TWI896653B - 電子零件之製造方法 - Google Patents
電子零件之製造方法Info
- Publication number
- TWI896653B TWI896653B TW110115469A TW110115469A TWI896653B TW I896653 B TWI896653 B TW I896653B TW 110115469 A TW110115469 A TW 110115469A TW 110115469 A TW110115469 A TW 110115469A TW I896653 B TWI896653 B TW I896653B
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- conductive resin
- electrode
- metal powder
- resin composition
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/0029—Processes of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Thermistors And Varistors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020081191 | 2020-05-01 | ||
| JP2020-081191 | 2020-05-01 | ||
| JP2020087086 | 2020-05-19 | ||
| JP2020-087086 | 2020-05-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202211274A TW202211274A (zh) | 2022-03-16 |
| TWI896653B true TWI896653B (zh) | 2025-09-11 |
Family
ID=78373243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110115469A TWI896653B (zh) | 2020-05-01 | 2021-04-29 | 電子零件之製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US12573564B2 (https=) |
| EP (1) | EP4145478A4 (https=) |
| JP (2) | JP7078195B2 (https=) |
| KR (1) | KR20230004732A (https=) |
| CN (1) | CN115485798B (https=) |
| PH (1) | PH12022553275A1 (https=) |
| TW (1) | TWI896653B (https=) |
| WO (1) | WO2021220975A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157434A (ja) * | 2005-12-02 | 2007-06-21 | Shoei Chem Ind Co | 導体形成方法 |
| JP2014135463A (ja) * | 2013-01-09 | 2014-07-24 | Samsung Electro-Mechanics Co Ltd | 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法 |
| TW201922654A (zh) * | 2017-10-03 | 2019-06-16 | 日商昭榮化學工業股份有限公司 | 太陽電池電極形成用導電性糊膏 |
| TW201926363A (zh) * | 2017-12-06 | 2019-07-01 | 日商納美仕有限公司 | 導電性膏 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60199057A (ja) * | 1984-03-22 | 1985-10-08 | Shin Etsu Chem Co Ltd | 導電性室温硬化型組成物 |
| JPS6331522A (ja) | 1986-07-25 | 1988-02-10 | Kao Corp | 吸湿剤 |
| TW379513B (en) * | 1997-04-17 | 2000-01-11 | Kureha Chemical Ind Co Ltd | Moisture-proof film and electro-luminescent element |
| JP3650546B2 (ja) | 1998-08-28 | 2005-05-18 | 松下電器産業株式会社 | 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法 |
| JP3669180B2 (ja) * | 1998-10-22 | 2005-07-06 | 株式会社スリーボンド | 接続抵抗値を改善する導電性組成物 |
| CN100467539C (zh) * | 2001-10-19 | 2009-03-11 | 日立化成工业株式会社 | 导电性树脂组合物及使用其的电子部件 |
| JP2005248047A (ja) | 2004-03-05 | 2005-09-15 | Kyocera Chemical Corp | 導電性樹脂組成物とその製造方法、およびそれを用いた電気・電子部品 |
| JP4367631B2 (ja) * | 2004-04-12 | 2009-11-18 | 信越化学工業株式会社 | 室温硬化型導電性シリコーンゴム組成物 |
| JP2006213909A (ja) * | 2005-01-06 | 2006-08-17 | Shieldtechs Inc | 防錆性および／または導電性に優れた樹脂組成物並びに樹脂組成物被覆部材 |
| JP2007294429A (ja) * | 2006-03-30 | 2007-11-08 | Ohara Inc | リチウムイオン伝導性固体電解質およびその製造方法 |
| JP2009295602A (ja) | 2006-08-22 | 2009-12-17 | Murata Mfg Co Ltd | 積層型電子部品、および積層型電子部品の製造方法。 |
| JP5201734B2 (ja) | 2009-03-06 | 2013-06-05 | 旭化成ケミカルズ株式会社 | 導電性樹脂組成物、それを用いた半導体装置及び導電性樹脂組成物の製造方法 |
| JP5297344B2 (ja) * | 2009-11-04 | 2013-09-25 | 京都エレックス株式会社 | 加熱硬化型導電性ペースト組成物 |
| JP5246207B2 (ja) | 2010-06-04 | 2013-07-24 | 株式会社村田製作所 | チップ型電子部品 |
| JP6416188B2 (ja) * | 2013-03-14 | 2018-10-31 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物、導電性シリコーン粘着剤、これらの製造及び使用方法、並びにこれらを含有する電気デバイス |
| JP2015109410A (ja) * | 2013-10-25 | 2015-06-11 | 株式会社村田製作所 | セラミック電子部品及びセラミック電子部品の製造方法 |
| US20150262728A1 (en) * | 2014-03-11 | 2015-09-17 | E I Du Pont De Nemours And Company | Electrically conductive paste composition and method of forming an electrical circuit on a polymer substrate |
| TWI764064B (zh) * | 2014-03-13 | 2022-05-11 | 日商半導體能源研究所股份有限公司 | 撓性裝置 |
| JP2016004659A (ja) * | 2014-06-16 | 2016-01-12 | 株式会社村田製作所 | 導電性樹脂ペーストおよびセラミック電子部品 |
| CN107004459B (zh) | 2014-12-26 | 2020-04-03 | 哈利玛化成株式会社 | 导电性糊剂 |
| JP6503826B2 (ja) * | 2015-03-26 | 2019-04-24 | 大日本印刷株式会社 | 電池用包装材料の巻取体 |
| WO2016178117A1 (en) * | 2015-05-06 | 2016-11-10 | Semiconductor Energy Laboratory Co., Ltd. | Secondary battery and electronic device |
| WO2017028020A1 (en) * | 2015-08-14 | 2017-02-23 | Henkel Ag & Co. Kgaa | Sinterable composition for use in solar photovoltaic cells |
| KR20180000941A (ko) | 2016-06-24 | 2018-01-04 | 삼성전자주식회사 | 음극 구성, 이를 포함하는 전기 화학 전지 |
| JP2018006501A (ja) * | 2016-06-30 | 2018-01-11 | Tdk株式会社 | 電子部品 |
| CN109791839B (zh) * | 2016-09-23 | 2021-08-24 | Tdk株式会社 | 电子部件和电子部件装置 |
| US11739232B2 (en) * | 2019-06-12 | 2023-08-29 | Kyoto Elex Co., Ltd. | Conductive paste composition |
| JP7565686B2 (ja) * | 2019-12-20 | 2024-10-11 | ノリタケ株式会社 | 導電性ペースト |
| JP7411537B2 (ja) * | 2020-01-22 | 2024-01-11 | 信越化学工業株式会社 | 生体電極組成物、生体電極、及び生体電極の製造方法 |
| KR102952186B1 (ko) * | 2020-05-01 | 2026-04-15 | 쇼에이 가가쿠 가부시키가이샤 | 도전성 수지 조성물 |
-
2021
- 2021-04-23 WO PCT/JP2021/016513 patent/WO2021220975A1/ja not_active Ceased
- 2021-04-23 PH PH1/2022/553275A patent/PH12022553275A1/en unknown
- 2021-04-23 KR KR1020227040628A patent/KR20230004732A/ko active Pending
- 2021-04-23 JP JP2022504008A patent/JP7078195B2/ja active Active
- 2021-04-23 US US17/922,577 patent/US12573564B2/en active Active
- 2021-04-23 CN CN202180032448.XA patent/CN115485798B/zh active Active
- 2021-04-23 EP EP21797325.4A patent/EP4145478A4/en active Pending
- 2021-04-29 TW TW110115469A patent/TWI896653B/zh active
-
2022
- 2022-04-11 JP JP2022064906A patent/JP7176654B2/ja active Active
-
2023
- 2023-07-03 US US18/346,515 patent/US20230352249A1/en active Pending
- 2023-07-03 US US18/346,485 patent/US20230352248A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007157434A (ja) * | 2005-12-02 | 2007-06-21 | Shoei Chem Ind Co | 導体形成方法 |
| JP2014135463A (ja) * | 2013-01-09 | 2014-07-24 | Samsung Electro-Mechanics Co Ltd | 導電性樹脂組成物、これを含む積層セラミックキャパシタ及びその製造方法 |
| TW201922654A (zh) * | 2017-10-03 | 2019-06-16 | 日商昭榮化學工業股份有限公司 | 太陽電池電極形成用導電性糊膏 |
| TW201926363A (zh) * | 2017-12-06 | 2019-07-01 | 日商納美仕有限公司 | 導電性膏 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4145478A4 (en) | 2025-05-21 |
| WO2021220975A1 (ja) | 2021-11-04 |
| JPWO2021220975A1 (https=) | 2021-11-04 |
| CN115485798B (zh) | 2025-05-09 |
| US20230170155A1 (en) | 2023-06-01 |
| JP7176654B2 (ja) | 2022-11-22 |
| US12573564B2 (en) | 2026-03-10 |
| JP2022082794A (ja) | 2022-06-02 |
| US20230352248A1 (en) | 2023-11-02 |
| PH12022553275A1 (en) | 2024-02-12 |
| TW202211274A (zh) | 2022-03-16 |
| EP4145478A1 (en) | 2023-03-08 |
| CN115485798A (zh) | 2022-12-16 |
| JP7078195B2 (ja) | 2022-05-31 |
| KR20230004732A (ko) | 2023-01-06 |
| US20230352249A1 (en) | 2023-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI896654B (zh) | 導電性樹脂組成物 | |
| EP2366739B1 (en) | Conductive resin composition and chip-type electronic component | |
| WO2014097823A1 (ja) | 積層セラミック電子部品 | |
| TWI896653B (zh) | 電子零件之製造方法 | |
| CN1930647A (zh) | 固体电解电容器及其用途 | |
| TW202328343A (zh) | 熱硬化型導電性樹脂組成物及電子零件之製造方法 | |
| US20250188290A1 (en) | Thermosetting conductive resin composition and method for producing electronic component | |
| JP2020055912A (ja) | 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法 |