以完善地防止整個電子機器用筐體2 0的 形狀產生變形。 經濟部智慧財產局員工消費合作社印製 並且，由於在形成有增厚部2 1及支撐2 2的情況下 ’係事先在模具裝置3 0形成有凹部3 6及溝部4 3，所 以只要將溶液導入模具裝置3 0的模槽3 5內部並使其硬 化，即可形成具有增厚部2 1及支撐2 2的模具成形品 5 0。因此，就算用增厚部2 1擋住噴射銷3 9，也可以 防止在取出模具成形品5 0時使此模具成形品5 0發生變 形’達到電子機器用筐體2 0形成的效率化，同時還可以 降低製造成本。 -14- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） A7 404162 B7___ 五、發明說明（12) 以上，係針對本發明之一實施形態所作的說明，但是 除此之外本發明也適用於各種變形。以下將針對這些其他 變形加以說明。， 在上述實施形態，增厚部2 1係如圖5、圖6所顯示 的’其頂上部的形狀係成略圓形狀，但是除此之外，增厚 部2 1之頂上部的形狀也可以是四角形等任何形狀都可以 〇 還有，支撐2 2的形狀，也並不限於緩緩傾斜的斜面 ’也可以是具有一定高度之只延伸出指定常度的形狀。 並且，除了增厚部2 1以外，例如如圖1 0所顯示的 ’使與電子機器用筐體2 0之噴射銷3 9連接的部分突出 變形形成突出部，也可以構成在此突出的突出部2 3連接 噴射銷3 9 »這個時候，模具裝置3 0的內部形狀，也必 須形成對應此狀態的形狀，只需要將溶液導入模具裝置 30內部，即可形成突出部23。 還有，就突出部而言，除了可以形成突出部2 3以外 ，如圖1 1所顯示的，也可以在噴射銷3 9的連接部分朝 電子機器用筐體2 0的內向突出形成增厚部2 4。此增厚 部24，係具有頂上部24a，及從此頂上部24a緩緩 傾斜朝周邊部形成之傾斜部2 4 b。在此構成裡，傾斜部 2 4b係具有噴射銷3 9連接頂上部2 4 a的補強作用。 另外，雖然在圖1 2係顯示朝電子機器用筐體2 〇的 內向突出形成增厚部2 4的構造，但是也可以如圖1 1所 顯示的朝電子機器用筐體2 0的外向突出形成增厚部2 5 • 15- 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐〉 (請先閱讀背面之注意事項再填寫本頁) 裝-----— II訂·！-線 經濟部智慧財產局員工消費合作社印製 A7 404162五、發明說明（13) 。這個時候也同樣地，如上述，此增厚部2 5係具有頂上 部2 5 a及傾斜部2 5 b。如圖4所顯示的，在攜帶式電 腦1 0的下筐體1 4的底面形成數個此增厚部2 5的話， 就可以以此增厚部2 5做爲接觸桌面等的接觸部。 其他，在不更改本發明之要旨的範圍內還可以做各式 各樣的變形。 (請先閲讀背面之注意事項再填窝本頁) 裝·！ I訂· —----線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -16-A7 404162 V. Description of the invention (1) [Technical field of the invention] (Please read the precautions on the back before filling out this page) The present invention relates to the manufacturing method of the housing for electronic equipment, and in particular, to the inside of the mold device. When the molded article is taken out. [Previous Technology] Regarding housings for electronic equipment made of light metals, recently, alloys mainly using magnesium alloys have been used, and these alloys are formed by die-casting or thixotropic methods. Although these forming methods are different in terms of the device structure, the conditions are all that the alloy dissolved in 580 to 750 degrees must be shot into the inside of a mold device of about 100 to 350 degrees. Make it shape. Printed by the Consumer Cooperatives of the Ministry of Economic Affairs and the Smart Finance Bureau. Figure 1 shows the structure of a conventional enclosure for electronic equipment. Here, the housing 1 for the electronic device is introduced from the rut 2 of the solution introduction part of the mold device (in this figure, the part corresponding to the shape of the housing for the electronic device immediately after molding is taken, and the mold device of FIG. 2 10 is a cross-sectional view for explanation), and a desired mold is introduced into the mold via a straight line 3. The introduced solution will spread throughout the mold groove 4 and then reach the vent 5, and the vent 5 is connected to the solution tank 6. Therefore, when the solution is introduced from the rut 2, it flows out through the vent 5 and the inside of the casing can be formed in a vacuum state. Although a molded article can be made by introducing the solution into the inside of the mold device 10 in this way, to remove the mold from the inside of the die groove 4, it is necessary to squeeze out the molded article using an ejection pin 7. In order to use the ejection pin 7 to squeeze out the mold formed product as described above, the mold device 10 is provided with a spray as shown in FIG. 2 -4- This paper size is applicable to Chinese National Standard (CNS) A4 Specifications < 2] 0 X 297 mm) Printed by the Ministry of Economic Affairs ’Smart Assets-J- Bureau employee consumer cooperative 404162 A7 B7 V. Description of the invention (2) Pin 7 structure. However, when the material of the housing 1 for electronic equipment is mainly made of light metal, the thickness of the housing 1 for electronic equipment can be generally reduced. If a magnesium alloy is used as the material, the thickness is about 0.7. ~ 1. Omm. Therefore, if the molded product is to be squeezed out from the inside of the mold device, the squeezed portion is depressed by the ejection pin 7 through the squeeze action, leaving a squeeze mark 8 as shown in FIG. Similar to the squeeze marks 8, if a plurality of protrusions or supports are provided in the casing 1 for an electronic device, the pressing force will increase accordingly. As the thickness of the casing 1 for an electronic device is reduced, This squeezed area becomes more visible. In addition, the deformation caused by such a pressing force is not limited to a light metal material, and the situation of a synthetic resin also occurs, but the situation of a synthetic resin is mostly accepted as a whitening phenomenon. When the depression deformation of the squeeze marks 8 like this occurs, the aesthetic appearance is affected, so that mass productivity is lacking. In addition, when the injection pin 7 is used for pressing, not only the pressing part, but also the entire die-molded product may be deformed due to the pressing force. Once such deformation occurs, it cannot be used for manufacturing. It becomes a housing 1 for electronic equipment, and also causes a shape defect due to deformation. [Means of Invention] The present invention is directed to the above problems, and its purpose is to provide an electronic device that does not deform when squeezed from the inside of a mold device by a spray pin, and the paper size applies to Chinese national standards (CNS ) A4 specification (210 X 297 mm) ------------ I ----- I--Order -------- I--line < Please read the note on the back first Please fill in this page again for details) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 404162 V. Description of the invention (3) Manufacturing method and mold device. In a suitable embodiment, the electronic machine of the present invention is characterized in that the connection portion of the casing and the injection pin provided inside the mold device of the casing is at least thicker than the periphery of the connection portion. Consisting of thickened section. In addition, the 'mold device of the present invention includes a first type and a second type which form a casing made of a metal material, and a spray which extracts the molded product from the first type after the molded product is formed. The pin is characterized in that a recessed portion of a thickened portion formed by the extrusion of the ejection pin is formed at a protruding portion of the ejection pin of the first type. In addition, the manufacturing method of the electronic device of the present invention is a mold device using an electronic device having a housing made of a metal material, and forming a recessed portion with a thickened portion in a pressed portion by pressing of a spray pin. To make an electronic machine manufacturing method, which is characterized by a hardening process of introducing a solution into the inside of the mold device, and a hardening process in which the solution introduced into the mold device during the above-mentioned flow is hardened to form a casing, and The ejection pin is used to squeeze out the thickened part of the mold formed product formed in the above-mentioned hardening process, and is configured to take out the mold formed product from the inside of the mold device. [Brief Description of Drawings] Fig. 1 is a perspective view showing the shape of a casing of an electronic device according to a conventional embodiment. Fig. 2 is a sectional view showing the structure of a conventional mold device. Figure 3 shows the squeezing marks formed on a conventional electronic machine housing. -6- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)-------- t-- ------ Order --------- Jun (Please read the notes on the back before filling this page) 404162 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs * 1Private _____B7__V. Invention Description (4) An oblique view. Fig. 4 is a perspective view showing the shape of a portable computer as an electronic device according to an embodiment of the present invention. Fig. 5 is a perspective view showing the structure of an electronic device housing of the same electronic device. Fig. 6 is a plan view showing the shape of a thickened portion and a support of an electronic device casing constituting the same electronic device. Fig. 7 is a sectional view showing the structure of the same mold device. FIG. 8 is a diagram showing a manufacturing method of an electronic device having the same housing for an electronic device. FIG. 8 A is a state diagram in which the first type and the second type of the mold device are released, and 8 B is the first type here. A state diagram in which a molded product is pressed by a spray pin. FIG. 9 is a flowchart showing a manufacturing method of the same electronic device. Fig. 10 is a partial sectional view showing a state of a housing for an electronic device of an electronic device according to a modified embodiment of the present invention, and is a view showing a state where a protruding portion is formed. Fig. 11 is a partial cross-sectional view showing a state of a casing for an electronic device of an electronic device according to a modified embodiment of the present invention, and is a view illustrating a state where a thickened portion protrudes inside the casing for an electronic device. Fig. 12 is a partial fragmentary view showing a state of a casing for an electronic device of an electronic device according to a modification of the present invention, and is a view illustrating a state where a thickened portion is protruded outside the casing for an electronic device. Comparison table of main components% 1 Electronic machine housing 2 Rutting (please read the precautions on the back before filling this page) 2123-I --- II ^ 11111111 1 · 23 paper standards are applicable to Chinese national standards ( CNS) A4 specification (210 X 297 mm) 404162 A7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs_B7 V. Description of the invention (5) 3 Straight 4 Die grooves 5 Vent 6 Grooves 7 Spray pins 8 Extrusion marks 10 Mould device 11 Computer body 12 Display 13 Case 14 Lower case 15 Upper case 2 0 Electronic equipment case 2 1 Thickened part 2 2 Support 2 4 Thickened part 24a Top upper part 24b Inclined part 2 5 Thickened part 25a Top part 25b Inclined part 30 Mold device 3 1 Type 1 3 2 Type 2 (Please read the precautions on the back before filling this page) — — — — — — — — — — — ι, ν · --- ----------- Order --------- wrap-8- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) A7 404162 B7 V. Invention Explanation (6) 3 3 Rutting 3 4 Straight 3 5 Mould groove 3 6 Recess 3 3 Projecting part 3 8 Insertion hole 3 9 Spray pin 4 0 Spring 4 1 Fixed type 4 2 Recessed part 4 3 Groove part 4 4 Vent port 4 5 Groove 5 0 Molded product — Bu II. U — IIII — IIIIII _ — — — — — — — (Please read the back Note: Please fill in this page again.) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs [Embodiment of the present invention] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 4 to 8. Fig. 4 is a diagram showing the appearance of a portable computer 10 such as a notebook computer. In this figure, a portable computer 10 includes a computer body 11 and a display 12 which is rotatably supported by the computer body 11. In addition, the computer main body 11 includes a housing 13 and the housing 13 is a structure in which the lower housing 14 and the upper housing 15 are combined by screws or the like. However, despite this, the combined structure of the lower case 14 and the upper case 15 is -9- This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 404162 a? __B7 _ 5. The invention description (7) is not limited to this, and it can also be constructed by using other combined structures. Here, in the following description, a housing 20 for an electronic device suitable for a housing of an electronic device such as a portable computer 10 will be described. Fig. 5 shows the shape of a housing 20 for an electronic device which is not deformed when the ejection pin 39 of the present invention is pressed. In this figure, a thickened portion 21 that is higher than the housing body of the electronic device housing 20 by a certain height is formed in a protruding manner, and the tip portion of the thickened portion 21 is gradually inclined toward the peripheral portion from this point. Supports 22 are provided at intervals of approximately 90 degrees. Figure 6 shows a plan view of this state from above. To manufacture a housing 20 for an electronic device having such a structure so that a squeezing mark is not generated by the pressing force transmitted through the injection pin 39, a mold device 30 described below is used. The mold device 30 shown in FIG. 7 is constituted by combining the first type 31 and the second type 32, and through the combination of the first type 31 and the second type 32, a mold groove 3 is formed in the inside. 5 construction. To introduce the solution into the mold slot 35, the solution is introduced from the rut 3 of the solution introduction port, so that the solution diffuses in a straight line 3 4 and flows into the mold slot 3 5 in a nearly parallel state. The introduced solution will be introduced into the concave portion 36 formed in the first type 3 1 while filling the mold groove 3 5. The recessed portion 36 is formed by recessing a certain depth in the portion where the first pin 3 9 is provided with the ejection pin 3 9. When the solution is introduced into the recessed portion 36 and hardened, a thickened portion is formed in the mold molded product 50. twenty one. -10 · This paper rule i applies Chinese National Standard (CNS) A4 (210 X 297 mm) --- K --------- ^ ---------- IIIII 1 ( Please read the precautions on the back before filling this page) 404162 A7 B7 V. Description of the invention (8) In addition, the protruding height of this thickened part 21 is 1 if the thickness of the housing 20 for electronic equipment is between 0.7 ~ In the range of 1.0mm, the thickness of the casing is about 20%, which is between 0.84 ~ 1.2 mm. This recessed portion 36 is the protruding portion 37 of the ejection pin provided inside the first type 31. In order to connect the projecting portion 37 of the ejection pin, an insertion hole 3 8 is formed inside the first type 3 1, and the ejection pin 39 can be freely installed in the insertion hole 38. Then, the injection pin 39 is inserted into the insertion hole 38. The ejection pin 39 has a structure that can move freely along the above-mentioned insertion hole 38, and the lower end portion protruding downward forms a structure that protrudes from the inner wall surface of the mold groove 3 5 of the first type 31. In addition, an upper end of the ejection pin 39 is provided with a spring 40 for supporting means. This spring 40 has a structure in which a pair of injection pins 39 are provided with a force that projects from the inner wall surface of the mold groove 35 of the first type 31. To constitute this structure, a fixed die 41 is provided at one end of the above-mentioned spring 40. This fixed mold 41 is located above the first type 31 and is a configuration that can be driven up and down. The fixed mold 41 is provided with a recessed portion 42 having a constant size. The recess 42 is structured to receive the upper end of the spring 40. Therefore, as long as the fixed mold 41 is driven downward, the ejection pin 39 can be applied in response to its action. Although the thickened portion 21 can be formed in the mold molded product 50 by introducing the solution into the recessed portion 36, only the thickened portion 21 -11-This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling out this page) i IIII! ί ί Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 404162 B7 5. In the description of the invention (9), when this part is squeezed with the ejection pin 3 9, it may not be possible to completely avoid the distortion of the electronic machine housing 2 0 Such as deformation occurs. Therefore, in order to prevent deformation, a support 22 is provided around the thickened portion 21 of the mold-molded product 50 at a predetermined interval angle. This support 22 is inclined in a shape that is gradually inclined from the outer peripheral edge portion of the top end portion of the thickened portion 21, and has a considerable length, and because it is gradually inclined from the concave portion 36, the solution can be made smooth. The ground flows into the recessed portion 3 6 0, and the length of the support 2 2 has a length that does not cause deformation such as distortion of the mold molded product 50 when the thickened portion 2 1 is pressed by the injection pin 3 9. In consideration of factors such as installation of other electronic parts, there is a limitation on the length of this support 22. In order to form a support 22 similar to this in the mold molded product 50, a groove portion 43 corresponding to the support 22 is formed around the recessed portion 36 of the mold device 30. The above-mentioned support 2 2 is formed by introducing a solution into this groove portion 4 3.塡 The solution in the filling cavity 3 5 ′ will reach the vent 4 4 at the other end of the straight line 3 4 corresponding to this cavity 35. This vent 44 is used to allow the air existing inside the cavity 3 5 to flow outward, so that the solution introduced into the cavity 35 can reach the cavity 45 under the vacuum state. The method for manufacturing the housing 20 for an electronic device using the mold device 30 having the above-mentioned structure is as follows. This manufacturing method is shown in Fig. 9. • 12 · This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page). Printed by the Consumer Property Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 404162 V. Description of the Invention (1G) First, the solution is first poured into the mold tank 3 5 to charge the battery [flow process], and then the cooling is used to charge the battery. Solution hardening [hardening process]. Then, after the mold-molded product 50 is formed, the mold-molded product 50 must be taken out from the mold groove 35 [removal process]. Therefore, as shown in FIG. 8 (a), it is necessary to release the engagement of the first type 31 and the second type 32 to take out the mold molded product 50, but to release the first type 31 and the second type 3 In the open state of 2, the first type is provided with a support structure and a protrusion provided in a general electronic device housing 20, or a concave-convex shaped mold molded article 50 such as the concave portion 36 and the support 22. 31, a state where a molded article 50 is attached is formed. At this time, the mold-molded product 50 must be taken out from the first type 31. To perform such a removal operation, the mold-molded product 50 must be extruded by the ejection pin 39 as shown in FIG. 8 (b).压 动。 Pressing action. At this time, although the solution is introduced into the mold device 30, it is possible to form the thickened portion 21 and the support 22 in the mold molded product 50. However, since the thickened portion 21 and the support 22 are formed by the injection Since the protruding portion of the pin 39 is exposed to the pressing force of the ejection pin 39 at the thickened portion 21, it is pushed out. Although the injection molded pin 39 can be used to push the molded product 50 out from the inside of the mold device 30, at this time, the molded product 50 is also connected to the ruts 33 and 3 in the mold device 30. Straight lines 3 to 4, so after taking out this mold molded product 50, these parts must be cut. As a result, a housing 20 for an electronic device is formed. Because of the above-structured electronic machine housing 20 and its manufacturer-13- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page ) Pack -------- Order ------- 1 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 404162 B7_ V. Description of Invention (11) (Please read the notes on the back before filling This page) method and mold device 30, thickened portion 21 is formed at the portion where the molded article 50 is taken out by the injection pin 39, and the thickened portion 21 receives the squeezing action of the injection pin 39. With force, it is possible to manufacture a thin electronic device case 20 and prevent deformation such as depression from affecting the appearance of the electronic device case 20. Therefore, not only can the electronic device housing 20 with a good appearance be manufactured, but also the occurrence of poor forming due to deformation due to extrusion can be prevented. Therefore, by forming the thickened portion 21, the mass productivity of the housing 20 for an electronic device can be improved. In addition, since the top end portion of the thickened portion 21 is gradually inclined as if it forms a slope, and the support 2 2 is provided at a certain interval, it is possible to prevent the electronic device housing 20 from being deformed or bent. Such as the occurrence of poor forming. In particular, by using the support 22 to reinforce the electronic device casing 20 to be made thin, it is possible to perfectly prevent the shape of the electronic device casing 20 from being deformed. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and in the case where the thickened portion 21 and the support 22 are formed, the recess 3 6 and the groove portion 4 3 are formed in the mold device 30 in advance. The mold groove 30 of the mold device 30 is introduced and hardened to form a mold molded product 50 having a thickened portion 21 and a support 22. Therefore, even if the injection pin 39 is blocked by the thickened portion 21, it is possible to prevent deformation of the molded article 50 when the molded article 50 is taken out, thereby achieving the efficiency of forming the electronic machine casing 20 and simultaneously It can also reduce manufacturing costs. -14- This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) A7 404162 B7___ V. Description of the invention (12) The above is a description of one embodiment of the present invention, but otherwise The present invention is also applicable to various modifications. These other variations will be described below. In the above embodiment, the thickness of the thickened portion 21 is shown in FIG. 5 and FIG. 6. It can be any shape such as a quadrangle. Also, the shape of the support 22 is not limited to a slowly inclined slope. It can also be a shape with a certain height that extends only a specified degree. Further, in addition to the thickened portion 21, for example, as shown in FIG. 10, a portion that is connected to the ejection pin 39 of the electronic device casing 20 is deformed to form a protruding portion, and a protruding portion may be configured to protrude therefrom. The part 2 3 is connected to the ejection pin 3 9 »At this time, the internal shape of the mold device 30 must also be formed into a shape corresponding to this state, and the protruding portion 23 can be formed by simply introducing the solution into the mold device 30. In addition, as for the protruding portion, in addition to forming the protruding portion 23, as shown in FIG. 11, the connecting portion of the ejection pin 39 may be formed to protrude and thicken toward the inward direction of the electronic device housing 20. Department 2 4. The thickened portion 24 has a top upper portion 24a, and an inclined portion 2 4b formed gradually from the top upper portion 24a toward the peripheral portion. In this configuration, the inclined portion 24b has a reinforcing effect of the ejection pin 39 connected to the top upper portion 2a. In addition, although the structure in which the thickened portion 24 is formed to protrude toward the inward direction of the electronic device housing 20 is shown in FIG. 12, it is also possible to protrude toward the outward direction of the electronic device housing 20 as shown in FIG. 11. Form thickened part 2 5 • 15- This paper size is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) ·! -Printed by A7 404162, Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, 5. Description of Invention (13). At this time, too, as described above, the thickened part 25 has a top part 2 5 a and an inclined part 2 5 b. As shown in FIG. 4, if several thickened portions 25 are formed on the bottom surface of the lower casing 14 of the portable computer 10, the thickened portions 25 can be used to contact the desktop or the like. Contact parts. In addition, various deformations can be made within the scope of not changing the gist of the present invention. (Please read the precautions on the back before filling in this page.) Printed on paper produced by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics, the paper size applies to China National Standard (CNS) A4 ( 210 X 297 mm) -16-