TWM501084U - 散熱器的尾部固定支架 - Google Patents

散熱器的尾部固定支架 Download PDF

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TWM501084U
TWM501084U TW103223432U TW103223432U TWM501084U TW M501084 U TWM501084 U TW M501084U TW 103223432 U TW103223432 U TW 103223432U TW 103223432 U TW103223432 U TW 103223432U TW M501084 U TWM501084 U TW M501084U
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fixing bracket
heat
heat sink
fin module
fins
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chong-xian Huang
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chong-xian Huang
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/007—Auxiliary supports for elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

散熱器的尾部固定支架
本創作係關於一種固定支架，尤指一種專供插植結合於散熱鰭片模組的散熱器尾部固定支架。
已知散熱器，至少包括一散熱底座及一散熱鰭片模組，或在散熱鰭片模組再裝設一個以上的熱導管，該熱導管的延伸一端另可結合一固定座，所述熱導管的散熱端主要係嵌入或貫穿結合於散熱底座或散熱鰭片，熱導管的吸熱端則可直接或間接的貼觸熱源，以供進行熱溫的傳遞及散熱工作；上述散熱鰭片模組係由複數個散熱鰭片相鄰排列而組成，該散熱器於裝設結合基板(PCB板)時，通常還需要通過輔助扣具，以便將散熱器定位結合於基板上，並保持散熱底座與熱源可呈良好接觸。習知散熱器的輔助扣具，主要是係依散熱器的不同形態而各有匹配扣具可提供輔助結合。
如新型第M298873號專利案所揭，其係一種可供固定散熱器的壓合扣具，亦即散熱器的輔助扣具，係包括一座體及一壓掣體所組成，而其中的散熱器並在兩端預先增設拉勾，以供座體穿設，再將壓掣體穿入座體而卡合定位於基板，使散熱器可定位結合於基板上。
習知包含散熱底座、散熱鰭片模組、熱導管及固定座所組成的散熱器，熱導管的延伸一端係結合一固定座，而固定座本身已具有複數個可供鎖固結合於基板的腳座，惟熱導管所嵌入或貫穿結合的散熱鰭片模組，其尾部與基板的結合方式，目前已知作法，都只是在該散熱鰭片模組的尾部直接施以焊接或膠黏結合，以使散熱鰭片模組尾部可固定於基板上，然此作法因必須倚賴焊接或膠黏的加工，故整體組裝仍嫌複雜不便，實有美中不足。
本創作之主要目的，乃在於提供一種散熱器的尾部固定支架，該固定支架係專供插植結合於散熱鰭片模組的尾部，其係一體沖壓成型而於一側形成一底板，另一側則向上轉折延伸形成一具有鎖孔的鎖合板，底板的內央並沖壓形成一呈半相連的上插片，上插片係朝上而反向轉折，散熱鰭片模組係於鰭片相對位置開設貫穿孔，使固定支架的上插片可匹配插入貫穿孔，進而與散熱鰭片模組形成緊配的插接結合，如此即可利用固定元件(如螺栓)穿入鎖合板的鎖孔，將散熱鰭片模組的尾部快速鎖固於基板，因此整體組裝更簡單方便，使散熱鰭片模組尾部能快速穩固的結合於基板上，具有簡化組裝的優點。
本創作之次要目的，乃在於提供一種散熱器的尾部固定支架，該固定支架係可於上插片的內壁面上沖設複數個呈間隔相離的凸部，其間隔相離的間距係匹配於各鰭片的相隔間隙，因此可利用複數個凸部分別對應並卡止 於各鰭片的間隙中，進而形成複數個卡止定位的結合效果，確保固定支架與散熱鰭片模組的結合更加穩固，故能有效防止固定支架的上插片與散熱鰭片模組的貫穿孔發生脫落。
本創作之又一目的，乃在於提供一種散熱器的尾部固定支架，該固定支架的底板內央係形成一中孔，而於該中孔兩側壁的上表面亦可沖設形成複數個間隔的凸部，且各凸部的間隔相離間距亦對應匹配於各鰭片的相隔間隙，故於上插片插入散熱鰭片模組的貫穿孔後，同樣可利用複數個凸部分別對應卡止於各鰭片的間隙中，使固定支架於上下端同時具有凸部可產生防脫離的雙重卡止定位效果。
本創作之另一目的，乃在於提供一種散熱器的尾部固定支架，該固定支架的上插片板體厚度係公差大於散熱鰭片模組貫穿孔的孔徑，因此於上插片插入散熱鰭片模組的貫穿孔後，即可獲得良好的緊迫定位結合。
本創作之再一目的，乃在於提供一種散熱器的尾部固定支架，該固定支架係插植結合於散熱鰭片模組的尾部，而散熱鰭片模組係可包含一個以上的熱導管，該熱導管的散熱端可嵌入或貫穿結合於散熱鰭片模組，而延伸的吸熱端則嵌入結合於一固定座，並使該熱導管的吸熱端呈適當外露，進而可直接貼觸於熱源，以供進行熱溫的傳遞及散熱工作。
1‧‧‧固定支架
2‧‧‧散熱鰭片模組
3‧‧‧熱導管
4‧‧‧固定座
11‧‧‧底板
111‧‧‧中孔
112‧‧‧側壁
113‧‧‧凸部
12‧‧‧鎖合板
121‧‧‧鎖孔
13‧‧‧上插片
131‧‧‧凸部
21‧‧‧鰭片
211‧‧‧貫穿孔
41‧‧‧腳座
第一圖為本創作第一實施例於組裝前的立體圖。
第二圖為本創作固定支架的立體圖。
第三圖為第二圖的上視圖。
第四圖為第三圖的a-a剖面圖。
第五圖為本創作第一實施例於組裝後的立體圖。
第六圖為本創作第一實施例於組裝後的底視圖。
第七圖為第六圖的b-b剖面圖。
第八圖為本創作第二實施例中固定支架的立體圖。
第九圖為本創作第二實施例中固定支架的斷面圖。
第十圖為本創作第二實施例的組合斷面圖。
第十一圖為本創作第三實施例中固定支架的立體圖。
第十二圖為本創作第三實施例中固定支架的斷面圖。
第十三圖為本創作第三實施例的組合斷面圖。
如茲依附圖實施例將本創作結構特徵及其他作用、目的詳細說明如下：
如第一圖及第二圖所示，本創作所為「散熱器的尾部固定支架」，該固定支架1係專供插植結合於一散熱鰭片模組2的尾部，而與該散熱鰭片模組2形成緊配結合，如第三圖及第四圖所示，所述固定支架1為一體沖壓成型，其一側係形成一底板11，而另一側則向上轉折延伸形成一具有鎖孔121的鎖合板12，底板11的內央並沖壓形成一呈半相連的上插片13，上插片13係朝上反向轉折，且散熱鰭片 模組2係於各鰭片21的相對位置開設貫穿孔211，使固定支架1的上插片13可匹配插入貫穿孔211，進而與散熱鰭片模組2形成緊配結合(如第五圖所示)。
上述固定支架1，係以上插片13匹配插入貫穿孔211，而與散熱鰭片模組2形成緊配結合，該固定支架1並以一側鎖合板12的鎖孔121可供任意固定元件(如螺栓等)貫穿，而將散熱鰭片模組2的尾部快速鎖固於基板(PCB板)，因此整體組裝更簡單方便，使散熱鰭片模組2尾部能快速穩固的結合於基板上，具有簡化組裝的優點。
如第六圖所示，本創作的固定支架1，其中該底板11係托持定位於散熱鰭片模組2的底面，而上插片13係匹配插入散熱鰭片模組2的貫穿孔211，故固定支架1與散熱鰭片模組2係呈插入托持狀態的夾置結合。
如第七圖所示，上述固定支架1的上插片13，其係在內壁面上沖設形成複數個間隔的凸部131，各凸部131的間隔相離間距係對應匹配於各鰭片21的相隔間隙，故上插片13插入貫穿孔211後，可利用複數個凸部131分別對應並卡止於各鰭片21的間隙中，進而於每個凸部131均能產生防脫離的卡止定位效果，用以確保固定支架1與散熱鰭片模組2的結合更加穩固，能有效防止固定支架1的上插片13與散熱鰭片模組2的貫穿孔211發生脫落情事。
上述固定支架1的底板11，其內央因沖壓一朝上反向轉折的上插片13而留下一中孔111，如第八、九圖的另一實施例所示，該中孔111的兩側壁112同理亦可在上表 面沖設形成複數個間隔的凸部113，且各凸部113的間隔相離間距亦對應匹配於各鰭片21的相隔間隙，故於上插片13插入散熱鰭片模組2的貫穿孔211後，同樣也可利用複數個凸部113分別對應卡止於各鰭片21的間隙中(如第十圖所示)，使固定支架1於上下端同時具有凸部131與113產生防脫離的雙重卡止定位效果，以確保固定支架1插入結合後，即無脫落之虞。
如第十一、十二圖之再一實施例所示，上述固定支架1的底板11與上插片13，其必要時亦可省略凸部，惟以該上插片13板體的厚度係公差大於散熱鰭片模組2貫穿孔211的孔徑，因此於上插片13插入散熱鰭片模組2的貫穿孔211後，亦可獲得緊迫的定位結合(如第十三圖所示)，故各實施例圖僅係揭露本創作的主要技術特徵，但涉及等效應用或簡易的增減變更，自仍不脫本案的技術範圍。
依本創作設計精神及實施例所揭，其主要係將一固定支架1插植結合於一散熱鰭片模組2的尾部所組成，而其中的散熱鰭片模組2，進一步係可包含一個以上的熱導管3，該熱導管3的散熱端係可嵌入或貫穿結合於散熱鰭片模組2，而延伸的吸熱端則嵌入結合於一固定座4，並使該熱導管3的吸熱端呈適當外露，進而可供直接貼觸於熱源，以便進行熱溫的傳遞及散熱工作。前述固定座4，其本身係已具有複數個可供鎖固結合於基板的腳座41。
綜上所述，本創作所為散熱器的尾部固定支架，其技術手段之應用，確已不同於習知的焊接或膠黏結 合，已具實用性及創作性，敬祈 詳賜審查並准專利，實為德便。
1‧‧‧固定支架
2‧‧‧散熱鰭片模組
3‧‧‧熱導管
4‧‧‧固定座
11‧‧‧底板
111‧‧‧中孔
112‧‧‧側壁
12‧‧‧鎖合板
121‧‧‧鎖孔
13‧‧‧上插片
21‧‧‧鰭片
211‧‧‧貫穿孔
41‧‧‧腳座

Claims (6)

  1. 一種散熱器的尾部固定支架，該固定支架係專供插植結合於一散熱鰭片模組的尾部，而與散熱鰭片模組形成緊配結合，而其特徵在於：所述固定支架為一體沖壓成型，其一側係形成一底板，而另一側則向上轉折延伸形成一具有鎖孔的鎖合板，底板的內央並沖壓形成一呈半相連的上插片，上插片係朝上反向轉折，且散熱鰭片模組係於各鰭片的相對位置開設貫穿孔，使固定支架的上插片係匹配插入貫穿孔，並與散熱鰭片模組形成緊配結合。
  2. 如申請專利範圍第1項所述散熱器的尾部固定支架，該固定支架的底板係托持定位於散熱鰭片模組的底面。
  3. 如申請專利範圍第1項所述散熱器的尾部固定支架，該固定支架的上插片係在內壁面上沖設形成複數個間隔的凸部，各凸部的間隔相離間距係對應匹配於各鰭片的相隔間隙。
  4. 如申請專利範圍第1項所述散熱器的尾部固定支架，該固定支架的內央係於沖壓上插片時形成一中孔，而該中孔的兩側壁係在上表面沖設形成複數個間隔的凸部，且各凸部的間隔相離間距係對應匹配於各鰭片的相隔間隙。
  5. 如申請專利範圍第1項所述散熱器的尾部固定支架，該固定支架的上插片板體厚度係公差大於散熱鰭片模 組的貫穿孔孔徑。
  6. 如申請專利範圍第1項所述散熱器的尾部固定支架，該散熱鰭片模組係包含一個以上的熱導管，該熱導管的散熱端係嵌入或貫穿結合於散熱鰭片模組，而延伸的吸熱端則嵌入結合於一固定座。
TW103223432U 2014-11-11 2014-12-31 散熱器的尾部固定支架 TWM501084U (zh)

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