CN1306466A - Electronic appts. method of mfg. same, and mold device - Google Patents
Electronic appts. method of mfg. same, and mold device Download PDFInfo
- Publication number
- CN1306466A CN1306466A CN99807586A CN99807586A CN1306466A CN 1306466 A CN1306466 A CN 1306466A CN 99807586 A CN99807586 A CN 99807586A CN 99807586 A CN99807586 A CN 99807586A CN 1306466 A CN1306466 A CN 1306466A
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- China
- Prior art keywords
- basket
- electronic equipments
- metal
- mentioned
- ejection pin
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
- B22D17/22—Dies; Die plates; Die supports; Cooling equipment for dies; Accessories for loosening and ejecting castings from dies
- B22D17/2236—Equipment for loosening or ejecting castings from dies
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
An electronic apparatus such as a portable computer comprises an electronic case and a raised portion provided on that region of the electronic case which engages an ejector pin projecting from inside a mold device and formed thicker than the other part of the electronic case.
Description
The present invention relates to electronic equipments basket manufacture method, particularly about situation from the inner taking-up of metal mould device metal pattern formed products.
With in the basket, mainly used magnesium alloy as raw material at light metal system electronic equipments recently, these alloys have been shaped by die casting or thixotropy method.No matter in these forming processes, device construction is different, but which kind of, all needs alloy reaction-injection moulding in 100～350 ℃ of metal mould devices with 580～750 ℃ of fusings as its molding condition.
Here, Fig. 1 shows the formation of existing electronic equipments with basket 1.When forming this electronic equipments with basket 1, liquation is imported (in the figure from the cast gate 2 as the liquation lead-in portion of metal mould device, to describe corresponding to the sectional drawing of the electronic equipments after being shaped with basket shape part and Fig. 2 metal mould device 10), liquation is imported the metal pattern inside that requires by runner 3.The liquation that imports flows through whole inner chamber 4 and arrives arbitrary exhaust outlet 5, and the cup 6 of ining succession on this exhaust outlet.Therefore, liquation one imports from cast gate 2, can air be discharged to the outside by this exhaust outlet 5, can not form under there is not the state in hole in basket inside thus.
Can form the metal pattern formed products by in such metal mould device 10, importing liquation, but be that this metal pattern formed products is taken out from inner chamber 4 inside, and use ejection pin 7 that this metal pattern formed products is released the outside.
In order the metal pattern formed products to be released, as shown in Figure 2,, be provided with ejection pin 7 in metal mould device 10 inside with such ejection pin 7.
Adopt light metal as electronic equipments with under the material situation of basket 1, wish that generally this electronic equipments does to such an extent that approach with basket 1 as far as possible, be under the material situation with the magnesium alloy, its wall thickness is about 0.7～1.0mm.Therefore, when the metal pattern formed products is released from metal mould device is inner, because this release power, the position depression of ejection pin 7 pushings of being everlasting, residual release vestige 8 shown in Figure 3.
This release vestige 8, as being provided with under the situation of concaveconvex shapes such as many places flange or rib on basket 1 at electronic equipments, because corresponding release power increases, and along with above-mentioned electronic equipments produces more obvious vestige with basket 1 attenuation meeting pushing the position.
It is the situation of material that the distortion that is produced by this release power also is not limited to the light metal, also can produce when using synthetic resin, can not see emulsion in the situation of using synthetic resin.
As produce the depressed deformation of this release vestige, and plain in appearance, also can't produce in batches simultaneously.
Under situation with ejection pin 7 pushings, because pushing force, not only releasing the position, and metal pattern formed products integral body also tends to produce distortion such as deflection, produce such distortion exactly, also can not provide and use, become the reason that causes shape defect because of distortion with basket 1 as electronic equipments.
The present invention is based on promptly that above-mentioned situation proposes, and its purpose is, provide have the electronic equipments of the basket that does not also produce distortion by ejection pin from metal mould device under the inner release situation and manufacture method thereof with and metal mould device.
In a suitable embodiment, electronic equipments of the present invention is characterised in that, it has basket and thickened section, and wherein thickened section is located at the position from the inner butt ejection pin of metal mould device of above-mentioned basket, and forms thicklyer than above-mentioned butt position periphery wall thickness at least.
In addition, have first mould and second mould that is used for forming basket in that the present invention is this, and have the metal mould device that forms behind the metal pattern formed products ejection pin that this metal pattern formed products is released from first mould, it is characterized in that by metal material,
At the ejection pin ledge of above-mentioned first mould, form recess, so that releasing part, ejection pin becomes thickened section.
Electronic equipments manufacture method of the present invention is, with forming recess so that ejection pin is released metal mould device that part becomes thickened section is shaped in the manufacture method of electronic equipments with basket that metal material makes, it is characterized in that it has flow process, curing process and taking-up operation.Wherein, flow process is to make liquation flow through above-mentioned metal mould device inside; Curing process is to make the liquation that imports metal mould device inside in the above-mentioned flow process be solidified to form basket; Taking out operation and be the thickened section of releasing the metal pattern formed products that forms in the above-mentioned curing process with ejection pin takes out the metal pattern formed products from metal mould device is inner.
Fig. 1 is the basket shape is used in expression as the electronic equipments of conventional example a stereogram; Fig. 2 is the sectional drawing that expression conventional example metal mould device constitutes; Fig. 3 is illustrated in the stereogram of conventional example electronic equipments with the state of generation vestige on the basket; Fig. 4 is the stereogram of expression as the hand-held computer shape of the electronic equipments of one embodiment of the invention; Fig. 5 is the stereogram that the electronic equipments of the same electronic equipments of expression constitutes with basket; Fig. 6 is that expression constitutes the plane of the electronic equipments of same electronic equipments with the shape of basket thickened section and rib; Fig. 7 is the sectional drawing that the same metal mould device of expression constitutes; Fig. 8 is that expression has the figure of same electronic equipments with the electronic equipments manufacture method of basket, Fig. 8 A is expression first mould that disassembles metal mould device and the figure of the mated condition of second mould, and Fig. 8 B is that expression is with the figure of ejection pin from first mould release metal pattern formed products state; Fig. 9 is the flow chart of the same electronic equipments manufacture method of expression; Figure 10 is the part sectioned view that the electronic equipments of the electronic equipments of expression variation of the present invention is used the basket state, is that expression forms the figure that heaves portion's state; Figure 11 is the part sectioned view that the electronic equipments of the electronic equipments of expression variation of the present invention is used the basket state, is the inner outstanding formation heavy section of the basket state diagram of expression electronic equipments; Figure 12 is the part sectioned view of the electronic equipments of expression variation electronic equipments of the present invention with the basket state, is the outside outstanding heavy section state diagram that forms of basket of expression electronic equipments.
Below by accompanying drawing 4～8 one embodiment of the invention is described.
Fig. 4 is the outside drawing of shape of the hand-held computer 10 of expression laptop etc.In the figure, hand-held computer 10 has computer body 11 and the display 12 that is supported on this computer body 11 free to rotate.Computer body 11 has basket 13, and this basket 13 is made of such as suitably being joined together by screw bottom basket 14 and top basket 15.And bottom basket 14 also is not limited thereto with the formation that engages of top basket 15, also can be made of other to be joined together.
Here, in the following description, the basket that is applicable to luggable computer 10 electronic equipments such as grade is illustrated with basket 20 as electronic equipments.
Even the shape that also can not produce the electronic equipments of distortion with basket 20 under by the situation of ejection pin 39 ejections of the present invention has been shown among Fig. 5.In the figure, give prominence to the thickened section 21 that has formed specified altitude by electronic equipments with the basket body of basket 20, the top, top from this thickened section 21 becomes the rib 22 of gentle slope to the periphery setting again, such as roughly becoming 90 ° of arranged spaced.Fig. 6 is a plane of seeing this state from above.
Use in the basket 20 for the electronic equipments that has this structure in manufacturing, do not produce the formed vestige of release power, adopted following metal mould device 30 by ejection pin 39.
Liquation from runner 34 diffusion importings, in filling inner chamber 35, be imported into the recess 36 that forms on first mould 31, recess 36, in the recessed prescribed depth in the position of establishing ejection pin 39 of first mould 31, enter this recess 36 and curing as liquation, promptly constituted the thickened section of being located on the metal pattern formed products 50 21.
The projecting height of this thickened section 21 is set at: when being roughly 0.7～1.0mm scope, 20% of outstanding basket wall thickness becomes the wall thickness of 0.84～1.2mm to electronic equipments with the wall ratio of basket 20.
This recess 36 is located at the outstanding position 37 of ejection of first mould, 31 inside.For being communicated with this ejection protuberance 37,, in this inserting hole 38, ejection pin 39 can be set with freely coming in and going out at first mould, the 31 inner inserting holes 38 that form.
In ejection pin 39 upper ends, be provided with spring 40 as the device of energizing.40 pairs of ejection pins 39 of this spring are energized to inner chamber 35 internal faces that make it from first mould 31 direction that highlights.In order to energize a distolateral fixed die 41 that is installed on of above-mentioned spring 40.This fixed die 41 is positioned at first mould, 31 tops, is arranged to drive form up and down.
Recess 42 with prescribed level is being set on fixed die 41, and the upper end of above-mentioned spring 40 is arranged in this recess 42.Therefore, as this fixed die 41 is driven downwards, corresponding elastic force can act on the ejection pin 39.
Flow into above-mentioned recess 36 by liquation, promptly on metal pattern formed products 50, form above-mentioned thickened section 21, but only when thickened section 21 pushes this part with ejection pin 39, usually can not prevent that electronic equipments from distortion such as deflection taking place on the whole with basket 20.For preventing this distortion, on metal pattern formed products 50, around thickened section 21, rib 22 is set with the predetermined distance angle.
This rib 22 becomes the ramped shaped that slowly tilts from thickened section 21 top top outer peripheral edges portions, and has enough length, and simultaneously, owing to also form slowly from recess 36, the liquation that enters this recess 36 also spreads apart easily.
In addition, the length of rib 22 under the situation with ejection pin 39 pushing thickened section 21, is not as the criterion not produce distortion such as deflection on metal pattern formed products 50; Consider the installation of other electronic components etc. in addition, the length of this rib 22 is also restricted.
Owing on metal pattern formed products 50, form such rib, so around the recess 36 of metal mould device 30, formed ditch portion 43 corresponding to rib 22.Enter this ditch portion 43 by liquation, can form above-mentioned rib 22.
Filling the liquation of inner chamber 35, arrive exhaust outlet 44 facing to the opposite side of the runner 34 of this inner chamber 35.This exhaust outlet 44 is used for and will exists the air of inner chamber 35 inside to be discharged to the outside from these inner chamber 35 inside, and thus, the liquation that imports inner chamber 35 inside can arrive cup 45, and can prevent the inner chamber 35 inner holes that produce simultaneously.
Now make electronic equipments and be described below, and this manufacture method is shown on Fig. 9 with the manufacture method of basket 20 with the metal mould device 30 of above-mentioned such formation.
At first, make liquation filling inner chamber 35 inside (flow process) of flowing, then make the liquation cooling curing (curing process) of filling, one forms metal pattern formed products 50, must as early as possible it be taken out (taking-up operation) from inner chamber 35.
For this reason, shown in Fig. 8 (a), must decompose combining of first mould 31 and second mould 32, take out metal pattern formed products 50, but when decomposing and opening the combining of first mould 31 and second mould 32, because first mould 31 has formed the concaveconvex shape of rib structure that electronic equipments often has with basket 20 and flange or above-mentioned recess 36 and rib 22 etc., and is located on the metal pattern formed products 50, thus metal pattern formed products 50 often one-tenth be attached to states on first mould 31.
Therefore, must metal pattern formed products 50 be taken out from first mould 31,, shown in Fig. 8 (b), need release this metal pattern formed products 50 by ejection pin 39 for carrying out this taking-up from this state.
In this case, by importing liquation to metal mould device 30, on metal pattern formed products 50, form thickened section 21 and rib 22, and, bear the release power of ejection pin 39 and be pushed out into the outside by this thickened section because these thickened section 21 and rib 22 are located at the outstanding position of ejection pin 39.
By this ejection pin 39 metal pattern formed products 50 being released the outside from metal mould device 30 inside takes out it, but also do not excise state corresponding to the cast gate 33 of metal pattern 30 inside and the part of runner 34 owing to also be in this metal pattern formed products 50, so after this metal pattern formed products 50 is taken out, these part excisions must be formed electronic equipments basket 20 thus.
Thus, can guarantee the good surface appearance performance of electronic equipments with basket 20, meanwhile, the shaping bad phenomenon that distortion causes in the time of also can preventing by release.Therefore, form thickened section 21 and guaranteed the good batch of product performance of electronic equipments with basket 20.
In addition and since become from top, thickened section 21 top the gentle slope in accordance with regulations angle intervals be provided with rib 22, so can prevent further that this electronic equipments is with shaping unfavorable conditions such as basket 20 generation depressed deformations, deflection deformations.
Particularly strengthen with basket 20, can prevent well that this electronic equipments from producing deflection with basket 20 whole shapes with 22 pairs of thin electronic equipments of rib.
Moreover, because under the situation that forms this thickened section 21 and rib 22, in metal mould device 30, formed recess 36 and ditch 43 in advance, only it has been solidified, can form metal pattern formed products 50 with thickened section 21 and rib 22 by means of inner chamber 35 inside that liquation imported metal mould device 30.Therefore, even bearing ejection pin 39 with this thickened section 21, produce distortion in the time of also can preventing to take out metal pattern formed products 50 on this metal pattern formed products, this not only is expected to improve the efficient when forming electronic equipments with basket 20, and can reduce cost thereupon.
One embodiment of the invention more than has been described, but the present invention also can carry out the outer all distortion of present embodiment, is described below.
In the above-described embodiments, as Fig. 5, shown in Figure 6, the top shaped upper part of thickened section 21 is slightly circular, and in addition, the top shaped upper part of thickened section 21 also can become arbitrary shapes such as quadrangle.
In addition, the shape of rib 22 also is not limited to into the gentle slope shape, such as also can only prolonging specific length under the certain altitude situation having.
Besides, outside the above-mentioned thickened section 21, also can make electronic equipments heave into protuberance and be out of shape like that as shown in figure 10, make the portion of the heaving 23 butt ejection pins 39 of heaving formation with 39 ones of the butt ejection pins of basket 20.In this case, metal mould device 30 interior shapes also become corresponding therewith shape, as long as liquation is imported metal mould device 30 inside, can form the portion of heaving 23 thus.
And as protuberance, except that forming above-mentioned heaving the portion 23, as shown in figure 11, also can form to electronic equipments in butt ejection pin 39 parts and give prominence to the heavy section 24 that forms with side in the basket 20.This heavy section 24 by top top 24a, with delay the rake 24b incline from this top, top 24a to periphery and constitute.In this formation, rake 24b can play booster action under the 24a situation of top, ejection pin 39 butts top.
Be to form heavy section 25 with side in the basket 20 is outstanding on Figure 12, but also can image pattern 11 such to electronic equipments, to electronic equipments with basket 20 foreign sides outstanding formation heavy section 25.At this moment also as above-mentioned, heavy section 25 have top top 25a, with rake 25b.If as shown in Figure 4, the number place forms these heavy sections 25 on the diapire face of hand-held computer 10 bottom baskets 14, can make heavy section 25 play the effect of the contact site that contacts with base plate etc.
Other can do all distortion in the scope that does not change main idea of the present invention.
Claims (6)
1. an electronic equipments is characterized in that it has basket and thickened section, and wherein thickened section is located at the butt position of ejection pin above-mentioned basket, that come out from metal mould device inside, and the wall than above-mentioned butt position periphery is thick at least.
2. by the described electronic equipments of claim 1, it is characterized in that, be provided with ribs at above-mentioned thickened section periphery.
3. an electronic equipments is characterized in that it has basket and protuberance, and wherein protuberance is located at the butt position of ejection pin above-mentioned basket, that come out from metal mould device inside, and also will highlight than above-mentioned butt position periphery at least.
4. a metal mould device has first mould and second mould of the metal material system of being used to form basket, and have and form the ejection pin of this metal pattern formed products being released from first mould behind the metal pattern formed products, it is characterized in that, ejection pin ledge at above-mentioned first mould, form thickened section for making ejection pin release part, and formed recess.
5. by the described metal mould device of claim 4, it is characterized in that, be formed with the ditch portion that is used to form ribs at above-mentioned recess periphery.
6. form the electronic equipments manufacture method of electronic equipments with the metal mould device of claim 4 or claim 5, it is characterized in that it has flow process, curing process and taking-up operation with metal material system basket device; Wherein flow process is used to make liquation to flow through above-mentioned metal mould device inside; Curing process is to make the liquation that imports metal mould device inside in above-mentioned flow process be solidified to form basket; Taking out operation is the thickened section of releasing the metal pattern formed products that is formed by above-mentioned curing process with ejection pin, thereby the metal pattern formed products is taken out from metal mould device is inner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP173024/1998 | 1998-06-19 | ||
| JP10173024A JP2000005859A (en) | 1998-06-19 | 1998-06-19 | Electronic equipment, its manufacture, and die device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1306466A true CN1306466A (en) | 2001-08-01 |
Family
ID=15952806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN99807586A Pending CN1306466A (en) | 1998-06-19 | 1999-04-02 | Electronic appts. method of mfg. same, and mold device |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20010001978A1 (en) |
| JP (1) | JP2000005859A (en) |
| CN (1) | CN1306466A (en) |
| TW (1) | TW404162B (en) |
| WO (1) | WO1999065632A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102941332A (en) * | 2012-12-04 | 2013-02-27 | 宁波勋辉电器有限公司 | Movable die pull-back structure of die casting die |
| WO2015035537A1 (en) * | 2013-09-16 | 2015-03-19 | Zhang Xuli | Thin housing structure and manufacturing method thereof |
| CN107457383A (en) * | 2017-08-08 | 2017-12-12 | 东莞市和镁五金有限公司 | A kind of die-casting forming die and compression molding process of LED display module drain pan |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007469A (en) * | 2001-06-25 | 2003-01-10 | Canon Inc | Light emitting element and display equipment |
| JP4772365B2 (en) * | 2005-04-15 | 2011-09-14 | 株式会社東芝 | Case forming method |
| JP4686440B2 (en) * | 2006-12-26 | 2011-05-25 | 株式会社東芝 | Electronics |
| US20090321034A1 (en) * | 2008-06-30 | 2009-12-31 | Kabushiki Kaisha Toshiba | Die and method of manufacturing cast product |
| JP5463709B2 (en) * | 2009-03-27 | 2014-04-09 | 富士電機株式会社 | Power converter |
| JP2011119299A (en) * | 2009-11-30 | 2011-06-16 | Toshiba Corp | Electronic device |
| JP5175944B2 (en) * | 2011-01-12 | 2013-04-03 | 株式会社東芝 | Electronics |
| US8899302B2 (en) * | 2012-03-22 | 2014-12-02 | Mahase Bhola | Mold valve |
| JP5726826B2 (en) * | 2012-08-30 | 2015-06-03 | 株式会社東芝 | Electronics |
| JP6420122B2 (en) * | 2014-11-05 | 2018-11-07 | 株式会社ケーヒン | Power converter |
| JP6406216B2 (en) * | 2015-11-09 | 2018-10-17 | トヨタ自動車株式会社 | Method for manufacturing metal casing |
| CN112935226B (en) * | 2021-01-30 | 2022-03-22 | 浙江新峰机械有限公司 | Hub blank demoulding device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH074654B2 (en) * | 1986-12-08 | 1995-01-25 | 扶桑軽合金株式会社 | Product removal method in die casting |
| JPH0811556B2 (en) * | 1987-06-19 | 1996-02-07 | 本田技研工業株式会社 | Body frame for motorcycles |
| JP3021296B2 (en) * | 1994-09-13 | 2000-03-15 | 株式会社デンソー | Box for electronic device, method of manufacturing the same, and method of using the same |
-
1998
- 1998-06-19 JP JP10173024A patent/JP2000005859A/en active Pending
-
1999
- 1999-03-09 TW TW088103638A patent/TW404162B/en not_active IP Right Cessation
- 1999-04-02 CN CN99807586A patent/CN1306466A/en active Pending
- 1999-04-02 WO PCT/JP1999/001764 patent/WO1999065632A1/en active Application Filing
-
2000
- 2000-12-18 US US09/737,872 patent/US20010001978A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102941332A (en) * | 2012-12-04 | 2013-02-27 | 宁波勋辉电器有限公司 | Movable die pull-back structure of die casting die |
| WO2015035537A1 (en) * | 2013-09-16 | 2015-03-19 | Zhang Xuli | Thin housing structure and manufacturing method thereof |
| CN107457383A (en) * | 2017-08-08 | 2017-12-12 | 东莞市和镁五金有限公司 | A kind of die-casting forming die and compression molding process of LED display module drain pan |
Also Published As
| Publication number | Publication date |
|---|---|
| US20010001978A1 (en) | 2001-05-31 |
| WO1999065632A1 (en) | 1999-12-23 |
| TW404162B (en) | 2000-09-01 |
| JP2000005859A (en) | 2000-01-11 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |