CN116490354B - 固化性有机硅组合物、其固化物以及层叠体 - Google Patents

固化性有机硅组合物、其固化物以及层叠体

Info

Publication number
CN116490354B
CN116490354B CN202180079379.8A CN202180079379A CN116490354B CN 116490354 B CN116490354 B CN 116490354B CN 202180079379 A CN202180079379 A CN 202180079379A CN 116490354 B CN116490354 B CN 116490354B
Authority
CN
China
Prior art keywords
curable silicone
composition
component
silicone composition
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180079379.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN116490354A (zh
Inventor
山崎亮介
山本真一
尾崎弘一
今泉彻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of CN116490354A publication Critical patent/CN116490354A/zh
Application granted granted Critical
Publication of CN116490354B publication Critical patent/CN116490354B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/08—Crosslinking by silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202180079379.8A 2020-12-25 2021-12-14 固化性有机硅组合物、其固化物以及层叠体 Active CN116490354B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-216206 2020-12-25
JP2020216206 2020-12-25
PCT/JP2021/046093 WO2022138336A1 (ja) 2020-12-25 2021-12-14 硬化性シリコーン組成物、その硬化物および積層体

Publications (2)

Publication Number Publication Date
CN116490354A CN116490354A (zh) 2023-07-25
CN116490354B true CN116490354B (zh) 2025-09-19

Family

ID=82159163

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180079379.8A Active CN116490354B (zh) 2020-12-25 2021-12-14 固化性有机硅组合物、其固化物以及层叠体

Country Status (7)

Country Link
US (1) US20240052106A1 (https=)
EP (1) EP4269503A4 (https=)
JP (1) JPWO2022138336A1 (https=)
KR (1) KR20230122648A (https=)
CN (1) CN116490354B (https=)
TW (1) TWI907594B (https=)
WO (1) WO2022138336A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7419251B2 (ja) 2018-10-30 2024-01-22 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途
WO2020138410A1 (ja) 2018-12-27 2020-07-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
JP7456938B2 (ja) 2018-12-27 2024-03-27 ダウ・東レ株式会社 ホットメルト性を有する硬化性シリコーンシートの製造方法
US12173157B2 (en) 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
KR102952088B1 (ko) 2019-03-29 2026-04-15 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
EP3950844B1 (en) * 2019-03-29 2026-03-11 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
JP7560442B2 (ja) 2019-03-29 2024-10-02 ダウ・東レ株式会社 硬化性シリコーン組成物、その硬化物、およびその製造方法
EP4083140A4 (en) 2019-12-27 2024-01-10 Dow Toray Co., Ltd. CURTAINABLE HOT-MEL SILICONE COMPOSITION, HARDENED MATERIAL THEREOF AND LAMINATE HAVING CURED HOT-MEL SILICONE COMPOSITION OR HARDENED MATERIAL THEREOF
CN115052742A (zh) * 2019-12-27 2022-09-13 陶氏东丽株式会社 层叠体以及由该层叠体构成的电子零件
JP7820893B2 (ja) * 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
DE102020113737A1 (de) * 2020-05-20 2021-11-25 CHT Germany GmbH Hybridelastomermaterial
US20240052220A1 (en) * 2020-12-25 2024-02-15 Dow Toray Co., Ltd. Method for manufacturing laminate
US20250051571A1 (en) * 2021-12-21 2025-02-13 Dow Toray Co., Ltd. Curable silicone composition having hot melt properties, cured product of same, and multilayer body comprising said composition
TW202438601A (zh) 2022-12-23 2024-10-01 日商陶氏東麗股份有限公司 硬化性聚矽氧組成物、其硬化產物及該組成物之使用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111148796A (zh) * 2017-10-20 2020-05-12 陶氏东丽株式会社 硬化性粒状硅酮组合物、其硬化物、及其制造方法
CN111212876A (zh) * 2017-10-31 2020-05-29 陶氏东丽株式会社 制造有机聚硅氧烷硬化物的方法、有机聚硅氧烷硬化物、叠层体、及光学零件

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS528854B2 (https=) 1972-01-13 1977-03-11
JP2967900B2 (ja) * 1993-11-04 1999-10-25 矢崎総業株式会社 コネクタ防水用シール部品
JP3831481B2 (ja) 1996-11-18 2006-10-11 東レ・ダウコーニング株式会社 カルバシラトラン誘導体、その製造方法、接着促進剤、および硬化性シリコーン組成物
JP6046395B2 (ja) 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
TWI629314B (zh) * 2012-12-21 2018-07-11 美商道康寧公司 壓縮成形或積層用熱熔型硬化性聚矽氧組合物
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
JP6607644B2 (ja) * 2014-09-01 2019-11-20 ダウ・東レ株式会社 硬化性シリコーン組成物、硬化性ホットメルトシリコーン、および光デバイス
JP6586555B2 (ja) * 2014-12-26 2019-10-09 ダウ・東レ株式会社 硬化性シリコーン組成物、それからなる半導体用封止剤および半導体装置
TWI709615B (zh) 2015-02-25 2020-11-11 日商陶氏東麗股份有限公司 硬化性粒狀聚矽氧組合物及其製造方法
JP6499511B2 (ja) 2015-05-19 2019-04-10 株式会社ジャパンディスプレイ 表示装置
JP7088763B2 (ja) 2018-07-13 2022-06-21 旭有機材株式会社 ポリウレタンフォーム用薬液組成物
JP7419251B2 (ja) * 2018-10-30 2024-01-22 ダウ・東レ株式会社 硬化反応性シリコーン組成物及びその硬化物並びにそれらの用途
JP7534061B2 (ja) * 2018-12-25 2024-08-14 ダウ・東レ株式会社 硬化反応性シリコーン粘着剤組成物及びその硬化物並びにそれらの用途
US12173157B2 (en) * 2018-12-27 2024-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product thereof, and method for producing same
EP3950846B1 (en) * 2019-03-29 2025-12-24 Dow Toray Co., Ltd. Curable silicone composition, cured product of same, and method for producing same
KR102952088B1 (ko) * 2019-03-29 2026-04-15 다우 도레이 캄파니 리미티드 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법
JP7820893B2 (ja) * 2020-03-30 2026-02-26 ダウ・東レ株式会社 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111148796A (zh) * 2017-10-20 2020-05-12 陶氏东丽株式会社 硬化性粒状硅酮组合物、其硬化物、及其制造方法
CN111212876A (zh) * 2017-10-31 2020-05-29 陶氏东丽株式会社 制造有机聚硅氧烷硬化物的方法、有机聚硅氧烷硬化物、叠层体、及光学零件

Also Published As

Publication number Publication date
TW202235538A (zh) 2022-09-16
TWI907594B (zh) 2025-12-11
WO2022138336A1 (ja) 2022-06-30
US20240052106A1 (en) 2024-02-15
EP4269503A4 (en) 2024-11-20
JPWO2022138336A1 (https=) 2022-06-30
KR20230122648A (ko) 2023-08-22
EP4269503A1 (en) 2023-11-01
CN116490354A (zh) 2023-07-25

Similar Documents

Publication Publication Date Title
CN116490354B (zh) 固化性有机硅组合物、其固化物以及层叠体
CN116635159B (zh) 层叠体的制造方法
CN115335459B (zh) 固化性热熔有机硅组合物、其固化物、以及包含所述组合物或固化物的层叠体
CN113490722B (zh) 固化性有机硅组合物、其固化物及其制造方法
JP2021107550A (ja) 硬化性ホットメルトシリコーン組成物、その硬化物、及び前記組成物又は硬化物を含む積層体
JP7450388B2 (ja) 電子装置用基板の封止方法及び封止された電子装置用基板
EP3950846A1 (en) Curable silicone composition, cured product of same, and method for producing same
JP7424733B2 (ja) ホットメルト性を有する硬化性シリコーンシートの製造方法
US20250051571A1 (en) Curable silicone composition having hot melt properties, cured product of same, and multilayer body comprising said composition
EP4640765A1 (en) Curable silicone composition, cured product of same, and use of said composition
TWI920200B (zh) 積層體之製造方法
TWI887391B (zh) 硬化性熱熔聚矽氧組成物、其硬化物、及含有該組成物或硬化物之積層體
EP4597552A1 (en) Conductive pillar module precursor for manufacturing semiconductor, conductive pillar module for manufacturing semiconductor, semiconductor or semiconductor precursor, and method for manufacturing same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant