CN2681217Y - 散热器扣合装置 - Google Patents

散热器扣合装置 Download PDF

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Publication number
CN2681217Y
CN2681217Y CN200420015038.8U CN200420015038U CN2681217Y CN 2681217 Y CN2681217 Y CN 2681217Y CN 200420015038 U CN200420015038 U CN 200420015038U CN 2681217 Y CN2681217 Y CN 2681217Y
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radiator
mentioned
backboard
buckling device
cylinder
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李学坤
鲁翠军
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200420015038.8U priority Critical patent/CN2681217Y/zh
Priority to US10/952,688 priority patent/US20050152119A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093Snap-on arrangements, e.g. clips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热器扣合装置,将散热器扣合在电路板上而与发热电子元件接触,其包括一背板和若干扣片,该背板具有一板体,垂直该板体形成若干柱体,柱体靠近末端形成环槽,上述每一扣片具有一片体,该片体的一边缘形成一把持部,片体中部由靠近把持部的位置向另一边缘方向切设并弯折翘起形成一弹片,该弹片内沿其中心线上开设一长槽,上述背板的柱体可穿过电路板及散热器,且柱体环槽与上述长槽相配合滑动,而将散热器固定。

Description

散热器扣合装置
【技术领域】
本实用新型是关于一种扣合装置,特别是一种用于将散热器固定在发热电子元件上的散热器扣合装置。
【背景技术】
随着电子信息业不断发展,电子元件(特别是中央处理器)运行频率及速度在不断提升。其产生的热量也随之增多,温度不断升高,严重影响着电子元件的运行性能,为确保电子元件能正常运行,通常在电子元件表面安装散热器,将热量排出。为使散热器与电子元件表面能够紧密稳固的贴合,通常需要一种扣合装置将散热器扣合在电子元件表面上并与电子元件紧贴。
如图1示出了一种现有的散热器扣合装置,具有二扣具2和一固定模组3,该二扣具2和固定模组3相配合将一散热器1固定在电子元件4上、该固定模组3安装在主机板5上的电子元件4周围,该固定模组3为一矩形框架结构,其四角落向上形成有卡脚302,该卡脚302设有卡孔304,上述散热器1设置于固定模组3内,该散热器1两侧各设有凸台102,上述扣具2具有一横梁202,该横梁202两端形成有扣臂204,该扣臂204末端设有一扣钩206,该横梁202中央开设有开槽208,该开槽208内枢接一凸轮式把手210。安装散热器1时,扣具2横跨在散热器1凸台102上,其扣臂204的扣钩206与固定模组3的卡脚302相卡扣,再摆动把手210使凸轮挤压散热器1凸台102,并与固定模组3扣紧而产生扣合力,达成扣合。但是,上述现有散热器扣合装置需与固定模组3相配合,散热器体积受限,而随着电子元件的运行能力快速升级,其冷却所需的散热器体积变大的情况下,上述现有的散热器扣合装置不仅所占空间较大,可能导致很难安装或无法安装。另外,上述散热器扣合装置结构复杂,耗材也较多,制造成本高。
【发明内容】
本实用新型的目的在于提供一种结构简单、制造容易的散热器扣合装置。
本实用新型的目的是通过以下技术方案实现的:
本实用新型散热器扣合装置,将散热器扣合在电路板上而与发热电子元件接触,其包括一背板和若干扣片,该背板具有一板体,垂直该板体形成若干柱体,柱体靠近末端形成环槽,上述每一扣片具有一片体,该片体中部切设并弯折翘起形成一弹片,该弹片上开设一长槽,上述背板的柱体可穿过电路板及散热器,且柱体的环槽与上述长槽相配合,而将散热器固定。
本实用新型与先前技术相比具有如下优点:本实用新型散热器扣合装置仅用设有柱体的背板及较小的扣片与散热器基座相配合即可达成扣合目的,其扣片结构简单,耗材少,制造容易,成本低,对主机板上的空间占用小。
下面参照附图,结合实施例对本实用新型作进一步的描述。
【附图说明】
图1是现有技术中一散热器扣合装置与相关元件的立体分解图。
图2是本实用新型散热器扣合装置与相关元件的立体分解图。
图3是图2中的扣片立体放大图。
图4是图2的立体组装图。
【具体实施方式】
请参阅图2和图3,本实用新型散热器扣合装置,是用来将散热器10固定在印刷电路板60上,并与其上发热电子元件50紧密接触以辅助其散热。
上述散热器10具有一基座12和若干散热鳍片14,该基座12具有与电子元件50相结合的一表面,其相对表面上设置上述若干散热鳍片14,且该表面各角落处具有无散热鳍片14的区域,该区域上设有与上述散热器扣合装置相配合用的穿孔16。
上述散热器扣合装置,包括一背板20和若干扣片30。该背板20具有一板体22,其中央为节省材料及减轻重量而设有开口24,该背板20各角落处向上垂直该板体22形成若干柱体26,该柱体26靠近末端形成一环槽28。上述每一扣片30具有一水平片体32,该片体32一边缘向上弯折形成一把持部34,片体32中部由靠近把持部34的位置向另一边缘方向切设并弯折翘起形成一弹片36,且该弹片36末端形成一略向下弧凹的水平段38,该片体32上开设一开孔40,该弹片36及水平段38沿其中心线开设一与该开孔40相连通的长槽42,上述该开孔40的直径略大于上述背板20的柱体26断面直径,该长槽42宽度略大于该柱体26的环槽28的断面直径,且小于该柱体26的断面直径。
当安装散热器10时,首先将上述背板20放置在装设有电子元件50的印刷电路板60背面,并使背板20的各柱体26穿过该预设有开孔的印刷电路板60,再将散热器10基座12上的各穿孔16对应背板20各柱体26穿过,使其贴设于电子元件50上。然后,通过上述各扣片30的开孔40套设于柱体26上,拉动扣片30的把持部34,使柱体26的环槽28在弹片36的长槽42内滑动,随着滑动距离的增大,弹片36与柱体26环槽28相抵撑产生弹性回复力,当该环槽28滑动到弹片36水平段38中部时,即将散热器10固定于电子元件上。

Claims (7)

1.一种散热器扣合装置,将散热器扣合在电路板上而与发热电子元件接触,其包括一背板和若干扣片,该背板具有一板体,垂直该板体形成若干柱体,柱体靠近末端形成环槽,其特征在于:上述每一扣片具有一片体,该片体中部切设并弯折翘起形成一弹片,该弹片上开设一长槽,上述背板的柱体可穿过电路板及散热器,且柱体的环槽与上述长槽相配合,而将散热器固定。
2.如权利要求1所述的散热器扣合装置,其特征在于:上述片体一边缘形成一把持部。
3.如权利要求1所述的散热器扣合装置,其特征在于:上述弹片末端形成一略向下弧凹的水平段。
4.如权利要求3所述的散热器扣合装置,其特征在于:上述长槽一直延伸到上述水平段下凹处。
5.如权利要求1所述的散热器扣合装置,其特征在于:上述片体上形成一开孔,该开孔与上述长槽相连。
6.如权利要求5所述的散热器扣合装置,其特征在于:上述开孔直径大于背板的柱体断面直径。
7.如权利要求1所述的散热器扣合装置,其特征在于:上述长槽宽度大于背板柱体的环槽断面直径,小于背板的柱体断面直径。
CN200420015038.8U 2004-01-14 2004-01-14 散热器扣合装置 Expired - Fee Related CN2681217Y (zh)

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US10/952,688 US20050152119A1 (en) 2004-01-14 2004-09-29 Locking device for heat dissipating device

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