PH12022553275A1 - Method for manufacturing electronic component - Google Patents

Method for manufacturing electronic component

Info

Publication number
PH12022553275A1
PH12022553275A1 PH1/2022/553275A PH12022553275A PH12022553275A1 PH 12022553275 A1 PH12022553275 A1 PH 12022553275A1 PH 12022553275 A PH12022553275 A PH 12022553275A PH 12022553275 A1 PH12022553275 A1 PH 12022553275A1
Authority
PH
Philippines
Prior art keywords
electronic component
electrode
manufacturing
forming
forming body
Prior art date
Application number
PH1/2022/553275A
Other languages
English (en)
Inventor
Soichiro ESAKI
Original Assignee
Shoei Chemical Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Ind Co filed Critical Shoei Chemical Ind Co
Publication of PH12022553275A1 publication Critical patent/PH12022553275A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/006Apparatus or processes for applying terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029Processes of manufacture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/042Electrodes or formation of dielectric layers thereon characterised by the material
    • H01G9/0425Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/048Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/055Etched foil electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)
  • Thermistors And Varistors (AREA)
PH1/2022/553275A 2020-05-01 2021-04-23 Method for manufacturing electronic component PH12022553275A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020081191 2020-05-01
JP2020087086 2020-05-19
PCT/JP2021/016513 WO2021220975A1 (ja) 2020-05-01 2021-04-23 電子部品の製造方法

Publications (1)

Publication Number Publication Date
PH12022553275A1 true PH12022553275A1 (en) 2024-02-12

Family

ID=78373243

Family Applications (1)

Application Number Title Priority Date Filing Date
PH1/2022/553275A PH12022553275A1 (en) 2020-05-01 2021-04-23 Method for manufacturing electronic component

Country Status (8)

Country Link
US (3) US12573564B2 (https=)
EP (1) EP4145478A4 (https=)
JP (2) JP7078195B2 (https=)
KR (1) KR20230004732A (https=)
CN (1) CN115485798B (https=)
PH (1) PH12022553275A1 (https=)
TW (1) TWI896653B (https=)
WO (1) WO2021220975A1 (https=)

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199057A (ja) * 1984-03-22 1985-10-08 Shin Etsu Chem Co Ltd 導電性室温硬化型組成物
JPS6331522A (ja) 1986-07-25 1988-02-10 Kao Corp 吸湿剤
US6432516B1 (en) * 1997-04-17 2002-08-13 Kureha Kagaku Kogyo K.K. Moistureproofing film and electroluminescent device
JP3650546B2 (ja) * 1998-08-28 2005-05-18 松下電器産業株式会社 導電性ペースト、およびそれを用いた導電性構造、セラミック電子部品、電子部品、実装体、回路基板、電気的接続方法、回路基板の製造方法、及びセラミック電子部品の製造方法
JP3669180B2 (ja) * 1998-10-22 2005-07-06 株式会社スリーボンド 接続抵抗値を改善する導電性組成物
CN100467539C (zh) * 2001-10-19 2009-03-11 日立化成工业株式会社 导电性树脂组合物及使用其的电子部件
JP2005248047A (ja) * 2004-03-05 2005-09-15 Kyocera Chemical Corp 導電性樹脂組成物とその製造方法、およびそれを用いた電気・電子部品
JP4367631B2 (ja) * 2004-04-12 2009-11-18 信越化学工業株式会社 室温硬化型導電性シリコーンゴム組成物
JP2006213909A (ja) * 2005-01-06 2006-08-17 Shieldtechs Inc 防錆性および/または導電性に優れた樹脂組成物並びに樹脂組成物被覆部材
JP4951948B2 (ja) 2005-12-02 2012-06-13 昭栄化学工業株式会社 導体形成方法
JP2007294429A (ja) * 2006-03-30 2007-11-08 Ohara Inc リチウムイオン伝導性固体電解質およびその製造方法
JP2009295602A (ja) 2006-08-22 2009-12-17 Murata Mfg Co Ltd 積層型電子部品、および積層型電子部品の製造方法。
JP5201734B2 (ja) 2009-03-06 2013-06-05 旭化成ケミカルズ株式会社 導電性樹脂組成物、それを用いた半導体装置及び導電性樹脂組成物の製造方法
JP5297344B2 (ja) 2009-11-04 2013-09-25 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
JP5246207B2 (ja) 2010-06-04 2013-07-24 株式会社村田製作所 チップ型電子部品
KR20140090466A (ko) * 2013-01-09 2014-07-17 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
KR102250406B1 (ko) 2013-03-14 2021-05-12 다우 실리콘즈 코포레이션 경화성 실리콘 조성물, 전기 전도성 실리콘 접착제, 이의 제조 및 사용 방법, 및 이를 포함하는 전기 디바이스
JP2015109410A (ja) * 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品及びセラミック電子部品の製造方法
US20150262728A1 (en) * 2014-03-11 2015-09-17 E I Du Pont De Nemours And Company Electrically conductive paste composition and method of forming an electrical circuit on a polymer substrate
TWI764064B (zh) * 2014-03-13 2022-05-11 日商半導體能源研究所股份有限公司 撓性裝置
JP2016004659A (ja) * 2014-06-16 2016-01-12 株式会社村田製作所 導電性樹脂ペーストおよびセラミック電子部品
JP6623174B2 (ja) 2014-12-26 2019-12-18 ハリマ化成株式会社 導電性ペースト
JP6503826B2 (ja) * 2015-03-26 2019-04-24 大日本印刷株式会社 電池用包装材料の巻取体
WO2016178117A1 (en) * 2015-05-06 2016-11-10 Semiconductor Energy Laboratory Co., Ltd. Secondary battery and electronic device
KR102510140B1 (ko) * 2015-08-14 2023-03-14 헨켈 아게 운트 코. 카게아아 태양 광기전 전지에서 사용하기 위한 소결가능 조성물
KR20180000941A (ko) 2016-06-24 2018-01-04 삼성전자주식회사 음극 구성, 이를 포함하는 전기 화학 전지
JP2018006501A (ja) 2016-06-30 2018-01-11 Tdk株式会社 電子部品
DE112017004775T5 (de) * 2016-09-23 2019-06-19 Tdk Corporation Elektronisches bauelement und elektronische bauelementevorrichtung
CN111183491B (zh) * 2017-10-03 2021-08-31 昭荣化学工业株式会社 太阳能电池电极形成用导电性糊剂
JP6877750B2 (ja) * 2017-12-06 2021-05-26 ナミックス株式会社 導電性ペースト
WO2020250675A1 (ja) * 2019-06-12 2020-12-17 京都エレックス株式会社 導電性ペースト組成物
JP7565686B2 (ja) * 2019-12-20 2024-10-11 ノリタケ株式会社 導電性ペースト
JP7411537B2 (ja) * 2020-01-22 2024-01-11 信越化学工業株式会社 生体電極組成物、生体電極、及び生体電極の製造方法
EP4144801A4 (en) * 2020-05-01 2024-12-25 Shoei Chemical Inc. ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENTS

Also Published As

Publication number Publication date
US20230352248A1 (en) 2023-11-02
JPWO2021220975A1 (https=) 2021-11-04
EP4145478A4 (en) 2025-05-21
JP7176654B2 (ja) 2022-11-22
TWI896653B (zh) 2025-09-11
EP4145478A1 (en) 2023-03-08
KR20230004732A (ko) 2023-01-06
TW202211274A (zh) 2022-03-16
WO2021220975A1 (ja) 2021-11-04
US20230170155A1 (en) 2023-06-01
US12573564B2 (en) 2026-03-10
CN115485798B (zh) 2025-05-09
CN115485798A (zh) 2022-12-16
JP2022082794A (ja) 2022-06-02
JP7078195B2 (ja) 2022-05-31
US20230352249A1 (en) 2023-11-02

Similar Documents

Publication Publication Date Title
PH12022553274A1 (en) Conductive resin composition and method for manufacturing electronic component
MX2020014080A (es) Pelicula de multiples capas con propiedades opticas conmutables electricamente y recubrimiento electrico mejorado.
JP2014204005A5 (https=)
WO2008126738A1 (ja) インターポーザ
TW200739611A (en) Thermosetting type conductive paste and laminated ceramic electronic component having an external electrode formed by using such thermosetting type conductive paste
SG169929A1 (en) Semiconductor device and method of forming cavity in pcb containing encapsulant or dummy die having cte similar to cte of large array wlcsp
MY171050A (en) Semiconductor component and method of manufacture
WO2011087870A3 (en) Solid electrolytic capacitor and method of manufacture
ATE554486T1 (de) Keramik-chip-anordnung
TW200742106A (en) Photoelectric conversion device, manufacturing method thereof and semiconductor device
MY166609A (en) Connector assembly and method of manufacture
TW200503020A (en) Capacitor and manufacturing method of capacitor
EP3929979A3 (en) Electronic component
JP2011249718A5 (https=)
EP1886628A3 (en) Antenna and body implant
TWI265580B (en) Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
TW200943342A (en) Solid electrolytic capacitor
US20150085462A1 (en) Electromagnetic interference shielding material, electromagnetic interference shielding device, method for making the electromagnetic interference shielding device, electromagnetic interference shielding package module and appliance
TW200511343A (en) Jig for producing capacitor, production method for capacitor and capacitor
EP2175457A3 (en) Ceramic chip assembly
PH12022553275A1 (en) Method for manufacturing electronic component
TW200605279A (en) Semiconductor device and manufacturing method thereof
EP2658355A3 (en) Circuit board, electric device, and method of manufacturing circuit board
MY204890A (en) Printed circuit board, method of manufacturing the same, and mobile terminal
JPWO2022065004A5 (https=)