TWI907594B - 硬化性聚矽氧組成物、其硬化物及積層體、以及積層體之製造方法 - Google Patents

硬化性聚矽氧組成物、其硬化物及積層體、以及積層體之製造方法

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Publication number
TWI907594B
TWI907594B TW110147713A TW110147713A TWI907594B TW I907594 B TWI907594 B TW I907594B TW 110147713 A TW110147713 A TW 110147713A TW 110147713 A TW110147713 A TW 110147713A TW I907594 B TWI907594 B TW I907594B
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TW
Taiwan
Prior art keywords
composition
component
curing
polysiloxane composition
curable
Prior art date
Application number
TW110147713A
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English (en)
Chinese (zh)
Other versions
TW202235538A (zh
Inventor
山崎亮介
山本真一
尾崎弘一
今泉徹
Original Assignee
日商陶氏東麗股份有限公司
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Publication of TW202235538A publication Critical patent/TW202235538A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW110147713A 2020-12-25 2021-12-20 硬化性聚矽氧組成物、其硬化物及積層體、以及積層體之製造方法 TWI907594B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2020-216206 2020-12-25
JP2020216206 2020-12-25

Publications (2)

Publication Number Publication Date
TW202235538A TW202235538A (zh) 2022-09-16
TWI907594B true TWI907594B (zh) 2025-12-11

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Country Status (7)

Country Link
US (1) US20240052106A1 (https=)
EP (1) EP4269503A4 (https=)
JP (1) JPWO2022138336A1 (https=)
KR (1) KR20230122648A (https=)
CN (1) CN116490354B (https=)
TW (1) TWI907594B (https=)
WO (1) WO2022138336A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7419251B2 (ja) 2018-10-30 2024-01-22 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途
WO2020138410A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
JP7456938B2 (ja) 2018-12-27 2024-03-27 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
US12173157B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
KR102952088B1 (ko) 2019-03-29 2026-04-15 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
EP3950844B1 (en) * 2019-03-29 2026-03-11 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
JP7560442B2 (ja) 2019-03-29 2024-10-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
EP4083140A4 (en) 2019-12-27 2024-01-10 Dow Toray Co., Ltd. CURTAINABLE HOT-MEL SILICONE COMPOSITION, HARDENED MATERIAL THEREOF AND LAMINATE HAVING CURED HOT-MEL SILICONE COMPOSITION OR HARDENED MATERIAL THEREOF
CN115052742A (zh) * 2019-12-27 2022-09-13 陶氏东丽株式会社 层叠体以及由该层叠体构成的电子零件
JP7820893B2 (ja) * 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
DE102020113737A1 (de) * 2020-05-20 2021-11-25 CHT Germany GmbH Hybridelastomermaterial
US20240052220A1 (en) * 2020-12-25 2024-02-15 Dow Toray Co., Ltd. Method for manufacturing laminate
US20250051571A1 (en) * 2021-12-21 2025-02-13 Dow Toray Co., Ltd. Curable silicone composition having hot melt properties, cured product of same, and multilayer body comprising said composition
TW202438601A (zh) 2022-12-23 2024-10-01 日商陶氏東麗股份有限公司 硬化性聚矽氧組成物、其硬化產物及該組成物之使用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201536866A (zh) * 2014-02-19 2015-10-01 道康寧公司 反應性聚矽氧組合物、由其製成之熱熔材料及可固化熱熔組合物
WO2019088067A1 (ja) * 2017-10-31 2019-05-09 ダウ・東レ株式会社 オルガノポリシロキサン硬化物を製造する方法、オルガノポリシロキサン硬化物、積層体、および光学部品
WO2020090797A1 (ja) * 2018-10-30 2020-05-07 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528854B2 (https=) 1972-01-13 1977-03-11
JP2967900B2 (ja) * 1993-11-04 1999-10-25 矢崎総業株式会社 コネクタ防水用シール部品
JP3831481B2 (ja) 1996-11-18 2006-10-11 東レ・ダウコーニング株式会社 カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物
JP6046395B2 (ja) 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
TWI629314B (zh) * 2012-12-21 2018-07-11 美商道康寧公司 壓縮成形或積層用熱熔型硬化性聚矽氧組合物
JP6607644B2 (ja) * 2014-09-01 2019-11-20 ダウ・東レ株式会社 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
JP6586555B2 (ja) * 2014-12-26 2019-10-09 ダウ・東レ株式会社 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置
TWI709615B (zh) 2015-02-25 2020-11-11 日商陶氏東麗股份有限公司 硬化性粒狀聚矽氧組合物及其製造方法
JP6499511B2 (ja) 2015-05-19 2019-04-10 株式会社ジャパンディスプレイ 表示装置
CN111148796B (zh) * 2017-10-20 2021-11-09 陶氏东丽株式会社 硬化性粒状硅酮组合物、其硬化物、及其制造方法
JP7088763B2 (ja) 2018-07-13 2022-06-21 旭有機材株式会社 ポリウレタンフォーム用薬液組成物
JP7534061B2 (ja) * 2018-12-25 2024-08-14 ダウ・東レ株式会社 硬化反応性シリコーン粘着剤組成物及びその硬化物並びにそれらの用途
US12173157B2 (en) * 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
EP3950846B1 (en) * 2019-03-29 2025-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
KR102952088B1 (ko) * 2019-03-29 2026-04-15 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7820893B2 (ja) * 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201536866A (zh) * 2014-02-19 2015-10-01 道康寧公司 反應性聚矽氧組合物、由其製成之熱熔材料及可固化熱熔組合物
WO2019088067A1 (ja) * 2017-10-31 2019-05-09 ダウ・東レ株式会社 オルガノポリシロキサン硬化物を製造する方法、オルガノポリシロキサン硬化物、積層体、および光学部品
WO2020090797A1 (ja) * 2018-10-30 2020-05-07 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途

Also Published As

Publication number Publication date
TW202235538A (zh) 2022-09-16
WO2022138336A1 (ja) 2022-06-30
US20240052106A1 (en) 2024-02-15
EP4269503A4 (en) 2024-11-20
CN116490354B (zh) 2025-09-19
JPWO2022138336A1 (https=) 2022-06-30
KR20230122648A (ko) 2023-08-22
EP4269503A1 (en) 2023-11-01
CN116490354A (zh) 2023-07-25

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